WO2007043438A1 - Carte à circuit imprimé multi-couche et son procédé de production - Google Patents

Carte à circuit imprimé multi-couche et son procédé de production Download PDF

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Publication number
WO2007043438A1
WO2007043438A1 PCT/JP2006/319976 JP2006319976W WO2007043438A1 WO 2007043438 A1 WO2007043438 A1 WO 2007043438A1 JP 2006319976 W JP2006319976 W JP 2006319976W WO 2007043438 A1 WO2007043438 A1 WO 2007043438A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
conductive resin
conductive
multilayer printed
resin composition
Prior art date
Application number
PCT/JP2006/319976
Other languages
English (en)
Japanese (ja)
Inventor
Hitoshi Takii
Yoshio Oka
Noriki Hayashi
Narito Yagi
Original Assignee
Sumitomo Electric Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005296729A external-priority patent/JP5077801B2/ja
Priority claimed from JP2005296088A external-priority patent/JP5077800B2/ja
Application filed by Sumitomo Electric Industries, Ltd. filed Critical Sumitomo Electric Industries, Ltd.
Priority to CN2006800006675A priority Critical patent/CN101044806B/zh
Priority to KR1020077001585A priority patent/KR101281898B1/ko
Priority to TW095137337A priority patent/TWI412313B/zh
Publication of WO2007043438A1 publication Critical patent/WO2007043438A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Definitions

  • the present invention relates to a multilayer printed wiring board in which a plurality of printed wiring layers are laminated, and a method for manufacturing the same.
  • Multilayer printed wiring boards enable high-density mounting of components, and as a technology that enables the components to be connected at the shortest distance (meaning that they are electrically connected; hereinafter simply referred to as "connection"). are known.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2004-95963
  • the conductive material is provided on an insulating substrate (single-sided substrate) provided with a conductive layer (conductor wiring layer) as a wiring pattern on one side.
  • a method for producing a multilayer printed wiring board for laminating press is described. However, in this method, single-sided substrates are sequentially laminated in one direction and batch-laminated press is performed, so that the surface of the insulating substrate is on the outer side of the single-sided substrate located on the outermost side. Component mounting becomes impossible.
  • Patent Document 2 Japanese Patent Laid-Open No. 2001-15920
  • An object of the present invention is to provide a multilayer printed wiring board capable of mounting components at high density on both surfaces thereof. Another object of the present invention is to provide a method for producing a multilayer printed wiring board capable of producing a multilayer printed wiring board capable of high-density component mounting on both surfaces thereof at a low cost with a simple process. .
  • the present inventor has determined that at least one of the insulating substrates having a wiring layer formed on the surface of the conductive material cover is bonded with an adhesive, and the wiring layer is at least on both outer sides thereof.
  • the present inventor has formed an insulating substrate cover having a wiring layer formed of a conductive material on at least one surface thereof, and formed with a conductive resin composition in the insulating substrate.
  • a wiring board substrate having conductive parts to be connected and bumps formed of the conductive resin composition on the conductive parts, and connecting the conductive parts of the wiring board base material by the bumps. It has been found that the multilayer printed wiring board can be manufactured in a simple process by the method of stacking on the substrate. The present invention has been completed based on these findings.
  • the present invention comprises the insulating substrate according to claim 1, wherein at least one surface of the insulating substrate is provided with a wiring layer formed of a conductive material. 2 pieces of wiring board base material having via holes opened in, and
  • An adhesive layer having through-holes in contact with the openings so that the openings at both ends each include the openings of the via holes;
  • the multilayer printed wiring board characterized by including the laminated body which has these.
  • the conductive material is a metal foil, and includes an insulating substrate provided with a wiring layer formed of at least one surface of the metal foil, and one wiring is formed in the insulating substrate.
  • Two of the wiring board substrate having via holes that reach the layer and open on the other surface, and
  • An adhesive layer having through-holes in contact with the openings so that the openings at both ends each include the openings of the via holes;
  • a multilayer printed wiring board comprising a laminate having
  • the present invention provides an insulating substrate in which the conductive material is a conductive resin composition A, and a wiring layer formed of the conductive resin composition A is provided on at least one surface thereof.
  • the conductive material is a conductive resin composition A
  • a wiring layer formed of the conductive resin composition A is provided on at least one surface thereof.
  • two wiring board substrates having via holes that reach one wiring layer and open on the other surface, and
  • An adhesive layer having through-holes in contact with the openings so that the openings at both ends each include the openings of the via holes;
  • a multilayer printed wiring board characterized by comprising a laminate having the above (Claim 3).
  • an insulating resin film can be used, and examples thereof include a resin film mainly composed of PET and polyimide.
  • the resin film mainly composed of polyimide is a heat-resistant film, can meet the demand for high heat resistance corresponding to the use of lead-free solder, and can be used for high-frequency transmission compared to resin containing ceramic and glass cloth. This is preferable since the loss of the insulating substrate is small and the insulating substrate can be thinned and strengthened (Claim 6).
  • the insulating substrate constituting the wiring board substrate is provided with a wiring layer having a conductive material strength on at least one surface thereof.
  • This wiring layer may be provided on one surface of the insulating substrate, It may be provided on both surfaces.
  • the conductive resin composition is referred to as a conductive resin composition A.
  • the metal foil wiring layer is made of, for example, copper bonded on the insulating substrate. It can be formed by applying an etching force to a metal foil such as a foil. For example, after forming a wiring layer pattern of a resist layer on a metal foil, it is immersed in an etchant that corrodes the metal foil to remove portions other than the wiring layer pattern, and then chemical etching (wet type) to remove the resist layer. Etching) is exemplified.
  • Examples of the etchant in this case include salt-ferric ferric etchants, ferric chloride-based etchants, salt-cupric copper etchants, and Al force re-etchants.
  • An example of the insulating substrate having a metal foil attached to one or both surfaces is a polyimide resin substrate (CCL) with a copper foil.
  • a material for forming the metal foil wiring layer a material mainly composed of copper is preferably exemplified from the viewpoints of conductivity, durability, availability, etc. (Claim 5).
  • the material mainly composed of copper is exemplified by copper or an alloy mainly composed of copper.
  • Conductive layer As the material of the wiring layer, silver, aluminum, nickel or the like is used in addition to copper.
  • the conductive resin composition A is used as the conductive resin composition.
  • the conductive resin composition A include those obtained by kneading conductive particles such as metal fine particles, metal fillers, and carbon fine particles in a resin that can be easily plastically deformed. Examples include silver coated copper fillers, copper fillers and carbon mixture pastes.
  • the conductive resin composition A may be formed by coating on an insulating substrate by means such as screen printing. it can
  • a via hole (bottomed hole) reaching one wiring layer and opening on the other surface is formed.
  • “to reach one wiring layer” means that one wiring layer is the bottom of the via hole.
  • the via hole can be formed by performing drilling using a laser, a drill, a mold or the like at a position where interlayer connection of the insulating substrate is desired.
  • the wiring layer is formed of a conductive resin composition, it can be processed by stacking many sheets, and the process of removing smear from the copper foil portion of the via hole portion is not necessary.
  • the multilayer printed wiring board of the present invention includes a laminate in which at least part of the multilayer printed wiring board (the central portion in the thickness direction) is bonded with an adhesive. To do.
  • the adhesive layer has through holes.
  • the two wiring board substrates and the adhesive have wiring layers on both outer sides (surfaces) of the resulting laminate, and the openings at both ends of the adhesive through-holes are two wiring boards. It arrange
  • the opening of the through hole is arranged so as to include the opening of the via hole” means that both of the openings of the via hole are within the opening of the through hole. Means contact.
  • the elastic modulus of the adhesive layer is 1 GPa or less because stress at the time of reflow when mounting a component on the multilayer printed wiring board is reduced, and reflow resistance and reliability are excellent.
  • the elastic modulus is less than 0.0OOlGPa, the amount of deformation (elongation) becomes so large that it may be difficult to handle. Therefore, it is preferably 0.0OOlGPa or more (the invention of claim 7).
  • Examples of the composite adhesive comprising two or more members include a sheet formed by impregnating an adhesive in a highly rigid porous material, and a highly rigid insulating film layer between two adhesive layers. A sheet or the like that is sandwiched between them is exemplified.
  • Examples of the adhesive forming the adhesive sheet include thermoplastic polyimide resins, thermoplastic resins mainly composed of thermoplastic polyimides, and thermosetting properties such as epoxy resins and imide-based resins. Examples include rosin and the like. Among these, in the case of a resin having a thermosetting function mainly composed of a thermoplastic polyimide, a thermosetting epoxy resin, and a thermosetting imide resin, a sufficient adhesive force is secured after heat curing, which is preferable. . Also, the through hole formation method is particularly limited. It is not specified, and a laser drilling method, a method of mechanically drilling using a drill, or the like can be employed.
  • the openings at both ends of the through-hole of the adhesive include the openings of the via holes of the two wiring board base materials, respectively. Holes reaching both ends are formed in the wiring layers on both outer sides.
  • the hole is filled with the conductive resin composition, and the wiring layers on both outer sides of the laminate are connected.
  • This conductive resin composition is referred to as conductive resin composition B.
  • the hole filled with conductive resin composition B is hereinafter simply referred to as “conductive part”).
  • the conductive resin composition B is obtained by kneading conductive particles, for example, metal fine particles, metal fillers, and carbon fine particles, with a resin that can be easily plastically deformed.
  • conductive particles for example, metal fine particles, metal fillers, and carbon fine particles
  • silver paste, a silver coated copper filler, a copper filler, a paste of a bonbon mixture, and the like are exemplified.
  • the resin that easily undergoes plastic deformation include epoxy resin, polyester resin, polyimide resin, polyamide resin, and liquid crystal polymer.
  • the conductive resin composition A and the conductive resin composition B may be conductive resin compositions having different blending compositions, but simplification of the process and at the interface between the two. From the viewpoint of changes in current value and resistance value, it is preferable to use the same one.
  • the multilayer printed wiring board of the present invention is a force that includes the above-described laminate, that is, a laminate having a wiring layer formed of a conductive material on both surfaces thereof.
  • another wiring board base material is bonded and laminated with an adhesive.
  • the other wiring board base material has an insulating substrate and a conductor layer provided on at least one surface of the insulating substrate, and the laminated body includes a conductive portion provided in the insulating substrate and in the adhesive.
  • the wiring layer on the outside is connected to the conductor layer of another wiring board substrate.
  • the conductive portion fills the via hole provided in the insulating substrate and the opening force provided in the adhesive with the opening S of the via hole in contact with the conductive resin composition. It is possible to obtain it.
  • the conductor layer of the other wiring board substrate is a wiring layer made of a metal foil or a conductive resin composition.
  • a multilayer printed wiring board is formed by connecting multiple wiring layers through conductive parts. Is done.
  • one or more similar wiring board substrates can be laminated on the outer side of the other laminated wiring board substrates, and a multilayer printed wiring board comprising more wiring layer layers can be obtained. It is formed.
  • the wiring layer made of the conductive resin composition is inferior to the metal foil wiring layer in terms of high temperature heat resistance, in reflow when mounting a component on the outermost wiring layer, Problems such as poor conductivity are more likely to occur than with metal foil wiring layers. Therefore, a metal foil wiring layer is preferable for the outermost wiring layer. Claim 4 corresponds to this preferred embodiment. The manufacturing method and material of the metal foil wiring layer are the same as described above.
  • the present invention further provides a method for producing the multilayer printed wiring board.
  • the present invention comprises an insulating substrate provided with a wiring layer formed of a conductive material on at least one surface thereof in claim 9, and reaches one wiring layer in the insulating substrate.
  • a wiring board substrate having a conductive resin portion formed by filling a conductive resin composition B in a via hole opened on another surface, and a wiring layer formed of a conductive material on at least one surface thereof
  • the insulating substrate includes a conductive resin portion formed by filling the conductive resin composition B in a via hole that reaches one wiring layer and opens on the other surface.
  • a plurality of wiring board substrates including at least two wiring board substrates having bumps formed of the conductive resin composition B on the resin part are connected to the conductive resin part of the wiring board substrate a. And the bumps on the wiring board substrate b are in contact with each other and between the wiring board substrates. Sandwiching the Chakuzai are stacked, to provide a method of manufacturing a multilayer printed wiring board, which comprises laminating press collectively these.
  • the insulating substrate, the wiring layer, and the via hole of the wiring board base material a and the wiring board base material b are the insulating substrate, the wiring layer described in the above description of the multilayer printed wiring board of the present invention. And the same as Bihonore.
  • the wiring board substrate a is characterized by having a conductive resin portion formed by filling the via hole with a conductive resin composition. Since this conductive resin part forms the wiring interlayer conductive part, the conductive resin composition forming the conductive resin part is the conductive resin composition B.
  • the filling method of the conductive resin composition B is not particularly limited, and examples thereof include a filling method by screen printing.
  • the wiring board base b is formed by further forming a conductive bump on the conductive resin portion of the wiring board base a.
  • the bump of the conductive material is a protrusion of the conductive material. Since this conductive bump also forms the wiring interlayer conductive portion, the conductive resin composition forming the bump is also the conductive resin composition B.
  • the method for forming the bumps of the conductive material is not particularly limited! However, for example, a mold release layer such as polyethylene terephthalate (PET) is formed on the insulating substrate, and the insulating substrate and An example is a method in which a via hole penetrating the release layer is formed, and after filling the via hole with the conductive resin composition B, the release layer is peeled off to form a protruding portion.
  • Another method for forming a conductive bump is to fill the via hole with the conductive resin composition B, and then apply the conductive resin composition B on the via hole by screen printing.
  • a plurality of wiring board base materials including at least two of the wiring board base material a and the wiring board base material b are laminated. Lamination is performed such that the conductive resin portion of the wiring board substrate a and the bumps of the wiring board substrate b are in contact with each other.
  • Lamination is performed by sandwiching an adhesive between the wiring board substrate a and the wiring board substrate b.
  • an adhesive is sandwiched between the other wiring board base materials, and these are collectively laminated and pressed.
  • the bumps are deformed, and conductive parts are formed between the wiring board base materials. Since the conductive parts cover the surface of the conductive resin part of the wiring board base material a, the wiring board base material a
  • the wiring layer of the wiring board and the wiring layer of the wiring board base material b are connected by a conductive portion formed by deforming the conductive resin part and the bump of the wiring board base material.
  • the present invention further comprises, in claim 10, an insulating substrate provided with a wiring layer formed of a conductive material on at least one surface thereof, wherein one wiring layer is formed in the insulating substrate.
  • a method for producing a multilayer printed wiring board which comprises laminating and laminating and laminating and pressing.
  • two wiring board bases b having bumps are arranged such that the bumps are mutually connected. It is characterized by being laminated so as to be in contact with each other, and is the same as the aspect of claim 9 in other points. Both bumps are deformed and integrated by the laminating press, and a conductive portion is formed between the wiring board substrates. Since each bump is connected to the conductive resin portion of each wiring board base material, the wiring layer of the two wiring board base materials b is connected by this integral connection.
  • the lamination press can be performed by heating and pressurizing with a cure press or the like.
  • the wiring board base material a and Z or the wiring board base material b is laminated on the outer side of the wiring board base material b.
  • the This wiring board substrate is composed of an insulating substrate provided with a conductor layer on one surface thereof, and the conductive resin composition is formed in the insulating substrate in a via hole that reaches one conductor layer and opens on the other surface.
  • the bump and another wiring board substrate (wiring) The wiring layer of the board substrate a or the wiring board substrate b is laminated so that the wiring layers are in contact with each other (claim 11).
  • a metal foil or a resin composition A is used as a conductive material.
  • Metal foil has excellent viewpoints such as electrical conductivity and durability.
  • Preferred resin composition A can be formed by coating on an insulating substrate by means of screen printing or the like, and is easy to process. (Claim 12).
  • the present invention provides the method for producing a multilayer printed wiring board having three or more layers according to claim 13, wherein the wiring board comprises an insulating substrate provided with a metal foil wiring layer on one surface thereof.
  • a method for producing a multilayer printed wiring board characterized in that a substrate is disposed and laminated such that the metal foil wiring layer is the outermost layer.
  • the wiring board base materials a and Z or the wiring board base material and the other wiring board base material are stacked with an adhesive sandwiched between them. These Press the layers together. That is, since the multilayer printed wiring board of the present invention can be produced by a single laminating press, high productivity can be obtained.
  • Examples of a method for sandwiching the adhesive include a method using an adhesive sheet and sandwiching the sheet.
  • an adhesive sheet having a through-hole is used at a position corresponding to the bump V, and a method of stacking the wiring board substrate b and the adhesive sheet so that the bump is inserted into the through-hole.
  • Claim 14 corresponds to an embodiment using this adhesive sheet.
  • the diameter of the through hole is preferably about 0.5 to 5 times the diameter (maximum diameter) of the bump. 0.
  • the alignment of the through hole and the bump becomes easy.
  • there is a gap between the adhesive sheet and the bump before the lamination press but if the diameter of the through hole is about 5 times the diameter of the bump or less, the adhesive sheet is expanded by the lamination press, Also, the bumps are plastically deformed, and the conductive material of the bumps and the adhesive are in contact with each other, and this gap is easily eliminated.
  • the melt viscosity of the adhesive sheet is preferably such that the adhesive sheet has a minimum melt viscosity at 100 to 250 ° C of 500 to 50,000 Pa's. If the melt viscosity is higher than the upper limit of this range, it may be difficult to eliminate the gap between the bump and the adhesive sheet during lamination. On the other hand, if it is lower than the lower limit of this range, the adhesive tends to flow between the bumps or the interface between the conductive resin part and the bumps, and connection failure may easily occur. Claim 15 corresponds to this preferred embodiment.
  • the adhesive sheet is a composite composed of two or more members
  • a member having a melt viscosity in the range of 500 to 50,000 Pa's at a minimum melt viscosity at 100 to 250 ° C is included.
  • the gap between the bump and the adhesive sheet can be eliminated at that portion, which is preferable in the same manner as in the aspect of the fourteenth aspect.
  • Claim 16 corresponds to this preferred embodiment.
  • Examples of the composite adhesive sheet having a force of two or more members include a sheet obtained by impregnating a porous material with an adhesive, and a sheet obtained by sandwiching an insulating film layer between two adhesive layers. An example is shown.
  • the multilayer printed wiring board of the present invention is capable of high-density component mounting on both surfaces thereof, and has little positional displacement between the wiring boards, and is highly reliable. It is suitably used for production. Moreover, according to the method for producing a multilayer printed wiring board of the present invention, this excellent multilayer printed wiring board can be produced by a simple process.
  • FIG. 1 is a schematic cross-sectional view showing an example of a multilayer printed wiring board according to the present invention.
  • FIG. 2 is a schematic cross-sectional view showing one process of manufacturing a multilayer printed wiring board according to the present invention.
  • FIG. 3 is a schematic cross-sectional view showing an example of a multilayer printed wiring board according to the present invention.
  • FIG. 4 is a schematic cross-sectional view showing an example of a multilayer printed wiring board according to the present invention.
  • the laminate included in the multilayer printed wiring board of the present invention is composed of two wiring board substrates, and each of the two wiring board substrates is electrically conductive on at least one surface thereof.
  • a wiring layer made of a material is provided. That is, as a combination of two wiring board base materials, (1) a combination of two single-sided base materials provided with a wiring layer formed of a conductive material on the surface, and (1) a wiring formed of a conductive material on the surface 2 sheets of double-sided substrate with a single-sided base that provides a layer and a double-sided base that provides a wiring layer formed of a conductive material on both surfaces, and a wiring layer that is formed of a conductive material on both surfaces Possible combinations
  • FIG. 1 is a schematic cross-sectional view showing a multilayer printed wiring board of the present invention when the laminate is a combination of two single-sided substrates.
  • a laminate 51 is composed of a single-sided base material 31 composed of a polyimide film 21 and a wiring layer 11 (hereinafter simply referred to as wiring layer 11) formed of a conductive material, a polyimide film 22 and a conductive material.
  • the wiring layer 12 the adhesive layer 41 having a moduli of elasticity of 0.001 to lGPa.
  • a hole extending from the wiring layer 11 to the wiring layer 12 and penetrating the polyimide film 21, the polyimide film 22, and the adhesive layer 41 is formed, and the conductive resin composition is formed in the hole.
  • the conductive portion 61 is formed by filling B.
  • the hole in which the conductive part 61 is formed is obtained by connecting the via holes 215 and 225 formed in the polyimide film 21 and the polyimide film 22, respectively, and the through hole 412 formed in the adhesive layer 41.
  • the opening portions at both ends of the through hole 412 include each larger than the opening portions of the via holes 215 and 225.
  • the conductive resin composition B is filled in the hole in which the via hole in the polyimide film 24 and the through hole in the adhesive layer 43 are connected, and the conductive portion 63 is formed.
  • the conductive layers 62 and 63 connect the wiring layer 13 and the wiring layer 14 to the wiring layer 11 and the wiring layer 12 on the multilayer body 51, respectively.
  • a piece in which a wiring layer 15 (hereinafter simply referred to as a wiring layer 15) formed of a conductive material is formed on a polyimide film 25.
  • a single-sided base material 36 in which a surface base material 35 and a wiring layer 16 formed of a conductive material (hereinafter simply referred to as wiring layer 16) are formed on a polyimide film 26 are laminated, and adhesive layers 44, Bonded by 45.
  • FIG. 2 is a schematic cross-sectional view showing a step of manufacturing the multilayer printed wiring board of the present invention.
  • 31 'and 32' are the wiring board base material b and the wiring board base material a, respectively.
  • the wiring board base material b31 ′ acts as a force with the polyimide film 21 and the wiring layer 11 formed on one surface thereof.
  • via holes are formed with the wiring layer 11 at the bottom and opened on the other surface, and the conductive resin composition B is screen-printed to form the conductive resin composition B inside the via hole.
  • a conductive resin part 811 filled with the above is formed, and a bump 812 is formed on the conductive resin part 811 by screen-printing the conductive resin composition B.
  • the wiring board substrate a32 includes a polyimide film 22 and a wiring layer 12 formed on one surface thereof.
  • a via hole having the wiring layer 12 as a bottom and an opening on the other surface is formed.
  • the via hole is filled with the conductive resin composition B.
  • a filled conductive oil 821 is formed.
  • an adhesive sheet 411 made of an adhesive having a cured elastic modulus of 0.001 to 1GPa is disposed, and the conductive resin portion 821 and bump 812 pair
  • the wiring board substrate a32 ′, the wiring board substrate b31 ′, and the adhesive sheet 411 are arranged so that the bumps 812 are inserted into the through holes 412 formed in the adhesive sheet 411.
  • An adhesive sheet 421 made of an adhesive having a cured elastic modulus of 0.001 to lGPa is disposed outside the wiring board substrate b31 '.
  • Wiring board base material b31 ′, adhesive sheet 421 and single-sided base material 33 ′ have bumps 832 inserted into through-holes 422 formed in adhesive sheet 421 so that wiring layer 11 and bumps 832 face each other. Arranged so that.
  • an adhesive sheet 441 having an adhesive strength of 0.001 to lGPa after curing is disposed on the outer side of the single-sided substrate 33 ', and on the outer side, a polyimide film 25 and A single-sided substrate comprising a wiring layer 15 formed on one surface thereof and having a conductive resin composition 851 and bumps 852 formed by screen-printing a conductive resin composition B in via holes in a polyimide film 25 35 ′ is arranged so that the wiring layer 13 and the bump 852 face each other and the bump 852 is inserted into the through hole 442 formed in the adhesive sheet 441.
  • the bumps 842 and 862 are inserted into the through holes 432 and 452 formed in the adhesive sheet 451, respectively, and the bumps 842 and 862 are arranged so as to face the wiring layers 12 and 14, respectively. .
  • each bump is plastically deformed by the pressure press.
  • each adhesive sheet is plastically deformed, and the gap between each adhesive sheet and each bump is eliminated, and the multilayer printed wiring board of the present invention shown in FIG. 1 is formed.
  • a wiring interlayer conductive portion and a conductive portion are formed by each conductive resin portion and the bump.
  • the above-described manufacturing method can be performed in the same manner by using two pieces of the wiring board base material b instead of the wiring board base material b31 'and the wiring board base material a32'.
  • the two wiring board bases b are arranged with the adhesive sheet sandwiched so that the respective bumps face each other.
  • the manufacturing method is the same as that shown in FIG.
  • the multilayer printed wiring board of this invention shown by is formed.
  • FIG. 3 is a schematic cross-sectional view showing the multilayer printed wiring board of the present invention when the laminate is a combination of a single-sided base material and a double-sided base material.
  • a laminate 52 includes a single-sided base material 311 composed of a polyimide film 211 and a wiring layer 111 (hereinafter simply referred to as a wiring layer 111) formed of a conductive material formed on the surface of the polyimide film 211, and A double-sided base material 321 composed of a polyimide film 221 and a wiring layer 121 (hereinafter simply referred to as a wiring layer 121) formed of a conductive material formed on both surfaces of the polyimide film 221, and an elastic modulus of 0.001 to
  • the adhesive layer 46 of lGPa is formed by bonding between the polyimide film 211 and the wiring layer 12 2 (hereinafter simply referred to as the wiring layer 122) formed of the conductive resin composition A. Except for the above points, it is the same as the example of FIG.
  • FIG. 4 is a schematic cross-sectional view showing the multilayer printed wiring board of the present invention when the laminate is a combination of two double-sided base materials.
  • a laminate 53 is a double-sided film composed of a polyimide film 212 and wiring layers 112 and 1 13 (hereinafter simply referred to as wiring layers 112 and 113, respectively) formed of a conductive material formed on both surfaces thereof.
  • a double-sided substrate comprising a substrate 312 and a polyimide film 222 and wiring layers 123 and 124 (hereinafter simply referred to as wiring layers 123 and 124, respectively) formed of a conductive material formed on both surfaces thereof.
  • 322 is an adhesive layer 47 having an elastic modulus of 0.001 GPa or more and 1 GPa or less, and is formed by bonding the wiring layers 113 and 124 together. Except for the above points, it is the same as the example of FIG. 1 and can be manufactured by the same method.
  • a multilayer printed wiring board having a metal foil wiring layer as an outermost layer replaces the outermost wiring layer (for example, 15 and 16 in FIGS. 1 and 2) of the laminate shown in FIGS. 1 to 4 with a metal foil wiring layer, and the others are as described above. It can be formed by a similar method.
  • PI polyimide film
  • the silver paste thus obtained was filled in each via hole by screen printing, and temporary curing was performed. Furthermore, using the same ingredients as the silver paste described above, screen printing of silver paste with increased viscosity by changing the amount of solvent to form a total of 8 bumps (projections) with a diameter of 200 / zm and a height of 60 m And temporary hardening was implemented. Thus, a single-sided wiring board base material corresponding to 31 ′, 33 ′, 34 ′, 35 ′, and 36 ′ in FIG.
  • a single-sided wiring board substrate corresponding to 32 'in Fig. 2 was produced in the same manner as described above, except that screen printing with a silver paste with increased viscosity was not performed.
  • the single-sided wiring board substrate (corresponding to 31, 32, 33, 34, 35, 36 in FIG. 2) As shown in Fig. 2, the single-sided wiring board substrate) and the insulating sheet for interlayer adhesion are stacked so that bumps can be inserted into the through-holes of the interlayer adhesive insulation, and then bonded by vacuum press. Thereafter, a wiring layer was formed so that the interlayer connection portion became a daisy chain, and a multilayer printed wiring board was produced.
  • Example 1 The bumps used in Example 1 are formed! In addition to the single-sided wiring board substrate (wiring board substrate corresponding to 32 'in FIG. 2), in Example 1, The same wiring board substrate as the one-sided wiring board substrate on which the bumps used were formed (the wiring board substrate corresponding to 31 'etc. in Fig. 2) was used. In addition, only the sheet corresponding to 411 in FIG. 2 among the insulating sheets for interlayer adhesion is placed at a predetermined position of the adhesive sheet made of epoxy resin (TLF-Y30: manufactured by Yodogawa Paper) with a thickness of 35 ⁇ m. Using a drill, a 300 m diameter through-hole was formed. In other respects, a multilayer printed wiring board was produced in the same manner as in Example 1.
  • TEZ-Y30 manufactured by Yodogawa Paper
  • an interlayer adhesive was impregnated with a wax on a non-woven fabric (EA541: Shin-Kobe Electric, the minimum melt viscosity of the resin at 100 to 250 ° C is 63 Pa's).
  • a multilayer printed wiring board was produced in the same manner as in Example 1 except that it was used.
  • Example 2 Example 3
  • Example 4 Example 4
  • the resistance change rate was 10% or less even when the lead-free reflow test was performed three times.
  • Example In 5 the resistance change rate was 15%.
  • An epoxy resin composed of 70 parts by weight of bisphenol A type epoxy resin (epoxy equivalent 7000-8500) and 30 parts by weight of bisphenol F type epoxy resin (epoxy equivalent 160-170) was used as a solvent with butyl carbitol acetate.
  • a solution was prepared, and an imidazole-based latent curing agent was added thereto to produce a silver paste, which was used as a conductive paste (conductive resin compositions A and B).
  • conductive resin compositions A and B When applying, if necessary, viscosity was adjusted using a solvent.
  • a conductive paste is applied by screen printing on one side of a polyimide film (PI) with a total of 8 through-holes (opening diameter 150 ⁇ m) formed by a drill to provide a wiring layer (PI: 25 ⁇ m, layer Thickness: m) was produced.
  • PI polyimide film
  • PI polyimide film
  • Thickness layer Thickness
  • Conductive paste was filled into each via hole by screen printing at a portion where each through-hole was formed on the back side of the printing surface, and temporary curing was performed. Furthermore, a conductive base was screen-printed to form a total of 8 bumps (convex parts) with a diameter of 250 / zm and a height of 60m, and pre-cured. In this manner, a single-sided paste wiring board substrate (with bumps) corresponding to 31 ′, 33 ′, and 34 ′ in FIG.
  • a single-sided paste wiring board substrate (no bump) corresponding to 32 ′ in FIG. 2 was produced in the same manner as the above method except that no bump was formed.
  • a wiring layer was formed on one side of a copper-laminated laminated substrate of polyimide 25 microns and copper foil 18 ⁇ m, and eight 150 micron diameter via holes were formed by laser from the opposite side.
  • the via hole was filled with a conductive paste by screen printing and temporarily cured. Further, a conductive paste was screen-printed to form a total of 8 bumps (convex portions) having a diameter of 250 / ⁇ and a height of 60 m, and pre-cured to prepare a single-sided wiring board substrate.
  • Two layers of the single-sided copper foil wiring board substrate obtained as described above are arranged on the outermost side, and three layers of the single-sided paste wiring board substrate (with bumps) obtained as described above are arranged on the inner side. And one side of the paste wiring board substrate (without bumps) is arranged in the same manner as in 31, 32, 33, and 34 in Fig. 2, and between the wiring board substrates, After superposing 5 layers of the insulating sheet for bonding so that the bumps are inserted into the through holes of the insulating sheet for interlayer bonding, the bonding process is performed by vacuum press, and then 40 interlayer connection parts are connected to the daisy chain. A wiring layer was formed so that a multilayer printed wiring board was produced.
  • Example 6 a single-sided best wiring board substrate (with bumps) was used instead of the single-sided paste wiring board substrate (without bumps) used above. Also, only the middle sheet (position corresponding to sheet 411 in Fig. 2) of the five-layer interlayer insulation sheet is an adhesive consisting of 35 / zm thick epoxy resin (TLF—Y30: made by Yodogawa Paper). A through-hole with a diameter of 300 m was formed using a drill at a predetermined position of the sheet. In other respects, a multilayer printed wiring board was produced in the same manner as in Example 6.
  • Example 6 Example 7, Example 8, and Example 9 electrical continuity was obtained, and the resistance change rate was 10% or less even when the lead-free reflow test was performed three times. On the other hand, in Example 10, the resistance change rate was 15%.
  • the multilayer printed wiring board of the present invention is capable of high-density component mounting on both surfaces thereof, and has little positional displacement between the wiring boards, and is highly reliable. It is suitably used for production. Further, according to the method for producing a multilayer printed wiring board of the present invention, this excellent multilayer printed wiring board can be produced by a simple process.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne une carte à circuits imprimés multicouche dans laquelle les composants peuvent être fixés sur les surfaces opposées avec une forte densité, ainsi qu'un procédé simple pour la produire. La carte à circuits imprimés multicouche comprend des substrats isolants (21, 22) munis, sur au moins l'une de ses surfaces, de couches de câblage (11, 12) formées d'un matériau conducteur ; elle est caractérisée en ce que les substrats isolants comprennent un corps multicouche (51) de deux substrats de carte de câblage (31', 32') possédant des orifices de raccordement (215, 225) atteignant une couche de câblage et s'ouvrant sur l'autre surface, une couche adhésive (41) possédant un orifice traversant (412) de sorte que les ouvertures des extrémités opposées soient en contact avec les ouvertures des orifices de raccordement, de manière à les inclure, ainsi qu'une partie conductrice (61) placée entre les couches de câblage formées en remplissant l'orifice de raccordement et l'orifice traversant de composition de résine conductrice (B811, 821). L'invention concerne également son procédé de production.
PCT/JP2006/319976 2005-10-11 2006-10-05 Carte à circuit imprimé multi-couche et son procédé de production WO2007043438A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2006800006675A CN101044806B (zh) 2005-10-11 2006-10-05 多层印刷配线板及其制造方法
KR1020077001585A KR101281898B1 (ko) 2005-10-11 2006-10-05 다층 프린트배선판 및 그 제조방법
TW095137337A TWI412313B (zh) 2005-10-11 2006-10-11 多層印刷配線板及其製法

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JP2005-296729 2005-10-11
JP2005-296088 2005-10-11
JP2005296729A JP5077801B2 (ja) 2005-10-11 2005-10-11 多層プリント配線板の製造方法
JP2005296088A JP5077800B2 (ja) 2005-10-11 2005-10-11 多層プリント配線板の製造方法

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JP5354380B2 (ja) * 2007-03-30 2013-11-27 日本電気株式会社 電子機器の配線構造及び電子機器パッケージの製造方法
EP2639821A3 (fr) * 2012-02-17 2015-03-04 HTC Corporation Carte de circuit imprimé, son unité structurelle et son procédé de fabrication
US20190206700A1 (en) * 2016-10-27 2019-07-04 Murata Manufacturing Co., Ltd. Multi-layer substrate and method of manufacturing the same

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WO2018044053A1 (fr) * 2016-08-31 2018-03-08 주식회사 아모센스 Procédé de fabrication de carte de circuit imprimé flexible et carte de circuit imprimé flexible fabriquée par ledit procédé

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JPH0422189A (ja) * 1990-05-17 1992-01-27 Hitachi Ltd 多層配線板の製造方法
JP2004095963A (ja) * 2002-09-02 2004-03-25 Fujikura Ltd 多層配線板およびその製造方法
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JP5354380B2 (ja) * 2007-03-30 2013-11-27 日本電気株式会社 電子機器の配線構造及び電子機器パッケージの製造方法
EP2639821A3 (fr) * 2012-02-17 2015-03-04 HTC Corporation Carte de circuit imprimé, son unité structurelle et son procédé de fabrication
US20190206700A1 (en) * 2016-10-27 2019-07-04 Murata Manufacturing Co., Ltd. Multi-layer substrate and method of manufacturing the same
US11075092B2 (en) * 2016-10-27 2021-07-27 Murata Manufacturing Co., Ltd. Multi-layer substrate

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TW200740333A (en) 2007-10-16
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TWI412313B (zh) 2013-10-11

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