DE60239181D1 - Flüssige Zusammensetzung zum Entfernen von Photoresistrückständen - Google Patents

Flüssige Zusammensetzung zum Entfernen von Photoresistrückständen

Info

Publication number
DE60239181D1
DE60239181D1 DE60239181T DE60239181T DE60239181D1 DE 60239181 D1 DE60239181 D1 DE 60239181D1 DE 60239181 T DE60239181 T DE 60239181T DE 60239181 T DE60239181 T DE 60239181T DE 60239181 D1 DE60239181 D1 DE 60239181D1
Authority
DE
Germany
Prior art keywords
liquid composition
removing photoresist
photoresist residues
residues
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60239181T
Other languages
German (de)
English (en)
Inventor
Ishikawa Norio
Oowada Kanto Takuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Chemical Co Inc
Original Assignee
Kanto Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Chemical Co Inc filed Critical Kanto Chemical Co Inc
Application granted granted Critical
Publication of DE60239181D1 publication Critical patent/DE60239181D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
DE60239181T 2001-12-04 2002-12-04 Flüssige Zusammensetzung zum Entfernen von Photoresistrückständen Expired - Lifetime DE60239181D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001370122A JP3787085B2 (ja) 2001-12-04 2001-12-04 フォトレジスト残渣除去液組成物

Publications (1)

Publication Number Publication Date
DE60239181D1 true DE60239181D1 (de) 2011-03-31

Family

ID=19179394

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60239181T Expired - Lifetime DE60239181D1 (de) 2001-12-04 2002-12-04 Flüssige Zusammensetzung zum Entfernen von Photoresistrückständen

Country Status (7)

Country Link
US (1) US6864044B2 (enExample)
EP (1) EP1318432B1 (enExample)
JP (1) JP3787085B2 (enExample)
KR (1) KR100927148B1 (enExample)
CN (1) CN1246739C (enExample)
DE (1) DE60239181D1 (enExample)
TW (1) TW200300876A (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101050011B1 (ko) * 2003-06-04 2011-07-19 가오 가부시키가이샤 박리제 조성물 및 이것을 사용한 박리 세정방법
US6946396B2 (en) 2003-10-30 2005-09-20 Nissan Chemical Indusries, Ltd. Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer
US7842382B2 (en) * 2004-03-11 2010-11-30 Knauf Insulation Gmbh Binder compositions and associated methods
JP4390616B2 (ja) 2004-04-27 2009-12-24 Ｎｅｃエレクトロニクス株式会社 洗浄液及び半導体装置の製造方法
JP2005347587A (ja) * 2004-06-04 2005-12-15 Sony Corp ドライエッチング後の洗浄液組成物および半導体装置の製造方法
JP4456424B2 (ja) 2004-06-29 2010-04-28 関東化学株式会社 フォトレジスト残渣及びポリマー残渣除去組成物
EP1814927A1 (en) * 2004-10-13 2007-08-08 Knauf Insulation GmbH Polyester binding compositions
KR20230007522A (ko) 2005-07-26 2023-01-12 크나우프 인설레이션, 인크. 접착제 및 이들로 만들어진 물질
US8772214B2 (en) 2005-10-14 2014-07-08 Air Products And Chemicals, Inc. Aqueous cleaning composition for removing residues and method using same
US7858572B2 (en) 2005-12-26 2010-12-28 Liquid Technology Co., Ltd. Composition for removing polymer residue of photosensitive etching-resistant layer
KR100752446B1 (ko) * 2005-12-26 2007-08-24 리퀴드테크놀로지(주) 감광성 내식각막의 잔사제거용 조성물
WO2007125634A1 (ja) * 2006-03-31 2007-11-08 Sanyo Chemical Industries, Ltd. 銅配線用洗浄剤
US7772128B2 (en) * 2006-06-09 2010-08-10 Lam Research Corporation Semiconductor system with surface modification
US9058975B2 (en) * 2006-06-09 2015-06-16 Lam Research Corporation Cleaning solution formulations for substrates
US7947637B2 (en) * 2006-06-30 2011-05-24 Fujifilm Electronic Materials, U.S.A., Inc. Cleaning formulation for removing residues on surfaces
PL2826903T3 (pl) 2007-01-25 2023-07-24 Knauf Insulation Sposób wytwarzania produktu izolacyjnego z włókien mineralnych
BRPI0721232B1 (pt) 2007-01-25 2023-01-24 Knauf Insulation Limited Placa de madeira compósita
US20100084598A1 (en) * 2007-01-25 2010-04-08 Roger Jackson Mineral fibre insulation
CN101668713B (zh) 2007-01-25 2012-11-07 可耐福保温材料有限公司 矿物纤维板
EP2108006B8 (en) 2007-01-25 2020-11-11 Knauf Insulation GmbH Binders and materials made therewith
US20080199751A1 (en) * 2007-02-20 2008-08-21 Commonwealth Scientific And Industrial Research Organisation Bipolar plate for an air breathing fuel cell stack
CA2683706A1 (en) 2007-04-13 2008-10-23 Knauf Insulation Gmbh Composite maillard-resole binders
WO2009006532A1 (en) * 2007-07-05 2009-01-08 Knauf Insulation Gmbh Hydroxymonocarboxylic acid-based maillard binder
US8802608B2 (en) 2007-07-26 2014-08-12 Mitsubishi Gas Chemical Comany, Inc. Composition for cleaning and rust prevention and process for producing semiconductor element or display element
GB0715100D0 (en) 2007-08-03 2007-09-12 Knauf Insulation Ltd Binders
US8900495B2 (en) 2009-08-07 2014-12-02 Knauf Insulation Molasses binder
JP6223823B2 (ja) 2010-05-07 2017-11-01 ナフ インサレーション エセペーアールエル 炭水化物ポリアミン結合剤およびそれを用いて作製される材料
PH12012502182A1 (en) 2010-05-07 2021-06-23 Knauf Insulation Carbohydrate binders and materials made therewith
CA2801546C (en) 2010-06-07 2018-07-10 Knauf Insulation Fiber products having temperature control additives
WO2011158634A1 (ja) 2010-06-18 2011-12-22 三菱瓦斯化学株式会社 銅層及びモリブデン層を含む多層構造膜用エッチング液
JP2012058273A (ja) 2010-09-03 2012-03-22 Kanto Chem Co Inc フォトレジスト残渣およびポリマー残渣除去液組成物
JP5817139B2 (ja) 2011-02-18 2015-11-18 富士通株式会社 化合物半導体装置の製造方法及び洗浄剤
WO2012152731A1 (en) 2011-05-07 2012-11-15 Knauf Insulation Liquid high solids binder composition
GB201206193D0 (en) 2012-04-05 2012-05-23 Knauf Insulation Ltd Binders and associated products
GB201214734D0 (en) 2012-08-17 2012-10-03 Knauf Insulation Ltd Wood board and process for its production
ES2921601T3 (es) 2012-12-05 2022-08-30 Knauf Insulation Sprl Aglutinante
EP3102587B1 (en) 2014-02-07 2018-07-04 Knauf Insulation, LLC Uncured articles with improved shelf-life
GB201408909D0 (en) 2014-05-20 2014-07-02 Knauf Insulation Ltd Binders
GB201412709D0 (en) 2014-07-17 2014-09-03 Knauf Insulation And Knauf Insulation Ltd Improved binder compositions and uses thereof
GB201517867D0 (en) 2015-10-09 2015-11-25 Knauf Insulation Ltd Wood particle boards
GB201610063D0 (en) 2016-06-09 2016-07-27 Knauf Insulation Ltd Binders
GB201701569D0 (en) 2017-01-31 2017-03-15 Knauf Insulation Ltd Improved binder compositions and uses thereof
KR102448220B1 (ko) 2018-01-25 2022-09-27 메르크 파텐트 게엠베하 포토레지스트 제거제 조성물
GB201804908D0 (en) 2018-03-27 2018-05-09 Knauf Insulation Ltd Binder compositions and uses thereof
GB201804907D0 (en) 2018-03-27 2018-05-09 Knauf Insulation Ltd Composite products

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1603558A (en) * 1968-12-18 1971-05-03 Cleaning heating surfaces with complexing agent soln
US3689292A (en) * 1970-12-07 1972-09-05 John M Preston Tin immersion plating bath and method
US4014715A (en) * 1975-12-08 1977-03-29 General Electric Company Solder cleaning and coating composition
US5279771A (en) 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US5466297A (en) * 1991-08-08 1995-11-14 Nalco Chemical Company Process for removal of primarily iron oxide deposits
US5480585A (en) 1992-04-02 1996-01-02 Nagase Electronic Chemicals, Ltd. Stripping liquid compositions
JP2980772B2 (ja) 1992-04-02 1999-11-22 ナガセ電子化学株式会社 剥離剤組成物
US6326130B1 (en) * 1993-10-07 2001-12-04 Mallinckrodt Baker, Inc. Photoresist strippers containing reducing agents to reduce metal corrosion
JP3264405B2 (ja) 1994-01-07 2002-03-11 三菱瓦斯化学株式会社 半導体装置洗浄剤および半導体装置の製造方法
US5567574A (en) 1995-01-10 1996-10-22 Mitsubishi Gas Chemical Company, Inc. Removing agent composition for photoresist and method of removing
JPH08262746A (ja) * 1995-03-28 1996-10-11 Mitsubishi Gas Chem Co Inc フォトレジスト剥離剤組成物および剥離方法
US5612304A (en) * 1995-07-07 1997-03-18 Olin Microelectronic Chemicals, Inc. Redox reagent-containing post-etch residue cleaning composition
KR100429440B1 (ko) * 1995-07-27 2004-07-15 미쓰비시 가가꾸 가부시키가이샤 기체의표면처리방법및그에사용되는표면처리조성물
US5678232A (en) * 1995-07-31 1997-10-14 Corpex Technologies, Inc. Lead decontamination method
TW387936B (en) * 1997-08-12 2000-04-21 Kanto Kagaku Washing solution
US5977041A (en) * 1997-09-23 1999-11-02 Olin Microelectronic Chemicals Aqueous rinsing composition
US6231677B1 (en) 1998-02-27 2001-05-15 Kanto Kagaku Kabushiki Kaisha Photoresist stripping liquid composition
JP4308959B2 (ja) 1998-02-27 2009-08-05 関東化学株式会社 フォトレジスト剥離液組成物
JP2000162788A (ja) 1998-11-27 2000-06-16 Tokyo Ohka Kogyo Co Ltd 銅配線形成基板に用いるホトレジスト用剥離液組成物およびこれを用いたレジスト剥離方法
JP3328250B2 (ja) 1998-12-09 2002-09-24 岸本産業株式会社 レジスト残渣除去剤
JP2000284506A (ja) * 1999-03-31 2000-10-13 Sharp Corp フォトレジスト剥離剤組成物および剥離方法
JP2001022095A (ja) 1999-07-02 2001-01-26 Nippon Zeon Co Ltd ポジ型レジスト用剥離液
JP2001022096A (ja) 1999-07-02 2001-01-26 Nippon Zeon Co Ltd ポジ型レジスト用剥離液
JP3389166B2 (ja) 1999-09-10 2003-03-24 日本電気株式会社 レジスト用剥離液組成物
JP2001252481A (ja) * 2000-03-14 2001-09-18 Takara Co Ltd 貯金箱玩具

Also Published As

Publication number Publication date
US20030143495A1 (en) 2003-07-31
CN1423172A (zh) 2003-06-11
KR20030076188A (ko) 2003-09-26
KR100927148B1 (ko) 2009-11-18
TWI311242B (enExample) 2009-06-21
EP1318432A1 (en) 2003-06-11
US6864044B2 (en) 2005-03-08
JP3787085B2 (ja) 2006-06-21
TW200300876A (en) 2003-06-16
CN1246739C (zh) 2006-03-22
EP1318432B1 (en) 2011-02-16
JP2003167360A (ja) 2003-06-13

Similar Documents

Publication Publication Date Title
DE60239181D1 (de) Flüssige Zusammensetzung zum Entfernen von Photoresistrückständen
DE60128501D1 (de) Zusammensetzung zur Entschichtung von Photoresist
DE60144118D1 (de) Gegenstand zum Reinigen
DE60316340D1 (de) Flüssige waschmittelzusammensetzung
DE60120706D1 (de) Gerät zum auftragen von flüssigkeit
DE50105056D1 (de) Vorrichtung zum Verbinden von Bauteilen
FI20010628L (fi) Laitteisto jäteaineen puhdistamiseksi
DE60118669D1 (de) Lithographischer Projektionsapparat
ATE285469T1 (de) Zusammensetzung zum reinigen von harten oberflächen
DE60237962D1 (de) Gerät zum behandeln von halbleiterscheiben
DE60127050D1 (de) Lithographischer Projektionsapparat
ATE369414T1 (de) Verfahren zum reinigen von oberflächen
DE60208190D1 (de) Verkapselte konzentrate zum reinigen von harten oberflächen
DE60335357D1 (de) Vorrichtung zum einbeuteln von trockenen zutaten
DE50101973D1 (de) Halteeinrichtung zum Halten von grossformatigen Bauteilen
ATE338810T1 (de) Zusammensetzungen zum reinigen von harten oberflächen
DE60218728D1 (de) Werkzeug zum entfernen von nieten
DE69942326D1 (de) Gerät zum Reinigen von Fussböden
DE60306987D1 (de) Flüssigwaschmittel
DE60121513D1 (de) Werkzeug zum Setzen von klammerartigen Muttern
ATE334185T1 (de) Zusammensetzungen zum reinigen von harten oberflächen
DE50210594D1 (de) Einrichtung zum umstellen von weichen
DE60121762D1 (de) Vorrichtung zum auftragen von flüssigem toner
DE60214792D1 (de) Lithographischer Projektionsapparat
DE10194170D2 (de) Vorrichtung zum Spülen von Mehrwegtrinkgefäßen