WO2005111169A1 - 接続材料 - Google Patents
接続材料 Download PDFInfo
- Publication number
- WO2005111169A1 WO2005111169A1 PCT/JP2005/000472 JP2005000472W WO2005111169A1 WO 2005111169 A1 WO2005111169 A1 WO 2005111169A1 JP 2005000472 W JP2005000472 W JP 2005000472W WO 2005111169 A1 WO2005111169 A1 WO 2005111169A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coupling agent
- silane coupling
- parts
- weight
- conductive filler
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
Definitions
- the present invention relates to a liquid or paste connection material for connecting various electronic components such as an IC chip to a flexible or rigid wiring board.
- connection materials include a thermosetting component composed of a thermosetting epoxy resin and a latent curing agent, and an adjustment of a linear expansion coefficient and a moisture absorption rate of the connection material.
- Non-conductive filler a coupling agent for creating a good bonding state between the thermosetting component and the non-conductive filler, and, if necessary, conductive particles for anisotropic conductive connection. What is uniformly dispersed is used (Patent Document 1).
- Patent Document 1 JP-A-2000-80341
- the range of the compounding amount of the non-conductive filler is narrower than that of the resin composition for forming the anisotropic conductive adhesive film.
- resin components with a high molecular weight or high viscosity could not be used, and solvents could not be used.
- a JEDEC level 2A moisture absorption reflow test is performed, there is a problem that, for example, a floating occurs between an IC chip and a connection material.
- the present invention is intended to solve the above-mentioned problems of the conventional technology, and enables highly reliable connection to a liquid or paste-like connection material, and has excellent storage characteristics and
- the purpose of the present invention is to provide good moisture absorption reflow resistance such that no floating occurs even when a moisture absorption reflow test of JEDE C level 2A is performed.
- connection material the above-mentioned problems in the liquid or paste-like connection material are caused not only by the adhesion between the IC chip or the wiring board and the cured thermosetting component in the connection material, but also by It depends largely on the adhesion between the non-conductive filler surface and the cured thermosetting component, which has hardly been considered in the past, and (2) the non-conductive filler surface and the cured thermosetting component.
- connection material is likely to absorb moisture, and ( 3)
- silane coupling agents having different reactivities to non-conductive fillers should be used together in a specific amount range for the connection material, and the present invention was completed. I let it.
- the present invention relates to a connecting material containing a thermosetting component, a non-conductive filler and a silane coupling agent, wherein the silane coupling agent is a first silane coupling agent and a second silane coupling agent. And wherein the reactivity of the first silane coupling agent to the non-conductive filler is higher than the reactivity of the second silane coupling agent to the non-conductive filler.
- the content of the ring agent is 0.15-1.85 parts by weight based on 100 parts by weight of the non-conductive filler, and the content of the second silane coupling agent is 100 parts by weight of the non-conductive filler. 0.80-12.00 parts by weight Offer.
- connection material of the present invention can be connected with high reliability while being in the form of a liquid or paste, and has been subjected to excellent storage characteristics and a JEDEC level 2A moisture absorption reflow test. Even in this case, no floating occurs, and good moisture absorption and reflow resistance is exhibited.
- the present invention is a connection material containing a thermosetting component, a non-conductive filler and a silane coupling agent, and has a relatively high reactivity as a silane coupling agent to a non-conductive filler.
- the first silane coupling agent shown is used in combination with the second silane coupling agent showing relatively low reactivity.
- a critical surface tension is an index of the reactivity of the silane coupling agent to the non-conductive filler. When the critical surface tension of the same substrate (for example, a soda glass substrate) is compared, the smaller the critical surface tension, the higher the reactivity.
- the reactivity with the non-conductive filler is high. Insufficient adhesion between the wiring board or IC chip to be connected and the thermosetting component after curing, which reduces the PCT resistance of the connection material and is relatively low compared to non-conductive fillers
- a second silane coupling agent showing reactivity is used alone as a silane coupling agent, the adhesiveness between the wiring board or IC chip to be connected and the cured thermosetting component is determined by the connection material.
- the adhesion between the non-conductive filler and the cured thermosetting component becomes insufficient, and the moisture absorption reflow resistance decreases. Therefore, in the present invention, by using a first silane coupling agent and a second coupling agent having different reactivities to each other with respect to the non-conductive filler, the cured thermosetting component and the second silane coupling agent are combined. It balances the adhesion between the non-conductive filter and the adhesion between the cured thermosetting component and the wiring board or IC chip to be connected.
- the amount is 0.15-1.85 parts by weight, preferably 0.2-1.7 parts by weight, per 100 parts by weight of the non-conductive filter.
- the content of the second silane coupling agent is too small, the adhesion between the wiring board or IC chip to be connected and the cured thermosetting component becomes insufficient.
- Moisture absorption resistance The reflow resistance is reduced, and if it is too large, the unreacted second silane capping agent for the non-conductive filler remains in the connection material, causing voids, and open occurs after the PCT test.
- the amount is 0.80-12.00 parts by weight, preferably 1.00-11.00 parts by weight, per 100 parts by weight of the conductive filler.
- Table 1 below shows specific examples of the silane coupling agent that can be used in the present invention.
- the difference in surface force between the first silane coupling agent and the second silane coupling agent is preferably 3dyneZcm or more and 10DyneZcm or less.
- the content weight ratio of the first silane coupling agent to the second coupling agent is such that the second silane coupling agent is too small relative to the first silane coupling agent. If the PC T resistance (pressure tacker test resistance) is too low or too high, the resin thickens or hardens, so that it is preferable to use 1: 0.85-1: 0.05, more preferably 1: 0.75-1 : 0.07.
- the non-conductive filler is for adjusting the linear expansion coefficient and the moisture absorption of the connecting material.
- One such non-conductive filter is silica with a particle size of about 0.1-5 ⁇ m. Fine particles, titanium oxide particles, and the like. Among them, silica fine particles are preferred in terms of cost.
- thermosetting component used in the present invention a thermosetting component used in conventional anisotropic conductive adhesive pastes and non-conductive adhesive pastes can be used.
- thermosetting component containing a polymerizable epoxy compound and a latent curing agent can be preferably used in view of conduction reliability and connection reliability.
- an epoxy monomer or oligomer having a molecular weight (weight average molecular weight) of 10,000 or less can be preferably mentioned.
- glycidyl ethers of phenols such as bisphenol 8, bisphenol F, resorcinol, phenol novolak, and cresol novolac
- glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol
- phthalic acid, isophthalic acid, tetrahydro Epoxy monomers such as glycidyl esters of carboxylic acids such as phthalic acid, and oligomers or alicyclic epoxides thereof can be mentioned.
- bisphenol A glycidyl ether monomer or oligomer can be preferably used.
- Epicoat 828 molecular weight 380
- Epicol 834 molecular weight 470
- Epicol 1001 molecular weight 900
- Epicol 1002 molecular weight 1060
- Epicoat 1055 molecular weight 1350 manufactured by Yuka Shell Co., Ltd.
- Epicoat 1007 molecular weight 2900 and the like can be used. These can be used alone or in combination of two or more.
- thermosetting epoxy adhesives those used and used for known thermosetting epoxy adhesives can be used.
- imidazole eg, HX3748, Asahi Kasei Chemicals
- amine PN-23, Ajinomoto
- dicyandiamide DCMV99, ACI Japan Limited
- the use amount of the latent curing agent is preferably 100 parts by weight per 100 parts by weight of the polymerizable epoxy compound.
- the connecting material of the present invention may appropriately contain a crosslinking agent, various rubber components, a filler, a leveling agent, a viscosity modifier, an antioxidant, and the like, as necessary. it can .
- conductive particles for anisotropic conductive connection because the connection material can be used as a liquid or paste-like anisotropic conductive adhesive.
- conductive particles Conventionally known conductive particles, for example, metal particles such as nickel and gold, composite particles in which the surface of a thermoplastic resin core is coated with the above-described metal, and surfaces of the metal particles and the composite particles having an insulating resin thin film Can be used.
- connection material of the present invention is obtained by subjecting a thermosetting component, a non-conductive filler, a silane coupling agent, and other components to be added as necessary to vacuum defoaming treatment, respectively, using a known stirring device. It can be manufactured by mixing uniformly.
- connection material of the present invention is used as a liquid or a paste, although it varies depending on the type and the ratio of the raw materials used.
- connection material of the present invention when used, for example, a connection material is applied to a connection terminal area of a wiring board by a known coating device, and various electronic components such as an IC chip are aligned and heated by a heating bonder. You should crimp ⁇ .
- connection material was uniformly mixed with a planetary stirrer (Neritaro, THINKY). Prepared. The storage stability of the obtained connection material was evaluated as described below.
- Tables 2 and 3 show [(A) wtp / 100 wt parts of the filler] and the content of the second silane coupling agent with respect to 100 parts by weight of the non-conductive filler [(B) wtp / 100 wt parts of the filler].
- connection material Leave the connection material at room temperature for one week, and evaluate the case where the change in viscosity with respect to the initial viscosity is less than ⁇ 20% as ⁇ good '', write ⁇ ⁇ '' in Table 2 and Table 3, and ⁇ 20% or more Was evaluated as “poor” and described in Tables 2 and 3 as “X”.
- connection material is applied to a COB substrate (FR5, 150 m pitch, TEG substrate manufactured by Sony Chemical Co., Ltd.) using a dispenser, and an Au plating bump ( Size: 60 ⁇ m square, 0.2 m high, bump pitch: 100 ⁇ m)
- a chip size: 6.3 mm square, 0.4 mm thick is aligned and heated and pressed with a heating bonder on a cradle heated to 80 ° C (heating temperature: 230 ° C, heating time: 5 seconds, pressure : 0.59 NZ bump) ⁇ COB connector was manufactured.
- the obtained COB connector was subjected to moisture absorption reflow treatment under JEDEC level 2A conditions (left at 85 ° CZ85% RH for 24 hours, and then reflow treated at a maximum temperature of 245 ° C three times). After being left in an atmosphere of 121 ° C, 100% RH, and 202.6 kPa for 100 hours, the connection resistance value was measured by a four-terminal method. If the maximum resistance value is 200 m ⁇ or less, it is evaluated as ⁇ good '', and Table 2 and Table 3 are described as ⁇ ⁇ '', and if it exceeds 200 m ⁇ , it is evaluated as ⁇ poor '' and Table 2 and Table 3 are evaluated. "X" was described in 3.
- the obtained COB connector is 121.
- the connection resistance value was measured by a four-terminal method. If the maximum resistance value is 200 m ⁇ or less, it is evaluated as ⁇ good '', and Table 2 and Table 3 are described as ⁇ ⁇ '', and if it exceeds 200 m ⁇ , it is evaluated as ⁇ poor '' and Table 2 and Table "X" was described in 3.
- the content of the first silane coupling agent was 0.125 parts by weight with respect to 100 parts by weight of the non-conductive filler. If it is too small, the moisture absorption reflow resistance is insufficient, and if it is 2 parts by weight, it is too large and storage stability is lacking.
- good moisture absorption resistance was obtained when the content of the first silane coupling agent was 0.25 parts by weight to 1.75 parts by weight with respect to 100 parts by weight of the nonconductive filler. It turns out that reflow property and storage stability were obtained. Therefore, it is understood that the content of the first silane coupling agent is appropriately 0.15-1.85 parts by weight based on 100 parts by weight of the non-conductive filter.
- connection material of the present invention can be connected with high reliability even though it is in a liquid or paste form, has excellent storage characteristics, and floats even when a JEDEC level 2A moisture absorption reflow test is performed. No good moisture absorption and reflow resistance. Therefore, the connection material of the present invention is useful as a liquid or paste connection material for connecting various electronic components such as IC chips to a flexible or rigid wiring board.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-146046 | 2004-05-17 | ||
JP2004146046A JP4466189B2 (ja) | 2004-05-17 | 2004-05-17 | 接続材料 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005111169A1 true WO2005111169A1 (ja) | 2005-11-24 |
Family
ID=35394150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/000472 WO2005111169A1 (ja) | 2004-05-17 | 2005-01-17 | 接続材料 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4466189B2 (ja) |
TW (1) | TWI290162B (ja) |
WO (1) | WO2005111169A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001081439A (ja) * | 1999-09-17 | 2001-03-27 | Fujitsu Ltd | 接着剤 |
JP2002184793A (ja) * | 2000-04-10 | 2002-06-28 | Sumitomo Bakelite Co Ltd | ダイアタッチペースト及び半導体装置 |
JP2002212536A (ja) * | 2001-01-22 | 2002-07-31 | Hitachi Chem Co Ltd | 接着部材とその製造方法、該接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
JP2002212525A (ja) * | 2001-01-22 | 2002-07-31 | Hitachi Chem Co Ltd | 半導体用接着フィルム、半導体チップ搭載用基板及び半導体装置 |
JP2003096426A (ja) * | 2001-09-26 | 2003-04-03 | Hitachi Chem Co Ltd | 接着部材 |
-
2004
- 2004-05-17 JP JP2004146046A patent/JP4466189B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-17 WO PCT/JP2005/000472 patent/WO2005111169A1/ja active Application Filing
- 2005-01-18 TW TW94101409A patent/TWI290162B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001081439A (ja) * | 1999-09-17 | 2001-03-27 | Fujitsu Ltd | 接着剤 |
JP2002184793A (ja) * | 2000-04-10 | 2002-06-28 | Sumitomo Bakelite Co Ltd | ダイアタッチペースト及び半導体装置 |
JP2002212536A (ja) * | 2001-01-22 | 2002-07-31 | Hitachi Chem Co Ltd | 接着部材とその製造方法、該接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
JP2002212525A (ja) * | 2001-01-22 | 2002-07-31 | Hitachi Chem Co Ltd | 半導体用接着フィルム、半導体チップ搭載用基板及び半導体装置 |
JP2003096426A (ja) * | 2001-09-26 | 2003-04-03 | Hitachi Chem Co Ltd | 接着部材 |
Also Published As
Publication number | Publication date |
---|---|
TW200538524A (en) | 2005-12-01 |
JP4466189B2 (ja) | 2010-05-26 |
TWI290162B (en) | 2007-11-21 |
JP2005327654A (ja) | 2005-11-24 |
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