TWI303248B - Vinyl silane compounds containing epoxy functionality - Google Patents
Vinyl silane compounds containing epoxy functionality Download PDFInfo
- Publication number
- TWI303248B TWI303248B TW091122782A TW91122782A TWI303248B TW I303248 B TWI303248 B TW I303248B TW 091122782 A TW091122782 A TW 091122782A TW 91122782 A TW91122782 A TW 91122782A TW I303248 B TWI303248 B TW I303248B
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- Taiwan
- Prior art keywords
- compound
- vinyl
- epoxy
- compounds containing
- functional group
- Prior art date
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- 239000004593 Epoxy Substances 0.000 title claims description 10
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 title 1
- 239000000203 mixture Substances 0.000 claims description 35
- 150000001875 compounds Chemical class 0.000 claims description 22
- -1 vinyl decyl functional group Chemical group 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 125000000524 functional group Chemical group 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 3
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical group CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical group CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 10
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000706 filtrate Substances 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- ZTEHOZMYMCEYRM-UHFFFAOYSA-N 1-chlorodecane Chemical compound CCCCCCCCCCCl ZTEHOZMYMCEYRM-UHFFFAOYSA-N 0.000 description 3
- 229940125904 compound 1 Drugs 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 3
- 239000010455 vermiculite Substances 0.000 description 3
- 229910052902 vermiculite Inorganic materials 0.000 description 3
- 235000019354 vermiculite Nutrition 0.000 description 3
- OLMLFDHMSIYSRF-UHFFFAOYSA-N 1,1-dichlorobut-2-ene Chemical compound CC=CC(Cl)Cl OLMLFDHMSIYSRF-UHFFFAOYSA-N 0.000 description 2
- DKJAIBUVFONHMK-UHFFFAOYSA-N 3,3-dichlorobut-1-ene Chemical compound CC(Cl)(Cl)C=C DKJAIBUVFONHMK-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- MTOVXZPDHLKNAO-UHFFFAOYSA-N (3-chloro-1-phenylprop-1-enyl)benzene Chemical compound C=1C=CC=CC=1C(=CCCl)C1=CC=CC=C1 MTOVXZPDHLKNAO-UHFFFAOYSA-N 0.000 description 1
- YTXCQYABGWUXFL-IWQZZHSRSA-N (Z)-prop-1-ene-1,2,3-triol Chemical compound OC\C(O)=C\O YTXCQYABGWUXFL-IWQZZHSRSA-N 0.000 description 1
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- VKEIPALYOJMDAC-UHFFFAOYSA-N 3,3,3-trichloroprop-1-ene Chemical compound ClC(Cl)(Cl)C=C VKEIPALYOJMDAC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002956 ash Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002496 gastric effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Description
1303248 玖、發明說明 【發明領域】 本發明有關含有乙烯基矽烷及環氧基官能基團二者且 可用作黏性促進劑或可固化組合物之化合物0 【發明背景】 黏著劑組合物係用於半導體封裝及微電子元件之製作 及裝配，譬如將積體電路晶片黏合於引線框或其他基質， 及將電路封裝或裝配件黏合於印刷線路板。引線框可用42 鐵/58鎳合金（合金42)、銅、或銀塗面或鈀塗面銅製作 ，且線板用陶瓷或層壓板製作，而一般具有良好性能之黏 著劑在用於此等基質之一或多種上時可能有缺陷0 將黏性促進劑添加於黏著劑組合物或將含有黏性促進 能力之可固化樹脂用作黏著劑將作用以校正此項缺陷0 【本發明綜述】 在一具體形式中，本發明有關含有乙烯基矽烷官能基 團及環氧基官能基團二者之化合物。在另一具體形式中， 本發明爲含有該等化合物之可固化組合物，譬如黏著劑、 塗料、或囊封組合物〇 【本發明詳述】 本發明之化合物含有至少一環氧基官能基團及至少一 乙烯基矽烷官能基團〇 —般而言，此等化合物可藉由去水 甘油或去水甘油醚聚醇與乙烯基矽烷之反應予以製備〇合 宜之乙烯基矽烷包括三乙烯基矽烷、甲基乙烯基二氯矽烷 、二苯基乙烯基氯矽烷及乙烯基三氯矽烷〇 在另一具體形式中，本發明爲一種含有本發明化合物 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 1303248 發明說明_；!； 之可固化組合物，譬如黏著劑、塗料、或囊封劑或密封劑 〇該可固化組合物可爲業界所知以標準攙合或硏磨技術製 備之糊之形式，或者可爲以膜形成技術製備之膜〇該可固 化組合物將隨意包括固化劑，以及隨意之填料〇 本發明之環氧基/乙稀基矽烷化合物可爲該可固化組 合物內之主要成份，或者可作爲黏性促進劑添加於另一可 固化樹脂〇當用作黏性促進劑時/環氧基/乙烯基矽烷化 合物在該可固化組合物內之用量將爲促進黏性之有效量， 而一般而言，有效量將在配方重量之0.005至20.0%範圍 內〇 除本發明乙烯基矽烷外用作主要成份之可固化樹脂實 例包括環氧樹脂、電子供體樹脂（例如乙烯醚、硫醇烯、 及含有附接於芳香族環且與該芳香族環內不飽和現象接合 之碳對碳雙鍵之樹脂，譬如由肉桂基及苯乙烯起始化合物 衍生之化合物）、以及電子受體樹脂（例如反丁烯二酸酯 、順丁烯二酸酯、丙烯酸酯、及順丁烯二醯亞胺）〇 合宜之固化劑爲熱啓發劑及光啓發劑，以有效量存在 以固化該組合物〇 —般而言，該等用量將在該組合物內總 有機物質（亦即排除任何無機填料）重量之0.5 %至3Ό% 範圍內，較佳爲1 %至201 〇較佳之熱啓發劑包括過氧化 物譬如過辛酸丁酯及二茴香基過氧化物，以及偶氮化合物 譬如2,2’-偶氮雙（2-甲基-丙睛）及2,2’-偶氮雙（2-甲基-丁睛）〇較佳系列之光啓發劑爲Ciba專業化學公司 以Irgacure商標銷售者。在一些配方中，熱啓發及光啓發 1303248 發明說明 二者均屬合宜：固化程序可藉照射繼以熱予以啓動，或者 可藉熱繼以照射予以啓動C 一般而言’該等可固化組合物 將在70 °C至250 °c之溫度範圍內固化，且固化將在十秒鐘 至三小時之範圍內完成Q實際之固化輪廓將隨成份變化且 可由實作者予以測定而無需過當之實驗〇 配方亦可包含不傳導或者熱或電傳導性填料〇合宜之 _、 傳導性填料爲碳黑、石墨、金、适、銅、鉑、鈀、鎳、鋁 、碳化矽、氮化硼、鑽石、及礬土。合宜之不傳導性填料 爲蛭石、雲母、矽灰石、碳酸鈣、氧化鈦、砂、玻璃、熔 凝矽石、燻矽石、硫酸鋇、及齒化乙烯聚合物如四氟乙烯 、三氟乙烯、雙氟亞乙烯、氟乙烯、雙氯亞乙烯及氯乙烯 〇若存在，填料之量一般將爲配方重量之20%至90% 〇 下列實例揭示一用以製成本說明書內所揭示乙烯基矽 烷/環氧基化合物之合成步驟，及代表性試樣在可固化組 合物內之性能〇 【實例】 實例1 〇通用合成步驟：醇與乙烯基矽烷之反應〇將 一摩爾當量之醇及三乙胺於0 ec混合於無水甲苯內，對其 添加一摩爾當量之溶解於甲苯內之乙烯基矽烷〇讓混合物 於室溫反應四小時，之後將溶劑蒸發獲得生成物。 實例2 〇
H3C 1303248 發明說明_頁 對2 5G毫升圓底燒瓶添加去水甘油（1〇·5〇克，〇.142摩 爾）、三乙胺（2〇毫升）及甲苯（5〇毫升）〇於〇。〇經由 緩慢添加漏斗逐滴添加甲基乙烯基二氯矽烷（10.00克， 0·07摩爾）（於冰浴內執行）。添加完成後，將冰浴移去 並於室溫攪拌混合物四小時〇將混合物過濾，並將濾液注 入250毫升圓底燒瓶。於低壓下移除溶劑獲得85%收率之 生成物〇 ‘
實例3。 八 A A A
對250毫升圓底燒瓶添加甘油二去水甘油醚（14.11克， 0.07摩爾）、三乙胺（6.98克，0·07摩爾）及甲苯（50毫 升）〇於〇 °C經由緩慢添加漏斗逐滴添加三乙烯基氯矽烷 (10.00克，0· 07摩爾）’（於冰浴內執行）〇添加完成後 ，將冰浴移去並於室溫攪拌混合物四小時〇然後將混合物 過濾，並將濾液注入2 5 0毫升圓底燒瓶〇於低壓下移除溶 劑獲得85%收率之生成物〇 實例4 〇
1303248 發明說明/續頁 對250毫升圓底燒瓶添加EPICL0N ΕΧΑ-71 20 ( 34·48克， 0.07摩爾）、二乙胺（6·98克，〇·〇7摩爾）及甲苯（50毫 升）0於0 °C經由緩慢添加漏斗逐滴添加三乙烯基氯矽烷 (10.00克’〇·〇7摩爾）（於冰浴內執行）〇添加一旦完 成，將冰浴移去並於室溫攪拌混合物四小時。將混合物過 濾’並將濾液注入25G毫升圓底燒瓶。於低壓下移除溶劑 獲得90%收率之生成物〇 實例5 〇
其中t-Bu代表三級丁基團〇對250毫升圓底燒瓶添加ΕΡΙ -CLON EXA-7120 ( 34.48 克，0·07 摩爾）、三乙胺（7·34 克 ，0·〇73摩爾）及甲苯（50毫升）〇於〇 °C經由緩慢添加 漏斗逐滴添加甲基乙烯基二氯矽烷（4 .88克，0 · 035摩爾 )(於冰浴內執行）〇添加一旦完成，將冰浴移去並於室 溫攪拌混合物四小時〇將混合物過濾，並將濾液注入250 毫升圓底燒瓶〇於低壓下移除溶劑獲得90 %收率之生成物 〇 實例6 〇 1303248 - 發明說明_胃
此化合物係依據實例1之通用合成步驟以去水甘油與三乙 烯基氯矽烷反應予以製備〇
此化合物係依據實例1之通用合成步驟以去水甘油與二苯 基乙烯基氯矽烷反應予以製備。 實例8 〇
Q 此化合物係依據實例1之通用合成步驟以EPICLON EXA-7120與甲基乙烯基二氯矽烷反應，繼而依據實例1之通用 合成步驟與1,4-丁二醇反應予以製備。 1303248 實例9 〇
此化合物係依據實例1之通用合成步驟以EPICLON EXA-7120與甲基乙烯基二氯矽烷反應，繼而依據實例1之通用 合成步驟與去水甘油反應予以製備〇 實例1 〇 〇
此化合物係依據實例1之通用合成步驟以去水甘油與乙烯 基三氯矽烷反應予以製備〇 實例11 〇在可固化組合物內之性能。製備一包含雙順 丁烯二醯亞胺、具有苯乙烯官能基團之化合物、環氧基化 合物、固化劑、及75重量％銀之可固化組合物。以1重量 %將實例2、3、4及5之乙烯基矽烷/環氧基化合物添 加於此組合物，並測試各個可固化組合物作爲晶片黏附用 1303248 - 發明說明_胃 黏著劑之黏著强度〇 將黏著劑分配於一塗銀引線框上，將一矽晶片（120 X 1 200密耳）置於黏著劑上，並以200 °C將黏著劑固化於 一熱板上達60秒鐘。就每一黏著劑製備十個裝配件〇各晶 片用Dage 2400-PC晶片剪切試驗機於240 °C以90度剪離該 引線框，而各項結果予以匯集及平均並以公斤力報告0 各項結果列示於下表並顯示5、烯基矽烷/環氧基化合 物之添加於該可固化組合物較之不含乙烯基矽烷/環氧基 化合物之可固化化合物增進在銀引線框上之黏性0在可固 化組合物內之實例3化合物亦在銅引線框上獲得增進之結 果。 乙烯基矽烷/環氧基 24〇°C晶片剪切强度 _化合物 _(公斤力」_ Μ 0 . 7 /\\\ 實例2化合物 1 · 4 實例3化合物 2 · 2 實例4化合物 1 · 9 實例5化合物 1 · 8 -8-
Claims (1)
1303248
9a懷 ( 93.1 0.07 修正） 拾、申請專利範圍： I ’;、： ή 1. 一種每分子具有至少一個環氧—個乙 烯基矽烷官能基團之由以下所組成集團中選出之化合物：
内 容 v〇一Si—CT H3c
及
1303248 2.—種可固化組合物，包含每分子具有至少一個環氧 基官能基團及一個乙烯基矽烷官能基團之一由以下所組成 集團中選出之化合物： X j 一 h3c 0 0 〇
以及一固化劑與一填料。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/966,454 US6590018B2 (en) | 2001-09-28 | 2001-09-28 | Vinyl silane compounds containing epoxy functionality |
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| Publication Number | Publication Date |
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| TWI303248B true TWI303248B (en) | 2008-11-21 |
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| TW091122782A TWI303248B (en) | 2001-09-28 | 2002-09-27 | Vinyl silane compounds containing epoxy functionality |
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| US (1) | US6590018B2 (zh) |
| EP (1) | EP1430063A1 (zh) |
| JP (1) | JP4309267B2 (zh) |
| KR (1) | KR100973777B1 (zh) |
| TW (1) | TWI303248B (zh) |
| WO (1) | WO2003029255A1 (zh) |
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| US7183353B2 (en) * | 2004-04-29 | 2007-02-27 | Hewlett-Packard Development Company, L.P. | UV curable coating composition |
| JP6828281B2 (ja) * | 2015-06-25 | 2021-02-10 | 東洋インキＳｃホールディングス株式会社 | 活性エネルギー線重合性樹脂組成物 |
| US11028208B2 (en) | 2016-04-21 | 2021-06-08 | Bridgestone Corporation | Terminal-functionalized polymer, rubber composition containing same and related processes |
| BR112020008084B1 (pt) * | 2017-11-23 | 2023-11-14 | Basf Se | Fenil éteres, composição herbicida, processo de preparação de composições ativas, método de controle de vegetação indesejada e uso dos fenil éteres |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3803196A (en) | 1971-03-01 | 1974-04-09 | Gen Electric | Aliphatically unsaturated organopolysiloxanes |
| US3770768A (en) | 1971-03-01 | 1973-11-06 | Gen Electric | Aliphatically unsaturated organopolysiloxanes |
| US3944707A (en) * | 1973-04-02 | 1976-03-16 | Owens-Corning Fiberglas Corporation | Glass fibers coated with compositions containing complex organo silicon compounds |
| JPS57141447A (en) | 1981-02-27 | 1982-09-01 | Toshiba Silicone Co Ltd | Polyorganosiloxane composition curable at room temperature |
| GB8531568D0 (en) | 1985-12-21 | 1986-02-05 | Dow Corning Sa | Curable organopolysiloxane compositions |
| JPS6469607A (en) | 1987-09-11 | 1989-03-15 | Japan Synthetic Rubber Co Ltd | Manufacture of modified acrylic copolymer |
| JPH0813825B2 (ja) | 1987-09-11 | 1996-02-14 | 東芝シリコーン株式会社 | エポキシ基含有有機ケイ素化合物 |
| JPH02251556A (ja) | 1989-03-25 | 1990-10-09 | Toshiba Silicone Co Ltd | 変性アクリルゴム組成物 |
| JP3836925B2 (ja) | 1997-01-22 | 2006-10-25 | 株式会社日本触媒 | 液晶表示板用スペーサーの製造方法 |
-
2001
- 2001-09-28 US US09/966,454 patent/US6590018B2/en not_active Expired - Fee Related
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2002
- 2002-07-01 JP JP2003532503A patent/JP4309267B2/ja not_active Expired - Fee Related
- 2002-07-01 KR KR1020047004001A patent/KR100973777B1/ko not_active IP Right Cessation
- 2002-07-01 WO PCT/US2002/020613 patent/WO2003029255A1/en active Application Filing
- 2002-07-01 EP EP02752116A patent/EP1430063A1/en not_active Withdrawn
- 2002-09-27 TW TW091122782A patent/TWI303248B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR100973777B1 (ko) | 2010-08-03 |
| JP4309267B2 (ja) | 2009-08-05 |
| WO2003029255A1 (en) | 2003-04-10 |
| JP2005504128A (ja) | 2005-02-10 |
| US20030083452A1 (en) | 2003-05-01 |
| EP1430063A1 (en) | 2004-06-23 |
| KR20040047840A (ko) | 2004-06-05 |
| US6590018B2 (en) | 2003-07-08 |
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