JP5183875B2 - コンパクトなピクセルレイアウトを有するcmosイメージセンサ - Google Patents
コンパクトなピクセルレイアウトを有するcmosイメージセンサ Download PDFInfo
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- JP5183875B2 JP5183875B2 JP2006017038A JP2006017038A JP5183875B2 JP 5183875 B2 JP5183875 B2 JP 5183875B2 JP 2006017038 A JP2006017038 A JP 2006017038A JP 2006017038 A JP2006017038 A JP 2006017038A JP 5183875 B2 JP5183875 B2 JP 5183875B2
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 18
- 229920005591 polysilicon Polymers 0.000 claims description 18
- 238000009792 diffusion process Methods 0.000 claims description 13
- 239000003990 capacitor Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 6
- 230000004044 response Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- FRIKWZARTBPWBN-UHFFFAOYSA-N [Si].O=[Si]=O Chemical compound [Si].O=[Si]=O FRIKWZARTBPWBN-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- RJCRUVXAWQRZKQ-UHFFFAOYSA-N oxosilicon;silicon Chemical compound [Si].[Si]=O RJCRUVXAWQRZKQ-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
Description
"A 2.0 μm Pixel Pitch MOS Image Sensor with an Amorphous Si Film Color Filter." (Digest of Technical Papers ISCC、vol.48、Feb.2005、pp.348-349)
101 アクティブ領域
102、202、203、302、303 ピンフォトダイオード
103、204、205、304、305 トランスファゲート(トランスファトランジスタのゲート)
104、206、306 共通フローティング拡散領域(共通FDノード)
105、208、308 ポリシリコンバス
106、210、310 リセットトランジスタのゲート
107、108 カラムライン
109、112、115、116、214、215、313 コンタクト
110 インターコネクト
111 ロートランスファライン
113、212、312 駆動トランジスタのゲート
114、213 アドレス選択トランジスタのゲート
118 ドレインバイアスノード
117 ローアドレスライン
119 駆動トランジスタのソース・ドレイン領域
120、222 アドレス選択トランジスタのソース
201、301 第1アクティブ領域
207、307 第1相互接続線
209、309 第2アクティブ領域
211、311 第2相互接続線
216 第1ローバスライン
217、218、314、315 トランスファゲートバスライン
219 第2ローバスライン
220、320 駆動トランジスタのドレイン
221、321 駆動トランジスタのソース
223 第2カラムバスライン
224 第1カラムバスライン
225、319 リセットトランジスタのドレイン
226、318 第3アクティブ領域
316、317 カラムバスライン
322 電源線
323 リセットライン
Claims (12)
- 複数のピクセルがロー及びカラムに配列されたピクセルアレイを有するイメージセンサにおいて、
隣接するローにそれぞれ割り当てられる2個のフォトダイオード、及び該2個のフォトダイオードに共有される共通フローティング拡散領域を有する第1アクティブ領域と、
前記第1アクティブ領域と空間的に分離されて形成され、前記共通フローティング拡散領域の電荷に応答してピクセル信号を出力する駆動トランジスタを有する第2アクティブ領域と、
前記駆動トランジスタのゲートから連続するように形成されたポリシリコンバスと、
前記第2アクティブ領域の一部である前記駆動トランジスタのドレイン領域と、前記ポリシリコンバスとがオーバーラップされて形成されたキャパシタと、を備えることを特徴とするイメージセンサ。 - 前記第1及び第2アクティブ領域と空間的に分離されて形成され、前記ピクセルをリセットするリセットトランジスタを有する第3アクティブ領域をさらに備えることを特徴とする請求項1に記載のイメージセンサ。
- 前記第2アクティブ領域に形成されるローアドレス指定用のアドレス選択トランジスタをさらに備えることを特徴とする請求項2に記載のイメージセンサ。
- 前記ピクセルアレイから選択されたローを構成する前記ピクセルの前記駆動トランジスタのソース領域にパルスを印加することにより、ローアドレス指定が行われることを特徴とする請求項2に記載のイメージセンサ。
- 前記第2アクティブ領域の別の一部である前記駆動トランジスタのドレイン領域は、ピクセル出力信号ラインに接続されることを特徴とする請求項2に記載のイメージセンサ。
- 前記駆動トランジスタのソース領域と、前記アドレス選択トランジスタのドレイン領域とは、前記第2アクティブ領域内の共通領域に形成されることを特徴とする請求項3に記載のイメージセンサ。
- 前記第2アクティブ領域の一部である前記アドレス選択トランジスタのソース領域は、ピクセル出力信号ラインに接続されることを特徴とする請求項3に記載のイメージセンサ。
- 前記ポリシリコンバスは、前記共通フローティング拡散領域及び前記第3アクティブ領域の一部である前記リセットトランジスタのソース領域と、電気的に接続することを特徴とする請求項5または請求項7に記載のイメージセンサ。
- 前記ポリシリコンバスと前記共通フローティング拡散領域とは、金属の第1接続線を介して接続され、
前記ポリシリコンバスと前記リセットトランジスタのソース領域とは、金属の第2接続線を介して接続されることを特徴とする請求項8に記載のイメージセンサ。 - 前記駆動トランジスタのドレイン領域と前記第3アクティブ領域の別の一部である前記リセットトランジスタのドレイン領域とは、それぞれVDD電源線に接続されることを特徴とする請求項8に記載のイメージセンサ。
- 前記フォトダイオードは、ピンフォトダイオードであることを特徴とする請求項1〜請求項3のいずれか一項に記載のイメージセンサ。
- 前記駆動トランジスタは、NチャネルMOSトランジスタまたは空乏型PチャネルMOSトランジスタであることを特徴とする請求項1〜請求項3のいずれか一項に記載のイメージセンサ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020050051555A KR100718781B1 (ko) | 2005-06-15 | 2005-06-15 | 콤팩트 픽셀 레이아웃을 갖는 cmos 이미지 센서 |
KR10-2005-0051555 | 2005-06-15 |
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JP2012129174A Division JP5486639B2 (ja) | 2005-06-15 | 2012-06-06 | イメージセンサに関する方法 |
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JP2006352070A JP2006352070A (ja) | 2006-12-28 |
JP2006352070A5 JP2006352070A5 (ja) | 2012-03-08 |
JP5183875B2 true JP5183875B2 (ja) | 2013-04-17 |
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JP2006017038A Active JP5183875B2 (ja) | 2005-06-15 | 2006-01-26 | コンパクトなピクセルレイアウトを有するcmosイメージセンサ |
JP2012129174A Active JP5486639B2 (ja) | 2005-06-15 | 2012-06-06 | イメージセンサに関する方法 |
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US (3) | US7700950B2 (ja) |
JP (2) | JP5183875B2 (ja) |
KR (1) | KR100718781B1 (ja) |
CN (1) | CN100492649C (ja) |
TW (1) | TWI299902B (ja) |
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US7446357B2 (en) * | 2005-05-11 | 2008-11-04 | Micron Technology, Inc. | Split trunk pixel layout |
KR100718781B1 (ko) * | 2005-06-15 | 2007-05-16 | 매그나칩 반도체 유한회사 | 콤팩트 픽셀 레이아웃을 갖는 cmos 이미지 센서 |
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CN100492649C (zh) | 2009-05-27 |
JP5486639B2 (ja) | 2014-05-07 |
US20100171157A1 (en) | 2010-07-08 |
JP2012199581A (ja) | 2012-10-18 |
US20120007157A1 (en) | 2012-01-12 |
US8217437B2 (en) | 2012-07-10 |
TWI299902B (en) | 2008-08-11 |
KR100718781B1 (ko) | 2007-05-16 |
US7700950B2 (en) | 2010-04-20 |
US8044446B2 (en) | 2011-10-25 |
TW200644228A (en) | 2006-12-16 |
CN1881599A (zh) | 2006-12-20 |
JP2006352070A (ja) | 2006-12-28 |
KR20060131265A (ko) | 2006-12-20 |
US20060284177A1 (en) | 2006-12-21 |
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