TWI328142B - - Google Patents

Download PDF

Info

Publication number
TWI328142B
TWI328142B TW095110566A TW95110566A TWI328142B TW I328142 B TWI328142 B TW I328142B TW 095110566 A TW095110566 A TW 095110566A TW 95110566 A TW95110566 A TW 95110566A TW I328142 B TWI328142 B TW I328142B
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
weight
parts
film
Prior art date
Application number
TW095110566A
Other languages
English (en)
Chinese (zh)
Other versions
TW200705100A (en
Inventor
Kiwamu Tokuhisa
Kentaro Hayashi
Hironobu Kawasato
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200705100A publication Critical patent/TW200705100A/zh
Application granted granted Critical
Publication of TWI328142B publication Critical patent/TWI328142B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y10S430/121—Nitrogen in heterocyclic ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymerisation Methods In General (AREA)
TW095110566A 2005-03-30 2006-03-27 Photosensitive resin composition and circuit substrate employing the same TW200705100A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005098369 2005-03-30

Publications (2)

Publication Number Publication Date
TW200705100A TW200705100A (en) 2007-02-01
TWI328142B true TWI328142B (enExample) 2010-08-01

Family

ID=37086800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110566A TW200705100A (en) 2005-03-30 2006-03-27 Photosensitive resin composition and circuit substrate employing the same

Country Status (6)

Country Link
US (1) US8026036B2 (enExample)
JP (1) JP4199294B2 (enExample)
KR (1) KR100921149B1 (enExample)
CN (1) CN101151579B (enExample)
TW (1) TW200705100A (enExample)
WO (1) WO2006109514A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007233319A (ja) * 2006-01-31 2007-09-13 Kaneka Corp 感光性樹脂組成物およびその利用
JP5087638B2 (ja) * 2007-12-10 2012-12-05 新日鐵化学株式会社 難燃性感光性樹脂組成物及びこれを用いた回路基板
WO2009102035A1 (ja) * 2008-02-15 2009-08-20 Asahi Kasei E-Materials Corporation 樹脂組成物
TWI470353B (zh) * 2009-03-26 2015-01-21 Nippon Steel & Sumikin Chem Co A photosensitive resin composition and a hardening film
KR101443293B1 (ko) * 2009-10-15 2014-09-19 주식회사 엘지화학 알칼리 수용액으로 현상 가능한 감광성 수지 조성물 및 이에 의해 제조된 드라이 필름
WO2011046397A2 (ko) * 2009-10-15 2011-04-21 주식회사 엘지화학 감광성 수지 조성물 및 이를 포함하는 드라이 필름
JP2013056964A (ja) * 2011-09-07 2013-03-28 Jnc Corp インクジェットインク
JP5435054B2 (ja) * 2012-02-09 2014-03-05 Ｊｎｃ株式会社 インクジェット用インクおよび当該インクにより得られる硬化膜形成方法
CN103122068B (zh) * 2012-12-25 2015-07-08 中山大学 一种uv涂料用聚酰亚胺丙烯酸酯低聚物
CN107406675B (zh) * 2015-03-31 2020-11-06 日产化学工业株式会社 剥离层形成用组合物和剥离层
KR102223837B1 (ko) * 2018-06-21 2021-03-04 주식회사 엘지화학 가지형 공중합체, 이를 이용한 감광성 수지 조성물, 감광성 수지 필름 및 광학 장치
JP7277573B2 (ja) * 2019-05-08 2023-05-19 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01283554A (ja) 1988-05-11 1989-11-15 Hitachi Ltd 耐熱感光性重合体組成物
EP0478321B1 (en) * 1990-09-28 1997-11-12 Kabushiki Kaisha Toshiba Photosenstive resin composition for forming polyimide film pattern and method of forming polyimide film pattern
JPH04300921A (ja) 1991-03-29 1992-10-23 Mitsubishi Kasei Corp 含芳香族複素環ポリイミド
US5756260A (en) * 1993-02-16 1998-05-26 Sumitomo Bakelite Company Limited Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same
JP3281473B2 (ja) 1994-01-17 2002-05-13 日本化薬株式会社 フレキシブルプリント配線板用レジストインキ組成物及びその硬化物
JPH09100350A (ja) * 1995-07-28 1997-04-15 Ube Ind Ltd 感光性ポリイミドシロキサン、組成物および絶縁膜
JPH09110350A (ja) 1995-10-18 1997-04-28 Kenji Hasegawa 複数レーン型エスカレーター（速いエスカレーター）
US5914354A (en) * 1996-08-12 1999-06-22 Shin-Etsu Chemical Co., Ltd. Radiation-sensitive resin composition
US5962113A (en) * 1996-10-28 1999-10-05 International Business Machines Corporation Integrated circuit device and process for its manufacture
JP3366859B2 (ja) * 1998-03-05 2003-01-14 日立化成デュポンマイクロシステムズ株式会社 感光性ポリイミド前駆体用現像液及びこれを用いたパターン製造法
JP2000221681A (ja) 1999-01-28 2000-08-11 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造法及び電子部品
JP4476417B2 (ja) * 2000-02-29 2010-06-09 新日鐵化学株式会社 赤色カラーレジストインキ及びカラーフィルター
JP2002006490A (ja) 2000-06-26 2002-01-09 Ube Ind Ltd イミド系感光性樹脂組成物、絶縁膜およびその形成法
US6686106B2 (en) 2000-06-26 2004-02-03 Ube Industries, Ltd. Photosensitive resin compositions, insulating films, and processes for formation of the films
JP2002162736A (ja) 2000-11-22 2002-06-07 Kanegafuchi Chem Ind Co Ltd 感光性ドライフィルム
JP2004294882A (ja) 2003-03-27 2004-10-21 Nippon Steel Chem Co Ltd 感光性樹脂組成物及び硬化物
JP4300921B2 (ja) 2003-07-22 2009-07-22 富士ゼロックス株式会社 プリントヘッド
JP3995253B2 (ja) * 2004-09-28 2007-10-24 Ｔｄｋ株式会社 感光性ポリイミドパターンの形成方法及び該パターンを有する電子素子

Also Published As

Publication number Publication date
US20090202786A1 (en) 2009-08-13
JP4199294B2 (ja) 2008-12-17
WO2006109514A1 (ja) 2006-10-19
CN101151579A (zh) 2008-03-26
KR20080002907A (ko) 2008-01-04
CN101151579B (zh) 2010-10-06
JPWO2006109514A1 (ja) 2008-10-23
TW200705100A (en) 2007-02-01
KR100921149B1 (ko) 2009-10-12
US8026036B2 (en) 2011-09-27

Similar Documents

Publication Publication Date Title
JP7066918B2 (ja) ビスマレイミド化合物、それを用いた感光性樹脂組成物、その硬化物及び半導体素子
JP7375761B2 (ja) ネガ型感光性樹脂組成物、ネガ型感光性樹脂組成物フィルム、硬化膜、これらを用いた中空構造体、および電子部品
TWI785264B (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體元件及熱鹼產生劑
KR102859438B1 (ko) 감광성 수지 조성물 및 그의 경화막
JP4930883B2 (ja) 感光性樹脂組成物及びそれを用いた回路基板
TWI470353B (zh) A photosensitive resin composition and a hardening film
JP5038721B2 (ja) 不飽和基含有ポリイミド樹脂、それを含有する感光性樹脂組成物及びその硬化物
TWI328142B (enExample)
TWI819121B (zh) 硬化膜的製造方法、硬化膜、積層體的製造方法及半導體元件的製造方法
JP2010211109A (ja) ポジ型感光性樹脂組成物及びそれを用いた樹脂パターンの製造方法
TWI870703B (zh) 硬化型感光性樹脂組成物、硬化物、抗蝕劑圖案及其製造方法、半導體元件及電子裝置
JP5644068B2 (ja) 感光性樹脂組成物、レジストパターンの製造法、及びハードディスクサスペンション
JP2011095355A (ja) 感光性樹脂組成物
TW200938955A (en) Flame-resistant photo-sensitive resin composition, and circuit board comprising the same
JP2010256881A (ja) 感光性樹脂組成物
JP2010204590A (ja) 感光性樹脂組成物及びこれを用いた回路配線基板
CN111936930A (zh) 感光性树脂组合物、固化膜、层叠体、固化膜的制造方法及半导体器件
JPH11130858A (ja) ポリイミド、その前駆体、それらの製造法及び感光性樹脂組成物
JPH11217414A (ja) 感光性樹脂組成物、その製造法及びこれを用いたソルダーレジストの製造法
US12504687B2 (en) Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device
CN105452383A (zh) 感光性树脂组合物、其浮雕图案膜、浮雕图案膜的制造方法、包含浮雕图案膜的电子部件或光学制品、和包含感光性树脂组合物的粘接剂
JP2008070477A (ja) 感光性樹脂フィルムとこれを用いた回路基板の製造方法
WO2024079925A1 (ja) 樹脂組成物、硬化物、半導体素子、およびドライフィルムレジスト
WO2025100302A1 (ja) ネガ型感光性樹脂組成物、それを用いた硬化レリーフパターンの製造方法、並びに半導体装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees