TWI330109B - - Google Patents

Download PDF

Info

Publication number
TWI330109B
TWI330109B TW096142866A TW96142866A TWI330109B TW I330109 B TWI330109 B TW I330109B TW 096142866 A TW096142866 A TW 096142866A TW 96142866 A TW96142866 A TW 96142866A TW I330109 B TWI330109 B TW I330109B
Authority
TW
Taiwan
Prior art keywords
coating liquid
discharge port
slit
flow path
slit nozzle
Prior art date
Application number
TW096142866A
Other languages
English (en)
Chinese (zh)
Other versions
TW200900162A (en
Inventor
Shinji Takase
Kazunobu Yamaguchi
Hirotsugu Kumazawa
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200900162A publication Critical patent/TW200900162A/zh
Application granted granted Critical
Publication of TWI330109B publication Critical patent/TWI330109B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Nozzles (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096142866A 2006-12-12 2007-11-13 Slit nozzle TW200900162A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006333930A JP5202838B2 (ja) 2006-12-12 2006-12-12 スリットノズル

Publications (2)

Publication Number Publication Date
TW200900162A TW200900162A (en) 2009-01-01
TWI330109B true TWI330109B (ja) 2010-09-11

Family

ID=39515429

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096142866A TW200900162A (en) 2006-12-12 2007-11-13 Slit nozzle

Country Status (4)

Country Link
JP (1) JP5202838B2 (ja)
KR (1) KR100940986B1 (ja)
CN (1) CN101199961B (ja)
TW (1) TW200900162A (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5157486B2 (ja) * 2008-01-30 2013-03-06 大日本印刷株式会社 ダイヘッド及びこれを備えたダイコーター
KR100968770B1 (ko) * 2008-06-20 2010-07-08 주식회사 디엠에스 현상액 도포장치
JP5303232B2 (ja) * 2008-09-30 2013-10-02 東京応化工業株式会社 ノズル、塗布装置及びノズルのメンテナンス方法
JP5764978B2 (ja) * 2011-03-04 2015-08-19 東レ株式会社 塗布器
CN102688828A (zh) * 2011-03-25 2012-09-26 恒辉新能源（昆山）有限公司 高精度涂布器
JP5815984B2 (ja) * 2011-05-19 2015-11-17 富士機械工業株式会社 塗工装置
JP5970864B2 (ja) * 2012-03-02 2016-08-17 大日本印刷株式会社 スリットノズル
CN103801466B (zh) * 2012-11-15 2015-11-18 沈阳芯源微电子设备有限公司 一种低冲击力均布流量的湿法处理工艺喷嘴
JP5494788B2 (ja) * 2012-12-06 2014-05-21 大日本印刷株式会社 ダイヘッド及びこれを備えたダイコーター
KR102052061B1 (ko) * 2013-05-24 2019-12-04 삼성에스디아이 주식회사 슬릿 노즐의 형상 결정장치 및 방법
KR102106443B1 (ko) * 2013-05-24 2020-05-04 삼성에스디아이 주식회사 슬릿 노즐 및 이를 이용한 슬릿 코팅 장치
JP6196916B2 (ja) * 2014-02-25 2017-09-13 東京応化工業株式会社 ノズルおよび塗布装置
CN103984213B (zh) * 2014-04-15 2017-05-31 清华大学深圳研究生院 一种具有均压流道的均匀出流显影喷嘴
CN104166318A (zh) * 2014-09-09 2014-11-26 清华大学深圳研究生院 静压出流显影喷嘴
JP6367075B2 (ja) * 2014-10-08 2018-08-01 株式会社ヒラノテクシード ダイとダイの空気抜き方法
JP6564648B2 (ja) * 2015-08-20 2019-08-21 東京応化工業株式会社 ノズルおよび塗布装置
CN105170406B (zh) * 2015-09-16 2018-04-24 华南师范大学 狭缝涂布单元、涂布头以及涂布设备
JP6341957B2 (ja) * 2016-08-10 2018-06-13 富士機械工業株式会社 塗工装置
KR102368359B1 (ko) 2019-05-14 2022-02-25 주식회사 엘지에너지솔루션 에어 벤트를 포함하는 슬롯 다이 코팅 장치
JP2022041420A (ja) * 2020-09-01 2022-03-11 エムテックスマート株式会社 塗布方法、燃料電池の製造方法または燃料電池、２次電池の製造方法または２次電池、全固体電池の製造方法または全固体電池

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11156278A (ja) * 1997-11-27 1999-06-15 Dainippon Screen Mfg Co Ltd 処理液吐出ノズル及びそれを備えた基板処理装置
JP2003245583A (ja) * 2002-02-25 2003-09-02 Hirata Corp 液体塗布装置
JP4315787B2 (ja) * 2003-11-18 2009-08-19 大日本スクリーン製造株式会社 基板処理装置、並びに被充填体における液体充填度および気体混入度判定構造
KR20050116417A (ko) * 2004-06-07 2005-12-12 삼성전자주식회사 코팅물질 도포장치
JP2005349280A (ja) * 2004-06-09 2005-12-22 Tokyo Ohka Kogyo Co Ltd スリットノズル
JP4619139B2 (ja) * 2005-01-19 2011-01-26 東京応化工業株式会社 スリットノズル
JP4835003B2 (ja) * 2005-02-07 2011-12-14 凸版印刷株式会社 スリットノズル及びスリットノズルの気泡排出方法並びに塗布装置
KR200427086Y1 (ko) 2006-07-03 2006-09-20 박대용 방사 노즐

Also Published As

Publication number Publication date
JP2008142648A (ja) 2008-06-26
KR100940986B1 (ko) 2010-02-05
CN101199961A (zh) 2008-06-18
CN101199961B (zh) 2011-02-09
JP5202838B2 (ja) 2013-06-05
KR20080054348A (ko) 2008-06-17
TW200900162A (en) 2009-01-01

Similar Documents

Publication Publication Date Title
TWI330109B (ja)
TWI310885B (en) Apparatus for coating photoresist having slit nozzle
TWI335872B (en) Air management in a fluid ejection device
EP2255889A2 (en) Slot nozzle assembly, slot coating gun, shim plate, and method of extruding a foamable melted material in a wide band
JP2014237323A (ja) 液滴吐出装置内での流体再循環
KR20150135317A (ko) 도포 장치
CN107078045A (zh) 使用定向成在喷洒主体下方且向入口端口引导流体的流体出口的抛光垫清洗系统及相关方法
WO2014156404A1 (ja) 塗布装置
WO2006031603A3 (en) Process for making a micro-fluid ejection head structure
EP1356937A3 (en) Ink jet head
TWI344863B (en) Slit nozzle
KR20160033026A (ko) 도포기, 도포 장치, 및 도포 방법
TWI613094B (zh) 噴嘴頭，製造該噴嘴頭的方法和具有該噴嘴頭的液體供給設備
JP5989843B2 (ja) 塗工装置
JP2016019975A (ja) 塗布装置
JP2005349280A (ja) スリットノズル
JP2006305548A (ja) 塗布装置および塗布方法
JP6655479B2 (ja) 塗布器及び塗布装置
JP5385974B2 (ja) フレキシブル回路シール
JP6341957B2 (ja) 塗工装置
JP5625299B2 (ja) 塗布装置
JP3739649B2 (ja) 塗布ノズル
JP2010274255A (ja) 液体貯留容器、塗布液体供給システムおよびインクジェット記録装置
CN219377777U (zh) 隔膜微凹涂布料盒及电池隔膜涂布机
JP2006102598A (ja) 塗布ノズル