JP7375761B2 - ネガ型感光性樹脂組成物、ネガ型感光性樹脂組成物フィルム、硬化膜、これらを用いた中空構造体、および電子部品 - Google Patents
ネガ型感光性樹脂組成物、ネガ型感光性樹脂組成物フィルム、硬化膜、これらを用いた中空構造体、および電子部品 Download PDFInfo
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- JP7375761B2 JP7375761B2 JP2020545603A JP2020545603A JP7375761B2 JP 7375761 B2 JP7375761 B2 JP 7375761B2 JP 2020545603 A JP2020545603 A JP 2020545603A JP 2020545603 A JP2020545603 A JP 2020545603A JP 7375761 B2 JP7375761 B2 JP 7375761B2
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- photosensitive resin
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- 239000011342 resin composition Substances 0.000 title claims description 169
- 150000001875 compounds Chemical class 0.000 claims description 139
- 229920000642 polymer Polymers 0.000 claims description 68
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 42
- 150000001732 carboxylic acid derivatives Chemical group 0.000 claims description 38
- 239000004593 Epoxy Substances 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 30
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 24
- 229920001721 polyimide Polymers 0.000 claims description 24
- 239000004642 Polyimide Substances 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 125000002091 cationic group Chemical group 0.000 claims description 17
- 239000003505 polymerization initiator Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 16
- 239000004952 Polyamide Substances 0.000 claims description 15
- 229920002647 polyamide Polymers 0.000 claims description 15
- 239000004962 Polyamide-imide Substances 0.000 claims description 12
- 229920002312 polyamide-imide Polymers 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 10
- 125000002723 alicyclic group Chemical group 0.000 claims description 9
- 150000001412 amines Chemical group 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 229920002577 polybenzoxazole Polymers 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 239000013585 weight reducing agent Substances 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims description 2
- -1 aromatic dicarboxylic acids Chemical class 0.000 description 35
- 238000000034 method Methods 0.000 description 31
- 239000000758 substrate Substances 0.000 description 23
- 239000004065 semiconductor Substances 0.000 description 19
- 238000006243 chemical reaction Methods 0.000 description 15
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- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 14
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- 238000011161 development Methods 0.000 description 13
- 230000018109 developmental process Effects 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 12
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- 125000003118 aryl group Chemical group 0.000 description 11
- 238000001035 drying Methods 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 125000000962 organic group Chemical group 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 239000002244 precipitate Substances 0.000 description 8
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- 150000008065 acid anhydrides Chemical class 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 238000001914 filtration Methods 0.000 description 7
- 125000000524 functional group Chemical group 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 5
- 230000007261 regionalization Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000004580 weight loss Effects 0.000 description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 150000001805 chlorine compounds Chemical class 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- 125000004427 diamine group Chemical group 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 229940116333 ethyl lactate Drugs 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 229940052303 ethers for general anesthesia Drugs 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002921 oxetanes Chemical class 0.000 description 3
- 125000003367 polycyclic group Chemical group 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 2
- UCFMKTNJZCYBBJ-UHFFFAOYSA-N 3-[1-(2,3-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)C1=CC=CC(C(O)=O)=C1C(O)=O UCFMKTNJZCYBBJ-UHFFFAOYSA-N 0.000 description 2
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 description 2
- MNUOZFHYBCRUOD-UHFFFAOYSA-N 3-hydroxyphthalic acid Chemical compound OC(=O)C1=CC=CC(O)=C1C(O)=O MNUOZFHYBCRUOD-UHFFFAOYSA-N 0.000 description 2
- MXLMTQWGSQIYOW-UHFFFAOYSA-N 3-methyl-2-butanol Chemical compound CC(C)C(C)O MXLMTQWGSQIYOW-UHFFFAOYSA-N 0.000 description 2
- FFKSVVOWOROQIU-UHFFFAOYSA-N 4-(2,5-dioxooxolan-3-yl)-1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic acid Chemical compound C12=CC=CC=C2C(C(O)=O)C(C(=O)O)CC1C1CC(=O)OC1=O FFKSVVOWOROQIU-UHFFFAOYSA-N 0.000 description 2
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
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- 239000004697 Polyetherimide Substances 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000004849 alkoxymethyl group Chemical group 0.000 description 2
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- 229910052782 aluminium Inorganic materials 0.000 description 2
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
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- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
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- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
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- 238000005227 gel permeation chromatography Methods 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
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- 238000009413 insulation Methods 0.000 description 2
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
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- 239000010410 layer Substances 0.000 description 2
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
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- 238000000465 moulding Methods 0.000 description 2
- FJUQMAYFKVKVRK-UHFFFAOYSA-N n-(4-triethoxysilylbutyl)aniline Chemical compound CCO[Si](OCC)(OCC)CCCCNC1=CC=CC=C1 FJUQMAYFKVKVRK-UHFFFAOYSA-N 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000011085 pressure filtration Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000000045 pyrolysis gas chromatography Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 229960000834 vinyl ether Drugs 0.000 description 2
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
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Description
前記(A)高分子化合物は、ポリアミド、ポリイミド、ポリアミドイミド及びポリベンゾオキサゾールからなる群より選ばれる少なくとも1つの化合物であって、
前記(A)高分子化合物の分子鎖末端がカルボン酸残基に由来する構造であり、
前記(B)カチオン重合性化合物は3官能及び/又は4官能のエポキシ化合物であり、
前記(A)高分子化合物100質量部に対する前記(B)カチオン重合性化合物の含有量が50~150質量部であり、
さらに(C)カチオン重合開始剤を含有することを特徴とするネガ型感光性樹脂組成物。
(A)高分子化合物は、その分子鎖末端がカルボン酸残基に由来する構造であることが好ましい。前記(A)高分子化合物の分子鎖末端がカルボン酸残基に由来する構造であることによって、分子鎖末端が、カチオン重合の阻害官能基となり得る、アミン末端構造を保有しない分子構造とすることができ、結果として、ポリアミドやポアイミドおよびポリアミドイミドを用いた際においても、十分なカチオン重合性を発現することができる点で好ましい。
一般式(1)および(2)中のY1およびY2は2価~4価の有機基を示し、ジアミン由来の有機基を表している。
(A)高分子化合物が前記一般式(3)または(4)で表される化合物に由来する構造を有することで、樹脂骨格が屈曲性を有することで、硬化前の樹脂組成物として、有機溶剤への溶解性が高く、組成物中において樹脂の析出が発生し難く、保存安定性に優れる点から好ましい。
分子鎖末端がカルボン酸残基に由来する構造である(A)高分子化合物は、例えば分子鎖末端がカルボン酸残基であるポリイミドの場合には、重合の際に用いるジアミンに対して酸無水物の含有量を多くすることで得ることができる。その際、(A)高分子化合物のカルボン酸残基の合計を100モル%とした場合、アミン残基の合計は60モル%以上98モル%以下であることが好ましい。つまり(A)高分子化合物は、カルボン酸残基の合計を100モル%とした場合に、アミン残基の合計を60~98モル%として重合させて得られる化合物であることが好ましい。アミン残基の合計が60モル%以上であると、重量平均分子量が1,000以上となり易く、フィルム状にする際の製膜性に優れ、98モル%以下であると末端がアミン残基となる高分子化合物が含有される割合が小さくなり、カチオン重合反応が進行し易くなり、硬化膜の耐薬品性が向上する。
本発明において、(A)高分子化合物は、たとえば、次の方法により合成されるが、これに限定はされない。ポリイミド構造は、ジアミンの一部を末端封止剤である1級モノアミンに置き換えて、または、テトラカルボン酸二無水物を、末端封止剤であるジカルボン酸無水物に置き換えて、公知の方法で合成される。例えば、低温中でテトラカルボン酸二無水物とジアミン化合物とモノアミンを反応させる方法、低温中でテトラカルボン酸二無水物とジカルボン酸無水物とジアミン化合物を反応させる方法、テトラカルボン酸二無水物とアルコールとによりジエステルを得、その後ジアミンとモノアミンと縮合剤の存在下で反応させる方法などの方法を利用して、ポリイミド前駆体を得る。その後、公知のイミド化反応法を利用してポリイミドを合成することができる。
本発明の樹脂組成物は、(B)カチオン重合性化合物を含有する。(B)カチオン重合性化合物は、環状エーテル化合物(エポキシ化合物及びオキセタン化合物等)、エチレン性不飽和化合物(ビニルエーテル及びスチレン類等)、ビシクロオルトエステル、スピロオルトカーボネート及びスピロオルトエステル等が挙げられる。
チルオキセタン、2-エチルヘキシル(3-エチル-3-オキセタニルメチル)エーテル、2-ヒドロキシエチル(3-エチル-3-オキセタニルメチル)エーテル、2-ヒドロキシプロピル(3-エチル-3-オキセタニルメチル)エーテル、1,4-ビス[(3-エチル-3-オキセタニルメトキシ)メチル]ベンゼン、オキセタニルシルセスキオキセタン及びフェノールノボラックオキセタン等が挙げられる。
本発明の樹脂組成物は、(C)カチオン重合開始剤を含有する。(C)カチオン重合開始剤は、光あるいは加熱により直接または間接的に酸を発生しカチオン重合を生じさせるものである。(C)カチオン重合開始剤としては、公知の化合物を、特に限定なく使用することができるが、スルホニウム塩であることが好ましい。(C)カチオン重合開始剤について具体的には、例えば芳香族ヨードニウム錯塩と芳香族スルホニウム錯塩等を挙げることができる。芳香族ヨードニウム錯塩の具体例としては、ジフェニルヨードニウムテトラキス(ペンタフルオロフェニル)ボレート、ジフェニルヨードニウムヘキサフルオロホスフェート、ジフェニルヨードニウムヘキサフルオロアンチモネート、ジ(4-ノニルフェニル)ヨードニウムヘキサフルオロホスフェート等が挙げられる。これらの(C)カチオン重合開始剤は単独で使用してもよく、または2種以上を併用してもよい。
本発明において、(C)カチオン重合開始剤は、光カチオン重合開始剤であることが好ましい。(C)カチオン重合開始剤として光カチオン重合開始剤を選択することにより、光照射部と光未照射部でカチオン重合の進行のコントラストをつけることができ、任意の現像液で樹脂組成物を溶解させることで、パターン形成が可能となる点から好ましい。
本発明の樹脂組成物は、紫外線を吸収し、吸収した光エネルギーを光酸発生剤に供与するために増感剤を使用してもよい。増感剤としては、例えば9位と10位にアルコキシ基を有するアントラセン化合物(9,10-ジアルコキシ-アントラセン誘導体)が好ましい。アルコキシ基としては、例えばメトキシ基、エトキシ基、プロポキシ基等のC1~C4のアルコキシ基が挙げられる。9,10-ジアルコキシ-アントラセン誘導体は、さらに置換基を有していても良い。置換基としては、例えばフッ素原子、塩素原子、臭素原子、ヨウ素原子等のハロゲン原子、メチル基、エチル基、プロピル基等のC1~C4のアルキル基やスルホン酸アルキルエステル基、カルボン酸アルキルエステル基等が挙げられる。スルホン酸アルキルエステル基やカルボン酸アルキルエステルにおけるアルキルとしては、例えばメチル、エチル、プロピル等のC1~C4のアルキルが挙げられる。これらの置換基の置換位置は2位が好ましい。
本発明の樹脂組成物は、硬化前の形状は限定されず、例えば、ワニス状やフィルム状などが挙げられる。本発明の樹脂組成物フィルムは、本発明の樹脂組成物の形態をフィルム状としたもの、つまり、本発明の樹脂組成物から形成された樹脂組成物被膜を有する樹脂組成物フィルムである。そのため本発明の樹脂組成物フィルムは、支持体上に形成されたフィルム状、つまり支持体上に本発明の樹脂組成物から形成された樹脂組成物被膜を有する樹脂組成物フィルムであってもよいし、支持体のない態様であってもよい。ワニス状で用いる場合は、(A)~(C)成分および必要に応じ加えられる成分を有機溶媒に溶解させたものを用いることができる。また、樹脂組成物フィルムは、例えば本発明の樹脂組成物を支持体上に塗布し、次いでこれを必要により乾燥することにより得られる。
次に、本発明の樹脂組成物組成物を用いて樹脂組成物フィルムを作製する方法について説明する。本発明の樹脂組成物フィルムは樹脂組成物の溶液(ワニス)を支持体上に塗布し、次いでこれを必要により乾燥することにより得られる。樹脂組成物ワニスは、樹脂組成物に有機溶剤を添加することで得られる。ここで使用される有機溶剤としては、樹脂組成物を溶解するものであればよい。
次に、本発明の樹脂組成物ワニス、またはそれを用いた樹脂組成物フィルムをパターン加工する方法、および他の部材に熱圧着する方法について、例を挙げて説明する。
本発明の硬化膜は、本発明の樹脂組成物または本発明の樹脂組成物フィルムの樹脂組成物被膜を硬化した硬化膜である。本発明の樹脂組成物や樹脂組成物フィルムの樹脂組成物被膜を硬化した本発明の硬化膜は、半導体装置等の電子部品に使用することができる。本発明でいう半導体装置とは、半導体素子の特性を利用することで機能し得る装置全般を指す。半導体素子を基板に接続した電気光学装置や半導体回路基板、複数の半導体素子を積層したもの、並びにこれらを含む電子装置は、全て半導体装置に含まれる。また、半導体素子を接続するための多層配線板等の電子部品も半導体装置に含める。具体的には、半導体のパッシベーション膜、半導体素子の表面保護膜、半導体素子と配線の間の層間絶縁膜、複数の半導体素子の間の層間絶縁膜、高密度実装用多層配線の配線層間の層間絶縁膜、有機電界発光素子の絶縁層などの用途に好適に用いられるが、これに制限されず、様々な用途に用いることができる。
本発明の樹脂組成物フィルムは、樹脂組成物被膜を200℃で加熱した時の重量減少率が0.01%以上、1.0%以下であることが好ましい。該重量減少率が上記範囲であることによって、上記中空構造体の屋根部分として硬化膜を形成する際に、樹脂組成物被膜からのアウトガス成分が抑えられ、極端に屋根構造が膨らんだり、または硬化収縮により撓んだりすることを抑制することができる。
なお、200℃で加熱した時の重量減少率は、熱重量分析装置を用い、樹脂組成物被膜の質量を8~12mg秤量し、窒素ガスを100mL/分でパージした状態で、40℃で10分間保持した後の重量を基準とし、40℃から200℃へ10℃/分の昇温速度で昇温し、その後60分間保持した後の質量の減少率を算出することができる。
また、本発明の樹脂組成物フィルムは、樹脂組成物被膜の40℃での溶融粘度が、0.5×106MPa・s以上、1.0×107MPa・s以下であることが好ましい。樹脂組成物フィルムの樹脂組成物被膜の40℃での溶融粘度が、0.5×106MPa・s以上であると室温でのフィルム表面のタックが低減され、フィルムのハンドリングが容易になる。一方、樹脂組成物フィルムの樹脂組成物被膜の40℃での溶融粘度が、1.0×107MPa・s以下であると、室温でのフィルムのクラックが低減され、フィルムの欠点が低減し、歩留まりが向上する。
本発明の樹脂組成物は、前記の通り、中構造体の屋根部分として使用することができる。特に、屋根部分として使用される際、樹脂組成物フィルムの樹脂組成物被膜を熱硬化させた後での180℃でのクリープ変形量が、0.5%以上、2.5%以下であることが好ましい。クリープ変形量が、0.5%以上であると硬化膜の靭性が高く、本発明の硬化膜を中空構造の屋根構造として有する電子部品をモールド樹脂で封止した際に、屋根構造にクラックが発生することが抑えられ、電子部品の収率が向上する。一方、クリープ変形量が2.5%以下であると、モールド樹脂で封止した際に、モールド封止時の圧力で屋根構造の撓みが抑制され、中空構造部分を保持したままでの、モールド封止された電子部品の収率を向上することができる。
各実施例および比較例で作製した樹脂組成物フィルムの保護フィルムを剥離し、該剥離面を、4インチのシリコンウェハ上に、真空ダイアフラム式ラミネータ((株)名機製作所製、MVLP-500/600)を用いて、上下熱盤温度80℃、真空引き時間20秒、真空プレス時間30秒、貼付圧力0.5MPaの条件でラミネートし、シリコンウェハ上に樹脂組成物フィルムを形成した。そして、支持体フィルムを剥離した後、露光装置にビアサイズが30μmφ、20μmφ、10μmφのパターンを有するマスクをセットし、マスクと感光性樹脂組成物フィルムの露光ギャップ100μmの条件下で、超高圧水銀灯を用いて、露光量1000mJ/cm2(i線換算、全波長露光)で露光を行った。露光後、ホットプレートで120℃、10分間、露光後加熱を行った。その後、ディップ現像にて、水酸化テトラメチルアンモニウムの2.38質量%水溶液を用いて未露光部を除去し、水にてリンス処理をした。現像時間は、未露光部が完全に溶解した時間の2倍の時間とした。この様にして得られたパターンを、光学顕微鏡で観察し、パターンにツマリ等の異常のない場合の最小のサイズをパターン加工性の評価とした。また、パターンが全て溶解したものを0(不良)とした。
<ガラス転移温度の評価>
前記パターン加工性の評価方法と同様にして、基板をシリコンウェハから平面サイズが10cm×10cmの銅箔(CF-T9DA-SV-1、福田金属箔粉工業(株)製)に変更し、銅箔上に樹脂組成物フィルムを形成した。そして支持体フィルムを剥離した後、超高圧水銀灯を用いて、露光量1000mJ/cm2(i線換算、全波長露光)で露光を行った。露光後、ホットプレートで120℃、10分間、露光後加熱を行った。そして、イナートオーブン(光洋サーモシステム(株)製、INL-60)を用いて、N2雰囲気下(酸素濃度20ppm以下)、室温から200℃まで60分かけて昇温したのち、200℃で60分間熱処理し、銅箔上に形成された樹脂組成物フィルムの硬化膜を得た。
<引張強度・引張伸度の評価>
前記ガラス転移温度の評価方法と同様にして、樹脂組成物フィルム単体の硬化膜を得た。得られた硬化膜を10mm×80mmサイズの試験片にカットし、万能試験機AG-Xplus((株)島津製作所製)、50Nのロードセルを用いて、室温下、チャック間距離50mm、引張速度50mm/分で引張試験を行い、引張強度(破断点応力)および引張伸度(破断点伸度)の測定を行った。測定は1検体につき10枚の試験片について行い、結果から上位5点の平均値を求めた。また、上記パターン加工性の評価でパターンが溶解したものの引張強度・引張伸度の評価は実施せず、0(不良)とした。
合成例1 ヒドロキシル基含有ジアミン化合物(a)の合成
2,2-ビス(3-アミノ-4-ヒドロキシフェニル)ヘキサフルオロプロパン(以降BAHFと呼ぶ)(18.3g、0.05モル)をアセトン100mL、プロピレンオキシド(17.4g、0.3モル)に溶解させ、-15℃に冷却した。ここに3-ニトロベンゾイルクロリド(20.4g、0.11モル)をアセトン100mLに溶解させた溶液を滴下した。滴下終了後、-15℃で4時間反応させ、その後室温に戻した。析出した白色個体をろ別し、50℃で真空乾燥した。
乾燥窒素気流下、BAHF(29.30g、0.08モル)をγ―ブチロラクトン(以下、GBLとする)100gに添加し、室温で攪拌溶解した。その後、反応溶液の温度を-10~0℃に保ちながら、4,4’-ジフェニルエーテルジカルボン酸ジクロリド(29.52、0.1モル)を少量ずつ添加し、添加終了後室温まで昇温させ、3時間攪拌を続けた。次に、反応溶液を水3Lに投入して白色沈殿を集めた。この沈殿をろ過で集めて、水で3回洗浄した後、80℃の真空乾燥機で5時間乾燥した。
乾燥窒素気流下、BAHF(29.30g、0.08モル)をGBL80gに添加し、120℃で攪拌溶解した。次に、4-(2,5-ジオキソテトラヒドロフラン-3-イル)-1,2,3,4-テトラヒドロナフタレン-1,2-ジカルボン酸二無水物(以下、TDA-100とする)(30.03g、0.1モル)をGBL20gとともに加えて、120℃で1時間攪拌し、次いで200℃で4時間攪拌して反応溶液を得た。次に、反応溶液を水3Lに投入して白色沈殿を集めた。この沈殿をろ過で集めて、水で3回洗浄した後、80℃の真空乾燥機で5時間乾燥した。
乾燥窒素気流下、ヒドロキシル基含有ジアミン化合物(a)(31.43g、0.08モル)をGBL80gに添加し、120℃で攪拌した。次に、TDA-100(30.03g、0.1モル)をGBL20gとともに加えて、120℃で1時間攪拌し、次いで200℃で4時間攪拌して反応溶液を得た。次に、反応溶液を水3Lに投入して白色沈殿を集めた。この沈殿をろ過で集めて、水で3回洗浄した後、80℃の真空乾燥機で5時間乾燥した。
乾燥窒素気流下、BAHF(25.64g、0.07モル)をGBL70gに添加し、120℃で攪拌溶解した。次に、ノルボルナン-2-スピロ-2’-シクロペンタノン-5’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸二無水物(38.44g、0.1モル)をGBL20gとともに加えて、120℃で1時間攪拌し、次いで200℃で4時間攪拌して反応溶液を得た。次に、反応溶液を水3Lに投入して白色沈殿を集めた。この沈殿をろ過で集めて、水で3回洗浄した後、80℃の真空乾燥機で5時間乾燥した。
実施例1
(A)成分として合成例2で得られたポリアミド(A-1)10g、(B)成分としてTEPIC-VL(商品名、日産化学(株)製)10g、(C)成分としてCPI-310B(商品名、サンアプロ(株)製)0.6g、シラン化合物としてKBM-403(商品名、信越化学工業(株)製)0.8gをGBLに溶解した。溶媒の添加量は、溶媒以外の添加物を固形分とし、固形分濃度が60重量%となるように調整した。その後、保留粒子径1μmのフィルターを用いて加圧ろ過し、樹脂組成物ワニスを得た。
(A)~(C)成分および、その他成分を下記の構造の化合物に変更し、それらの混合比を表1に記載のように変更した以外は実施例1と同様にして、樹脂組成物フィルムを作製し、前記のように、パターン加工性、ガラス転移温度、引張強度・引張伸度の評価を行った。結果を表1に示す。
実施例2と同様にして、樹脂組成物フィルムを作製し、前記のパターン加工性の評価において、水酸化テトラメチルアンモニウムの2.38質量%水溶液をプロピレングリコールモノメチルエーテルアセテートに、リンスの水をイソプロピルアルコールに変更した以外は同様に評価を行った。結果を表1に示す。
(A)~(C)成分および、その他成分を下記の構造の化合物に変更し、それらの混合比を表1に記載のように変更した以外は実施例9と同様にして、樹脂組成物フィルムを作製し、前記のように、パターン加工性、ガラス転移温度、引張強度・引張伸度の評価を行った。結果を表1に示す。
A-1:分子鎖末端がカルボン酸残基のポリアミド
A-2:分子鎖末端がカルボン酸残基のポリイミド
A-3:分子鎖末端がカルボン酸残基のポリアミドイミド
A-4:分子鎖末端がカルボン酸残基のポリイミド
(A)以外の高分子化合物
1007(BisA型フェノキシ樹脂、三菱化学(株)製)
(B)カチオン重合性化合物
TEPIC-VL(日産化学(株)製)、常温において液体、エポキシ当量=128g/eq.
PETG(昭和電工(株)製)、常温において液体、エポキシ当量=90g/eq.
BATG(昭和電工(株)製)、常温において液体、エポキシ当量=113g/eq.
CPI-210S(スルホニウム塩系光酸発生剤、サンアプロ(株)製)
CPI-310B(スルホニウム塩系光酸発生剤、サンアプロ(株)製)
シラン化合物
KBM-403(3-グリシドキシプロピルトリメトキシシラン、信越化学工業(株)製)
<重量減少率の評価>
各実施例および比較例で作製した樹脂組成物フィルムの保護フィルムを剥離し、スパチュラを用いで樹脂組成物被膜を8~12mg取り出した。その後、熱重量測定装置TG/DTA6200((株)日立ハイテクサイエンス製)を用い、窒素ガスを100mL/分でパージした状態で、40℃で10分間保持した後の重量を基準とし、40℃から200℃へ10℃/分の昇温速度で昇温し、その後60分間保持した後の質量を読み取り、重量減少率を算出した。
各実施例および比較例で作製した樹脂組成物フィルムの保護フィルムを剥離し、樹脂組成物フィルムの樹脂組成物被膜同士を対向させ、60℃にて熱圧着し、積層された樹脂組成物被膜(樹脂組成物被膜の積層体)を得る。次いで、樹脂組成物被膜の積層体のPETフィルムを剥離した樹脂組成物被膜の積層体と、樹脂組成物フィルムの保護フィルムを剥離した樹脂組成物被膜を対向させ、上記のように熱圧着し、樹脂組成物被膜の積層体を得る。その後、上記操作を繰り返し、樹脂組成物被膜の積層体の厚みを600~700μm厚みまで積層した。次に、樹脂組成物被膜の積層体を用い、レオメーターMCR302((株)アントンパール製)にて、直径15mmのディスポーザブルパラレルプレートを用い、周波数0.2Hz、ひずみ量1.0%、30℃から80℃まで昇温速度2℃/分にて昇温測定した際の40℃での複素溶融粘度の値を読みとった。
<クリープ変形量>
樹脂組成物被膜の厚みを30μmとした以外は、前記ガラス転移温度の評価方法と同様にして、樹脂組成物フィルム単体の硬化膜を得た。得られた硬化膜を得られた硬化膜を10mm×80mmサイズの試験片にカットし、万能試験機AG-Xplus((株)島津製作所製)、50Nのロードセルを用い、180℃下のチャンバーにセットし、6分間温度が安定するまで保持した後、チャック間隔5cm、5Nの一定荷重で引張荷重を加え、300秒後の変形量を読みとり、初期のチャック間隔からの変形量をクリープ変形量とした。
実施例11~12
実施例2および実施例5の樹脂組成物フィルムを用い、前記のように重量減少率、溶融粘度、クリープ変形量の評価を行った。結果を表2に示す。
比較例1の樹脂組成物フィルムを用い、前記のように重量減少率、溶融粘度、クリープ変形量の評価を行った。結果を表1に示す。
Claims (17)
- (A)高分子化合物、及び(B)カチオン重合性化合物を含有し、カチオン重合反応により硬化するネガ型感光性樹脂組成物であって、
前記(A)高分子化合物は、ポリアミド、ポリイミド、ポリアミドイミド、及びポリベンゾオキサゾールからなる群より選ばれる少なくとも1つの化合物であって、
前記(A)高分子化合物の分子鎖末端がカルボン酸残基に由来する構造であり、
前記(B)カチオン重合性化合物は3官能及び/又は4官能のエポキシ化合物であり、
前記(A)高分子化合物100質量部に対する前記(B)カチオン重合性化合物の含有量が50~150質量部であり、
さらに(C)カチオン重合開始剤を含有することを特徴とするネガ型感光性樹脂組成物。 - 全てのネガ型感光性樹脂組成物の合計を100質量%とした場合、前記(A)高分子化合物が30~70質量%、前記(B)カチオン重合性化合物が30~70質量%であることを特徴とする、請求項1に記載のネガ型感光性樹脂組成物。
- 前記(A)高分子化合物は、カルボン酸残基の合計を100モル%とした場合に、アミン残基の合計を60~98モル%として重合させて得られる化合物であることを特徴とする、請求項1または2に記載のネガ型感光性樹脂組成物。
- 前記(A)高分子化合物は、ポリアミド、ポリイミド、及びポリアミドイミドからなる群より選ばれる少なくとも1つの化合物であって、さらに、脂環式テトラカルボン酸二無水物に由来する構造を有することを特徴とする、請求項1~3のいずれかに記載のネガ型感光性樹脂組成物。
- 前記(A)高分子化合物の分子鎖末端がカルボン酸残基に由来する構造が、テトラカルボン酸二無水物に由来する構造であることを特徴とする請求項1~4のいずれかに記載のネガ型感光性樹脂組成物。
- 前記(A)高分子化合物は、分子鎖内にフェノール性水酸基を有する化合物であることを特徴とする、請求項1~6のいずれかに記載のネガ型感光性樹脂組成物。
- 前記(B)カチオン重合性化合物は、常温で液状である多官能エポキシ化合物であって、エポキシ当量が80~160g/eq.であることを特徴とする、請求項1~7のいずれかに記載のネガ型感光性樹脂組成物。
- 前記(C)カチオン重合開始剤は、スルホニウム塩であることを特徴とする、請求項1~8のいずれかに記載のネガ型感光性樹脂組成物。
- 請求項1~9のいずれかに記載のネガ型感光性樹脂組成物から形成された樹脂組成物被膜を有するネガ型感光性樹脂組成物フィルム。
- 前記樹脂組成物被膜を200度で加熱した時の重量減少率が0.01~1.0%であることを特徴とする、請求項10に記載のネガ型感光性樹脂組成物フィルム。
- 前記樹脂組成物被膜の40℃での溶融粘度が、0.5×106~1.0×107MPa・sであることを特徴とする、請求項10又は11に記載のネガ型感光性樹脂組成物フィルム。
- 前記樹脂組成物被膜を熱硬化させた後の180℃でのクリープ変形量が、0.5~2.5%であることを特徴とする、請求項10~12のいずれかに記載のネガ型感光性樹脂組成物フィルム。
- 請求項1~9のいずれかに記載のネガ型感光性樹脂組成物または請求項10~13のいずれかに記載のネガ型感光性樹脂組成物フィルムの樹脂組成物被膜を硬化した硬化膜。
- 請求項14に記載の硬化膜が、中空部分を有する構造体(以下、中空構造体という)の屋根部分として用いられたことを特徴とする中空構造体。
- 前記屋根部分の厚みが、10~30μmであることを特徴とする、請求項15に記載の中空構造体。
- 請求項15又は16に記載の中空構造体の外周部が、モールド樹脂で封止された構造であることを特徴とする電子部品。
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011123277A (ja) | 2009-12-10 | 2011-06-23 | Shin-Etsu Chemical Co Ltd | 光硬化性樹脂組成物、該組成物を用いたフィルム状接着剤及び接着シート |
JP2013105063A (ja) | 2011-11-15 | 2013-05-30 | Jsr Corp | 液晶配向剤および液晶表示素子 |
JP5347107B2 (ja) | 2008-08-06 | 2013-11-20 | 株式会社フジシール | 緩衝性包装体 |
WO2016035593A1 (ja) | 2014-09-02 | 2016-03-10 | 東レ株式会社 | 樹脂および感光性樹脂組成物 |
WO2016140024A1 (ja) | 2015-03-04 | 2016-09-09 | 東レ株式会社 | 感光性樹脂組成物、樹脂硬化膜の製造方法および半導体装置 |
WO2017170032A1 (ja) | 2016-03-28 | 2017-10-05 | 東レ株式会社 | 感光性フィルム |
WO2019131896A1 (ja) | 2017-12-28 | 2019-07-04 | 宇部興産株式会社 | ポリイミド、ポリイミド溶液組成物、ポリイミドフィルム、及び基板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5169911A (en) * | 1992-02-18 | 1992-12-08 | General Electric Company | Heat curable blends of silicone polymide and epoxy resin |
TWI425311B (zh) | 2006-07-14 | 2014-02-01 | Nippon Kayaku Kk | 感光性樹脂組成物、其層合物、其硬化物及使用該組成物之圖型的形成方法(3) |
TWI516527B (zh) * | 2009-12-10 | 2016-01-11 | 信越化學工業股份有限公司 | 光固化性樹脂組成物,圖案形成法和基板保護膜,以及使用該組成物之膜狀黏著劑及黏著片 |
JP2019038964A (ja) | 2017-08-28 | 2019-03-14 | 住友ベークライト株式会社 | 感光性樹脂組成物および電子装置 |
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5347107B2 (ja) | 2008-08-06 | 2013-11-20 | 株式会社フジシール | 緩衝性包装体 |
JP2011123277A (ja) | 2009-12-10 | 2011-06-23 | Shin-Etsu Chemical Co Ltd | 光硬化性樹脂組成物、該組成物を用いたフィルム状接着剤及び接着シート |
JP2013105063A (ja) | 2011-11-15 | 2013-05-30 | Jsr Corp | 液晶配向剤および液晶表示素子 |
WO2016035593A1 (ja) | 2014-09-02 | 2016-03-10 | 東レ株式会社 | 樹脂および感光性樹脂組成物 |
WO2016140024A1 (ja) | 2015-03-04 | 2016-09-09 | 東レ株式会社 | 感光性樹脂組成物、樹脂硬化膜の製造方法および半導体装置 |
WO2017170032A1 (ja) | 2016-03-28 | 2017-10-05 | 東レ株式会社 | 感光性フィルム |
WO2019131896A1 (ja) | 2017-12-28 | 2019-07-04 | 宇部興産株式会社 | ポリイミド、ポリイミド溶液組成物、ポリイミドフィルム、及び基板 |
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