TWI270137B - Plasma treatment method - Google Patents

Plasma treatment method Download PDF

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Publication number
TWI270137B
TWI270137B TW91137526A TW91137526A TWI270137B TW I270137 B TWI270137 B TW I270137B TW 91137526 A TW91137526 A TW 91137526A TW 91137526 A TW91137526 A TW 91137526A TW I270137 B TWI270137 B TW I270137B
Authority
TW
Taiwan
Prior art keywords
film
plasma
mask
processing container
ruthenium
Prior art date
Application number
TW91137526A
Other languages
English (en)
Chinese (zh)
Other versions
TW200306625A (en
Inventor
Kiwamu Fujimoto
Jeong Jy
Takashi Fuse
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200306625A publication Critical patent/TW200306625A/zh
Application granted granted Critical
Publication of TWI270137B publication Critical patent/TWI270137B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Drying Of Semiconductors (AREA)
TW91137526A 2002-01-07 2002-12-26 Plasma treatment method TWI270137B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002000933 2002-01-07
JP2002104160A JP4326746B2 (ja) 2002-01-07 2002-04-05 プラズマ処理方法

Publications (2)

Publication Number Publication Date
TW200306625A TW200306625A (en) 2003-11-16
TWI270137B true TWI270137B (en) 2007-01-01

Family

ID=26625442

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91137526A TWI270137B (en) 2002-01-07 2002-12-26 Plasma treatment method

Country Status (4)

Country Link
JP (1) JP4326746B2 (fr)
AU (1) AU2002359950A1 (fr)
TW (1) TWI270137B (fr)
WO (1) WO2003058700A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4889199B2 (ja) * 2003-11-05 2012-03-07 株式会社アルバック 低誘電率層間絶縁膜のドライエッチング方法
US20050101135A1 (en) * 2003-11-12 2005-05-12 Lam Research Corporation Minimizing the loss of barrier materials during photoresist stripping
JP4749683B2 (ja) * 2004-06-08 2011-08-17 東京エレクトロン株式会社 エッチング方法
US7951262B2 (en) 2004-06-21 2011-05-31 Tokyo Electron Limited Plasma processing apparatus and method
TWI447802B (zh) * 2004-06-21 2014-08-01 Tokyo Electron Ltd A plasma processing apparatus, a plasma processing method, and a computer-readable recording medium
US7740737B2 (en) 2004-06-21 2010-06-22 Tokyo Electron Limited Plasma processing apparatus and method
JP5036143B2 (ja) * 2004-06-21 2012-09-26 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法、ならびにコンピュータ読み取り可能な記憶媒体
US7988816B2 (en) 2004-06-21 2011-08-02 Tokyo Electron Limited Plasma processing apparatus and method
JP4672455B2 (ja) * 2004-06-21 2011-04-20 東京エレクトロン株式会社 プラズマエッチング装置およびプラズマエッチング方法、ならびにコンピュータ読み取り可能な記憶媒体
JP4523351B2 (ja) * 2004-07-14 2010-08-11 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4616605B2 (ja) * 2004-09-27 2011-01-19 東京エレクトロン株式会社 プラズマ処理方法、プラズマ処理装置及び記憶媒体
US8193096B2 (en) 2004-12-13 2012-06-05 Novellus Systems, Inc. High dose implantation strip (HDIS) in H2 base chemistry
US8129281B1 (en) 2005-05-12 2012-03-06 Novellus Systems, Inc. Plasma based photoresist removal system for cleaning post ash residue
US7244313B1 (en) * 2006-03-24 2007-07-17 Applied Materials, Inc. Plasma etch and photoresist strip process with intervening chamber de-fluorination and wafer de-fluorination steps
US8435895B2 (en) 2007-04-04 2013-05-07 Novellus Systems, Inc. Methods for stripping photoresist and/or cleaning metal regions
US20110143548A1 (en) 2009-12-11 2011-06-16 David Cheung Ultra low silicon loss high dose implant strip
CN102652351B (zh) 2009-12-11 2016-10-05 诺发系统有限公司 在高剂量植入剥除前保护硅的增强式钝化工艺
US9613825B2 (en) * 2011-08-26 2017-04-04 Novellus Systems, Inc. Photoresist strip processes for improved device integrity
US9514954B2 (en) 2014-06-10 2016-12-06 Lam Research Corporation Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214356A (ja) * 1998-01-29 1999-08-06 Sony Corp シリコン基板のドライエッチング方法
JP2000195830A (ja) * 1998-12-28 2000-07-14 Mitsubishi Electric Corp 半導体製造装置、半導体製造装置のクリ―ニング方法、半導体装置の製造方法及び半導体装置
US6492186B1 (en) * 1999-08-05 2002-12-10 Eaton Corporation Method for detecting an endpoint for an oxygen free plasma process
JP2001135630A (ja) * 1999-11-10 2001-05-18 Matsushita Electronics Industry Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JP4326746B2 (ja) 2009-09-09
JP2003264170A (ja) 2003-09-19
WO2003058700A1 (fr) 2003-07-17
AU2002359950A1 (en) 2003-07-24
TW200306625A (en) 2003-11-16

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MM4A Annulment or lapse of patent due to non-payment of fees