TWI318634B - Transparent, highly heat-resistant polyimide precusor and photosensitive polyimide composition thereof - Google Patents

Transparent, highly heat-resistant polyimide precusor and photosensitive polyimide composition thereof

Info

Publication number
TWI318634B
TWI318634B TW093107861A TW93107861A TWI318634B TW I318634 B TWI318634 B TW I318634B TW 093107861 A TW093107861 A TW 093107861A TW 93107861 A TW93107861 A TW 93107861A TW I318634 B TWI318634 B TW I318634B
Authority
TW
Taiwan
Prior art keywords
transparent
precusor
highly heat
polyimide
resistant
Prior art date
Application number
TW093107861A
Other languages
English (en)
Other versions
TW200500395A (en
Inventor
Dong Seok Kim
Yong Sik Ahn
Kyungjun Kim
Mi Hie Yi
Original Assignee
Lg Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chemical Ltd filed Critical Lg Chemical Ltd
Publication of TW200500395A publication Critical patent/TW200500395A/zh
Application granted granted Critical
Publication of TWI318634B publication Critical patent/TWI318634B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW093107861A 2003-03-24 2004-03-24 Transparent, highly heat-resistant polyimide precusor and photosensitive polyimide composition thereof TWI318634B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030018127A KR100548625B1 (ko) 2003-03-24 2003-03-24 고내열성 투명 폴리이미드 전구체 및 이를 이용한 감광성수지 조성물

Publications (2)

Publication Number Publication Date
TW200500395A TW200500395A (en) 2005-01-01
TWI318634B true TWI318634B (en) 2009-12-21

Family

ID=36748314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093107861A TWI318634B (en) 2003-03-24 2004-03-24 Transparent, highly heat-resistant polyimide precusor and photosensitive polyimide composition thereof

Country Status (6)

Country Link
US (2) US8232366B2 (zh)
JP (1) JP2006521452A (zh)
KR (1) KR100548625B1 (zh)
CN (1) CN100590528C (zh)
TW (1) TWI318634B (zh)
WO (1) WO2004086146A1 (zh)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100633235B1 (ko) * 2004-07-05 2006-10-11 주식회사 엘지화학 패턴드 스페이서를 구비하는 디스플레이 패널
KR20070116228A (ko) * 2005-03-29 2007-12-07 닛산 가가쿠 고교 가부시키 가이샤 폴리아믹산, 폴리이미드 및 그 제조 방법
KR100759189B1 (ko) * 2005-12-01 2007-09-14 주식회사 엘지화학 액정 배향막의 제조방법, 이에 의해 제조된 액정 배향막,및 이를 포함하는 액정 디스플레이
JP4986071B2 (ja) * 2007-03-30 2012-07-25 国立大学法人東京工業大学 樹脂組成物、硬化物及び光学用部材
TWI435893B (zh) * 2007-08-03 2014-05-01 Eternal Chemical Co Ltd 聚醯亞胺之前驅物及其應用
KR101130504B1 (ko) 2007-09-10 2012-03-28 후지쯔 가부시끼가이샤 규소 함유 피막의 제조방법, 규소 함유 피막 및 반도체 장치
KR100882586B1 (ko) 2007-10-10 2009-02-13 제일모직주식회사 액정 광배향제, 이를 포함하는 액정 광배향막, 및 이를포함하는 액정 표시 장치
WO2009051187A1 (ja) * 2007-10-19 2009-04-23 Nissan Chemical Industries, Ltd. 熱硬化膜形成用ポリエステル樹脂溶液
KR100913605B1 (ko) * 2007-12-07 2009-08-26 제일모직주식회사 액정 광배향제, 이를 포함하는 액정 광배향막, 및 이를포함하는 액정 표시 장치
KR101481729B1 (ko) * 2007-12-28 2015-01-12 주식회사 동진쎄미켐 폴리이미드 전구체용 반응성 단량체 및 이를 이용한폴리이미드 전구체
CN101684181B (zh) * 2008-09-26 2011-12-14 比亚迪股份有限公司 一种光敏聚酰亚胺及其柔性线路板
KR101541018B1 (ko) * 2008-12-08 2015-07-31 삼성디스플레이 주식회사 광배향 화합물, 광배향 조성물, 배향막을 포함하는 표시 기판 및 이의 제조 방법
KR101288558B1 (ko) 2008-12-12 2013-07-22 제일모직주식회사 액정 광배향제 및 이를 이용하여 제조된 액정 광배향막
JP5201155B2 (ja) * 2009-01-27 2013-06-05 新日本理化株式会社 ポリ（アミド酸―イミド）樹脂
KR101010036B1 (ko) * 2009-08-28 2011-01-21 주식회사 엘지화학 신규한 폴리아믹산, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름
JP5699469B2 (ja) * 2009-09-16 2015-04-08 Jsr株式会社 液晶配向剤
KR101443293B1 (ko) * 2009-10-15 2014-09-19 주식회사 엘지화학 알칼리 수용액으로 현상 가능한 감광성 수지 조성물 및 이에 의해 제조된 드라이 필름
CN102102019A (zh) 2009-12-16 2011-06-22 第一毛织株式会社 液晶光取向剂、液晶光取向层及其液晶显示器装置
KR101304590B1 (ko) 2010-03-11 2013-09-05 주식회사 엘지화학 Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물
CN102298998A (zh) * 2010-06-23 2011-12-28 比亚迪股份有限公司 一种绝缘材料及其制备方法
JP5879861B2 (ja) * 2010-11-01 2016-03-08 Jsr株式会社 液晶配向膜の形成方法
JP5461372B2 (ja) * 2010-11-26 2014-04-02 株式会社ジャパンディスプレイ 配向膜形成用溶媒、それを用いた配向膜材料および液晶表示装置の製造方法
CN102559205B (zh) 2010-12-29 2014-07-30 第一毛织株式会社 液晶取向剂、使用其制造的液晶取向膜和液晶显示器
US20120190802A1 (en) * 2011-01-26 2012-07-26 Nexolve Corporation Polyimide polymer from non-stoichiometric components
JP2012153848A (ja) * 2011-01-28 2012-08-16 Sumitomo Electric Wintec Inc ポリイミド樹脂ワニス及びそれを用いた絶縁電線、電機コイル、モータ
CN103987763B (zh) * 2011-08-19 2017-12-29 阿克伦聚合物体系有限公司 热稳定的低双折射共聚聚酰亚胺膜
KR101444190B1 (ko) 2011-12-19 2014-09-26 제일모직 주식회사 액정 배향제, 이를 이용한 액정 배향막 및 상기 액정 배향막을 포함하는 액정표시소자
JP5849773B2 (ja) * 2012-02-29 2016-02-03 日産化学工業株式会社 ポリアミック酸、ポリイミド及び新規ジアミン
KR101384967B1 (ko) * 2012-04-10 2014-04-15 한국화학연구원 알릴기 또는 비닐기 측쇄기로 가교된 방향족 폴리이미드계 수지
WO2013168675A1 (ja) * 2012-05-07 2013-11-14 旭化成イーマテリアルズ株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
JP6422432B2 (ja) * 2012-05-11 2018-11-14 アクロン ポリマー システムズ，インコーポレイテッド 熱的に安定な電子デバイス用フレキシブル基板
US20150125680A1 (en) * 2012-05-21 2015-05-07 Toray Industries, Inc. Substrate and touch panel member using same
JP6051653B2 (ja) * 2012-07-24 2016-12-27 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミド樹脂硬化物およびポリイミドフィルム
US9899120B2 (en) 2012-11-02 2018-02-20 Nanotek Instruments, Inc. Graphene oxide-coated graphitic foil and processes for producing same
US9533889B2 (en) 2012-11-26 2017-01-03 Nanotek Instruments, Inc. Unitary graphene layer or graphene single crystal
US10566482B2 (en) 2013-01-31 2020-02-18 Global Graphene Group, Inc. Inorganic coating-protected unitary graphene material for concentrated photovoltaic applications
US10087073B2 (en) 2013-02-14 2018-10-02 Nanotek Instruments, Inc. Nano graphene platelet-reinforced composite heat sinks and process for producing same
US9017934B2 (en) 2013-03-08 2015-04-28 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist defect reduction system and method
US9245751B2 (en) 2013-03-12 2016-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-reflective layer and method
US8932799B2 (en) 2013-03-12 2015-01-13 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist system and method
US9543147B2 (en) 2013-03-12 2017-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and method of manufacture
US9256128B2 (en) 2013-03-12 2016-02-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method for manufacturing semiconductor device
US9502231B2 (en) 2013-03-12 2016-11-22 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist layer and method
US9175173B2 (en) 2013-03-12 2015-11-03 Taiwan Semiconductor Manufacturing Company, Ltd. Unlocking layer and method
US9110376B2 (en) 2013-03-12 2015-08-18 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist system and method
US9354521B2 (en) 2013-03-12 2016-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist system and method
US9117881B2 (en) 2013-03-15 2015-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive line system and process
US9341945B2 (en) 2013-08-22 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and method of formation and use
KR101928598B1 (ko) * 2013-09-30 2018-12-12 주식회사 엘지화학 폴리이미드 필름 및 그 제조방법
JP6175032B2 (ja) * 2013-10-10 2017-08-02 Ｊｆｅケミカル株式会社 ベンゾフラン誘導体組成物、ポリイミド前駆体組成物およびポリイミド樹脂の製造方法
US10036953B2 (en) 2013-11-08 2018-07-31 Taiwan Semiconductor Manufacturing Company Photoresist system and method
US10095113B2 (en) 2013-12-06 2018-10-09 Taiwan Semiconductor Manufacturing Company Photoresist and method
US9761449B2 (en) 2013-12-30 2017-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Gap filling materials and methods
US9599896B2 (en) 2014-03-14 2017-03-21 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist system and method
US9581908B2 (en) 2014-05-16 2017-02-28 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and method
EP2950144B1 (en) * 2014-05-31 2016-12-14 Rohm and Haas Electronic Materials LLC Imaging process on substrates with aqueous alkaline soluble uv blocking compositions and aqueous soluble uv transparent films
JP6618043B2 (ja) * 2014-11-12 2019-12-11 日産化学株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
CN104371102B (zh) * 2014-12-11 2017-01-18 河北科技大学 一种负性光敏聚酰亚胺及其制备方法
KR101777450B1 (ko) 2015-01-30 2017-09-11 주식회사 엘지화학 폴리이미드 필름 형성용 조성물 및 이를 이용하여 제조된 폴리이미드 필름
CN105273614B (zh) * 2015-10-12 2017-08-22 广东省宜华木业股份有限公司 室温反应制备用于木质材料表面uv超疏水聚酰亚胺涂料
TW201720855A (zh) * 2015-12-01 2017-06-16 台虹科技股份有限公司 聚醯亞胺聚合物、聚醯亞胺膜以及聚醯亞胺膜的製造方法
CN105585671A (zh) * 2016-03-23 2016-05-18 江南大学 一种生物基光敏聚酰亚胺树脂及其制备的涂料
CN109313387B (zh) * 2016-06-15 2021-11-26 东丽株式会社 感光性树脂组合物
KR102197805B1 (ko) * 2016-08-25 2021-01-05 후지필름 가부시키가이샤 막의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법
CA3041114A1 (en) 2016-11-28 2018-05-31 Dfine, Inc. Tumor ablation devices and related methods
JP6776498B2 (ja) * 2016-11-28 2020-10-28 エルジー・ケム・リミテッド 液晶配向膜、その製造方法およびこれを用いた液晶表示素子
KR102087261B1 (ko) 2017-02-16 2020-03-10 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 블랙 화소 격벽층 및 디스플레이 장치
CN106990673B (zh) * 2017-04-20 2021-06-11 浙江福斯特新材料研究院有限公司 一种透明、感光性聚酰亚胺树脂组合物
EP3633455A4 (en) 2017-05-31 2020-06-17 FUJIFILM Corporation PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, HARDENED FILM, LAMINATE, PROCESS FOR PRODUCING HARDENED FILM, AND SEMICONDUCTOR DEVICE
KR102065718B1 (ko) 2017-10-17 2020-02-11 주식회사 엘지화학 액정 배향막 및 이를 이용한 액정표시소자
KR102417834B1 (ko) * 2017-11-28 2022-07-07 (주)덕산테코피아 네거티브 감광성 수지 조성물, 이를 사용한 유기절연막을 갖는 전자장치
CN107936682A (zh) * 2017-12-01 2018-04-20 中国科学院兰州化学物理研究所 光固化3d打印聚酰亚胺墨水及其制备方法与应用
CN108586744A (zh) * 2018-05-08 2018-09-28 深圳飞世尔新材料股份有限公司 一种无色透明聚酰亚胺薄膜及其制备方法
US11186704B2 (en) 2018-07-02 2021-11-30 Global Graphene Group, Inc. Manufacturing process for dark-color polymer composite films
US11242443B2 (en) 2018-07-02 2022-02-08 Global Graphene Group, Inc. Dark-color polymer composite films
CN110028669A (zh) * 2019-04-10 2019-07-19 明士新材料有限公司 负性光敏性聚酰胺酸酯树脂、树脂组合物、其制备方法及应用
WO2021227020A1 (zh) * 2020-05-15 2021-11-18 律胜科技股份有限公司 感光性聚酰亚胺树脂组合物及应用其的保护膜
CN112939915B (zh) * 2021-02-05 2022-10-14 武汉柔显科技股份有限公司 感光树脂用二胺单体、聚酰亚胺前体、感光树脂组合物及其应用
CN115612099B (zh) * 2022-09-05 2023-10-03 江西有泽新材料科技有限公司 一种低膨胀透明共聚聚酰亚胺材料及制备方法和应用
WO2024111130A1 (ja) * 2022-11-25 2024-05-30 Ｈｄマイクロシステムズ株式会社 ポリアミック酸エステル及び樹脂組成物
CN115947940A (zh) * 2023-01-10 2023-04-11 山东大学 一种具有双功能的光敏聚酰亚胺前体材料及其制备方法与在光刻中的应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4217688A1 (de) * 1992-05-29 1993-12-02 Basf Lacke & Farben Durch Einwirkung von Strahlung vernetzendes Gemisch und dessen Verwendung zur Herstellung hochtemperaturbeständiger Reliefstrukturen
US5756260A (en) * 1993-02-16 1998-05-26 Sumitomo Bakelite Company Limited Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same
JP3324250B2 (ja) * 1993-02-25 2002-09-17 チッソ株式会社 感光性樹脂組成物
TW290558B (zh) * 1994-04-28 1996-11-11 Nissan Chemical Ind Ltd
JPH0995533A (ja) 1995-09-29 1997-04-08 Maruzen Petrochem Co Ltd 無色透明性ポリイミド樹脂材料およびそれを用いたフィルムまたはコーティング膜
JP3425311B2 (ja) * 1996-03-04 2003-07-14 株式会社東芝 ネガ型感光性ポリマー樹脂組成物、これを用いたパターン形成方法、および電子部品
JPH11227099A (ja) * 1998-02-10 1999-08-24 Mitsubishi Chemical Corp 耐熱性基板
JP4168593B2 (ja) * 1998-07-29 2008-10-22 チッソ株式会社 新規なジアミノ化合物、ポリアミド酸、ポリイミド、該ポリイミド膜を用いた液晶配向膜、および該配向膜を用いた液晶表示素子
US6479581B1 (en) * 1999-03-12 2002-11-12 Solvay Advanced Polymers, Llc Aqueous-based polyamide-amic acid compositions
JP3942063B2 (ja) * 1999-06-28 2007-07-11 株式会社カネカ 新規ポリイミド組成物およびこれに使用される新規酸二無水物
DE60041630D1 (de) * 1999-07-15 2009-04-09 Arakawa Chem Ind Enthaltend glycidylethergruppe partielles alkoxysilan-kondensat, silanmodifiziertes harz, zusammensetzung daraus und verfahren zu deren herstellung
KR100405301B1 (ko) * 1999-09-10 2003-11-12 주식회사 엘지화학 새로운 폴리이미드 전구체 및 이를 이용한 감광성 수지 조성물
JP2001330721A (ja) 2000-05-24 2001-11-30 Toray Ind Inc カラーフィルター用透明保護膜、カラーフィルター、および、液晶表示装置
JP2002121207A (ja) * 2000-10-16 2002-04-23 Kanegafuchi Chem Ind Co Ltd 組成物とそれを用いた感光性組成物及びカバーレイ
EP1375562A4 (en) * 2000-12-26 2005-11-30 Nissan Chemical Ind Ltd DIAMINOBENZOLE DERIVATIVES, POLYIMIDE PRECURSORS PRODUCED BY THE USE OF THE DERIVATIVES, AND POLYIMIDES AND LIQUID CRYSTAL ORIENTATION AGENTS
TWI291065B (en) * 2000-12-26 2007-12-11 Nissan Chemical Ind Ltd Diamines, polyimide precursors and polyimides produced by using the diamines, and liquid crystal aligning agents
JP3773845B2 (ja) * 2000-12-29 2006-05-10 三星電子株式会社 ポジティブ型感光性ポリイミド前駆体およびこれを含む組成物
TW565582B (en) * 2001-04-13 2003-12-11 Kaneka Corp Diamine, acid dianhydride, and reactive group containing polyimide composition prepared therefrom and preparing them
KR20020046229A (ko) 2001-12-19 2002-06-20 (주)삼우설비컨설턴트 매스 콘크리트의 온도제어 시스템 및 그 시스템에 의한파이프 쿨링 공법

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US8703901B2 (en) 2014-04-22
WO2004086146A1 (en) 2004-10-07
KR20040083610A (ko) 2004-10-06
US20070093640A1 (en) 2007-04-26
TW200500395A (en) 2005-01-01
CN1764872A (zh) 2006-04-26
KR100548625B1 (ko) 2006-01-31

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