CN111434190A - 软硬结合电路板及其制作方法 - Google Patents

软硬结合电路板及其制作方法 Download PDF

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Publication number
CN111434190A
CN111434190A CN201880028351.XA CN201880028351A CN111434190A CN 111434190 A CN111434190 A CN 111434190A CN 201880028351 A CN201880028351 A CN 201880028351A CN 111434190 A CN111434190 A CN 111434190A
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China
Prior art keywords
layer
circuit board
conductive
protective layer
rigid
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CN201880028351.XA
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CN111434190B (zh
Inventor
侯宁
李卫祥
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Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
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Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

一种软硬结合电路板的制作方法，其包括以下步骤：提供一第一线路板及一第一基板，并通过一第一胶层将第一基板压合于第一线路板的表面上，第一基板包括一压合于第一胶层表面的第二基层、形成于第二基层表面的一保护层及形成于保护层表面的一第一铜层；使得第一铜层形成第三导电线路层；对第三导电线路层裸露的保护层进行部分遮盖，将第三导电线路层及遮盖区裸露的保护层除去；提供一第二铜层，并通过一第二胶层将第二铜层压合于第三导电线路层的表面上，第二铜层及第二胶层均经过预开窗处理，形成开窗区，开窗区位于剩余保护层处；将开窗区处的保护层除去；及使得第二铜层形成第五导电线路层。本发明还提供一种软硬结合电路板。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN201880028351.XA 2018-11-09 2018-11-09 软硬结合电路板及其制作方法 Active CN111434190B (zh)

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Application Number Priority Date Filing Date Title
PCT/CN2018/114914 WO2020093400A1 (zh) 2018-11-09 2018-11-09 软硬结合电路板及其制作方法

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WO (1) WO2020093400A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113423172A (zh) * 2021-05-24 2021-09-21 鹏鼎控股(深圳)股份有限公司 软硬结合电路板及其制作方法
CN114080105A (zh) * 2020-08-20 2022-02-22 宏启胜精密电子(秦皇岛)有限公司 具有凹穴的电路板的制作方法
CN115038263A (zh) * 2022-05-16 2022-09-09 盐城维信电子有限公司 多层板前开盖位置碳粉残留的去除方法
CN115515325A (zh) * 2021-06-22 2022-12-23 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021212480A1 (zh) * 2020-04-24 2021-10-28 庆鼎精密电子（淮安）有限公司 软硬结合电路板及其制作方法
CN113747653B (zh) * 2020-05-27 2023-10-10 庆鼎精密电子（淮安）有限公司 嵌埋元件的软硬结合电路板及其制作方法
CN112654178B (zh) * 2020-11-09 2022-04-29 广东科翔电子科技股份有限公司 一种内嵌焊盘式刚挠结合板的工艺方法
CN114554691B (zh) * 2020-11-25 2024-08-02 鹏鼎控股(深圳)股份有限公司 超长电路板及其制备方法
CN113630987B (zh) * 2021-07-20 2023-05-02 珠海达汉电子科技有限公司 一种软硬结合板的软板对位方法
WO2023224292A1 (ko) * 2022-05-17 2023-11-23 삼성전자주식회사 코팅 레이어를 포함하는 기판을 포함하는 전자 장치
CN115023029A (zh) * 2022-07-01 2022-09-06 淮北翌光科技有限公司 一种柔性电路板及电子产品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101170877A (zh) * 2007-11-21 2008-04-30 健鼎（无锡）电子有限公司 软硬印刷电路板的结合方法
CN103068185A (zh) * 2012-12-21 2013-04-24 深圳市中兴新宇软电路有限公司 印制电路板软硬结合基板挠性区域的制作方法
US20140290989A1 (en) * 2012-04-17 2014-10-02 Advanced Flexible Circuits Co., Ltd. Structure of via hole of electrical circuit board and manufacturing method thereof
CN104582325A (zh) * 2013-10-12 2015-04-29 富葵精密组件(深圳)有限公司 刚挠结合板及其制作方法、电路板模组
CN106332438A (zh) * 2015-06-26 2017-01-11 富葵精密组件(深圳)有限公司 软硬结合电路板及其制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG107593A1 (en) * 2002-06-04 2004-12-29 Agency Science Tech & Res Method for electroless metalisation of polymer substrate
WO2004093508A1 (ja) * 2003-04-18 2004-10-28 Ibiden Co., Ltd. フレックスリジッド配線板
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
JP2006216593A (ja) * 2005-02-01 2006-08-17 Fujikura Ltd リジッドフレックス多層配線板の製造方法
KR100646529B1 (ko) * 2005-03-24 2006-11-23 삼성에스디아이 주식회사 리튬 이차 전지
JP2010040934A (ja) * 2008-08-07 2010-02-18 Sumitomo Bakelite Co Ltd リジッドフレックス回路板
US8404398B2 (en) * 2008-08-12 2013-03-26 Bloom Energy Corporation Hermetic high temperature dielectric with groove and thermal expansion compensator
CN105472906A (zh) * 2014-09-11 2016-04-06 富葵精密组件(深圳)有限公司 软硬结合电路板及其制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101170877A (zh) * 2007-11-21 2008-04-30 健鼎（无锡）电子有限公司 软硬印刷电路板的结合方法
US20140290989A1 (en) * 2012-04-17 2014-10-02 Advanced Flexible Circuits Co., Ltd. Structure of via hole of electrical circuit board and manufacturing method thereof
CN103068185A (zh) * 2012-12-21 2013-04-24 深圳市中兴新宇软电路有限公司 印制电路板软硬结合基板挠性区域的制作方法
CN104582325A (zh) * 2013-10-12 2015-04-29 富葵精密组件(深圳)有限公司 刚挠结合板及其制作方法、电路板模组
CN106332438A (zh) * 2015-06-26 2017-01-11 富葵精密组件(深圳)有限公司 软硬结合电路板及其制作方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114080105A (zh) * 2020-08-20 2022-02-22 宏启胜精密电子(秦皇岛)有限公司 具有凹穴的电路板的制作方法
CN114080105B (zh) * 2020-08-20 2023-06-16 宏启胜精密电子(秦皇岛)有限公司 具有凹穴的电路板的制作方法
CN113423172A (zh) * 2021-05-24 2021-09-21 鹏鼎控股(深圳)股份有限公司 软硬结合电路板及其制作方法
CN113423172B (zh) * 2021-05-24 2023-04-14 鹏鼎控股(深圳)股份有限公司 软硬结合电路板及其制作方法
CN115515325A (zh) * 2021-06-22 2022-12-23 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
CN115038263A (zh) * 2022-05-16 2022-09-09 盐城维信电子有限公司 多层板前开盖位置碳粉残留的去除方法

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CN111434190B (zh) 2022-08-09
US20200154559A1 (en) 2020-05-14
US11140776B2 (en) 2021-10-05

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