JPWO2006109514A1 - 感光性樹脂組成物及びこれを用いた回路基板 - Google Patents
感光性樹脂組成物及びこれを用いた回路基板 Download PDFInfo
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Abstract
Description
(式中、Arは芳香族テトラカルボン酸からカルボキシル基を除いた4価のテトラカルボン酸残基を示し、R1は炭素数1〜6のアルキル基又はフェニル基、R2は炭素数2〜6のアルキレン基又はフェニレン基、lは0〜10の数を示し、R3は2価の基又は直結合を示し、R4はCH2=CH−R6−で表される基を示し、R6は直結合、炭素数1〜6のアルキレン基又はフェニレン基を示し、R5はジアミン化合物からアミノ基を除いた2価ジアミン残基を示すが、式(1)及び(2)に含まれるジアミン残基である場合を除く。また、m、n及びoは各構成単位の存在モル比を表し、mは0.3〜0.95、nは0.05〜0.7及びoは0〜0.5の範囲である。なお、式(1)〜(3)中のArは、同一であっても異なってもよい。)
本発明のシロキサン含有ポリアミック酸樹脂は上記式(1)及び(2)で表される構成単位を有するが、式(3)で表される構成単位を有することが好ましい。式(1)、(2)及び(3)において、式中、Arは芳香族テトラカルボン酸からカルボキシル基を除いた4価のテトラカルボン酸残基を示すが、それぞれ同一であっても、異なっていてもよいし、2種類以上であってもよい。
シロキサン含有ポリアミック酸樹脂:50〜99wt%、好ましくは60〜90wt%、光重合開始剤:1〜20wt%、好ましくは2〜10wt%、増感剤:0〜2wt%、好ましくは0.05〜0.5wt%、他の樹脂、アクリレート等のモノマーからなる樹脂成分:0〜45wt%、好ましくは10〜30wt%。
本発明のフィルム状感光性樹脂組成物は、フォトリソ特性に優れるばかりでなく、硬化した場合に適度なフレキシブル性を有しており、耐折性にも優れる。その硬化フィルムの好ましい弾性率の範囲は、0.1〜1GPaであり、0.2〜0.8GPaの範囲がより好ましい。フィルムの弾性率が1GPaを超えた場合には基板の反りが激しくなり加工特性が低下し、一方、0.1GPaに満たないと耐熱性や強度が低下しやすい傾向にある。
まず、実施例で使用したシロキサン含有ポリアミック酸樹脂の合成例を示す。
窒素注入管を装備した反応器中でベンゾフェノンテトラカルボン酸二無水物(BTDA)102.2gをジメチルアセトアミド460gに溶解させ、反応器を氷冷した。これに式(2)のR3が直結合、パラ位にアミノ基が位置し、メタ位にビニル基が位置するジアミンである2,2’-ジビニル-4,4’-ジアミノ-ビフェニルを15.0g加え、更に式(1)における、R1がCH3、R2が(CH2)3で、lが7〜8、数平均分子量約750のシロキサンジアミン(東レ・ダウコーニング・シリコーン社製:BY16−853X)188.4gを、窒素雰囲気下で1時間かけて滴下した。滴下終了後、反応器内の温度を室温に戻し、窒素雰囲気下で5時間攪拌することによって目的であるシロキサン含有ポリアミック酸樹脂溶液を得た。GPC(ポリスチレン標準品換算)の測定結果より、得られたシロキサン含有ポリアミック酸の数平均分子量:3.3×104、分子量分布:2.64であった。また、このシロキサン含有ポリアミック酸樹脂のジメチルアセトアミド溶液(樹脂濃度:40.4wt%)の25℃における粘度を、E型粘度計を用いて測定したところ7589cPa・sであった。
窒素注入管を装備した反応器中でビフェニルテトラカルボン酸二無水物(BPDA)93.3gをジメチルアセトアミド450gに溶解させ、反応器を氷冷した。これに前記2,2’-ジビニル-4,4’-ジアミノ-ビフェニル5.0gを加え、更に188.4gのBY16−853Xを窒素雰囲気下で1時間かけて滴下した。滴下終了後、反応器内の温度を室温に戻し、窒素雰囲気下で5時間攪拌することによってシロキサン含有ポリアミック酸樹脂溶液を得た。
窒素注入管を装備した反応器中でBTDA102.2gを、ジメチルアセトアミド450gに溶解させ、反応器を氷冷した。これに237.8gのBY16−853Xを、窒素雰囲気下で1時間かけて滴下した。滴下終了後、反応器内の温度を室温に戻し、窒素雰囲気下で5時間攪拌することによってシロキサン含有ポリアミック酸樹脂溶液を得た。
窒素注入管を装備した反応器中でBTDA102.2gをジメチルアセトアミド460gに溶解させ、反応器を氷冷した。これに2,2’-ジビニル-4,4’-ジアミノ-ビフェニル15.0gと、ジアミノジフェニルエーテル(DAPE)38.1gを加え、更に47.1gのBY16−853Xを、窒素雰囲気下で1時間かけて滴下した。滴下終了後、反応器内の温度を室温に戻し、窒素雰囲気下で5時間攪拌することによってシロキサン含有ポリアミック酸樹脂溶液を得た。
合成例1で得られたシロキサン含有ポリアミック酸樹脂溶液(シロキサン含有ポリアミック酸樹脂として100重量部。以下、同じ)に対して、トリメチロールプロパントリメタクリレート(日本化薬製:SR−350)30重量部、光重合開始剤(Ciba Specialty Chemicals Inc.製:CGI124)5重量部を配合し、これを予め離型処理されたPETフィルム上に乾燥後の膜厚が25μmとなるように塗工し、110℃で10分間乾燥させることで、フィルム状感光性樹脂組成物とした。フィルム状感光性樹脂組成物の硬化後の弾性率は、0.2GPaであった。なお、弾性率は、フィルム状感光性樹脂組成物を露光、現像、硬化した後、動的粘弾性測定装置(DMA)を用い、基本周波数11Hzにて測定した場合の室温域におけるE’(貯蔵弾性率)の値である。
合成例1で得られたシロキサン含有ポリアミック酸樹脂溶液に対して、トリメチロールプロパントリメタクリレートの代わりに、1分子中にアクリル基を6個有するジペンタエリスリトールヘキサアクリレート(日本化薬製:DPHA)を30重量部配合したこと以外は実施例1と同様に行って、フィルム状感光性樹脂組成物とした。フィルム状感光性樹脂組成物の硬化後の弾性率は、0.2GPaであった。
合成例2で得られたシロキサン含有ポリアミック酸樹脂溶液に対して、SR−350を30重量部、CGI124を5重量部配合し、これを予め離型処理されたPETフィルム上に塗工し、110℃で10分間乾燥させることで、フィルム状感光性樹脂組成物とした。フィルム状感光性樹脂組成物の硬化後の弾性率は、0.3GPaであった。
シロキサン含有ポリアミック酸樹脂として合成例3で得られたシロキサン含有ポリアミック酸樹脂を用いた他は、実施例1と同様の配合及びフィルム化操作を行い、フィルム状感光性樹脂組成物とした。フィルム状感光性樹脂組成物の硬化後の弾性率は、0.08GPaであった。
シロキサン含有ポリアミック酸樹脂として合成例4で得られたシロキサン含有ポリアミック酸樹脂を用いた他は、実施例1と同様の配合及びフィルム化操作を行い、フィルム状感光性樹脂組成物とした。フィルム状感光性樹脂組成物の硬化後の弾性率は、1.2GPaであった。
Claims (5)
- 下記式(1)で表される構成単位を30モル%〜95モル%、式(2)表される構成単位を5モル%〜70モル%及び式(3)表される構成単位を0〜50モル%含むシロキサン含有ポリアミック酸樹脂100重量部に対して、1〜20重量部の光重合開始剤を必須成分として配合してなる感光性樹脂組成物。
ここで、
Arは芳香族テトラカルボン酸からカルボキシル基を除いた4価のテトラカルボン酸残基を示し、R1は炭素数1〜6のアルキル基又はフェニル基を示し、R2は炭素数2〜6のアルキレン基又はフェニレン基を示し、lは0〜10の数を示し、R3は2価の基又は直結合を示し、R4はCH2=CH−R6−で表される基を示し、R6は直結合、炭素数1〜6のアルキレン基又はフェニレン基を示し、R5はジアミン化合物からアミノ基を除いた2価のジアミン残基を示すが、一般式(1)及び(2)に含まれるジアミン残基である場合を除く。また、m、n及びoは各構成単位の存在モル比を示し、mは0.3〜0.95、nは0.05〜0.7及びoは0〜0.5の範囲である。 - シロキサン含有ポリアミック酸樹脂100重量部に対して、1〜20重量部の光重合開始剤及び5〜60重量部の単官能又は多官能のアクリレートを必須成分として配合してなる請求項1記載の感光性樹脂組成物。
- 請求項1又は2に記載の感光性樹脂組成物に、溶剤を加えてなるワニス状の感光性樹脂組成物。
- 請求項3に記載のワニス状の感光性樹脂組成物を、基板フィルム上に塗布、乾燥してなるフィルム状の感光性樹脂組成物。
- 請求項1〜3のいずれかに記載の感光性樹脂組成物を、導体層がパターニングされた回路基板上に皮膜形成した後、露光、現像、硬化して得られるネガ型の絶縁皮膜が形成された回路基板。
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WO2009075217A1 (ja) * | 2007-12-10 | 2009-06-18 | Nippon Steel Chemical Co., Ltd. | 難燃性感光性樹脂組成物及びこれを用いた回路基板 |
US20110048261A1 (en) * | 2008-02-15 | 2011-03-03 | Tadashi Shimura | Resin composition |
TWI470353B (zh) * | 2009-03-26 | 2015-01-21 | Nippon Steel & Sumikin Chem Co | A photosensitive resin composition and a hardening film |
WO2011046397A2 (ko) * | 2009-10-15 | 2011-04-21 | 주식회사 엘지화학 | 감광성 수지 조성물 및 이를 포함하는 드라이 필름 |
KR101443293B1 (ko) * | 2009-10-15 | 2014-09-19 | 주식회사 엘지화학 | 알칼리 수용액으로 현상 가능한 감광성 수지 조성물 및 이에 의해 제조된 드라이 필름 |
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CN103122068B (zh) * | 2012-12-25 | 2015-07-08 | 中山大学 | 一种uv涂料用聚酰亚胺丙烯酸酯低聚物 |
WO2016158990A1 (ja) * | 2015-03-31 | 2016-10-06 | 日産化学工業株式会社 | 剥離層形成用組成物及び剥離層 |
KR102223837B1 (ko) * | 2018-06-21 | 2021-03-04 | 주식회사 엘지화학 | 가지형 공중합체, 이를 이용한 감광성 수지 조성물, 감광성 수지 필름 및 광학 장치 |
JP7277573B2 (ja) * | 2019-05-08 | 2023-05-19 | 富士フイルム株式会社 | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス |
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JPH01283554A (ja) | 1988-05-11 | 1989-11-15 | Hitachi Ltd | 耐熱感光性重合体組成物 |
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JPH09100350A (ja) * | 1995-07-28 | 1997-04-15 | Ube Ind Ltd | 感光性ポリイミドシロキサン、組成物および絶縁膜 |
JPH09110350A (ja) | 1995-10-18 | 1997-04-28 | Kenji Hasegawa | 複数レーン型エスカレーター(速いエスカレーター) |
US5914354A (en) * | 1996-08-12 | 1999-06-22 | Shin-Etsu Chemical Co., Ltd. | Radiation-sensitive resin composition |
US5962113A (en) * | 1996-10-28 | 1999-10-05 | International Business Machines Corporation | Integrated circuit device and process for its manufacture |
JP3366859B2 (ja) * | 1998-03-05 | 2003-01-14 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性ポリイミド前駆体用現像液及びこれを用いたパターン製造法 |
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JP4476417B2 (ja) * | 2000-02-29 | 2010-06-09 | 新日鐵化学株式会社 | 赤色カラーレジストインキ及びカラーフィルター |
US6686106B2 (en) * | 2000-06-26 | 2004-02-03 | Ube Industries, Ltd. | Photosensitive resin compositions, insulating films, and processes for formation of the films |
JP2002006490A (ja) | 2000-06-26 | 2002-01-09 | Ube Ind Ltd | イミド系感光性樹脂組成物、絶縁膜およびその形成法 |
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