ITRM20030188A0 - Attrezzatura per il collaudo automatico di dispositivi a semiconduttori. - Google Patents

Attrezzatura per il collaudo automatico di dispositivi a semiconduttori.

Info

Publication number
ITRM20030188A0
ITRM20030188A0 IT2003RM000188A ITRM20030188A ITRM20030188A0 IT RM20030188 A0 ITRM20030188 A0 IT RM20030188A0 IT 2003RM000188 A IT2003RM000188 A IT 2003RM000188A IT RM20030188 A ITRM20030188 A IT RM20030188A IT RM20030188 A0 ITRM20030188 A0 IT RM20030188A0
Authority
IT
Italy
Prior art keywords
equipment
semiconductor devices
automatic testing
testing
automatic
Prior art date
Application number
IT2003RM000188A
Other languages
English (en)
Inventor
Nasser Ali Jafari
Kenneth Dean Karklin
William T Sprague
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of ITRM20030188A0 publication Critical patent/ITRM20030188A0/it
Publication of ITRM20030188A1 publication Critical patent/ITRM20030188A1/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
IT000188A 2002-04-26 2003-04-24 Attrezzatura per il collaudo automatico di dispositivi a semiconduttori. ITRM20030188A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/133,165 US6794889B2 (en) 2002-04-26 2002-04-26 Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing

Publications (2)

Publication Number Publication Date
ITRM20030188A0 true ITRM20030188A0 (it) 2003-04-24
ITRM20030188A1 ITRM20030188A1 (it) 2003-10-27

Family

ID=29248935

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000188A ITRM20030188A1 (it) 2002-04-26 2003-04-24 Attrezzatura per il collaudo automatico di dispositivi a semiconduttori.

Country Status (4)

Country Link
US (1) US6794889B2 (it)
JP (1) JP4495919B2 (it)
IT (1) ITRM20030188A1 (it)
TW (1) TWI269346B (it)

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US10629473B2 (en) 2016-09-09 2020-04-21 Applied Materials, Inc. Footing removal for nitride spacer
US10546729B2 (en) 2016-10-04 2020-01-28 Applied Materials, Inc. Dual-channel showerhead with improved profile
US10163696B2 (en) 2016-11-11 2018-12-25 Applied Materials, Inc. Selective cobalt removal for bottom up gapfill
US10026621B2 (en) 2016-11-14 2018-07-17 Applied Materials, Inc. SiN spacer profile patterning
US10431429B2 (en) 2017-02-03 2019-10-01 Applied Materials, Inc. Systems and methods for radial and azimuthal control of plasma uniformity
US10943834B2 (en) 2017-03-13 2021-03-09 Applied Materials, Inc. Replacement contact process
US10761128B2 (en) * 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US11276590B2 (en) 2017-05-17 2022-03-15 Applied Materials, Inc. Multi-zone semiconductor substrate supports
US11276559B2 (en) 2017-05-17 2022-03-15 Applied Materials, Inc. Semiconductor processing chamber for multiple precursor flow
US10920320B2 (en) 2017-06-16 2021-02-16 Applied Materials, Inc. Plasma health determination in semiconductor substrate processing reactors
US10727080B2 (en) 2017-07-07 2020-07-28 Applied Materials, Inc. Tantalum-containing material removal
US10297458B2 (en) 2017-08-07 2019-05-21 Applied Materials, Inc. Process window widening using coated parts in plasma etch processes
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US10903054B2 (en) 2017-12-19 2021-01-26 Applied Materials, Inc. Multi-zone gas distribution systems and methods
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US10854426B2 (en) 2018-01-08 2020-12-01 Applied Materials, Inc. Metal recess for semiconductor structures
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Also Published As

Publication number Publication date
ITRM20030188A1 (it) 2003-10-27
US20030201764A1 (en) 2003-10-30
TW200305913A (en) 2003-11-01
JP2003324133A (ja) 2003-11-14
JP4495919B2 (ja) 2010-07-07
TWI269346B (en) 2006-12-21
US6794889B2 (en) 2004-09-21

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