CN106332438A - 软硬结合电路板及其制作方法 - Google Patents
软硬结合电路板及其制作方法 Download PDFInfo
- Publication number
- CN106332438A CN106332438A CN201510367357.8A CN201510367357A CN106332438A CN 106332438 A CN106332438 A CN 106332438A CN 201510367357 A CN201510367357 A CN 201510367357A CN 106332438 A CN106332438 A CN 106332438A
- Authority
- CN
- China
- Prior art keywords
- conformable region
- layer
- rigid
- connecting area
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510367357.8A CN106332438A (zh) | 2015-06-26 | 2015-06-26 | 软硬结合电路板及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510367357.8A CN106332438A (zh) | 2015-06-26 | 2015-06-26 | 软硬结合电路板及其制作方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106332438A true CN106332438A (zh) | 2017-01-11 |
Family
ID=57721502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510367357.8A Pending CN106332438A (zh) | 2015-06-26 | 2015-06-26 | 软硬结合电路板及其制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN106332438A (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106686916A (zh) * | 2017-02-27 | 2017-05-17 | 深圳市仁创艺电子有限公司 | 一种高密度超薄型刚挠结合板的层压方法 |
CN108156758A (zh) * | 2017-12-28 | 2018-06-12 | 信利光电股份有限公司 | 一种软硬结合板的软硬结合处毛刺改善方法 |
TWI681475B (zh) * | 2017-08-29 | 2020-01-01 | 大陸商鵬鼎控股(深圳)股份有限公司 | 軟硬結合板及其製作方法 |
CN111132443A (zh) * | 2018-10-31 | 2020-05-08 | 庆鼎精密电子(淮安)有限公司 | 含屏蔽结构的电路板及其制作方法 |
WO2020093400A1 (zh) * | 2018-11-09 | 2020-05-14 | 庆鼎精密电子(淮安)有限公司 | 软硬结合电路板及其制作方法 |
CN111212519A (zh) * | 2020-03-17 | 2020-05-29 | 浙江万正电子科技有限公司 | 金属散热聚酰亚胺软硬结合多层线路板 |
CN112839453A (zh) * | 2021-01-20 | 2021-05-25 | 福立旺精密机电(中国)股份有限公司 | 刚挠结合线路板及其制备方法 |
CN113543469A (zh) * | 2021-07-21 | 2021-10-22 | 高德(无锡)电子有限公司 | 印刷电路板及其co2镭射烧窗开盖的方法 |
CN114980572A (zh) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | 一种软硬结合电路板及加工方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252559A (ja) * | 1993-02-22 | 1994-09-09 | Toshiba Chem Corp | 複合多層配線板の製造方法 |
JP2002158445A (ja) * | 2000-11-22 | 2002-05-31 | Cmk Corp | リジッドフレックスプリント配線板及びその製造方法 |
CN103281859A (zh) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | 一种软硬结合线路板及其制作方法 |
US20130292050A1 (en) * | 2012-05-04 | 2013-11-07 | Mutual-Tek Industries Co., Ltd. | Method of manufacturing a combined circuit board |
-
2015
- 2015-06-26 CN CN201510367357.8A patent/CN106332438A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252559A (ja) * | 1993-02-22 | 1994-09-09 | Toshiba Chem Corp | 複合多層配線板の製造方法 |
JP2002158445A (ja) * | 2000-11-22 | 2002-05-31 | Cmk Corp | リジッドフレックスプリント配線板及びその製造方法 |
US20130292050A1 (en) * | 2012-05-04 | 2013-11-07 | Mutual-Tek Industries Co., Ltd. | Method of manufacturing a combined circuit board |
CN103281859A (zh) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | 一种软硬结合线路板及其制作方法 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106686916A (zh) * | 2017-02-27 | 2017-05-17 | 深圳市仁创艺电子有限公司 | 一种高密度超薄型刚挠结合板的层压方法 |
TWI681475B (zh) * | 2017-08-29 | 2020-01-01 | 大陸商鵬鼎控股(深圳)股份有限公司 | 軟硬結合板及其製作方法 |
CN108156758A (zh) * | 2017-12-28 | 2018-06-12 | 信利光电股份有限公司 | 一种软硬结合板的软硬结合处毛刺改善方法 |
CN108156758B (zh) * | 2017-12-28 | 2020-12-25 | 信利光电股份有限公司 | 一种软硬结合板的软硬结合处毛刺改善方法 |
CN111132443A (zh) * | 2018-10-31 | 2020-05-08 | 庆鼎精密电子(淮安)有限公司 | 含屏蔽结构的电路板及其制作方法 |
CN111132443B (zh) * | 2018-10-31 | 2021-08-24 | 庆鼎精密电子(淮安)有限公司 | 含屏蔽结构的电路板及其制作方法 |
US11140776B2 (en) | 2018-11-09 | 2021-10-05 | Qing Ding Precision Electronics (Huaian) Co., Ltd | Method of making a rigid/flex circuit board |
WO2020093400A1 (zh) * | 2018-11-09 | 2020-05-14 | 庆鼎精密电子(淮安)有限公司 | 软硬结合电路板及其制作方法 |
US20200154559A1 (en) * | 2018-11-09 | 2020-05-14 | Qing Ding Precision Electronics (Huaian) Co.,Ltd | Rigid-flex circuit board and method for making same |
CN111434190A (zh) * | 2018-11-09 | 2020-07-17 | 庆鼎精密电子(淮安)有限公司 | 软硬结合电路板及其制作方法 |
CN111434190B (zh) * | 2018-11-09 | 2022-08-09 | 庆鼎精密电子(淮安)有限公司 | 软硬结合电路板及其制作方法 |
CN111212519A (zh) * | 2020-03-17 | 2020-05-29 | 浙江万正电子科技有限公司 | 金属散热聚酰亚胺软硬结合多层线路板 |
CN112839453A (zh) * | 2021-01-20 | 2021-05-25 | 福立旺精密机电(中国)股份有限公司 | 刚挠结合线路板及其制备方法 |
CN114980572A (zh) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | 一种软硬结合电路板及加工方法 |
CN113543469A (zh) * | 2021-07-21 | 2021-10-22 | 高德(无锡)电子有限公司 | 印刷电路板及其co2镭射烧窗开盖的方法 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170309 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518105 Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Shenzhen Baoan District city Songgang street Chuanyan Luzhen Yan Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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CB02 | Change of applicant information | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170111 |
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WD01 | Invention patent application deemed withdrawn after publication |