TWI330109B - - Google Patents

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TWI330109B
TWI330109B TW096142866A TW96142866A TWI330109B TW I330109 B TWI330109 B TW I330109B TW 096142866 A TW096142866 A TW 096142866A TW 96142866 A TW96142866 A TW 96142866A TW I330109 B TWI330109 B TW I330109B
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TW
Taiwan
Prior art keywords
coating liquid
discharge port
slit
flow path
slit nozzle
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TW096142866A
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Chinese (zh)
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TW200900162A (en
Inventor
Shinji Takase
Kazunobu Yamaguchi
Hirotsugu Kumazawa
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Tokyo Ohka Kogyo Co Ltd
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Publication of TW200900162A publication Critical patent/TW200900162A/en
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Publication of TWI330109B publication Critical patent/TWI330109B/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Nozzles (AREA)

Description

1330109 九、發明說明 【發明所屬之技術領域】 本發明係關於以一定寬度將塗佈液塗佈在基板表面的 狹縫式噴嘴。 【先前技術】 將光阻等塗佈液塗佈在玻璃基板等之表面的方法,有 利用旋轉塗佈者,其係將液塗佈從一般之噴嘴滴至基板表 面,然後藉由使之高速旋轉以形成均一之厚度。然而,以 該方法所塗佈之塗佈液有90%以上會飛散而造成很大的 浪費。因此,最近所進行之方法係使用狹縫式噴嘴以一定 寬度將塗佈液塗佈在基板之後,使之以某種程度旋轉來形 成均一之塗膜厚度,或使用狹縫式噴嘴以一定寬度將塗佈 液塗佈在基板但不使之旋轉而結束塗佈步驟。 如上述,爲減少塗佈液之浪費其條件係盡可能不要使 基板旋轉並使塗膜厚度均一。因此,對狹縫式噴嘴必須要 求沿著狹縫狀吐出口從吐出口所吐出之塗佈液的量爲均 一。爲確保該均一性以往已提出各種提案。 圖6(a)係表示習知狹縫式噴嘴之槪要的立體圖,(b) 係表示構成同狹縫式噴嘴之噴嘴半體的圖。狹縫式噴嘴 1 00,係由2個半體1 〇 1、1 02相對向組合所構成,在一側 之半體101的中央形成塗佈液供給孔103,從該塗佈液供 給孔103所供應之塗佈液,係透過形成於2個半體101、 102間之流路104,從狹縫狀吐出口 105朝向基板表面塗 -5- 1330109 佈。又,以往係將流路1 04形成爲經過頂板部之山形,並 在其頂部開設供將流路1 04內之氣泡排出的氣泡排出口 10 6。 然而,最近爲因應基板尺寸之大型化,狹縫式噴嘴亦 大型化,隨此流路1 04之頂板部的傾斜度變小而逐漸產生 流路內之氣泡無法充分脫離的問題。若氣泡不易脫離,則 會延長氣泡去除作業所須之閒置時間,且脫離不完全所殘 留之氣泡會與塗佈液一起從吐出口排出,而成爲在塗膜產 生條紋的原因。 專利文獻1中,如圖6(c)所示,係將進行狹縫式噴嘴 內之氣泡排出的通氣口設在狹縫式噴嘴之長邊方向的兩端 部。此外,使狹縫式噴嘴之氣泡累積部內的上部,以從狹 縫式噴嘴之中央部向兩端部緩緩變高的方式,傾斜成V 字形。 又,專利文獻2中,係藉由吸引泵所產生之氣泡吸引 以將來自狹縫式噴嘴之氣泡排出。 [專利文獻1]日本特開2006 - 212592號公報 [專利文獻2]日本特開2006 - 87999號公報 【發明內容】 [發明欲解決之課題] 專利文獻1所揭示之狹縫式噴嘴,氣泡雖容易脫離, 但僅在兩端之通氣口到進行氣泡排出之通氣口之距離較 遠,所以未必是萬全。又,由於氣泡蓄積部內之上部,係 -6- 1330109 以自狹縫式噴嘴之中央部向兩端部緩緩變高的方式傾斜, 因此氣泡呈大容量蓄積。 又,一般亦認爲由於相對於塗佈液量空氣所佔之容積 相對變大,因此因空氣所造成之阻尼效果,導致塗佈液供 給泵所產生之對塗佈液的加壓不足,而使吐出壓之控制變 得困難。 又,以專利文獻2所揭示之利用吸引泵的方法,係難 以分離吸引混在塗佈液中之氣泡。 [用以解決課題之手段] 爲解決上述課題,本發明係一種狹縫式噴嘴,形成有 供應塗佈液之塗佈液供給口、供使塗部液往下流至基板上 之寬幅狹縫狀吐出口、以及連接前述塗佈液供給口與狹縫 狀吐出口之塗佈液流路,並將其構成設爲:前述塗佈液流 路之頂板面係形成爲具有複數個傾斜之相連山狀,並於相 連山狀塗佈液流路之頂部設有用來排出塗佈液流路內之氣 泡的排出口。 除開口於前述相連山狀塗佈液流路之頂部的排出口 外,排出口亦可形成於狹縫式噴嘴長邊方向之兩端部側面 或長邊方向之中央部。 [發明效果] 根據本發明之狹縫式噴嘴,由於在相連山狀塗佈液流 路之頂部開設有複數個用來排出塗佈液流路內之氣泡的排 f; S ) -7- 1330109 孔之下端即成爲狹縫狀吐出口 9。 又,爲防止塗佈液從第1貯留部4'第2貯留部5、 及小孔8洩漏,在噴嘴之兩端安裝有端板10, n。 以上’從塗佈液供給孔6流入第1貯留部4之塗佈 液,係經過第1貯留部4均等地流入第2貯留部5。此 外’爲提高均等流入之效果,亦可將2個塗佈液供給孔6 形成在2個山之頂點亦即塗佈液供給孔6的附近。 混入塗佈液之氣泡(空氣),在從第1貯留部4流往第 2貯留部5之期間,雖脫離塗佈液而累積在第1貯留部4 之頂板部分,但由於第1貯留部4係形成爲2個相連山 狀,因此空氣會沿頂板到達頂部,並從開設於頂部之氣泡 排出口 7排出。 在圖6之已述的習知機構中,由於氣泡排出口爲一處 或與塗佈液供給孔6之距離過大,因此若應用於狹縫寬度 較寬之狹縫式噴嘴即難以排出空氣,但在本發明之狹縫式 噴嘴則容易排出空氣。 本發明之狹縫式噴嘴,除上述例之外亦可將氣泡排出 口 7以複數個並設於各種部位。圖4係表示本發明之狹縫 式噴嘴之其他例的正視圖。爲加以簡化該圖中僅表示氣泡 排出口 7以外之氣泡排出口 7a, 7b,7c之位置與氣泡排出 方向。 又,圖5係表示其他實施例之狹縫式噴嘴的剖面圖, 氣泡排出口 7開口之面係設於背面,而非噴嘴半體1之上 面0 -9- 1330109 塗佈液係從塗佈液供給孔6送至未圖示之第1貯留 部。又’混在塗佈液之氣泡即轉變成空氣並累積在第1貯 留部之頂板部分。此處,形成僅以排出口 7a爲頂點之第 1貯留部係圖6 (b)所示之習知例。其他實施例中,係同時 設置排出口 7與長邊方向兩端之排出口 7 b, 7b»或者,同 時設置排出口 7與長邊方向兩端之排出口 7 c, 7c。 又,開設2處排出口 7係圖2之實施例,此時,亦可 使排出口開口於如圖5所示之側面》再者,亦可適當組合 以上說明之排出口 7a,7b,以及7c中之2個或2個以 上,來構成本發明之狹縫式噴嘴。此時,如前述最好使第 1貯留部傾斜成各排出口能位於頂點》 【圖式簡單說明】 [圖1]係本發明之狹縫式噴嘴的立體圖。 [圖2]係表示構成本發明之狹縫式噴嘴之噴嘴半體的 圖。 [圖3] (a)係圖1之A — A方向剖面圖,(b)係圖1之B 一 B方向剖面圖。 [圖4]係表示其他實施例之狹縫式噴嘴的正視圖。 [圖5 ]係表示其他實施例之狹縫式噴嘴的剖面圖。 [圖6](a)係習知狹縫式噴嘴的立體圖,(b)及(c)係表 示構成習知狹縫式噴嘴之噴嘴半體的圖。 【主要元件符號說明】 -10- 1330109 1,2 :噴嘴半體 3 :塗佈液流路 4 :第1貯留部 5 :第2貯留部 / 6 :塗佈液供給孔 7, 7a,7b, 7c :氣泡排出口 8 :形成小孔之平坦面 φ 9 :狹縫狀吐出口 10, 1 1 :端板 100 :狹縫式噴嘴 101 , 1 02 :狹縫半體 103 :塗佈液供給孔 1 0 4 :塗佈液流路 1 〇 5 :狹縫狀吐出口 1 〇 6 :氣泡排出口 -11 -[Technical Field] The present invention relates to a slit nozzle which coats a coating liquid on a surface of a substrate with a certain width. [Prior Art] A method of applying a coating liquid such as a photoresist onto the surface of a glass substrate or the like is a method of applying a spin coating to a surface of a substrate from a general nozzle, and then making it high speed. Rotate to form a uniform thickness. However, more than 90% of the coating liquid applied by this method will scatter and cause a great waste. Therefore, a method recently carried out is to apply a coating liquid to a substrate with a certain width using a slit nozzle, to rotate it to some extent to form a uniform coating film thickness, or to use a slit nozzle to have a certain width. The coating liquid was applied to the substrate without being rotated to complete the coating step. As described above, in order to reduce the waste of the coating liquid, the condition is such that the substrate is not rotated as much as possible and the thickness of the coating film is uniform. Therefore, it is necessary for the slit nozzle to have a uniform amount of the coating liquid discharged from the discharge port along the slit-shaped discharge port. Various proposals have been made in the past to ensure this uniformity. Fig. 6(a) is a perspective view showing a conventional slit type nozzle, and Fig. 6(b) is a view showing a nozzle half body constituting the same slit type nozzle. The slit nozzle 100 is formed by opposing the two half bodies 1 〇1 and 102, and a coating liquid supply hole 103 is formed in the center of the one half body 101, and the coating liquid supply hole 103 is provided. The coating liquid to be supplied is passed through a flow path 104 formed between the two halves 101 and 102, and is coated with a -5 to 1330109 cloth from the slit-shaped discharge port 105 toward the surface of the substrate. Further, in the related art, the flow path 104 is formed in a mountain shape passing through the top plate portion, and a bubble discharge port 106 for discharging the air bubbles in the flow path 104 is opened at the top. However, recently, in order to increase the size of the substrate, the size of the slit nozzle has also increased, and as the inclination of the top plate portion of the flow path 104 is reduced, the problem that the bubbles in the flow path cannot be sufficiently separated is gradually generated. If the bubble is not easily detached, the idle time required for the bubble removing operation is prolonged, and the bubble remaining after the incomplete detachment is discharged from the discharge port together with the coating liquid, which causes the streaking of the coating film. In the patent document 1, as shown in Fig. 6 (c), the vent holes for discharging the air bubbles in the slit nozzle are provided at both ends in the longitudinal direction of the slit nozzle. In addition, the upper portion of the bubble accumulating portion of the slit nozzle is inclined in a V shape so as to gradually increase from the central portion of the slit nozzle to both end portions. Further, in Patent Document 2, the bubbles from the slit nozzle are discharged by the suction of the bubbles generated by the suction pump. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2006-87999 (Patent Document 2) JP-A-2006-87999 (Problem to be Solved by the Invention) The slit nozzle disclosed in Patent Document 1 has a bubble It is easy to disengage, but it is not necessarily the only distance from the vents at both ends to the vents where the bubbles are discharged. In addition, since the upper portion of the bubble accumulating portion is inclined so as to gradually increase from the central portion of the slit nozzle to the both end portions, the bubbles are accumulated in a large capacity. In addition, it is generally considered that the volume occupied by the air relative to the amount of the coating liquid is relatively large, so that the damping effect by the air causes insufficient pressure on the coating liquid generated by the coating liquid supply pump. It is difficult to control the discharge pressure. Further, in the method using the suction pump disclosed in Patent Document 2, it is difficult to separate and attract the bubbles mixed in the coating liquid. [Means for Solving the Problem] In order to solve the above problems, the present invention is a slit nozzle in which a coating liquid supply port for supplying a coating liquid and a wide slit for allowing a coating liquid to flow down onto a substrate are formed. a discharge port and a coating liquid flow path that connects the coating liquid supply port and the slit-shaped discharge port, and the top surface of the coating liquid flow path is formed to have a plurality of inclined connections The mountain shape is provided with a discharge port for discharging the bubbles in the coating liquid flow path at the top of the connected mountain-shaped coating liquid flow path. The discharge port may be formed at the side portions of the both end portions in the longitudinal direction of the slit nozzle or the central portion in the longitudinal direction, except for the discharge port that is opened at the top of the flow path of the connected mountain-shaped coating liquid. [Effect of the Invention] According to the slit nozzle of the present invention, a plurality of rows f for discharging the bubbles in the flow path of the coating liquid are provided at the top of the flow path of the connected mountain-shaped coating liquid; S) -7- 1330109 The lower end of the hole is a slit-shaped discharge port 9. Further, in order to prevent the coating liquid from leaking from the first storage portion 5' of the first storage portion 4' and the small holes 8, the end plates 10, n are attached to both ends of the nozzle. The above-described application liquid that has flowed into the first storage unit 4 from the coating liquid supply hole 6 flows into the second storage unit 5 uniformly through the first storage unit 4. Further, in order to enhance the effect of the uniform inflow, the two coating liquid supply holes 6 may be formed in the vicinity of the coating liquid supply holes 6 at the apex of the two mountains. The air bubbles (air) mixed with the coating liquid are accumulated in the top plate portion of the first storage portion 4 while leaving the coating liquid while flowing from the first storage portion 4 to the second storage portion 5, but the first storage portion The 4 series is formed in two connected mountains, so that the air reaches the top along the top plate and is discharged from the bubble discharge port 7 opened at the top. In the conventional mechanism described in FIG. 6, since the bubble discharge port is one place or the distance from the coating liquid supply hole 6 is too large, it is difficult to discharge the air if it is applied to a slit type nozzle having a wide slit width. However, in the slit nozzle of the present invention, air is easily discharged. In addition to the above examples, the slit nozzle of the present invention may be provided in a plurality of bubble discharge ports 7 in various places. Fig. 4 is a front elevational view showing another example of the slit nozzle of the present invention. In order to simplify the figure, only the positions of the bubble discharge ports 7a, 7b, 7c other than the bubble discharge port 7 and the bubble discharge direction are shown. 5 is a cross-sectional view showing a slit nozzle of another embodiment, the surface of the bubble discharge port 7 is provided on the back surface instead of the upper surface of the nozzle half 1 0 -9 - 1330109. The liquid supply hole 6 is sent to a first storage portion (not shown). Further, the bubbles mixed in the coating liquid are converted into air and accumulated in the top plate portion of the first storage portion. Here, the first storage portion having only the discharge port 7a as a vertex is formed as a conventional example shown in Fig. 6(b). In other embodiments, the discharge port 7 and the discharge ports 7 b, 7b» at both ends in the longitudinal direction are simultaneously provided, and at the same time, the discharge port 7 and the discharge ports 7 c, 7c at both ends in the longitudinal direction are provided. Further, two discharge ports 7 are provided in the embodiment of Fig. 2, and in this case, the discharge port may be opened on the side as shown in Fig. 5, and the discharge ports 7a, 7b described above may be appropriately combined, and Two or more of 7c are used to constitute the slit nozzle of the present invention. In this case, it is preferable that the first storage portion is inclined so that the discharge ports can be located at the apex as described above. [Fig. 1] Fig. 1 is a perspective view of the slit nozzle of the present invention. Fig. 2 is a view showing a nozzle half constituting a slit nozzle of the present invention. [Fig. 3] (a) is a cross-sectional view taken along line A - A of Fig. 1, and (b) is a cross-sectional view taken along line B - B of Fig. 1. Fig. 4 is a front elevational view showing a slit nozzle of another embodiment. Fig. 5 is a cross-sectional view showing a slit nozzle of another embodiment. Fig. 6 (a) is a perspective view showing a conventional slit nozzle, and (b) and (c) are views showing a nozzle half body constituting a conventional slit nozzle. [Description of main component symbols] -10- 1330109 1,2 : Nozzle half 3 : Coating liquid flow path 4 : First storage portion 5 : Second storage portion / 6 : Coating liquid supply holes 7, 7a, 7b, 7c: bubble discharge port 8: flat surface φ 9 forming a small hole: slit-shaped discharge port 10, 1 1 : end plate 100: slit nozzle 101, 012: slit half body 103: coating liquid supply hole 1 0 4 : Coating liquid flow path 1 〇 5 : slit-shaped discharge port 1 〇 6 : bubble discharge port -11 -

Claims (1)

1330109 十、申請專利範圍 1. 一種狹縫式噴嘴,形成有供應塗佈液之塗佈液供 給口、供使塗佈液往下流至基板上之寬幅狹縫狀吐出口、 以及連接前述塗佈液供給口與狹縫狀吐出口之塗佈液流 路,其特徵爲: 前述塗佈液流路之頂扳面係形成爲具有複數個傾斜之 相連山狀,並於相連山狀塗佈液流路之頂部設有用來排出 塗佈液流路內之氣泡的排出口。 2. 如申請專利範圍第1項所記載之狹縫式噴嘴,其 中,前述排出口亦形成於狹縫式噴嘴長邊方向之兩端部側 面或長邊方向之中央部。1330109 X. Patent Application Range 1. A slit nozzle formed with a coating liquid supply port for supplying a coating liquid, a wide slit-like discharge port for allowing a coating liquid to flow down onto a substrate, and a connection of the aforementioned coating a coating liquid flow path of the cloth liquid supply port and the slit-shaped discharge port, wherein the top surface of the coating liquid flow path is formed to have a plurality of inclined mountain shapes, and is coated in a mountain shape. A discharge port for discharging air bubbles in the flow path of the coating liquid is provided at the top of the liquid flow path. 2. The slit nozzle according to the first aspect of the invention, wherein the discharge port is formed in a side portion of the both end portions in the longitudinal direction of the slit nozzle or a central portion in the longitudinal direction. -12--12-
TW096142866A 2006-12-12 2007-11-13 Slit nozzle TW200900162A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006333930A JP5202838B2 (en) 2006-12-12 2006-12-12 Slit nozzle

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TW200900162A TW200900162A (en) 2009-01-01
TWI330109B true TWI330109B (en) 2010-09-11

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JP (1) JP5202838B2 (en)
KR (1) KR100940986B1 (en)
CN (1) CN101199961B (en)
TW (1) TW200900162A (en)

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