TWI290162B - Connecting material - Google Patents

Connecting material Download PDF

Info

Publication number
TWI290162B
TWI290162B TW94101409A TW94101409A TWI290162B TW I290162 B TWI290162 B TW I290162B TW 94101409 A TW94101409 A TW 94101409A TW 94101409 A TW94101409 A TW 94101409A TW I290162 B TWI290162 B TW I290162B
Authority
TW
Taiwan
Prior art keywords
coupling agent
conductive
weight
decane coupling
connecting material
Prior art date
Application number
TW94101409A
Other languages
English (en)
Chinese (zh)
Other versions
TW200538524A (en
Inventor
Satoshi Yamamoto
Original Assignee
Sony Chemicals & Information D
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals & Information D filed Critical Sony Chemicals & Information D
Publication of TW200538524A publication Critical patent/TW200538524A/zh
Application granted granted Critical
Publication of TWI290162B publication Critical patent/TWI290162B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
TW94101409A 2004-05-17 2005-01-18 Connecting material TWI290162B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004146046A JP4466189B2 (ja) 2004-05-17 2004-05-17 接続材料

Publications (2)

Publication Number Publication Date
TW200538524A TW200538524A (en) 2005-12-01
TWI290162B true TWI290162B (en) 2007-11-21

Family

ID=35394150

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94101409A TWI290162B (en) 2004-05-17 2005-01-18 Connecting material

Country Status (3)

Country Link
JP (1) JP4466189B2 (ja)
TW (1) TWI290162B (ja)
WO (1) WO2005111169A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3866459B2 (ja) * 1999-09-17 2007-01-10 富士通株式会社 接着剤
JP3765731B2 (ja) * 2000-04-10 2006-04-12 住友ベークライト株式会社 ダイアタッチペースト及び半導体装置
JP2002212536A (ja) * 2001-01-22 2002-07-31 Hitachi Chem Co Ltd 接着部材とその製造方法、該接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP2002212525A (ja) * 2001-01-22 2002-07-31 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体チップ搭載用基板及び半導体装置
JP2003096426A (ja) * 2001-09-26 2003-04-03 Hitachi Chem Co Ltd 接着部材

Also Published As

Publication number Publication date
TW200538524A (en) 2005-12-01
JP4466189B2 (ja) 2010-05-26
WO2005111169A1 (ja) 2005-11-24
JP2005327654A (ja) 2005-11-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees