TWI311242B - - Google Patents

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Publication number
TWI311242B
TWI311242B TW091134679A TW91134679A TWI311242B TW I311242 B TWI311242 B TW I311242B TW 091134679 A TW091134679 A TW 091134679A TW 91134679 A TW91134679 A TW 91134679A TW I311242 B TWI311242 B TW I311242B
Authority
TW
Taiwan
Prior art keywords
acid
photoresist residue
photoresist
wire
composition
Prior art date
Application number
TW091134679A
Other languages
English (en)
Chinese (zh)
Other versions
TW200300876A (en
Inventor
Ishikawa Norio
Oowada Takuo
Original Assignee
Kanto Kagaku Kabushiki Kaish
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Kagaku Kabushiki Kaish filed Critical Kanto Kagaku Kabushiki Kaish
Publication of TW200300876A publication Critical patent/TW200300876A/zh
Application granted granted Critical
Publication of TWI311242B publication Critical patent/TWI311242B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Detergent Compositions (AREA)
TW091134679A 2001-12-04 2002-11-28 Photoresist residue removing liquid composition TW200300876A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001370122A JP3787085B2 (ja) 2001-12-04 2001-12-04 フォトレジスト残渣除去液組成物

Publications (2)

Publication Number Publication Date
TW200300876A TW200300876A (en) 2003-06-16
TWI311242B true TWI311242B (enExample) 2009-06-21

Family

ID=19179394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091134679A TW200300876A (en) 2001-12-04 2002-11-28 Photoresist residue removing liquid composition

Country Status (7)

Country Link
US (1) US6864044B2 (enExample)
EP (1) EP1318432B1 (enExample)
JP (1) JP3787085B2 (enExample)
KR (1) KR100927148B1 (enExample)
CN (1) CN1246739C (enExample)
DE (1) DE60239181D1 (enExample)
TW (1) TW200300876A (enExample)

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US7858572B2 (en) 2005-12-26 2010-12-28 Liquid Technology Co., Ltd. Composition for removing polymer residue of photosensitive etching-resistant layer
WO2007125634A1 (ja) * 2006-03-31 2007-11-08 Sanyo Chemical Industries, Ltd. 銅配線用洗浄剤
US9058975B2 (en) * 2006-06-09 2015-06-16 Lam Research Corporation Cleaning solution formulations for substrates
US7772128B2 (en) * 2006-06-09 2010-08-10 Lam Research Corporation Semiconductor system with surface modification
US7947637B2 (en) * 2006-06-30 2011-05-24 Fujifilm Electronic Materials, U.S.A., Inc. Cleaning formulation for removing residues on surfaces
WO2008089850A1 (en) 2007-01-25 2008-07-31 Knauf Insulation Limited Mineral fibre board
DK2108006T3 (da) 2007-01-25 2020-12-21 Knauf Insulation Gmbh Bindemidler og materialer lavet dermed
US8501838B2 (en) 2007-01-25 2013-08-06 Knauf Insulation Sprl Composite wood board
PL2826903T3 (pl) * 2007-01-25 2023-07-24 Knauf Insulation Sposób wytwarzania produktu izolacyjnego z włókien mineralnych
EP2109594A1 (en) * 2007-01-25 2009-10-21 Knauf Insulation Limited Mineral fibre insulation
US20080199751A1 (en) * 2007-02-20 2008-08-21 Commonwealth Scientific And Industrial Research Organisation Bipolar plate for an air breathing fuel cell stack
WO2008127936A2 (en) 2007-04-13 2008-10-23 Knauf Insulation Gmbh Composite maillard-resole binders
BRPI0814014A2 (pt) * 2007-07-05 2015-02-03 Knauf Insulation Gmbh Material colante de maillard de base ácido hidróxi-monocarboxílico
JP5278319B2 (ja) 2007-07-26 2013-09-04 三菱瓦斯化学株式会社 洗浄防食用組成物および半導体素子または表示素子の製造方法
GB0715100D0 (en) 2007-08-03 2007-09-12 Knauf Insulation Ltd Binders
EP2462169B1 (en) 2009-08-07 2019-02-27 Knauf Insulation Molasses binder
EA025774B1 (ru) 2010-05-07 2017-01-30 Кнауф Инзулацьон Способ получения волокон, связанных отвержденным полимерным связующим, композиция и композитная древесная плита
EP3922655A1 (en) 2010-05-07 2021-12-15 Knauf Insulation Carbohydrate polyamine binders and materials made therewith
EP2576882B1 (en) 2010-06-07 2015-02-25 Knauf Insulation Fiber products having temperature control additives
JP5682624B2 (ja) 2010-06-18 2015-03-11 三菱瓦斯化学株式会社 銅層及びモリブデン層を含む多層構造膜用エッチング液
JP2012058273A (ja) 2010-09-03 2012-03-22 Kanto Chem Co Inc フォトレジスト残渣およびポリマー残渣除去液組成物
JP5817139B2 (ja) 2011-02-18 2015-11-18 富士通株式会社 化合物半導体装置の製造方法及び洗浄剤
WO2012152731A1 (en) 2011-05-07 2012-11-15 Knauf Insulation Liquid high solids binder composition
GB201206193D0 (en) 2012-04-05 2012-05-23 Knauf Insulation Ltd Binders and associated products
GB201214734D0 (en) 2012-08-17 2012-10-03 Knauf Insulation Ltd Wood board and process for its production
WO2014086777A2 (en) 2012-12-05 2014-06-12 Knauf Insulation Binder
CA2938154C (en) 2014-02-07 2022-11-01 Knauf Insulation, Inc. Uncured articles with improved shelf-life
GB201408909D0 (en) 2014-05-20 2014-07-02 Knauf Insulation Ltd Binders
GB201412709D0 (en) 2014-07-17 2014-09-03 Knauf Insulation And Knauf Insulation Ltd Improved binder compositions and uses thereof
GB201517867D0 (en) 2015-10-09 2015-11-25 Knauf Insulation Ltd Wood particle boards
GB201610063D0 (en) 2016-06-09 2016-07-27 Knauf Insulation Ltd Binders
GB201701569D0 (en) 2017-01-31 2017-03-15 Knauf Insulation Ltd Improved binder compositions and uses thereof
EP3743773B1 (en) 2018-01-25 2022-04-06 Merck Patent GmbH Photoresist remover compositions
GB201804907D0 (en) 2018-03-27 2018-05-09 Knauf Insulation Ltd Composite products
GB201804908D0 (en) 2018-03-27 2018-05-09 Knauf Insulation Ltd Binder compositions and uses thereof

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JP2001252481A (ja) * 2000-03-14 2001-09-18 Takara Co Ltd 貯金箱玩具

Also Published As

Publication number Publication date
US20030143495A1 (en) 2003-07-31
KR100927148B1 (ko) 2009-11-18
US6864044B2 (en) 2005-03-08
KR20030076188A (ko) 2003-09-26
EP1318432B1 (en) 2011-02-16
EP1318432A1 (en) 2003-06-11
CN1246739C (zh) 2006-03-22
JP2003167360A (ja) 2003-06-13
DE60239181D1 (de) 2011-03-31
CN1423172A (zh) 2003-06-11
JP3787085B2 (ja) 2006-06-21
TW200300876A (en) 2003-06-16

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MM4A Annulment or lapse of patent due to non-payment of fees