TWI289580B - Epoxy resin composition - Google Patents

Epoxy resin composition Download PDF

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Publication number
TWI289580B
TWI289580B TW092122289A TW92122289A TWI289580B TW I289580 B TWI289580 B TW I289580B TW 092122289 A TW092122289 A TW 092122289A TW 92122289 A TW92122289 A TW 92122289A TW I289580 B TWI289580 B TW I289580B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
compounds
composition
compound
Prior art date
Application number
TW092122289A
Other languages
English (en)
Other versions
TW200413466A (en
Inventor
Kazuhiro Arai
Satoshi Asai
Hideto Kato
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200413466A publication Critical patent/TW200413466A/zh
Application granted granted Critical
Publication of TWI289580B publication Critical patent/TWI289580B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

(3) 1289580 iii )硬化促進劑係選自三苯膦、三丁基膦、三癸磷、三苯 磷三苯硼、四苯銹四苯硼酸酯、二甲基四苯二膦，苄基二 甲胺（BDMA)、二甲胺甲苯酚（DMP-10)、三個（二甲胺甲基 )苯酚（DMP-30)、1，8 -二氮雜雙環（5，4，0)H--烯- 7(DBU)、2-甲基-4-乙基咪唑（2E4MZ)、2-苯基咪唑（2PZ) 、2-甲基咪唑（2MZ)、1-苄基-2-苯基咪唑（1B2PZ)。
7 ·如申請專利範圍第1項之環氧樹脂組成物，其中成 型品係包含該硬化之環氧組成物，或由該硬化之環氧組成 物所組成。 8 .如申請專利範圍第1項之環氧樹脂組成物，其中該 組成物係使用於半導體密封材，黏著劑或塗料，或者薄片 材料者。 9.如申請專利範圍第8項之環氧樹脂組成物，其中該組 成物係在溫度100〜200°C，經1~24小時硬化者。
-3-
TW092122289A 2002-08-13 2003-08-13 Epoxy resin composition TWI289580B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002235623A JP3874108B2 (ja) 2002-08-13 2002-08-13 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
TW200413466A TW200413466A (en) 2004-08-01
TWI289580B true TWI289580B (en) 2007-11-11

Family

ID=30768039

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092122289A TWI289580B (en) 2002-08-13 2003-08-13 Epoxy resin composition

Country Status (6)

Country Link
US (1) US7060761B2 (zh)
EP (1) EP1389631B1 (zh)
JP (1) JP3874108B2 (zh)
KR (1) KR100697108B1 (zh)
DE (1) DE60301926T2 (zh)
TW (1) TWI289580B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI627224B (zh) * 2013-03-14 2018-06-21 味之素股份有限公司 Resin composition

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US7504460B2 (en) * 2005-03-07 2009-03-17 Delphi Technologies, Inc. Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine
JP4878810B2 (ja) * 2005-10-27 2012-02-15 新日鐵化学株式会社 熱可塑性ポリヒドロキシポリエーテル樹脂及びその使用
US20070225477A1 (en) * 2006-03-22 2007-09-27 General Electric Company Optoelectronic devices with multilayered structures
US7633220B2 (en) * 2006-03-22 2009-12-15 General Electric Company Optoelectronic devices with multilayered structures
JP2009040919A (ja) * 2007-08-09 2009-02-26 Sekisui Chem Co Ltd 熱硬化性樹脂組成物、及びこれを用いてなる樹脂フィルム、積層板、プリプレグ
US8617792B2 (en) 2009-07-31 2013-12-31 Cheil Industries, Inc. Aromatic ring-containing polymer for resist underlayer, resist underlayer composition including the same, and method of patterning device using the same
GB0922599D0 (en) * 2009-12-23 2010-02-10 Cytec Tech Corp Modified resin systems for liquid resin infusion applications, prepreg autoclave applications and hybrids thereof
US8614266B2 (en) 2010-05-05 2013-12-24 Tyco Electronics Services Gmbh Potting for electronic components
KR101035492B1 (ko) * 2011-01-19 2011-05-20 에스엘코리아 주식회사 친환경 향기블록
US20120286416A1 (en) * 2011-05-11 2012-11-15 Tessera Research Llc Semiconductor chip package assembly and method for making same
US8957520B2 (en) * 2011-06-08 2015-02-17 Tessera, Inc. Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts
JP5966955B2 (ja) * 2012-02-10 2016-08-10 信越化学工業株式会社 蛍光性化合物及びその製造方法並びに蛍光性樹脂組成物
JP5890284B2 (ja) * 2012-09-04 2016-03-22 信越化学工業株式会社 新規有機珪素化合物の製造方法
JP2012246497A (ja) * 2012-09-04 2012-12-13 Sekisui Chem Co Ltd 樹脂フィルム、積層板、及びプリプレグ
US8884427B2 (en) 2013-03-14 2014-11-11 Invensas Corporation Low CTE interposer without TSV structure
JP6265105B2 (ja) * 2014-10-30 2018-01-24 信越化学工業株式会社 シリコーン樹脂、樹脂組成物、樹脂フィルム及び半導体装置とその製造方法
US10181447B2 (en) 2017-04-21 2019-01-15 Invensas Corporation 3D-interconnect
KR102687075B1 (ko) * 2019-03-27 2024-07-19 닛폰 하츠죠 가부시키가이샤 열경화성 에폭시 수지 조성물, 회로 기판용 적층판, 금속 베이스 회로 기판, 및 파워 모듈
WO2021084632A1 (ja) * 2019-10-29 2021-05-06 昭和電工マテリアルズ株式会社 熱硬化性樹脂フィルム、銅箔付き熱硬化性樹脂フィルム、フレキシブルプリント配線板用積層フィルムの製造方法、及びフレキシブルプリント配線板
US12040284B2 (en) 2021-11-12 2024-07-16 Invensas Llc 3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna

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KR930001988B1 (ko) * 1988-04-05 1993-03-20 미쓰비시뎅끼 가부시끼가이샤 반도체 봉지용 에폭시 수지조성물
MY107113A (en) * 1989-11-22 1995-09-30 Sumitomo Bakelite Co Epoxy resin composition for semiconductor sealing.
US5512376A (en) * 1994-06-20 1996-04-30 Hercules Incorporated Nonpolar polymers comprising antiplasticizers
US5583195A (en) 1995-09-29 1996-12-10 General Electric Company Photocurable epoxy silicones functionalized with fluorescent or photosensitizing marker dyes
US5998509A (en) * 1996-11-29 1999-12-07 Kabushiki Kaisha Toshiba Resin composition and semiconductor device employing the same
JP3767676B2 (ja) * 2000-09-12 2006-04-19 信越化学工業株式会社 オルガノシロキサン系高分子化合物及び光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜
JP3832572B2 (ja) * 2001-10-09 2006-10-11 信越化学工業株式会社 光硬化性樹脂組成物、パターン形成方法及び基板保護用フィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI627224B (zh) * 2013-03-14 2018-06-21 味之素股份有限公司 Resin composition

Also Published As

Publication number Publication date
DE60301926D1 (de) 2006-03-02
JP2004075769A (ja) 2004-03-11
US20040034187A1 (en) 2004-02-19
KR20040023502A (ko) 2004-03-18
US7060761B2 (en) 2006-06-13
DE60301926T2 (de) 2006-07-06
JP3874108B2 (ja) 2007-01-31
EP1389631B1 (en) 2005-10-19
KR100697108B1 (ko) 2007-03-21
EP1389631A1 (en) 2004-02-18
TW200413466A (en) 2004-08-01

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