KR20090066714A - 반도체 조립용 접착 필름 조성물 및 접착 필름 - Google Patents
반도체 조립용 접착 필름 조성물 및 접착 필름 Download PDFInfo
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- KR20090066714A KR20090066714A KR1020070134390A KR20070134390A KR20090066714A KR 20090066714 A KR20090066714 A KR 20090066714A KR 1020070134390 A KR1020070134390 A KR 1020070134390A KR 20070134390 A KR20070134390 A KR 20070134390A KR 20090066714 A KR20090066714 A KR 20090066714A
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Abstract
Description
Claims (13)
- 엘라스토머 수지, 에폭시 수지, 페놀형 경화수지를 포함하는 반도체 조립용 접착 필름 조성물에 있어서,실세스퀴옥산 올리고머를 전체 조성물의 고형분 100중량% 대비 0.01 내지 3중량%로 추가로 포함하는 것을 특징으로 하는 반도체 조립용 접착 필름 조성물.
- 제 1항에 있어서, 상기 엘라스토머 수지는 수산기, 카르복시기 또는 에폭시기를 함유하는 엘라스토머 수지인 것을 특징으로 하는 반도체 조립용 접착 필름 조성물.
- 제 1항에 있어서, 상기 에폭시 수지는 비스페놀계 에폭시, 페놀 노볼락계 에폭시, 오르쏘 크레졸 노볼락계 에폭시, 다관능 에폭시, 아민계 에폭시, 복소환 함유 에폭시, 치환형 에폭시 및 나프톨계 에폭시로 이루어진 군에서 선택된 1종 이상인 것을 특징으로 하는 반도체 조립용 접착 필름 조성물.
- 제 1항에 있어서, 상기 에폭시 수지 및 페놀형 경화수지의 배합량은 에폭시 당량과 수산기 당량의 비율로 0.6 내지 1.6인 것을 특징으로 하는 반도체 조립용 접착 필름 조성물.
- 제 1항에 있어서, 상기 반도체 조립용 접착 필름 조성물이 실란 커플링제, 경화촉진제 및 충진제를 추가로 포함하는 것을 특징으로 하는 반도체 조립용 접착 필름 조성물.
- 제 7항에 있어서, 상기 충진제는 무기 충진제로서 구형 또는 무정형이고, 그 크기는 5nm 내지 10um 범위인 반도체 조립용 접착 필름 조성물.
- 제 7항에 있어서, 상기 반도체 조립용 접착 필름 조성물은 전체 조성물의 고형분 100중량%를 기준으로:엘라스토머 수지 5 내지 60 중량%;에폭시 수지 3 내지 40 중량%;페놀형 경화수지 3 내지 25 중량%;실세스퀴옥산 올리고머 0.01 내지 3 중량%;실란 커플링제 0.01 내지 10 중량%;경화촉진제 0.01 내지 10 중량%; 및충진제 3 내지 60 중량%를 포함하는 것을 특징으로 하는 반도체 조립용 접착 필름 조성물.
- 제 1항 내지 제 10항 중 어느 한 항에 따른 반도체 조립용 접착 필름 조성물로 형성된 것을 특징으로 하는 반도체 조립용 접착 필름.
- 기재 필름, 점착제층 및 접착 필름층을 포함하는 다이싱 다이 본딩 필름에 있어서, 상기 다이싱 다이 본딩 필름이 제11항의 반도체 조립용 접착 필름을 포함하는 것을 특징으로 하는 다이싱 다이 본딩 필름.
- 제 12항에 있어서, 상기 점착제층이 에폭시링의 함량이 2~5mol%, 수산기가가 15~30, 산가가 1이하, 비닐기 도입 모노머의 함량이 15~20 mol%인 비닐기를 갖는 아크릴계 점착 바인더 및 바인더의 수산기가 대비 0.5~1 당량의 열경화제를 포함하는 것을 특징으로 하는 다이싱 다이 본딩 필름.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070134390A KR100962936B1 (ko) | 2007-12-20 | 2007-12-20 | 반도체 조립용 접착 필름 조성물 및 접착 필름 |
TW97149394A TWI394812B (zh) | 2007-12-20 | 2008-12-18 | 用於半導體總成之黏合膜組成物、黏合膜、切割晶粒接合膜、元件封裝體及相關方法 |
CN2008101865056A CN101463245B (zh) | 2007-12-20 | 2008-12-18 | 粘合膜组合物、粘合膜、切割芯片粘接膜、封装体及方法 |
US12/314,973 US20090162650A1 (en) | 2007-12-20 | 2008-12-19 | Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods |
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KR1020070134390A KR100962936B1 (ko) | 2007-12-20 | 2007-12-20 | 반도체 조립용 접착 필름 조성물 및 접착 필름 |
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KR20090066714A true KR20090066714A (ko) | 2009-06-24 |
KR100962936B1 KR100962936B1 (ko) | 2010-06-09 |
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US (1) | US20090162650A1 (ko) |
KR (1) | KR100962936B1 (ko) |
CN (1) | CN101463245B (ko) |
TW (1) | TWI394812B (ko) |
Cited By (3)
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WO2014014590A1 (en) * | 2012-07-16 | 2014-01-23 | Baker Hughes Incorporated | High glass transition temperature thermoset and method of making the same |
US10208188B2 (en) | 2013-10-11 | 2019-02-19 | Shengyi Technology Co., Ltd. | Thermosetting resin composition and uses thereof |
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JP5376767B2 (ja) * | 2007-03-26 | 2013-12-25 | 新日鉄住金化学株式会社 | 新規熱可塑性ポリヒドロキシポリエーテル樹脂及び、それを配合した樹脂組成物 |
US20110045725A1 (en) * | 2009-08-24 | 2011-02-24 | Ppg Industries Ohio, Inc. | Film-forming compositions, related processes and coated substrates |
KR101033044B1 (ko) * | 2009-12-30 | 2011-05-09 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 다이 접착 필름 |
KR101033045B1 (ko) * | 2009-12-30 | 2011-05-09 | 제일모직주식회사 | 반도체 조립용 접착필름 조성물 및 이를 이용한 접착필름 |
CN101851478B (zh) * | 2010-04-29 | 2012-11-21 | 黄文迎 | 一种快速固化导电胶粘剂组合物及其制备方法 |
WO2011155482A1 (ja) * | 2010-06-08 | 2011-12-15 | 積水化学工業株式会社 | 光半導体装置用ダイボンド材及びそれを用いた光半導体装置 |
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JP5890795B2 (ja) * | 2013-03-18 | 2016-03-22 | 日本碍子株式会社 | 半導体製造装置用部材 |
WO2015088932A1 (en) | 2013-12-09 | 2015-06-18 | 3M Innovative Properties Company | Curable silsesquioxane polymers, compositions, articles, and methods |
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JP7232387B2 (ja) * | 2018-09-07 | 2023-03-03 | 株式会社プロテリアル | 接着方法及び積層磁石 |
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WO2020251219A1 (ko) * | 2019-06-10 | 2020-12-17 | 주식회사 엘지화학 | 반도체 회로 접속용 접착제 조성물 및 이를 포함한 접착 필름 |
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US7560821B2 (en) * | 2005-03-24 | 2009-07-14 | Sumitomo Bakelite Company, Ltd | Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same |
TWI384046B (zh) * | 2005-10-20 | 2013-02-01 | Shinetsu Chemical Co | An adhesive composition and a sheet having an adhesive layer made of an adhesive |
TWI460249B (zh) * | 2006-02-16 | 2014-11-11 | Shinetsu Chemical Co | 黏合組成物、黏合膜及製造半導體元件的方法 |
-
2007
- 2007-12-20 KR KR1020070134390A patent/KR100962936B1/ko active IP Right Grant
-
2008
- 2008-12-18 TW TW97149394A patent/TWI394812B/zh not_active IP Right Cessation
- 2008-12-18 CN CN2008101865056A patent/CN101463245B/zh not_active Expired - Fee Related
- 2008-12-19 US US12/314,973 patent/US20090162650A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130096626A (ko) * | 2012-02-22 | 2013-08-30 | 린텍 가부시키가이샤 | 점착제 조성물 및 점착 시트 |
WO2014014590A1 (en) * | 2012-07-16 | 2014-01-23 | Baker Hughes Incorporated | High glass transition temperature thermoset and method of making the same |
US10208188B2 (en) | 2013-10-11 | 2019-02-19 | Shengyi Technology Co., Ltd. | Thermosetting resin composition and uses thereof |
Also Published As
Publication number | Publication date |
---|---|
US20090162650A1 (en) | 2009-06-25 |
CN101463245A (zh) | 2009-06-24 |
TWI394812B (zh) | 2013-05-01 |
TW200940672A (en) | 2009-10-01 |
KR100962936B1 (ko) | 2010-06-09 |
CN101463245B (zh) | 2012-02-29 |
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