CN107920415B - 具厚铜线路的电路板及其制作方法 - Google Patents

具厚铜线路的电路板及其制作方法 Download PDF

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CN107920415B
CN107920415B CN201610880403.9A CN201610880403A CN107920415B CN 107920415 B CN107920415 B CN 107920415B CN 201610880403 A CN201610880403 A CN 201610880403A CN 107920415 B CN107920415 B CN 107920415B
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conductive circuit
layer
circuit pattern
conductive
copper
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CN107920415A (zh
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许芳波
吴鹏
沈鉴泉
吴科建
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Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
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Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
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Priority to TW105138076A priority patent/TWI640234B/zh
Priority to US15/394,735 priority patent/US9907167B1/en
Priority to US15/870,865 priority patent/US11160166B2/en
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Abstract

一种电路板的制作方法，其包括：提供覆铜基板，该覆铜基板包括支撑层及基铜层；在该基铜层的一表面电镀形成第一导电线路图形；在该第一导电线路图形的表面形成第一保护层，该第一保护层还填充该第一导电线路图形与该基铜层之间的间隙；剥离该支撑层；在该基铜层的另外一表面电镀形成第二导电线路图；将该基铜层的被该第一导电线路图形与该第二导电线路图形暴露的部分蚀刻去掉以将该基铜层形成基铜导电线路图形，该基铜导电线路图形、该第一导电线路图形及该第二导电线路图形共同形成导电线路；及在该第二导电线路图形的表面形成第二保护层，该第二保护层还填充该第二导电线路图形与该第一保护层之间的间隙。

Description

具厚铜线路的电路板及其制作方法
技术领域
本发明涉及电路板制作领域，尤其涉及一种具厚铜线路的电路板及其制作方法。
背景技术
随着电子产品的高速发展,作为元器件支撑体与传输电信号载体的印制电路板也应逐渐步向微型化、轻量化、高密度与多功能，进而对印制电路板精细线路的制作提出了更高的要求。常规印制电路板生产工艺线宽受限于铜层厚度,铜层厚度越薄线路越细,故用厚铜来制作细线路本身有局限性；并且常规印制电路板的导电线路通常为减成法，但受限于铜厚，制作细线路只能搭配薄铜，且制作后有蚀刻因子差，蚀刻不凈形成毛边。
发明内容
有鉴于此，有必要提供一种能够解决上述技术问题的电路板制作方法制作而成的电路板。
一种具厚铜线路的电路板的制作方法，其步骤如下：
提供单面覆铜基板，该单面覆铜基板包括支撑层及覆盖在该支撑层表面的基铜层，该基铜层包括第一表面以及与该支撑层接触的第二表面；
在该基铜层的该第一表面电镀形成第一导电线路图形；
在该第一导电线路图形的表面形成第一保护层，该第一保护层还填充该第一导电线路图形与该基铜层之间的间隙；
剥离该第二表面的该支撑层；
在该第二表面电镀形成第二导电线路图且使形成的该第二导电线路图形与该第一导电线路图形相同；
将该基铜层的被该第一导电线路图形与该第二导电线路图形暴露的部分蚀刻去掉以将该基铜层形成基铜导电线路图形，该基铜导电线路图形、该第一导电线路图形及该第二导电线路图形共同形成导电线路；及
在该第二导电线路图形的表面形成第二保护层，该第二保护层还填充该第二导电线路图形与该第一保护层之间的间隙。
一种具厚铜线路的电路板，其包括：导电线路、第一保护层及第二保护层，该导电线路包括基铜导电线路图形、形成在该基铜导电线路图形相背两个表面的第一导电线路图形与第二导电线路图形，该第一保护层压合在该第一导电线路图形及第一导电线路图形间隙的，及压合在第二导电线路图形及第二导电线路图形间隙的第二保护层，该第一保护层及该第二保护层共同包覆该第一导电线路图形、该基铜导电线路图形与该第二导电线路图形，该基铜导电线路图形之间的间隙、该第一导电线路图形之间的间隙及第二导电线路图形之间的间隙三者相互对齐。
与现有技术相比，本发明提供的具细线路的电路板制作方法及由此制作而成的电路板，由于细线路是电镀形成，可以制作出厚铜线路。避免了直接蚀刻厚铜层来形成导电线路时形成的毛边现象及避免了蚀刻不净的现象。
附图说明
图1是本发明第一实施例利用卷对卷方式提供单面覆铜基板的示意图。
图2是提供的单面覆铜基板的剖视图。
图3是在单面覆铜基板包括的基铜层的其中一个表面形成一层感光膜的剖视图。
图4是对感光膜进行曝光显影形成防护层的剖视图。
图5是在感光膜线路的该基铜层的表面进行电镀形成第一导电线路图形的剖面图。
图6是剥离该防护层的剖面图。
图7是在第一导电线路图形的表面形成第一保护膜的剖视图。
图8是移除该基铜层另外一个表面的支撑层的剖面图。
图9是对该基铜层进行研磨以降低该基铜层厚度的剖面图。
图10是在该基铜层的表面形成第二感光膜的剖面图。
图11是对该感光膜进行曝光显影形成防护层的剖面图。
图12是在该基铜层的另外一个表面电镀形成第二导电线路图形的剖面图。
图13是剥离该基铜层的该防护层的剖面图。
图14是蚀刻该基铜层形成基铜导电图形的剖面图。
图15是在该第二导电图形表面形成第二保护层、最终得到该具厚铜线路的电路板的剖面图。
主要元件符号说明
Figure GDA0002331984620000031
Figure GDA0002331984620000041
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合附图及实施例，对本发明提供的电路板及其制作方法作进一步的详细说明。
请参阅图1-15，本发明第一实施例提供一种具厚铜线路的电路板的制作方法，其步骤包括：
第一步，请参阅图1至图2，提供单面覆铜基板10，该单面覆铜基板10包括支撑层11及覆盖在该支撑层11表面的基铜层12，该基铜层12包括第一表面121以及与该支撑层11接触的第二表面123。该支撑层11可以为聚对苯二甲酸乙二醇酯(PET)。
提供该单面覆铜基板10的方法包括：请参阅图1，提供卷绕在卷轮101上的基铜层12，将该基铜层12从该卷轮101上卷出，该基铜层12具有第一表面121以及与第一表面121相对的第二表面123，在该第二表面123贴合一层支撑层11，再对贴合有支撑层11的基铜层12进行裁切至需要的尺寸，从而形成该单面覆铜基板10，该单面覆铜基板10包括的该基铜层12的厚度为18微米。在其它实施方式中，也可以先提供卷绕在卷轮上的支撑层，然后在该支撑层上溅镀铜层或者沉铜形成该基铜层。
第二步：请参阅图3至图6，在该基铜层12的该第一表面121电镀形成第一导电线路图形130。在本实施方式中，在该基铜层12的该第一表面121电镀形成第一导电线路图形130的方法包括：
请参阅图3，在该第一表面121贴合一层感光膜110；该感光膜110的厚度为75微米，请参阅图4，对该感光膜110进行曝光、显影之后，将该感光膜110形成防护层112，该防护层112包括多个开口114，该开口114显露该基铜层12。
然后，请参阅图5，在该开口114的位置进行电镀一层铜层，电镀的铜层用于形成第一导电线路图形130。
最后，请参阅图6，移除该第一表面121的该防护层112，从而在该基铜层12的第一表面121形成该第一导电线路图形130。
第三步，请参阅图7，在该第一导电线路图形130的表面形成第一保护层150，该第一保护层150还填充该第一导电线路图形130与该基铜层12之间的间隙。该第一保护层150用于保护第一导电线路图形130不被氧化，划伤等。在本实施方式中，该第一保护层150为覆盖膜(Coverlay，CVL)，其包括基材层152以及形成在该基材层152表面的胶层154。该胶层154用于覆盖第一导电线路图形130及填充该第一导电线路图形130与该基铜层12形成的间隙132。在其它实施方式中，该第一保护层150还可以为防焊绿漆。
第四步，请参阅图8及图9，剥离该基铜层12的第二表面123的该支撑层11，并且对该基铜层12进行研磨以降低该基铜层的厚度，该第二表面经过研磨变薄后形第三表面125，该基铜层12经研磨后其厚度被减至2至6微米。
第五步，请参阅10至图13，在该第三表面125电镀形成第二导电线路图形140且使形成的该第二导电线路图形140与该第一导电线路图130形相同，该第二导电线路图形140与该第一导电线路图形130相同是指电镀形成的该第二导电线路图形140的宽度、厚度与该第一导电线路图形130的宽度、厚度相同，且该第一导电线路图形130之间的间隙132与第二导电线路图形140之间的间隙142相互对齐。在本实施方式中，形成该第二导电线路图形140的方法与形成第一导电线路图形130的方法相同，形成该第二导电线路图形140也是包括：在该基铜层12的第一表面121形成感光膜(图10)，将该感光膜曝光、显影(图11)，将该感光膜形成防护层116，在该防护层116显露的该第三表面125上电镀一层铜层，及剥离该防护层116(图13)，电镀的该铜层即为形成的该第二导电线路图形140。电镀的该第一导电线路图形130及第二导电线路图形140的厚度均为60至70微米。
第六步，请参阅图14，蚀刻去掉该胶层154表面、且被该第一导电线路图形130与该第二导电线路图形140共同暴露的该部分基铜层12，以将该基铜层12制作形成基铜导电线路图形120。该基铜导电线路图形120之间的间隙122、该第一导电线路图形130之间的间隙132、及该第二导电线路图形140之间的间隙142均相互对齐，也即该基铜导电线路图形120的宽度、该第一导电线路图形130的宽度及该第二导电线路图形140的宽度三者均相同。该基铜导电线路图形120、该第一导电线路图形130及该第二导电线路图140形共同形成导电线路20。
第七步，请参阅图15，在该第二导电线路图形140的表面形成第二保护层160，该第二保护层160还填充该第二导电线路图形140与该第一保护层150之间的间隙，从而得到该具厚铜线路的电路板100。
请再次参阅图15，本发明第二实施例还提供由上述具细线路的电路板制作方法制作而成的具厚铜线路的电路板100，其包括：导电线路20、第一保护层150及第二保护层160。该导电线路20包括基铜导电线路图形120、通过电镀形成在该基铜导电线路图形120相背两个表面的第一导电线路图形130与第二导电线路图形140。该第一导电线路图形130与该第二导电线路图形140均与该基铜导电线路图形120电性接触导通。该基铜导电线路图形120的宽度、该第一导电线路图形130的宽度及该第二导电线路图形140的宽度三者均相同。该第一保护层150压合在该第一导电线路图形130表面及填充第一导电线路图形130的间隙(Pitch)132，该第二保护层压合在第二导电线路图形140的表面及第二导电线路图形140的间隙142，该第一保护层150及该第二保护层160共同包覆该第一导电线路图形130、该基铜导电线路图形120与该第二导电线路图形140，该基铜导电线路图形120之间的间隙122、该第一导电线路图形130之间的间隙132及第二导电线路图形140之间的间隙142三者相互对齐。该第一导电线路图形130的厚度为60至70微米,该第二导电线路图形140的厚度为60至70微米，该基铜导电线路图形120的厚度为2至6微米，所以，通过电镀及蚀刻的方式，可以制作出厚度为125微米的导电线路20。
后续可以在该第一保护层150与第二保护层160中形成切口(图未示)以暴露部分导电线路20作为焊盘，从而在导电线路20的切口位置设置电子元件。
本发明制作的具厚铜线路电路板100可适用于软性电路板，软硬结合电路板以及射频电路板。
综上所述，本发明提供的具细线路的电路板制作方法及由此制作而成的具厚铜线路电路板100，由于导电线路20是电镀形成，从而可以制作出厚铜线路。避免了直接蚀刻厚铜层来形成导电线路时形成的毛边现象及避免了蚀刻不净的现象。
可以理解的是，以上实施例仅用来说明本发明，并非用作对本发明的限定。对于本领域的普通技术人员来说，根据本发明的技术构思做出的其它各种相应的改变与变形，都落在本发明权利要求保护范围之内。

Claims (9)

1.一种具厚铜线路的电路板的制作方法，其步骤如下：
提供单面覆铜基板，该单面覆铜基板包括支撑层及覆盖在该支撑层表面的基铜层，该基铜层具有第一表面以及与该第一表面相背的第二表面，该第二表面与该支撑层相接触；
在该基铜层的该第一表面电镀形成第一导电线路图形；
在该第一导电线路图形的表面形成第一保护层，该第一保护层还填充该第一导电线路图形与该基铜层形成的间隙；
剥离该支撑层；
对该基铜层进行研磨以降低该基铜层的厚度；
在该基铜层的该第二表面电镀形成第二导电线路图形；
将该基铜层的被该第一导电线路图形与该第二导电线路图形暴露的部分蚀刻去掉以将该基铜层形成基铜导电线路图形，该基铜导电线路图形的厚度小于该第一导电线路图形的厚度，且该基铜导电线路图形的厚度小于该第二导电线路图形的厚度，该基铜导电线路图形、该第一导电线路图形及该第二导电线路图形共同形成导电线路；及
在该第二导电线路图形的表面形成第二保护层，该第二保护层还填充该第二导电线路图形与该第一保护层之间的间隙。
2.如权利要求1所述的具厚铜线路的电路板的制作方法，其特征在于，提供该单面覆铜基板的方法包括：提供卷绕在卷轮上的该基铜层，将该基铜层从该卷轮上卷出，在该第二表面贴合一层该支撑层，再对贴合有该支撑层的该基铜层进行裁切至需要的尺寸，从而形成该单面覆铜基板。
3.如权利要求1所述的具厚铜线路的电路板的制作方法，其特征在于，在该基铜层的该第一表面电镀形成第一导电线路图形的方法包括：
在该第一表面贴合一层感光膜；
对该感光膜进行曝光显影将该感光膜形成防护层，该防护层包括多个开口；
在该开口的位置进行电镀；及
移除该第一表面的该防护层，从而形成该第一导电线路图形。
4.如权利要求1所述的具厚铜线路的电路板的制作方法，其特征在于，电镀形成的该第二导电线路图形的厚度与该第一导电线路图形的厚度相同。
5.如权利要求4所述的具厚铜线路的电路板的制作方法，其特征在于，该基铜导电线路图形的宽度、该第一导电线路图形的宽度及该第二导电线路图形的宽度三者均相同。
6.如权利要求5所述的具厚铜线路的电路板的制作方法，其特征在于，该基铜层的原始厚度为18微米，经减铜之后该基铜层的厚度保持在2至6微米。
7.一种具厚铜线路的电路板，其包括：导电线路、第一保护层及第二保护层，该导电线路包括基铜导电线路图形、形成在该基铜导电线路图形相背两个表面的第一导电线路图形与第二导电线路图形，该第一保护层压合在该第一导电线路图形的表面及第一导电线路图形的间隙，第二保护层压合在第二导电线路图形的表面及第二导电线路图形的间隙，该第一保护层及该第二保护层共同包覆该第一导电线路图形、该基铜导电线路图形与该第二导电线路图形，该基铜导电线路图形之间的间隙、该第一导电线路图形之间的间隙及第二导电线路图形之间的间隙三者相互对齐，该基铜导电线路图形的厚度小于该第一导电线路图形的厚度，且该基铜导电线路图形的厚度小于该第二导电线路图形的厚度。
8.如权利要求7所述的电路板，其特征在于，该第一导电线路图形与该第二导电线路图形的厚度相同。
9.如权利要求7所述的电路板，其特征在于，该基铜导电线路图形的宽度、该第一导电线路图形的宽度及该第二导电线路图形的宽度三者均相同。
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