TWI313577B - Copper-clad laminate for multilayer printed wiring board, multilayer printed wiring board and manufacturing method thereof - Google Patents

Copper-clad laminate for multilayer printed wiring board, multilayer printed wiring board and manufacturing method thereof Download PDF

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Publication number
TWI313577B
TWI313577B TW93111299A TW93111299A TWI313577B TW I313577 B TWI313577 B TW I313577B TW 93111299 A TW93111299 A TW 93111299A TW 93111299 A TW93111299 A TW 93111299A TW I313577 B TWI313577 B TW I313577B
Authority
TW
Taiwan
Prior art keywords
copper
circuit board
printed circuit
multilayer printed
layer
Prior art date
Application number
TW93111299A
Other languages
English (en)
Chinese (zh)
Other versions
TW200427389A (en
Inventor
Daisuke Kanaya
Shuji Maeda
Taro Fukui
Original Assignee
Panasonic Elec Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Elec Works Co Ltd filed Critical Panasonic Elec Works Co Ltd
Publication of TW200427389A publication Critical patent/TW200427389A/zh
Application granted granted Critical
Publication of TWI313577B publication Critical patent/TWI313577B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
TW93111299A 2003-04-22 2004-04-22 Copper-clad laminate for multilayer printed wiring board, multilayer printed wiring board and manufacturing method thereof TWI313577B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003116466A JP4075673B2 (ja) 2003-04-22 2003-04-22 多層プリント配線板用銅張り積層板、多層プリント配線板、多層プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
TW200427389A TW200427389A (en) 2004-12-01
TWI313577B true TWI313577B (en) 2009-08-11

Family

ID=33307992

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93111299A TWI313577B (en) 2003-04-22 2004-04-22 Copper-clad laminate for multilayer printed wiring board, multilayer printed wiring board and manufacturing method thereof

Country Status (4)

Country Link
JP (1) JP4075673B2 (fr)
CN (1) CN1778155B (fr)
TW (1) TWI313577B (fr)
WO (1) WO2004095900A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI563892B (en) * 2014-02-21 2016-12-21 Mitsui Mining & Smelting Co Copper clad laminate with protective layer and multi-layer printed wiring board

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4301152B2 (ja) * 2004-11-25 2009-07-22 パナソニック電工株式会社 バイアホール形成金属張積層板及びスルーホール形成アンクラッド板
JP2006294725A (ja) 2005-04-07 2006-10-26 Fujikura Ltd 配線基板、多層配線基板およびそれらの製造方法
WO2007043438A1 (fr) * 2005-10-11 2007-04-19 Sumitomo Electric Industries, Ltd. Carte à circuit imprimé multi-couche et son procédé de production
JP5077800B2 (ja) * 2005-10-11 2012-11-21 住友電気工業株式会社 多層プリント配線板の製造方法
JP5077801B2 (ja) * 2005-10-11 2012-11-21 住友電気工業株式会社 多層プリント配線板の製造方法
JP4838606B2 (ja) * 2006-03-17 2011-12-14 三菱樹脂株式会社 樹脂付き銅箔
EP2114579B1 (fr) * 2007-01-02 2019-09-11 Ormet Circuits, Inc. Procédés pour produire des cartes de circuits imprimés multicouches, haute densité à partir de circuits fabriqués en parallèle et trous d'interconnexion remplis
JP2008235833A (ja) * 2007-03-23 2008-10-02 Mitsubishi Plastics Ind Ltd 多層配線基板用層間接続ボンディングシート
JP2008244091A (ja) * 2007-03-27 2008-10-09 Mitsubishi Plastics Ind Ltd 多層配線基板用層間接続ボンディングシート
JP2008244061A (ja) * 2007-03-27 2008-10-09 Mitsubishi Plastics Ind Ltd 多層配線基板用層間接続ボンディングシート
WO2009017051A1 (fr) 2007-07-27 2009-02-05 Zeon Corporation Composite pour une carte de circuit multicouche
KR101019155B1 (ko) 2008-12-03 2011-03-04 삼성전기주식회사 기판 제조방법
JP5359939B2 (ja) * 2010-03-08 2013-12-04 株式会社デンソー 樹脂フィルムおよびそれを用いた多層回路基板とその製造方法
EP2564677A4 (fr) * 2010-04-30 2015-06-24 Viasystems Technologies Corp L L C Procédés de fabrication de cartes de circuit imprimé utilisant des processus parallèles en vue d'obtenir une interconnexion avec des sous-ensembles
CN103179808B (zh) * 2011-12-21 2016-08-24 北大方正集团有限公司 多层印刷电路板及其制作方法
JP6177639B2 (ja) * 2013-09-20 2017-08-09 日本メクトロン株式会社 多層プリント配線板の製造方法、および多層プリント配線板
CN103730190B (zh) * 2014-01-16 2016-08-17 广州新视界光电科技有限公司 复合铜导电薄膜及其制备方法以及金属布线电路
JP6240007B2 (ja) * 2014-03-18 2017-11-29 日本メクトロン株式会社 フレキシブルプリント基板の製造方法およびフレキシブルプリント基板の製造に用いられる中間生成物
JP6322075B2 (ja) * 2014-07-23 2018-05-09 日本メクトロン株式会社 多層プリント配線板の製造方法
TWI626870B (zh) * 2016-12-05 2018-06-11 中華精測科技股份有限公司 垂直連接介面結構、具該結構的電路板及其製造方法
JP6803249B2 (ja) * 2017-01-30 2020-12-23 新光電気工業株式会社 配線基板及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62104196A (ja) * 1985-10-31 1987-05-14 日東紡績株式会社 多層用プリント配線基板
JP4776056B2 (ja) * 2000-03-23 2011-09-21 イビデン株式会社 導電性ペースト
JP2001105555A (ja) * 1999-10-13 2001-04-17 Ajinomoto Co Inc 接着フィルム及びこれを用いた多層プリント配線板の製造法
JP4489899B2 (ja) * 2000-03-08 2010-06-23 イビデン株式会社 多層プリント配線板用両面回路基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI563892B (en) * 2014-02-21 2016-12-21 Mitsui Mining & Smelting Co Copper clad laminate with protective layer and multi-layer printed wiring board
US10244640B2 (en) 2014-02-21 2019-03-26 Mitsui Mining & Smelting Co., Ltd. Copper clad laminate provided with protective layer and multilayered printed wiring board

Also Published As

Publication number Publication date
JP4075673B2 (ja) 2008-04-16
CN1778155A (zh) 2006-05-24
TW200427389A (en) 2004-12-01
JP2004327510A (ja) 2004-11-18
CN1778155B (zh) 2010-12-08
WO2004095900A1 (fr) 2004-11-04

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