TWI269346B - Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing - Google Patents
Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing Download PDFInfo
- Publication number
- TWI269346B TWI269346B TW091133971A TW91133971A TWI269346B TW I269346 B TWI269346 B TW I269346B TW 091133971 A TW091133971 A TW 091133971A TW 91133971 A TW91133971 A TW 91133971A TW I269346 B TWI269346 B TW I269346B
- Authority
- TW
- Taiwan
- Prior art keywords
- planarization
- probe card
- ate
- optical
- flat surface
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 137
- 238000012360 testing method Methods 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 238000005259 measurement Methods 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 230000003287 optical effect Effects 0.000 claims abstract description 88
- 238000003032 molecular docking Methods 0.000 claims description 58
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 44
- 238000010586 diagram Methods 0.000 description 6
- 238000010200 validation analysis Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 210000004027 cell Anatomy 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000013598 vector Substances 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 230000003278 mimic effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/133,165 US6794889B2 (en) | 2002-04-26 | 2002-04-26 | Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200305913A TW200305913A (en) | 2003-11-01 |
| TWI269346B true TWI269346B (en) | 2006-12-21 |
Family
ID=29248935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091133971A TWI269346B (en) | 2002-04-26 | 2002-11-21 | Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6794889B2 (enExample) |
| JP (1) | JP4495919B2 (enExample) |
| IT (1) | ITRM20030188A1 (enExample) |
| TW (1) | TWI269346B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI802560B (zh) * | 2017-03-23 | 2023-05-21 | 美商克萊譚克公司 | 用於線上部分平均測試及潛在可靠性缺陷偵測之方法及系統 |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7170307B2 (en) * | 2003-03-14 | 2007-01-30 | Applied Precision, Llc | System and method of mitigating effects of component deflection in a probe card analyzer |
| US7595629B2 (en) * | 2004-07-09 | 2009-09-29 | Formfactor, Inc. | Method and apparatus for calibrating and/or deskewing communications channels |
| JP4413130B2 (ja) * | 2004-11-29 | 2010-02-10 | Ｏｋｉセミコンダクタ株式会社 | プローブカードを用いた半導体素子の検査方法およびその検査方法により検査した半導体装置 |
| US7598725B2 (en) * | 2005-12-30 | 2009-10-06 | Teradyne, Inc. | Alignment receptacle of a sensor adapted to interact with a pin to generate position data along at least two transverse axes for docking a test head |
| US7750657B2 (en) * | 2007-03-15 | 2010-07-06 | Applied Materials Inc. | Polishing head testing with movable pedestal |
| JP5343278B2 (ja) * | 2007-05-15 | 2013-11-13 | 日本電子材料株式会社 | 半導体試験装置 |
| CA2592901C (en) * | 2007-07-13 | 2012-03-27 | Martin Blouin | Semi-generic in-circuit test fixture |
| US7791361B2 (en) * | 2007-12-10 | 2010-09-07 | Touchdown Technologies, Inc. | Planarizing probe card |
| JP5222038B2 (ja) * | 2008-06-20 | 2013-06-26 | 東京エレクトロン株式会社 | プローブ装置 |
| US9132436B2 (en) | 2012-09-21 | 2015-09-15 | Applied Materials, Inc. | Chemical control features in wafer process equipment |
| US10256079B2 (en) | 2013-02-08 | 2019-04-09 | Applied Materials, Inc. | Semiconductor processing systems having multiple plasma configurations |
| US9966240B2 (en) | 2014-10-14 | 2018-05-08 | Applied Materials, Inc. | Systems and methods for internal surface conditioning assessment in plasma processing equipment |
| US11637002B2 (en) | 2014-11-26 | 2023-04-25 | Applied Materials, Inc. | Methods and systems to enhance process uniformity |
| US9702906B2 (en) * | 2015-06-26 | 2017-07-11 | International Business Machines Corporation | Non-permanent termination structure for microprobe measurements |
| US9691645B2 (en) | 2015-08-06 | 2017-06-27 | Applied Materials, Inc. | Bolted wafer chuck thermal management systems and methods for wafer processing systems |
| US9741593B2 (en) | 2015-08-06 | 2017-08-22 | Applied Materials, Inc. | Thermal management systems and methods for wafer processing systems |
| US10504700B2 (en) | 2015-08-27 | 2019-12-10 | Applied Materials, Inc. | Plasma etching systems and methods with secondary plasma injection |
| CN106558511A (zh) * | 2015-10-22 | 2017-04-05 | 安徽超元半导体有限公司 | 一种设定晶圆针测针压的自动设定系统 |
| US10725138B2 (en) | 2015-12-11 | 2020-07-28 | Infineon Technologies Ag | Scattering parameter calibration to a semiconductor layer |
| US10504754B2 (en) | 2016-05-19 | 2019-12-10 | Applied Materials, Inc. | Systems and methods for improved semiconductor etching and component protection |
| US9865484B1 (en) | 2016-06-29 | 2018-01-09 | Applied Materials, Inc. | Selective etch using material modification and RF pulsing |
| US10629473B2 (en) | 2016-09-09 | 2020-04-21 | Applied Materials, Inc. | Footing removal for nitride spacer |
| JP6832654B2 (ja) * | 2016-09-09 | 2021-02-24 | 東京エレクトロン株式会社 | 検査システムの調整方法およびそれに用いる補助エレメント |
| US10546729B2 (en) | 2016-10-04 | 2020-01-28 | Applied Materials, Inc. | Dual-channel showerhead with improved profile |
| US10163696B2 (en) | 2016-11-11 | 2018-12-25 | Applied Materials, Inc. | Selective cobalt removal for bottom up gapfill |
| US10026621B2 (en) | 2016-11-14 | 2018-07-17 | Applied Materials, Inc. | SiN spacer profile patterning |
| US10431429B2 (en) | 2017-02-03 | 2019-10-01 | Applied Materials, Inc. | Systems and methods for radial and azimuthal control of plasma uniformity |
| US10943834B2 (en) | 2017-03-13 | 2021-03-09 | Applied Materials, Inc. | Replacement contact process |
| US11276590B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Multi-zone semiconductor substrate supports |
| US11276559B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Semiconductor processing chamber for multiple precursor flow |
| JP7176860B6 (ja) | 2017-05-17 | 2022-12-16 | アプライド マテリアルズ インコーポレイテッド | 前駆体の流れを改善する半導体処理チャンバ |
| US10920320B2 (en) | 2017-06-16 | 2021-02-16 | Applied Materials, Inc. | Plasma health determination in semiconductor substrate processing reactors |
| US10727080B2 (en) | 2017-07-07 | 2020-07-28 | Applied Materials, Inc. | Tantalum-containing material removal |
| US10297458B2 (en) | 2017-08-07 | 2019-05-21 | Applied Materials, Inc. | Process window widening using coated parts in plasma etch processes |
| KR102014334B1 (ko) * | 2017-09-28 | 2019-08-26 | 한국생산기술연구원 | 기판 검사 카트리지 및 이의 제조 방법 |
| US10903054B2 (en) | 2017-12-19 | 2021-01-26 | Applied Materials, Inc. | Multi-zone gas distribution systems and methods |
| US11328909B2 (en) | 2017-12-22 | 2022-05-10 | Applied Materials, Inc. | Chamber conditioning and removal processes |
| US10854426B2 (en) | 2018-01-08 | 2020-12-01 | Applied Materials, Inc. | Metal recess for semiconductor structures |
| US10964512B2 (en) | 2018-02-15 | 2021-03-30 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus and methods |
| US10679870B2 (en) | 2018-02-15 | 2020-06-09 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus |
| TWI766433B (zh) | 2018-02-28 | 2022-06-01 | 美商應用材料股份有限公司 | 形成氣隙的系統及方法 |
| US10319600B1 (en) | 2018-03-12 | 2019-06-11 | Applied Materials, Inc. | Thermal silicon etch |
| US10699879B2 (en) | 2018-04-17 | 2020-06-30 | Applied Materials, Inc. | Two piece electrode assembly with gap for plasma control |
| US10886137B2 (en) | 2018-04-30 | 2021-01-05 | Applied Materials, Inc. | Selective nitride removal |
| US10755941B2 (en) | 2018-07-06 | 2020-08-25 | Applied Materials, Inc. | Self-limiting selective etching systems and methods |
| US10872778B2 (en) | 2018-07-06 | 2020-12-22 | Applied Materials, Inc. | Systems and methods utilizing solid-phase etchants |
| US10672642B2 (en) | 2018-07-24 | 2020-06-02 | Applied Materials, Inc. | Systems and methods for pedestal configuration |
| US10892198B2 (en) | 2018-09-14 | 2021-01-12 | Applied Materials, Inc. | Systems and methods for improved performance in semiconductor processing |
| US11049755B2 (en) | 2018-09-14 | 2021-06-29 | Applied Materials, Inc. | Semiconductor substrate supports with embedded RF shield |
| US11062887B2 (en) | 2018-09-17 | 2021-07-13 | Applied Materials, Inc. | High temperature RF heater pedestals |
| US11417534B2 (en) | 2018-09-21 | 2022-08-16 | Applied Materials, Inc. | Selective material removal |
| US11682560B2 (en) | 2018-10-11 | 2023-06-20 | Applied Materials, Inc. | Systems and methods for hafnium-containing film removal |
| US11121002B2 (en) | 2018-10-24 | 2021-09-14 | Applied Materials, Inc. | Systems and methods for etching metals and metal derivatives |
| US11437242B2 (en) | 2018-11-27 | 2022-09-06 | Applied Materials, Inc. | Selective removal of silicon-containing materials |
| US11721527B2 (en) | 2019-01-07 | 2023-08-08 | Applied Materials, Inc. | Processing chamber mixing systems |
| US10920319B2 (en) | 2019-01-11 | 2021-02-16 | Applied Materials, Inc. | Ceramic showerheads with conductive electrodes |
| US11022628B2 (en) | 2019-09-13 | 2021-06-01 | Reid-Ashman Manufacturing, Inc. | Probe card support apparatus for automatic test equipment |
| CN114518472B (zh) * | 2020-11-18 | 2025-04-25 | 致茂电子(苏州)有限公司 | 探针头连接方法 |
| TWI771805B (zh) * | 2020-11-18 | 2022-07-21 | 致茂電子股份有限公司 | 探針頭連接方法 |
| US11747394B1 (en) * | 2022-03-09 | 2023-09-05 | Nanya Technology Corporation | Probe apparatus with a track |
| US11668745B1 (en) * | 2022-03-09 | 2023-06-06 | Nanya Technology Corporation | Probe apparatus having a track and wafer inspection method using the same |
| CN117438331B (zh) * | 2023-12-20 | 2024-04-12 | 武汉芯极客软件技术有限公司 | 一种半导体cp测试程序的混版本兼容方法 |
| TWI881779B (zh) * | 2024-04-01 | 2025-04-21 | 黑澤科技股份有限公司 | 治具探針之水平高度測量方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61125033A (ja) * | 1984-11-22 | 1986-06-12 | Hitachi Ltd | 平行度調整装置 |
| JPH07142542A (ja) * | 1993-11-12 | 1995-06-02 | Kawasaki Steel Corp | プローブ装置 |
| US5974662A (en) * | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
| US5642056A (en) * | 1993-12-22 | 1997-06-24 | Tokyo Electron Limited | Probe apparatus for correcting the probe card posture before testing |
| US5585738A (en) * | 1994-03-31 | 1996-12-17 | Tokyo Electron Limited | Probe system having vertical height detection and double focal image pickup coinciding with probe contact in height adjustment |
| US5528158A (en) * | 1994-04-11 | 1996-06-18 | Xandex, Inc. | Probe card changer system and method |
| US5851759A (en) * | 1996-04-19 | 1998-12-22 | Chiron Corporation | Heteroduplex tracking assay (HTA) for genotyping HCV |
| JP3364401B2 (ja) * | 1996-12-27 | 2003-01-08 | 東京エレクトロン株式会社 | プローブカードクランプ機構及びプローブ装置 |
| US5861759A (en) * | 1997-01-29 | 1999-01-19 | Tokyo Electron Limited | Automatic probe card planarization system |
| US6040700A (en) * | 1997-09-15 | 2000-03-21 | Credence Systems Corporation | Semiconductor tester system including test head supported by wafer prober frame |
| US6043668A (en) * | 1997-12-12 | 2000-03-28 | Sony Corporation | Planarity verification system for integrated circuit test probes |
| JP2000315711A (ja) * | 1999-05-06 | 2000-11-14 | Sony Corp | 半導体測定装置 |
| US6509751B1 (en) * | 2000-03-17 | 2003-01-21 | Formfactor, Inc. | Planarizer for a semiconductor contactor |
| US6441629B1 (en) * | 2000-05-31 | 2002-08-27 | Advantest Corp | Probe contact system having planarity adjustment mechanism |
| JP3920541B2 (ja) * | 2000-07-17 | 2007-05-30 | 横河電機株式会社 | Ｉｃテスタ、及びその接続機構の接続位置制御方法 |
-
2002
- 2002-04-26 US US10/133,165 patent/US6794889B2/en not_active Expired - Lifetime
- 2002-11-21 TW TW091133971A patent/TWI269346B/zh not_active IP Right Cessation
-
2003
- 2003-04-24 IT IT000188A patent/ITRM20030188A1/it unknown
- 2003-04-24 JP JP2003119745A patent/JP4495919B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI802560B (zh) * | 2017-03-23 | 2023-05-21 | 美商克萊譚克公司 | 用於線上部分平均測試及潛在可靠性缺陷偵測之方法及系統 |
Also Published As
| Publication number | Publication date |
|---|---|
| ITRM20030188A1 (it) | 2003-10-27 |
| TW200305913A (en) | 2003-11-01 |
| JP2003324133A (ja) | 2003-11-14 |
| JP4495919B2 (ja) | 2010-07-07 |
| ITRM20030188A0 (it) | 2003-04-24 |
| US6794889B2 (en) | 2004-09-21 |
| US20030201764A1 (en) | 2003-10-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI269346B (en) | Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing | |
| KR100260116B1 (ko) | 프로우브 장치 | |
| KR100248569B1 (ko) | 프로우브장치 | |
| TWI512875B (zh) | 用於調整聯結於一晶圓處理機器人之一進給手臂之校直及位置之系統以及用於調整聯結於一晶圓處理機器人之一進給手臂之校直及位置之方法 | |
| TWI362717B (en) | Methods for alignment utilizing an optical reference | |
| US9772181B2 (en) | Test body for determining rotation errors of a rotating apparatus | |
| JP4435328B2 (ja) | 基板の試験方法 | |
| US7221177B2 (en) | Probe apparatus with optical length-measuring unit and probe testing method | |
| US7253608B2 (en) | Planarity diagnostic system, e.g., for microelectronic component test systems | |
| US20070159194A1 (en) | Probing apparatus | |
| US20040100297A1 (en) | Semiconductor device inspection apparatus and inspection method | |
| JP2001110857A (ja) | プローブ方法及びプローブ装置 | |
| KR20060130679A (ko) | 웨이퍼-레벨 광-전자 테스트 장치 및 방법 | |
| TW200846859A (en) | Apparatus and method of generating map data for a probe tester | |
| TW200811980A (en) | Repair apparatus for substrate circuit of flat display panel | |
| CN118424655A (zh) | 硅光芯片耦合测试装置以及测试方法 | |
| JP5464468B2 (ja) | 基板検査装置及び検査治具 | |
| CN118443984B (zh) | 一种简易探针台 | |
| JP2017050120A (ja) | 試料ホルダ及び試料ホルダ群 | |
| CN101680929B (zh) | 集成电路探测卡分析器 | |
| JP3248136B1 (ja) | プローブ方法及びプローブ装置 | |
| JP2002057196A (ja) | プローブ方法及びプローブ装置 | |
| TWM365473U (en) | Optics characteristic measurement system for light-emitting diodes (LED) | |
| CN215418104U (zh) | 一种晶片翘曲测试装置 | |
| CN118937955A (zh) | 一种毫米波双面晶圆的自动化测试系统及测试方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |