KR100927148B1 - 포토레지스트 잔사제거액 조성물 - Google Patents

포토레지스트 잔사제거액 조성물 Download PDF

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Publication number
KR100927148B1
KR100927148B1 KR1020020075386A KR20020075386A KR100927148B1 KR 100927148 B1 KR100927148 B1 KR 100927148B1 KR 1020020075386 A KR1020020075386 A KR 1020020075386A KR 20020075386 A KR20020075386 A KR 20020075386A KR 100927148 B1 KR100927148 B1 KR 100927148B1
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South Korea
Prior art keywords
photoresist residue
acid
wiring
photoresist
liquid composition
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Expired - Fee Related
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KR1020020075386A
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English (en)
Korean (ko)
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KR20030076188A (ko
Inventor
노리오 이시카와
오오와다타쿠오
Original Assignee
간토 가가꾸 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
KR1020020075386A 2001-12-04 2002-11-29 포토레지스트 잔사제거액 조성물 Expired - Fee Related KR100927148B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001370122A JP3787085B2 (ja) 2001-12-04 2001-12-04 フォトレジスト残渣除去液組成物
JPJP-P-2001-00370122 2001-12-04

Publications (2)

Publication Number Publication Date
KR20030076188A KR20030076188A (ko) 2003-09-26
KR100927148B1 true KR100927148B1 (ko) 2009-11-18

Family

ID=19179394

Family Applications (1)

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KR1020020075386A Expired - Fee Related KR100927148B1 (ko) 2001-12-04 2002-11-29 포토레지스트 잔사제거액 조성물

Country Status (7)

Country Link
US (1) US6864044B2 (enExample)
EP (1) EP1318432B1 (enExample)
JP (1) JP3787085B2 (enExample)
KR (1) KR100927148B1 (enExample)
CN (1) CN1246739C (enExample)
DE (1) DE60239181D1 (enExample)
TW (1) TW200300876A (enExample)

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US7858572B2 (en) 2005-12-26 2010-12-28 Liquid Technology Co., Ltd. Composition for removing polymer residue of photosensitive etching-resistant layer
WO2007125634A1 (ja) * 2006-03-31 2007-11-08 Sanyo Chemical Industries, Ltd. 銅配線用洗浄剤
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US9058975B2 (en) * 2006-06-09 2015-06-16 Lam Research Corporation Cleaning solution formulations for substrates
US7947637B2 (en) * 2006-06-30 2011-05-24 Fujifilm Electronic Materials, U.S.A., Inc. Cleaning formulation for removing residues on surfaces
SI2826903T1 (sl) * 2007-01-25 2023-10-30 Knauf Insulation Postopek za izdelavo izolacijskega izdelka iz mineralnih vlaken
PL2108006T3 (pl) 2007-01-25 2021-04-19 Knauf Insulation Gmbh Spoiwa i wytworzone z nich materiały
EP2125650B1 (en) 2007-01-25 2024-05-15 Knauf Insulation Mineral fibre board
EP2108026A1 (en) 2007-01-25 2009-10-14 Knauf Insulation Limited Composite wood board
US20100084598A1 (en) * 2007-01-25 2010-04-08 Roger Jackson Mineral fibre insulation
US20080199751A1 (en) * 2007-02-20 2008-08-21 Commonwealth Scientific And Industrial Research Organisation Bipolar plate for an air breathing fuel cell stack
EP2137223B1 (en) 2007-04-13 2019-02-27 Knauf Insulation GmbH Composite maillard-resole binders
EA018672B1 (ru) * 2007-07-05 2013-09-30 Кнауф Инзулацьон Гмбх Связующее майларда на основе гидроксимонокарбоновой кислоты, содержащие его продукты и способы их получения
KR20100044777A (ko) 2007-07-26 2010-04-30 미츠비시 가스 가가쿠 가부시키가이샤 세정 방식용 조성물 및 반도체소자 또는 표시소자의 제조 방법
GB0715100D0 (en) 2007-08-03 2007-09-12 Knauf Insulation Ltd Binders
EP2462169B1 (en) 2009-08-07 2019-02-27 Knauf Insulation Molasses binder
LT2566904T (lt) 2010-05-07 2021-10-25 Knauf Insulation Angliavandeniai poliamido rišikliai ir iš jų pagamintos medžiagos
PH12012502182A1 (en) 2010-05-07 2021-06-23 Knauf Insulation Carbohydrate binders and materials made therewith
WO2011154368A1 (en) 2010-06-07 2011-12-15 Knauf Insulation Fiber products having temperature control additives
US9580818B2 (en) 2010-06-18 2017-02-28 Mitsubishi Gas Chemical Company, Inc. Etching liquid for film of multilayer structure containing copper layer and molybdenum layer
JP2012058273A (ja) 2010-09-03 2012-03-22 Kanto Chem Co Inc フォトレジスト残渣およびポリマー残渣除去液組成物
JP5817139B2 (ja) 2011-02-18 2015-11-18 富士通株式会社 化合物半導体装置の製造方法及び洗浄剤
WO2012152731A1 (en) 2011-05-07 2012-11-15 Knauf Insulation Liquid high solids binder composition
GB201206193D0 (en) 2012-04-05 2012-05-23 Knauf Insulation Ltd Binders and associated products
GB201214734D0 (en) 2012-08-17 2012-10-03 Knauf Insulation Ltd Wood board and process for its production
PL2928936T3 (pl) 2012-12-05 2022-12-27 Knauf Insulation Sprl Spoiwo
US11401204B2 (en) 2014-02-07 2022-08-02 Knauf Insulation, Inc. Uncured articles with improved shelf-life
GB201408909D0 (en) 2014-05-20 2014-07-02 Knauf Insulation Ltd Binders
GB201412709D0 (en) 2014-07-17 2014-09-03 Knauf Insulation And Knauf Insulation Ltd Improved binder compositions and uses thereof
GB201517867D0 (en) 2015-10-09 2015-11-25 Knauf Insulation Ltd Wood particle boards
GB201610063D0 (en) 2016-06-09 2016-07-27 Knauf Insulation Ltd Binders
GB201701569D0 (en) 2017-01-31 2017-03-15 Knauf Insulation Ltd Improved binder compositions and uses thereof
EP3743773B1 (en) 2018-01-25 2022-04-06 Merck Patent GmbH Photoresist remover compositions
GB201804907D0 (en) 2018-03-27 2018-05-09 Knauf Insulation Ltd Composite products
GB201804908D0 (en) 2018-03-27 2018-05-09 Knauf Insulation Ltd Binder compositions and uses thereof

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JPH08262746A (ja) * 1995-03-28 1996-10-11 Mitsubishi Gas Chem Co Inc フォトレジスト剥離剤組成物および剥離方法
KR20010024201A (ko) * 1997-09-23 2001-03-26 스티븐티.워쇼 수성 세정 조성물
JP2001252481A (ja) * 2000-03-14 2001-09-18 Takara Co Ltd 貯金箱玩具

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JPH08262746A (ja) * 1995-03-28 1996-10-11 Mitsubishi Gas Chem Co Inc フォトレジスト剥離剤組成物および剥離方法
KR20010024201A (ko) * 1997-09-23 2001-03-26 스티븐티.워쇼 수성 세정 조성물
JP2001252481A (ja) * 2000-03-14 2001-09-18 Takara Co Ltd 貯金箱玩具

Also Published As

Publication number Publication date
JP2003167360A (ja) 2003-06-13
TW200300876A (en) 2003-06-16
US6864044B2 (en) 2005-03-08
TWI311242B (enExample) 2009-06-21
CN1423172A (zh) 2003-06-11
JP3787085B2 (ja) 2006-06-21
EP1318432A1 (en) 2003-06-11
CN1246739C (zh) 2006-03-22
US20030143495A1 (en) 2003-07-31
KR20030076188A (ko) 2003-09-26
EP1318432B1 (en) 2011-02-16
DE60239181D1 (de) 2011-03-31

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