TWI282993B - Method and apparatus for cooling magnetic circuit elements - Google Patents
Method and apparatus for cooling magnetic circuit elements Download PDFInfo
- Publication number
- TWI282993B TWI282993B TW093116671A TW93116671A TWI282993B TW I282993 B TWI282993 B TW I282993B TW 093116671 A TW093116671 A TW 093116671A TW 93116671 A TW93116671 A TW 93116671A TW I282993 B TWI282993 B TW I282993B
- Authority
- TW
- Taiwan
- Prior art keywords
- housing
- coolant
- core support
- core
- coolant flow
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000002826 coolant Substances 0.000 claims abstract description 340
- 239000012530 fluid Substances 0.000 claims abstract description 31
- 238000004891 communication Methods 0.000 claims abstract description 20
- 238000000576 coating method Methods 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- 150000002736 metal compounds Chemical class 0.000 claims 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 150000002484 inorganic compounds Chemical class 0.000 claims 1
- 229910010272 inorganic material Inorganic materials 0.000 claims 1
- 150000002894 organic compounds Chemical class 0.000 claims 1
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 7
- 239000010409 thin film Substances 0.000 abstract description 3
- 239000003990 capacitor Substances 0.000 description 52
- 230000006835 compression Effects 0.000 description 23
- 238000007906 compression Methods 0.000 description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000007787 solid Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 238000004804 winding Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 230000001939 inductive effect Effects 0.000 description 8
- 239000012212 insulator Substances 0.000 description 7
- 238000011084 recovery Methods 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 238000005219 brazing Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 230000002441 reversible effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 210000003423 ankle Anatomy 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 210000002683 foot Anatomy 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- 244000019459 Cynara cardunculus Species 0.000 description 1
- 235000019106 Cynara scolymus Nutrition 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 235000016520 artichoke thistle Nutrition 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 210000003323 beak Anatomy 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical class FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- -1 poly(p-quinone) Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
- H01F27/266—Fastening or mounting the core on casing or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/10—Liquid cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/097—Processes or apparatus for excitation, e.g. pumping by gas discharge of a gas laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/025—Constructional details relating to cooling
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
- Dc-Dc Converters (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Transformer Cooling (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/607,407 US7002443B2 (en) | 2003-06-25 | 2003-06-25 | Method and apparatus for cooling magnetic circuit elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200509153A TW200509153A (en) | 2005-03-01 |
| TWI282993B true TWI282993B (en) | 2007-06-21 |
Family
ID=33540258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093116671A TWI282993B (en) | 2003-06-25 | 2004-06-10 | Method and apparatus for cooling magnetic circuit elements |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7002443B2 (enExample) |
| EP (1) | EP1644945A4 (enExample) |
| JP (2) | JP2007524226A (enExample) |
| KR (1) | KR101151260B1 (enExample) |
| CN (1) | CN1809903B (enExample) |
| TW (1) | TWI282993B (enExample) |
| WO (1) | WO2005001853A2 (enExample) |
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| US20050259709A1 (en) | 2002-05-07 | 2005-11-24 | Cymer, Inc. | Systems and methods for implementing an interaction between a laser shaped as a line beam and a film deposited on a substrate |
| US7087914B2 (en) * | 2004-03-17 | 2006-08-08 | Cymer, Inc | High repetition rate laser produced plasma EUV light source |
| US20060222034A1 (en) * | 2005-03-31 | 2006-10-05 | Cymer, Inc. | 6 Khz and above gas discharge laser system |
| US20070071047A1 (en) * | 2005-09-29 | 2007-03-29 | Cymer, Inc. | 6K pulse repetition rate and above gas discharge laser system solid state pulse power system improvements |
| US7471455B2 (en) | 2005-10-28 | 2008-12-30 | Cymer, Inc. | Systems and methods for generating laser light shaped as a line beam |
| US7679029B2 (en) * | 2005-10-28 | 2010-03-16 | Cymer, Inc. | Systems and methods to shape laser light as a line beam for interaction with a substrate having surface variations |
| US7317179B2 (en) * | 2005-10-28 | 2008-01-08 | Cymer, Inc. | Systems and methods to shape laser light as a homogeneous line beam for interaction with a film deposited on a substrate |
| US7864825B2 (en) * | 2006-08-10 | 2011-01-04 | Lasertel, Inc. | Method and system for a laser diode bar array assembly |
| US12009144B2 (en) * | 2007-04-05 | 2024-06-11 | Grant A. MacLennan | Cooled / cast inductor apparatus and method of use thereof |
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| US9524820B2 (en) | 2012-11-13 | 2016-12-20 | Raytheon Company | Apparatus and method for thermal management of magnetic devices |
| US9349523B2 (en) | 2013-07-15 | 2016-05-24 | Raytheon Company | Compact magnetics assembly |
| US10892140B2 (en) * | 2018-07-27 | 2021-01-12 | Eagle Harbor Technologies, Inc. | Nanosecond pulser bias compensation |
| US9373436B2 (en) * | 2014-07-07 | 2016-06-21 | Hamilton Sundstrand Corporation | Liquid cooled inductors |
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| CN104319072A (zh) * | 2014-10-21 | 2015-01-28 | 国家电网公司 | 变压器降温换热装置 |
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| JPWO2016143033A1 (ja) * | 2015-03-09 | 2018-02-01 | ギガフォトン株式会社 | 高電圧パルス発生装置 |
| WO2017223118A1 (en) | 2016-06-21 | 2017-12-28 | Eagle Harbor Technologies, Inc. | High voltage pre-pulsing |
| US10529479B2 (en) * | 2016-11-04 | 2020-01-07 | Ford Global Technologies, Llc | Inductor cooling systems and methods |
| US10141095B2 (en) * | 2016-11-04 | 2018-11-27 | Ford Global Technologies, Llc | Inductor cooling systems and methods |
| US11025031B2 (en) | 2016-11-29 | 2021-06-01 | Leonardo Electronics Us Inc. | Dual junction fiber-coupled laser diode and related methods |
| EP3330983B1 (en) * | 2016-11-30 | 2023-10-04 | Danfoss Editron Oy | An inductive device |
| EP3567619B1 (en) * | 2018-05-08 | 2020-11-25 | Abiomed Europe GmbH | Corrosion-resistant permanent magnet and intravascular blood pump comprising the magnet |
| US11810761B2 (en) | 2018-07-27 | 2023-11-07 | Eagle Harbor Technologies, Inc. | Nanosecond pulser ADC system |
| CA3109659C (en) | 2018-08-13 | 2023-10-31 | Leonardo Electronics Us Inc. | Use of metal-core printed circuit board (pcb) for generation of ultra-narrow, high-current pulse driver |
| US11056854B2 (en) | 2018-08-14 | 2021-07-06 | Leonardo Electronics Us Inc. | Laser assembly and related methods |
| US11348717B2 (en) | 2018-10-31 | 2022-05-31 | Hamilton Sundstrand Corporation | Thermal management of high power inductors |
| US11296481B2 (en) | 2019-01-09 | 2022-04-05 | Leonardo Electronics Us Inc. | Divergence reshaping array |
| TWI749546B (zh) | 2019-05-14 | 2021-12-11 | 美商希瑪有限責任公司 | 用於調變光源波長的裝置及方法 |
| JP7382424B2 (ja) | 2019-05-22 | 2023-11-16 | サイマー リミテッド ライアビリティ カンパニー | 複数の深紫外光発振器のための制御システム |
| KR102562520B1 (ko) | 2019-05-22 | 2023-08-01 | 사이머 엘엘씨 | 다수의 레이저 빔을 생성하는 장치 및 방법 |
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| US11594364B2 (en) * | 2020-03-18 | 2023-02-28 | Hamilton Sundstrand Corporation | Systems and methods for thermal management in inductors |
| US11967484B2 (en) | 2020-07-09 | 2024-04-23 | Eagle Harbor Technologies, Inc. | Ion current droop compensation |
| US12100541B2 (en) * | 2020-09-14 | 2024-09-24 | Intel Corporation | Embedded cooling channel in magnetics |
| DE102020212388A1 (de) * | 2020-09-30 | 2022-03-31 | Mahle International Gmbh | Bodenbaugruppe für eine induktive Ladevorrichtung |
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| JP2023554301A (ja) | 2020-12-22 | 2023-12-27 | サイマー リミテッド ライアビリティ カンパニー | ハイブリッド非線形磁性材料を用いたパルスパワー回路及びハイブリッド非線形磁性材料を組み込んだインダクタ |
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-
2003
- 2003-06-25 US US10/607,407 patent/US7002443B2/en not_active Expired - Lifetime
-
2004
- 2004-06-10 TW TW093116671A patent/TWI282993B/zh not_active IP Right Cessation
- 2004-06-14 WO PCT/US2004/018941 patent/WO2005001853A2/en not_active Ceased
- 2004-06-14 KR KR1020057024794A patent/KR101151260B1/ko not_active Expired - Fee Related
- 2004-06-14 CN CN2004800174332A patent/CN1809903B/zh not_active Expired - Lifetime
- 2004-06-14 JP JP2006517266A patent/JP2007524226A/ja active Pending
- 2004-06-14 EP EP04776564A patent/EP1644945A4/en not_active Withdrawn
-
2011
- 2011-04-19 JP JP2011092788A patent/JP5606987B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US7002443B2 (en) | 2006-02-21 |
| JP2007524226A (ja) | 2007-08-23 |
| CN1809903B (zh) | 2010-06-16 |
| KR20060035635A (ko) | 2006-04-26 |
| JP5606987B2 (ja) | 2014-10-15 |
| JP2011142354A (ja) | 2011-07-21 |
| EP1644945A4 (en) | 2012-06-13 |
| CN1809903A (zh) | 2006-07-26 |
| EP1644945A2 (en) | 2006-04-12 |
| US20040264521A1 (en) | 2004-12-30 |
| TW200509153A (en) | 2005-03-01 |
| KR101151260B1 (ko) | 2012-06-14 |
| WO2005001853A3 (en) | 2005-11-24 |
| WO2005001853A2 (en) | 2005-01-06 |
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