DE60237962D1 - Gerät zum behandeln von halbleiterscheiben - Google Patents

Gerät zum behandeln von halbleiterscheiben

Info

Publication number
DE60237962D1
DE60237962D1 DE60237962T DE60237962T DE60237962D1 DE 60237962 D1 DE60237962 D1 DE 60237962D1 DE 60237962 T DE60237962 T DE 60237962T DE 60237962 T DE60237962 T DE 60237962T DE 60237962 D1 DE60237962 D1 DE 60237962D1
Authority
DE
Germany
Prior art keywords
semiconducted
discs
treating
treating semiconducted
semiconducted discs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60237962T
Other languages
English (en)
Inventor
Stephen D Coomer
John Francis Mcintee
Jozsef Michael Iha
Robert T Borra
Eric Lusby
Michael J Lombardi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of DE60237962D1 publication Critical patent/DE60237962D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/35—Miscellaneous

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60237962T 2001-01-12 2002-01-04 Gerät zum behandeln von halbleiterscheiben Expired - Lifetime DE60237962D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/759,613 US6612590B2 (en) 2001-01-12 2001-01-12 Apparatus and methods for manipulating semiconductor wafers
PCT/US2002/000225 WO2002056350A2 (en) 2001-01-12 2002-01-04 Apparatus and methods for manipulating semiconductor wafers

Publications (1)

Publication Number Publication Date
DE60237962D1 true DE60237962D1 (de) 2010-11-25

Family

ID=25056318

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60237962T Expired - Lifetime DE60237962D1 (de) 2001-01-12 2002-01-04 Gerät zum behandeln von halbleiterscheiben

Country Status (5)

Country Link
US (2) US6612590B2 (de)
EP (1) EP1362363B1 (de)
DE (1) DE60237962D1 (de)
TW (1) TW523798B (de)
WO (1) WO2002056350A2 (de)

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US6988879B2 (en) * 2002-10-18 2006-01-24 Asm Technology Singapore Pte Ltd Apparatus and method for reducing substrate warpage
US7641840B2 (en) 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
ES2226564B1 (es) * 2003-05-16 2006-05-16 Juan Gambini Ricapa Cabestrillo suburetral para el tratamiento quirurgico de la incontinencia urinaria femenina.
US6858466B1 (en) * 2003-11-03 2005-02-22 Hewlett-Packard Development Company, L.P. System and a method for fluid filling wafer level packages
US20060182589A1 (en) * 2005-01-20 2006-08-17 Pi-Tang Chiu Plate support having movable ribs for adjusting and guiding a wafer
US7635263B2 (en) 2005-01-31 2009-12-22 Molecular Imprints, Inc. Chucking system comprising an array of fluid chambers
US7636999B2 (en) 2005-01-31 2009-12-29 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
US7670529B2 (en) 2005-12-08 2010-03-02 Molecular Imprints, Inc. Method and system for double-sided patterning of substrates
US7670530B2 (en) 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
US8215946B2 (en) 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
JP4699283B2 (ja) * 2006-05-23 2011-06-08 東京エレクトロン株式会社 熱処理板の温度制御方法、プログラム及び熱処理板の温度制御装置
US20080131244A1 (en) * 2006-11-29 2008-06-05 Pouch Pac Innovations, Llc System, method and machine for continuous loading of a product
JP4313824B2 (ja) * 2007-03-23 2009-08-12 東京エレクトロン株式会社 基板移載装置及び基板移載方法並びに記憶媒体
KR100877102B1 (ko) * 2007-05-28 2009-01-09 주식회사 하이닉스반도체 열처리 장치 및 이를 이용한 열처리 방법
DE102008020512B4 (de) * 2008-04-23 2010-06-10 Schunk Gmbh & Co. Kg Spann- Und Greiftechnik Greiffinger und Greifvorrichtung
US7749884B2 (en) * 2008-05-06 2010-07-06 Astrowatt, Inc. Method of forming an electronic device using a separation-enhancing species
US20100310775A1 (en) * 2009-06-09 2010-12-09 International Business Machines Corporation Spalling for a Semiconductor Substrate
US8703521B2 (en) * 2009-06-09 2014-04-22 International Business Machines Corporation Multijunction photovoltaic cell fabrication
US8802477B2 (en) * 2009-06-09 2014-08-12 International Business Machines Corporation Heterojunction III-V photovoltaic cell fabrication
US20110048517A1 (en) * 2009-06-09 2011-03-03 International Business Machines Corporation Multijunction Photovoltaic Cell Fabrication
US8633097B2 (en) 2009-06-09 2014-01-21 International Business Machines Corporation Single-junction photovoltaic cell
US9159595B2 (en) 2010-02-09 2015-10-13 Suss Microtec Lithography Gmbh Thin wafer carrier
US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
US8914143B1 (en) * 2010-04-30 2014-12-16 Applied Materials, Inc. Method and system for handling substrates
US8268645B2 (en) 2010-12-29 2012-09-18 Twin Creeks Technologies, Inc. Method and apparatus for forming a thin lamina
US8435804B2 (en) 2010-12-29 2013-05-07 Gtat Corporation Method and apparatus for forming a thin lamina
US9312107B1 (en) 2011-03-31 2016-04-12 WD Media, LLC Disk handling apparatus and method for supporting a disk during material deposition at a deposition station
DE102011001879A1 (de) * 2011-04-07 2012-10-11 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Spannen verformter Wafer
DE202012013640U1 (de) * 2012-01-03 2018-11-12 solar-semi GmbH Substratteller
US20140060434A1 (en) * 2012-09-04 2014-03-06 Applied Materials, Inc. Gas injector for high volume, low cost system for epitaxial silicon depositon
TW201437423A (zh) * 2013-02-21 2014-10-01 Applied Materials Inc 用於注射器至基板的空隙控制之裝置及方法
KR102223824B1 (ko) * 2013-03-14 2021-03-04 어플라이드 머티어리얼스, 인코포레이티드 Ald를 위한 서셉터 상에 웨이퍼를 척킹하기 위한 장치 및 방법
US9349629B2 (en) * 2014-01-23 2016-05-24 Lam Research Corporation Touch auto-calibration of process modules
JP2016127086A (ja) * 2014-12-26 2016-07-11 東京エレクトロン株式会社 基板吸着補助部材及び基板搬送装置
US10180337B1 (en) 2017-07-11 2019-01-15 International Business Machines Corporation Optical deformation detection sensor and system having a material disposed on the inner surface of an elongated hollow housing
CN111383979B (zh) * 2018-12-27 2023-03-03 上海微电子装备（集团）股份有限公司 翘曲片的预对准装置及方法
JP7303635B2 (ja) * 2019-01-07 2023-07-05 株式会社ディスコ ワークの保持方法及びワークの処理方法
WO2024105732A1 (ja) * 2022-11-14 2024-05-23 株式会社日立ハイテク ウェーハ搬送ロボット

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US4915564A (en) 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
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US4915584A (en) * 1988-08-11 1990-04-10 Daniel Kashubara Wind device with an oscillating blade
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US5516732A (en) 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
JPH0758191A (ja) 1993-08-13 1995-03-03 Toshiba Corp ウェハステージ装置
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JP3850951B2 (ja) * 1997-05-15 2006-11-29 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
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US6217034B1 (en) * 1998-09-24 2001-04-17 Kla-Tencor Corporation Edge handling wafer chuck
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US6467827B1 (en) * 1999-10-30 2002-10-22 Frank J. Ardezzone IC wafer handling apparatus incorporating edge-gripping and pressure or vacuum driven end-effectors
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Also Published As

Publication number Publication date
TW523798B (en) 2003-03-11
US20020094260A1 (en) 2002-07-18
WO2002056350A3 (en) 2003-03-06
US6869266B2 (en) 2005-03-22
US20030198547A1 (en) 2003-10-23
EP1362363B1 (de) 2010-10-13
US6612590B2 (en) 2003-09-02
WO2002056350A2 (en) 2002-07-18
EP1362363A2 (de) 2003-11-19

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