TWI292213B - - Google Patents

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Publication number
TWI292213B
TWI292213B TW090125297A TW90125297A TWI292213B TW I292213 B TWI292213 B TW I292213B TW 090125297 A TW090125297 A TW 090125297A TW 90125297 A TW90125297 A TW 90125297A TW I292213 B TWI292213 B TW I292213B
Authority
TW
Taiwan
Prior art keywords
insulating member
semiconductor device
semiconductor wafer
inner lead
lead
Prior art date
Application number
TW090125297A
Other languages
English (en)
Chinese (zh)
Inventor
Suzuki Hiromichi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TWI292213B publication Critical patent/TWI292213B/zh

Links

Classifications

    • H10W72/00—
    • H10W70/413—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/884—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
TW090125297A 2000-10-20 2001-10-12 TWI292213B (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000320794A JP2002134674A (ja) 2000-10-20 2000-10-20 半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
TWI292213B true TWI292213B (cg-RX-API-DMAC10.html) 2008-01-01

Family

ID=18799021

Family Applications (2)

Application Number Title Priority Date Filing Date
TW090125297A TWI292213B (cg-RX-API-DMAC10.html) 2000-10-20 2001-10-12
TW096136616A TWI301652B (en) 2000-10-20 2001-10-12 Semiconductor device and its manufacturing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW096136616A TWI301652B (en) 2000-10-20 2001-10-12 Semiconductor device and its manufacturing method

Country Status (4)

Country Link
US (3) US6661081B2 (cg-RX-API-DMAC10.html)
JP (1) JP2002134674A (cg-RX-API-DMAC10.html)
KR (1) KR100764405B1 (cg-RX-API-DMAC10.html)
TW (2) TWI292213B (cg-RX-API-DMAC10.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4149439B2 (ja) * 2002-07-01 2008-09-10 株式会社ルネサステクノロジ 半導体装置
AU2003261857A1 (en) * 2003-08-29 2005-03-29 Renesas Technology Corp. Semiconductor device manufacturing method
US8648458B2 (en) * 2009-12-18 2014-02-11 Nxp B.V. Leadframe circuit and method therefor
US10267506B2 (en) 2010-11-22 2019-04-23 Cree, Inc. Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
CN103348496A (zh) 2011-02-07 2013-10-09 克利公司 用于发光二极管（led）发光的部件和方法
US9431582B2 (en) * 2012-01-06 2016-08-30 Luminus Devices, Inc. Packaging method and system for LEDs
JP2013149779A (ja) * 2012-01-19 2013-08-01 Semiconductor Components Industries Llc 半導体装置
US9786825B2 (en) 2012-02-07 2017-10-10 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9806246B2 (en) 2012-02-07 2017-10-31 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US8895998B2 (en) * 2012-03-30 2014-11-25 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components and methods
US9538590B2 (en) 2012-03-30 2017-01-03 Cree, Inc. Solid state lighting apparatuses, systems, and related methods
USD738542S1 (en) 2013-04-19 2015-09-08 Cree, Inc. Light emitting unit
US9826581B2 (en) 2014-12-05 2017-11-21 Cree, Inc. Voltage configurable solid state lighting apparatuses, systems, and related methods
US10748830B2 (en) * 2016-09-20 2020-08-18 Mitsubishi Electric Corporation Semiconductor device
USD823492S1 (en) 2016-10-04 2018-07-17 Cree, Inc. Light emitting device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02217995A (ja) * 1989-02-18 1990-08-30 Kubota Ltd 自動販売機
JP2734463B2 (ja) * 1989-04-27 1998-03-30 株式会社日立製作所 半導体装置
US5068708A (en) * 1989-10-02 1991-11-26 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US5177032A (en) * 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
JPH0536862A (ja) 1991-07-31 1993-02-12 Nec Ic Microcomput Syst Ltd 半導体装置
JPH05160304A (ja) 1991-12-06 1993-06-25 Toshiba Corp 半導体装置
JP3080333B2 (ja) 1992-02-25 2000-08-28 日立電線株式会社 半導体装置
US5457340A (en) * 1992-12-07 1995-10-10 Integrated Device Technology, Inc. Leadframe with power and ground planes
JPH06291217A (ja) 1993-03-30 1994-10-18 Hitachi Cable Ltd 熱放散型リードフレーム
JP3049466B2 (ja) 1993-11-30 2000-06-05 株式会社三井ハイテック 半導体装置用リ−ドフレ−ム
JPH08116012A (ja) 1994-10-18 1996-05-07 Dainippon Printing Co Ltd 放熱板とそれを用いたリードフレーム部材及び樹脂封止型半導体装置、および放熱板の製造方法
US5650663A (en) 1995-07-03 1997-07-22 Olin Corporation Electronic package with improved thermal properties
JPH09312375A (ja) * 1996-03-18 1997-12-02 Hitachi Ltd リードフレーム、半導体装置及び半導体装置の製造方法
JPH11289040A (ja) 1998-02-09 1999-10-19 Shinko Electric Ind Co Ltd リードフレーム及びこれを用いた半導体装置
US6404067B1 (en) * 1998-06-01 2002-06-11 Intel Corporation Plastic ball grid array package with improved moisture resistance
JP2000252404A (ja) 1999-02-25 2000-09-14 Toshiba Microelectronics Corp 半導体パッケージ及びその製造方法
WO2009002600A1 (en) 2007-06-27 2008-12-31 Tabula, Inc. Restructuring data from a trace buffer of a configurable ic

Also Published As

Publication number Publication date
US6962836B2 (en) 2005-11-08
TWI301652B (en) 2008-10-01
KR20020031050A (ko) 2002-04-26
KR100764405B1 (ko) 2007-10-05
US20040051167A1 (en) 2004-03-18
JP2002134674A (ja) 2002-05-10
US20040089923A1 (en) 2004-05-13
US20020047189A1 (en) 2002-04-25
TW200811973A (en) 2008-03-01
US6661081B2 (en) 2003-12-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees