DE60110819D1 - Vorrichtung zum polieren von scheibenartigen gegenständen - Google Patents

Vorrichtung zum polieren von scheibenartigen gegenständen

Info

Publication number
DE60110819D1
DE60110819D1 DE60110819T DE60110819T DE60110819D1 DE 60110819 D1 DE60110819 D1 DE 60110819D1 DE 60110819 T DE60110819 T DE 60110819T DE 60110819 T DE60110819 T DE 60110819T DE 60110819 D1 DE60110819 D1 DE 60110819D1
Authority
DE
Germany
Prior art keywords
polishing disk
typed objects
typed
objects
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60110819T
Other languages
English (en)
Other versions
DE60110819T2 (de
Inventor
Katrin Ebner
Walter Glashauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies SC300 GmbH and Co KG
Original Assignee
Infineon Technologies SC300 GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies SC300 GmbH and Co KG filed Critical Infineon Technologies SC300 GmbH and Co KG
Application granted granted Critical
Publication of DE60110819D1 publication Critical patent/DE60110819D1/de
Publication of DE60110819T2 publication Critical patent/DE60110819T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60110819T 2000-09-29 2001-09-04 Vorrichtung zum polieren von scheibenartigen gegenständen Expired - Lifetime DE60110819T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00121485 2000-09-29
EP00121485A EP1193031A1 (de) 2000-09-29 2000-09-29 Vorrichtung zum Polieren von Scheibenartigen Gegenständen
PCT/EP2001/010186 WO2002026443A1 (en) 2000-09-29 2001-09-04 Arrangement for polishing disk-like objects

Publications (2)

Publication Number Publication Date
DE60110819D1 true DE60110819D1 (de) 2005-06-16
DE60110819T2 DE60110819T2 (de) 2006-02-02

Family

ID=8169989

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60110819T Expired - Lifetime DE60110819T2 (de) 2000-09-29 2001-09-04 Vorrichtung zum polieren von scheibenartigen gegenständen

Country Status (7)

Country Link
US (1) US6824456B2 (de)
EP (2) EP1193031A1 (de)
JP (1) JP3866657B2 (de)
KR (1) KR100586915B1 (de)
DE (1) DE60110819T2 (de)
TW (1) TW499347B (de)
WO (1) WO2002026443A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6652362B2 (en) * 2000-11-23 2003-11-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor
JP4659273B2 (ja) * 2001-05-31 2011-03-30 ニッタ・ハース株式会社 被研磨物保持用のバッキング材の製造方法
TWI367208B (en) 2004-11-12 2012-07-01 Sumitomo Chemical Co Production method of pyrimidine compounds
JP2007173815A (ja) * 2005-12-20 2007-07-05 Siltron Inc シリコンウエハ研磨装置、これに使用されるリテーニングアセンブリ及びシリコンウエハ平坦度補正方法
US7789738B2 (en) * 2006-07-03 2010-09-07 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US20090252876A1 (en) * 2007-05-07 2009-10-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7918706B2 (en) 2007-05-29 2011-04-05 Honeywell International Inc. Mesotube burn-in manifold
DE102007026292A1 (de) * 2007-06-06 2008-12-11 Siltronic Ag Verfahren zur einseitigen Politur nicht strukturierter Halbleiterscheiben
TWI408027B (zh) * 2009-06-26 2013-09-11 Hon Hai Prec Ind Co Ltd 鏡片承載裝置
US11267099B2 (en) * 2017-09-27 2022-03-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization membrane

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2634343B2 (ja) 1991-10-28 1997-07-23 信越化学工業株式会社 半導体ウェーハの保持方法
JP3024373B2 (ja) * 1992-07-07 2000-03-21 信越半導体株式会社 シート状弾性発泡体及びウェーハ研磨加工用治具
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
US5820448A (en) * 1993-12-27 1998-10-13 Applied Materials, Inc. Carrier head with a layer of conformable material for a chemical mechanical polishing system
US5558111A (en) * 1995-02-02 1996-09-24 International Business Machines Corporation Apparatus and method for carrier backing film reconditioning
US5876273A (en) * 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
US5885135A (en) * 1997-04-23 1999-03-23 International Business Machines Corporation CMP wafer carrier for preferential polishing of a wafer
DE19722679A1 (de) * 1997-05-30 1998-12-03 Wacker Siltronic Halbleitermat Scheibenhalter und Verfahren zur Herstellung einer Halbleiterscheibe
US6074288A (en) * 1997-10-30 2000-06-13 Lsi Logic Corporation Modified carrier films to produce more uniformly polished substrate surfaces
JPH11226865A (ja) 1997-12-11 1999-08-24 Speedfam Co Ltd キャリア及びｃｍｐ装置
US6030275A (en) * 1998-03-17 2000-02-29 International Business Machines Corporation Variable control of carrier curvature with direct feedback loop
US6113466A (en) * 1999-01-29 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for controlling polishing profile in chemical mechanical polishing
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6171513B1 (en) * 1999-04-30 2001-01-09 International Business Machines Corporation Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier
US6344414B1 (en) * 1999-04-30 2002-02-05 International Business Machines Corporation Chemical-mechanical polishing system having a bi-material wafer backing film assembly
US6371833B1 (en) * 1999-09-13 2002-04-16 Infineon Technologies Ag Backing film for chemical mechanical planarization (CMP) of a semiconductor wafer
US6612915B1 (en) * 1999-12-27 2003-09-02 Nutool Inc. Work piece carrier head for plating and polishing
US6537141B1 (en) * 2001-01-30 2003-03-25 Koninklijke Philips Electronics N.V. Non-slip polisher head backing film

Also Published As

Publication number Publication date
DE60110819T2 (de) 2006-02-02
KR20030040504A (ko) 2003-05-22
EP1320442A1 (de) 2003-06-25
TW499347B (en) 2002-08-21
KR100586915B1 (ko) 2006-06-07
JP3866657B2 (ja) 2007-01-10
US6824456B2 (en) 2004-11-30
EP1193031A1 (de) 2002-04-03
JP2004510335A (ja) 2004-04-02
WO2002026443A1 (en) 2002-04-04
US20030181061A1 (en) 2003-09-25
EP1320442B1 (de) 2005-05-11

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: INFINEON TECHNOLOGIES SC300 GMBH & CO. OHG, 01099

8364 No opposition during term of opposition