TWI331425B - - Google Patents
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- Publication number
- TWI331425B TWI331425B TW096102834A TW96102834A TWI331425B TW I331425 B TWI331425 B TW I331425B TW 096102834 A TW096102834 A TW 096102834A TW 96102834 A TW96102834 A TW 96102834A TW I331425 B TWI331425 B TW I331425B
- Authority
- TW
- Taiwan
- Prior art keywords
- body portion
- guiding member
- small holes
- positioning
- hole
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 claims description 36
- 230000007246 mechanism Effects 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 206010070834 Sensitisation Diseases 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000008313 sensitization Effects 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 210000002784 stomach Anatomy 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 description 15
- 230000008859 change Effects 0.000 description 12
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000004804 winding Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005363 electrowinning Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Landscapes
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006020382 | 2006-01-30 | ||
| JP2006205935A JP2007227341A (ja) | 2006-01-30 | 2006-07-28 | ガイド部材及びガイド部材を備えた接続ボード並びにガイド部材の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200810268A TW200810268A (en) | 2008-02-16 |
| TWI331425B true TWI331425B (enExample) | 2010-10-01 |
Family
ID=38309326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096102834A TW200810268A (en) | 2006-01-30 | 2007-01-25 | Guide member, connecting board with guide member, and method for manufacturing guide member |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20090021924A1 (enExample) |
| JP (1) | JP2007227341A (enExample) |
| KR (1) | KR20080081205A (enExample) |
| CN (1) | CN101416361B (enExample) |
| TW (1) | TW200810268A (enExample) |
| WO (1) | WO2007086549A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI503557B (zh) * | 2012-10-26 | 2015-10-11 | Techwing Co Ltd | 測試分選機用插件 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4065898B2 (ja) * | 2006-01-30 | 2008-03-26 | アルプス電気株式会社 | 接続ボード |
| JP4895979B2 (ja) * | 2007-11-06 | 2012-03-14 | 日本航空電子工業株式会社 | コネクタ |
| US8896403B2 (en) | 2009-10-19 | 2014-11-25 | Exscitron Gmbh | Inductive electronic module and use thereof |
| DE102010014281A1 (de) * | 2010-04-08 | 2011-10-13 | Exscitron Gmbh | Induktive elektronische Baugruppe und Verwendung einer solchen |
| JP6063145B2 (ja) * | 2012-04-27 | 2017-01-18 | 本田技研工業株式会社 | 半導体チップの通電検査装置 |
| JP6341634B2 (ja) | 2013-05-28 | 2018-06-13 | 新光電気工業株式会社 | プローブガイド板及びその製造方法、半導体検査装置 |
| KR102355016B1 (ko) * | 2014-12-11 | 2022-01-25 | 엘지이노텍 주식회사 | 이미지 센서의 각도 조절이 가능한 카메라 모듈 |
| TWI583963B (zh) * | 2016-04-18 | 2017-05-21 | 旺矽科技股份有限公司 | 探針卡 |
| US10187634B2 (en) | 2016-08-12 | 2019-01-22 | Avegant Corp. | Near-eye display system including a modulation stack |
| JP7084738B2 (ja) * | 2018-02-14 | 2022-06-15 | 川崎重工業株式会社 | 実装装置及び実装方法 |
| TWI767860B (zh) * | 2021-10-27 | 2022-06-11 | 福懋科技股份有限公司 | 封裝陣列基板的測試裝置及其測試方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60112090U (ja) * | 1983-12-29 | 1985-07-29 | 磐田電工株式会社 | デバイス用ソケツト |
| JP3674300B2 (ja) * | 1998-03-16 | 2005-07-20 | Ｊｓｒ株式会社 | 半導体素子検査装置および検査方法 |
| JPWO2003007435A1 (ja) * | 2001-07-13 | 2004-11-04 | 日本発条株式会社 | コンタクタ |
| JP2003168100A (ja) * | 2001-12-03 | 2003-06-13 | Matsushita Electric Ind Co Ltd | カード端末装置 |
| JP2005134373A (ja) * | 2003-10-09 | 2005-05-26 | Alps Electric Co Ltd | スパイラル接触子を用いた接続装置 |
| JP3971749B2 (ja) * | 2004-01-21 | 2007-09-05 | 株式会社アドバンストシステムズジャパン | 凸型スパイラルコンタクタおよびその製造方法 |
| JP2005349463A (ja) * | 2004-06-14 | 2005-12-22 | Toyota Auto Body Co Ltd | 筋状凹凸成形方法および同筋状凹凸成形方法によって製造される燃料電池用のメタルセパレータ |
-
2006
- 2006-07-28 JP JP2006205935A patent/JP2007227341A/ja not_active Withdrawn
-
2007
- 2007-01-25 TW TW096102834A patent/TW200810268A/zh not_active IP Right Cessation
- 2007-01-29 CN CN2007800124356A patent/CN101416361B/zh not_active Expired - Fee Related
- 2007-01-29 KR KR1020087018735A patent/KR20080081205A/ko not_active Abandoned
- 2007-01-29 WO PCT/JP2007/051349 patent/WO2007086549A1/ja not_active Ceased
-
2008
- 2008-07-29 US US12/181,698 patent/US20090021924A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI503557B (zh) * | 2012-10-26 | 2015-10-11 | Techwing Co Ltd | 測試分選機用插件 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200810268A (en) | 2008-02-16 |
| CN101416361A (zh) | 2009-04-22 |
| JP2007227341A (ja) | 2007-09-06 |
| KR20080081205A (ko) | 2008-09-08 |
| CN101416361B (zh) | 2011-05-25 |
| WO2007086549A1 (ja) | 2007-08-02 |
| US20090021924A1 (en) | 2009-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |