TWI299902B - Image sensor with compact pixel layout - Google Patents
Image sensor with compact pixel layout Download PDFInfo
- Publication number
- TWI299902B TWI299902B TW094138646A TW94138646A TWI299902B TW I299902 B TWI299902 B TW I299902B TW 094138646 A TW094138646 A TW 094138646A TW 94138646 A TW94138646 A TW 94138646A TW I299902 B TWI299902 B TW I299902B
- Authority
- TW
- Taiwan
- Prior art keywords
- transistor
- image sensor
- region
- active region
- active
- Prior art date
Links
- 238000009792 diffusion process Methods 0.000 claims description 14
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 14
- 229920005591 polysilicon Polymers 0.000 claims description 14
- 239000003990 capacitor Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 238000003491 array Methods 0.000 claims 2
- 230000002496 gastric effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000012546 transfer Methods 0.000 description 14
- 230000008901 benefit Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 230000000171 quenching effect Effects 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010012735 Diarrhoea Diseases 0.000 description 1
- KZNMRPQBBZBTSW-UHFFFAOYSA-N [Au]=O Chemical compound [Au]=O KZNMRPQBBZBTSW-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050051555A KR100718781B1 (ko) | 2005-06-15 | 2005-06-15 | 콤팩트 픽셀 레이아웃을 갖는 cmos 이미지 센서 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200644228A TW200644228A (en) | 2006-12-16 |
| TWI299902B true TWI299902B (en) | 2008-08-11 |
Family
ID=37519706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094138646A TWI299902B (en) | 2005-06-15 | 2005-11-03 | Image sensor with compact pixel layout |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US7700950B2 (enExample) |
| JP (2) | JP5183875B2 (enExample) |
| KR (1) | KR100718781B1 (enExample) |
| CN (1) | CN100492649C (enExample) |
| TW (1) | TWI299902B (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8508638B2 (en) | 2005-03-14 | 2013-08-13 | Intellectual Ventures Ii Llc | 3T pixel for CMOS image sensors with low reset noise and low dark current generation utilizing parametric reset |
| KR100718781B1 (ko) | 2005-06-15 | 2007-05-16 | 매그나칩 반도체 유한회사 | 콤팩트 픽셀 레이아웃을 갖는 cmos 이미지 센서 |
| TWI310987B (en) * | 2005-07-09 | 2009-06-11 | Samsung Electronics Co Ltd | Image sensors including active pixel sensor arrays |
| KR100778854B1 (ko) * | 2005-12-29 | 2007-11-22 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 그 제조방법 |
| KR100688589B1 (ko) * | 2006-03-10 | 2007-03-02 | 삼성전자주식회사 | 필 팩터가 증대된 이미지 센서 및 그의 제조방법 |
| KR100826941B1 (ko) * | 2006-07-28 | 2008-05-02 | 엠텍비젼 주식회사 | 이미지 센서의 배치 구조 |
| KR100829383B1 (ko) * | 2006-12-27 | 2008-05-13 | 동부일렉트로닉스 주식회사 | 시모스 이미지 센서 |
| KR100922931B1 (ko) | 2006-12-27 | 2009-10-22 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 그 제조 방법 |
| US7924333B2 (en) | 2007-08-17 | 2011-04-12 | Aptina Imaging Corporation | Method and apparatus providing shared pixel straight gate architecture |
| US7989749B2 (en) * | 2007-10-05 | 2011-08-02 | Aptina Imaging Corporation | Method and apparatus providing shared pixel architecture |
| US20090102211A1 (en) * | 2007-10-22 | 2009-04-23 | Amir Antar | Portable pet waste receptacle |
| KR101393633B1 (ko) | 2007-10-31 | 2014-05-09 | 삼성디스플레이 주식회사 | 엑스레이 검출 패널, 엑스레이 검출기 및 엑스레이검출기의 구동 방법 |
| US20090237540A1 (en) * | 2008-03-20 | 2009-09-24 | Micron Technology, Inc. | Imager method and apparatus having combined gate signals |
| US7833819B2 (en) | 2008-07-23 | 2010-11-16 | Aptina Imaging Corporation | Method and apparatus for decreasing storage node parasitic charge in active pixel image sensors |
| US8350939B2 (en) | 2008-10-01 | 2013-01-08 | Micron Technology, Inc. | Vertical 4-way shared pixel in a single column with internal reset and no row select |
| KR101211085B1 (ko) | 2008-12-03 | 2012-12-12 | 한국전자통신연구원 | 공유 포토 다이오드 이미지 센서 |
| JP4760915B2 (ja) * | 2009-01-08 | 2011-08-31 | ソニー株式会社 | 固体撮像素子 |
| KR20120047368A (ko) * | 2010-11-02 | 2012-05-14 | 삼성전자주식회사 | 이미지 센서 |
| JP5864990B2 (ja) * | 2011-10-03 | 2016-02-17 | キヤノン株式会社 | 固体撮像装置およびカメラ |
| KR102017713B1 (ko) | 2012-05-31 | 2019-09-03 | 삼성전자주식회사 | 시모스 이미지 센서 |
| JP6231741B2 (ja) | 2012-12-10 | 2017-11-15 | キヤノン株式会社 | 固体撮像装置およびその製造方法 |
| US9287313B2 (en) | 2013-03-12 | 2016-03-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Active pixel sensor having a raised source/drain |
| US9190435B2 (en) * | 2014-03-09 | 2015-11-17 | Himax Imaging Limited | Shared active pixel sensor |
| KR102366416B1 (ko) | 2014-08-11 | 2022-02-23 | 삼성전자주식회사 | Cmos 이미지 센서 |
| JP6213743B2 (ja) * | 2014-10-08 | 2017-10-18 | パナソニックIpマネジメント株式会社 | 撮像装置およびその駆動方法 |
| KR101908286B1 (ko) * | 2017-02-23 | 2018-10-16 | (주)멜파스 | 커패시턴스 검출 방법 및 이를 이용하는 커패시턴스 검출 장치 |
| KR102651393B1 (ko) * | 2019-04-05 | 2024-03-27 | 에스케이하이닉스 주식회사 | 쉴딩 배선을 갖는 이미지 센서 |
| KR20200118723A (ko) * | 2019-04-08 | 2020-10-16 | 삼성전자주식회사 | 픽셀 그룹들을 포함하는 이미지 센서 및 이를 포함하는 전자 장치 |
| CN113629090B (zh) * | 2021-08-17 | 2024-10-15 | 思特威(上海)电子科技股份有限公司 | 一种像素、图像传感器及其制备方法、图像采集装置 |
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| JPH10256520A (ja) * | 1997-03-14 | 1998-09-25 | Toshiba Corp | 増幅型固体撮像装置 |
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| US6107655A (en) | 1997-08-15 | 2000-08-22 | Eastman Kodak Company | Active pixel image sensor with shared amplifier read-out |
| JP3496918B2 (ja) | 1997-12-26 | 2004-02-16 | キヤノン株式会社 | 固体撮像装置 |
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| CN1437263A (zh) | 2002-02-05 | 2003-08-20 | 双汉科技股份有限公司 | 可降低暗电流的互补式金氧半图像传感器结构及其布局方法 |
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| JP3720036B2 (ja) * | 2002-10-11 | 2005-11-24 | 岩手東芝エレクトロニクス株式会社 | Cmosイメージセンサ |
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| JP4585964B2 (ja) * | 2004-12-16 | 2010-11-24 | パナソニック株式会社 | 固体撮像装置 |
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| KR100718781B1 (ko) | 2005-06-15 | 2007-05-16 | 매그나칩 반도체 유한회사 | 콤팩트 픽셀 레이아웃을 갖는 cmos 이미지 센서 |
-
2005
- 2005-06-15 KR KR1020050051555A patent/KR100718781B1/ko not_active Expired - Lifetime
- 2005-10-26 US US11/260,010 patent/US7700950B2/en active Active
- 2005-11-03 TW TW094138646A patent/TWI299902B/zh active
- 2005-11-24 CN CNB2005101260473A patent/CN100492649C/zh not_active Expired - Lifetime
-
2006
- 2006-01-26 JP JP2006017038A patent/JP5183875B2/ja active Active
-
2010
- 2010-03-16 US US12/725,396 patent/US8044446B2/en not_active Expired - Lifetime
-
2011
- 2011-09-22 US US13/240,300 patent/US8217437B2/en not_active Expired - Lifetime
-
2012
- 2012-06-06 JP JP2012129174A patent/JP5486639B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20120007157A1 (en) | 2012-01-12 |
| JP5486639B2 (ja) | 2014-05-07 |
| TW200644228A (en) | 2006-12-16 |
| CN1881599A (zh) | 2006-12-20 |
| JP2006352070A (ja) | 2006-12-28 |
| KR100718781B1 (ko) | 2007-05-16 |
| KR20060131265A (ko) | 2006-12-20 |
| US20100171157A1 (en) | 2010-07-08 |
| US20060284177A1 (en) | 2006-12-21 |
| US8217437B2 (en) | 2012-07-10 |
| US8044446B2 (en) | 2011-10-25 |
| CN100492649C (zh) | 2009-05-27 |
| JP5183875B2 (ja) | 2013-04-17 |
| JP2012199581A (ja) | 2012-10-18 |
| US7700950B2 (en) | 2010-04-20 |
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