TWI325402B - - Google Patents

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Publication number
TWI325402B
TWI325402B TW095142274A TW95142274A TWI325402B TW I325402 B TWI325402 B TW I325402B TW 095142274 A TW095142274 A TW 095142274A TW 95142274 A TW95142274 A TW 95142274A TW I325402 B TWI325402 B TW I325402B
Authority
TW
Taiwan
Prior art keywords
substrate
classification
card
cassette
sorting
Prior art date
Application number
TW095142274A
Other languages
English (en)
Chinese (zh)
Other versions
TW200817259A (en
Inventor
Kensuke Hirata
Susumu Murayama
Kuniaki To
Kai Tanaka
Wataru Ueda
Original Assignee
Ishikawajima Harima Heavy Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishikawajima Harima Heavy Ind filed Critical Ishikawajima Harima Heavy Ind
Publication of TW200817259A publication Critical patent/TW200817259A/zh
Application granted granted Critical
Publication of TWI325402B publication Critical patent/TWI325402B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
TW095142274A 2006-10-03 2006-11-15 Substrate transfer system TW200817259A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/319792 WO2008041326A1 (fr) 2006-10-03 2006-10-03 système de transfert de substrats

Publications (2)

Publication Number Publication Date
TW200817259A TW200817259A (en) 2008-04-16
TWI325402B true TWI325402B (de) 2010-06-01

Family

ID=39268193

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095142274A TW200817259A (en) 2006-10-03 2006-11-15 Substrate transfer system

Country Status (5)

Country Link
JP (1) JP4992906B2 (de)
KR (1) KR101183042B1 (de)
CN (1) CN101511709B (de)
TW (1) TW200817259A (de)
WO (1) WO2008041326A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI700233B (zh) * 2017-08-11 2020-08-01 大陸商上海微電子裝備（集團）股份有限公司 基於托盤的物料分揀裝置以及分揀方法
TWI701205B (zh) * 2015-09-04 2020-08-11 日商琳得科股份有限公司 供給裝置及供給方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067706A (ja) * 2008-09-09 2010-03-25 Shin Etsu Polymer Co Ltd 収納容器、ウェーハ移載システム及びウェーハ移載方法
JP5105189B2 (ja) * 2008-09-12 2012-12-19 株式会社ダイフク 基板搬送設備
JP5115501B2 (ja) * 2009-03-12 2013-01-09 株式会社Ｉｈｉ 基板仕分け装置及び基板仕分け方法
JP6033593B2 (ja) * 2012-07-18 2016-11-30 東レエンジニアリング株式会社 基板搬送装置
US9545724B2 (en) * 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
CN108144863B (zh) * 2016-12-02 2022-05-10 比雅斯股份公司 家具行业的面板生产线中精益生产的优化制造方法和系统
DE102018218141B4 (de) * 2018-05-04 2022-03-24 Hegla Gmbh & Co. Kg Sortierverfahren und -vorrichtung zum Sortieren von plattenförmigen Gegenständen, vorzugsweise Glastafelzuschnitten, Verfahren und Vorrichtung zum Herstellen von Glastafelzuschnitten mit einer derartigen Sortiervorrichtung
CN108792620B (zh) * 2018-06-19 2020-06-30 信义环保特种玻璃（江门）有限公司 自动堆垛系统和方法
JP7191472B2 (ja) * 2019-01-25 2022-12-19 株式会社ディスコ 加工装置の使用方法
WO2024165131A1 (en) * 2023-02-06 2024-08-15 Applied Materials, Inc. Apparatus and method for storing a plurality of waveguides

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252148A (ja) * 1986-04-24 1987-11-02 Nec Corp ウエハの並べ換え装置
JP3185595B2 (ja) * 1995-04-03 2001-07-11 株式会社ダイフク 基板仕分け装置を備えた荷保管設備
KR100309919B1 (ko) * 1998-11-26 2002-10-25 삼성전자 주식회사 작업대상물의절단및분류자동화시스템과그제어방법
JP4334190B2 (ja) 2002-08-09 2009-09-30 大日本印刷株式会社 バッファ装置およびカラーフィルター製造ライン
CN1807204A (zh) * 2005-01-20 2006-07-26 英业达股份有限公司 自动分类包装方法及系统

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI701205B (zh) * 2015-09-04 2020-08-11 日商琳得科股份有限公司 供給裝置及供給方法
TWI700233B (zh) * 2017-08-11 2020-08-01 大陸商上海微電子裝備（集團）股份有限公司 基於托盤的物料分揀裝置以及分揀方法

Also Published As

Publication number Publication date
JP4992906B2 (ja) 2012-08-08
TW200817259A (en) 2008-04-16
CN101511709B (zh) 2013-03-20
KR20090077814A (ko) 2009-07-15
CN101511709A (zh) 2009-08-19
WO2008041326A1 (fr) 2008-04-10
KR101183042B1 (ko) 2012-09-20
JPWO2008041326A1 (ja) 2010-02-04

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