TWI268200B - Substrate holding mechanism, substrate polishing apparatus and substrate polishing method - Google Patents
Substrate holding mechanism, substrate polishing apparatus and substrate polishing methodInfo
- Publication number
- TWI268200B TWI268200B TW092136990A TW92136990A TWI268200B TW I268200 B TWI268200 B TW I268200B TW 092136990 A TW092136990 A TW 092136990A TW 92136990 A TW92136990 A TW 92136990A TW I268200 B TWI268200 B TW I268200B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- polishing
- retainer ring
- substrate holding
- holding mechanism
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 13
- 238000005498 polishing Methods 0.000 title abstract 10
- 238000000034 method Methods 0.000 title abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 239000000428 dust Substances 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002380583 | 2002-12-27 | ||
JP2003188775A JP4448297B2 (ja) | 2002-12-27 | 2003-06-30 | 基板研磨装置及び基板研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200416108A TW200416108A (en) | 2004-09-01 |
TWI268200B true TWI268200B (en) | 2006-12-11 |
Family
ID=32716318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092136990A TWI268200B (en) | 2002-12-27 | 2003-12-26 | Substrate holding mechanism, substrate polishing apparatus and substrate polishing method |
Country Status (7)
Country | Link |
---|---|
US (3) | US7419420B2 (zh) |
JP (1) | JP4448297B2 (zh) |
KR (3) | KR101053192B1 (zh) |
CN (1) | CN101693354A (zh) |
AU (1) | AU2003295242A1 (zh) |
TW (1) | TWI268200B (zh) |
WO (1) | WO2004060610A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI630068B (zh) * | 2014-01-21 | 2018-07-21 | 日商荏原製作所股份有限公司 | 基板保持裝置及研磨裝置 |
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KR100632468B1 (ko) | 2005-08-31 | 2006-10-09 | 삼성전자주식회사 | 리테이너 링, 연마 헤드 및 화학적 기계적 연마 장치 |
JP4787063B2 (ja) * | 2005-12-09 | 2011-10-05 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
KR100898793B1 (ko) * | 2005-12-29 | 2009-05-20 | 엘지디스플레이 주식회사 | 액정표시소자용 기판 합착 장치 |
JP2008093811A (ja) * | 2006-10-16 | 2008-04-24 | Shin Etsu Handotai Co Ltd | 研磨ヘッド及び研磨装置 |
US7335088B1 (en) * | 2007-01-16 | 2008-02-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | CMP system with temperature-controlled polishing head |
JP4902433B2 (ja) * | 2007-06-13 | 2012-03-21 | 株式会社荏原製作所 | 研磨装置の研磨面加熱、冷却装置 |
US7988535B2 (en) | 2008-04-18 | 2011-08-02 | Applied Materials, Inc. | Platen exhaust for chemical mechanical polishing system |
KR101036605B1 (ko) * | 2008-06-30 | 2011-05-24 | 세메스 주식회사 | 기판 지지 유닛 및 이를 이용한 매엽식 기판 연마 장치 |
JP5505713B2 (ja) * | 2010-04-26 | 2014-05-28 | 株式会社Sumco | 研磨液分配装置及びこれを備えた研磨装置 |
DE102010038324B4 (de) * | 2010-07-23 | 2012-03-22 | Hilti Aktiengesellschaft | Vorrichtung zum Positionieren von Schneidpartikeln |
JP5552401B2 (ja) | 2010-09-08 | 2014-07-16 | 株式会社荏原製作所 | 研磨装置および方法 |
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JP5748709B2 (ja) * | 2012-06-05 | 2015-07-15 | 三菱電機株式会社 | プローブカード |
CN102699821A (zh) * | 2012-06-18 | 2012-10-03 | 南京航空航天大学 | 提高精密抛光加工速度和工件表面质量的方法及装置 |
JP2014011408A (ja) | 2012-07-02 | 2014-01-20 | Toshiba Corp | 半導体装置の製造方法および研磨装置 |
JP6140439B2 (ja) * | 2012-12-27 | 2017-05-31 | 株式会社荏原製作所 | 研磨装置、及び研磨方法 |
CN103323299B (zh) * | 2013-04-26 | 2015-08-26 | 李宜强 | 手持式含油砂岩冷冻磨片装置 |
JP5538601B1 (ja) * | 2013-08-22 | 2014-07-02 | ミクロ技研株式会社 | 研磨ヘッド及び研磨処理装置 |
US9308622B2 (en) * | 2013-10-18 | 2016-04-12 | Seagate Technology Llc | Lapping head with a sensor device on the rotating lapping head |
TW201528399A (zh) * | 2014-01-02 | 2015-07-16 | All Ring Tech Co Ltd | 電子元件搬運方法及裝置 |
JP6344950B2 (ja) * | 2014-03-31 | 2018-06-20 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
SG10201808052SA (en) | 2014-04-30 | 2018-10-30 | Ebara Corp | Substrate Polishing Apparatus |
JP6373796B2 (ja) * | 2014-05-29 | 2018-08-15 | 株式会社荏原製作所 | 基板研磨装置 |
KR102173323B1 (ko) | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법 |
CN104589172B (zh) * | 2014-12-24 | 2017-06-30 | 宁波大学 | 一种硫系玻璃的抛光方法 |
CN104858773B (zh) * | 2015-04-29 | 2017-04-12 | 盐城工学院 | 可调节晶片研磨平面度的修正盘和蓝宝石晶片研磨方法 |
CN105538118A (zh) * | 2016-02-04 | 2016-05-04 | 浙江胜华波电器股份有限公司 | 进给等量自控式蜗杆抛光抽尘机构 |
WO2018080797A1 (en) * | 2016-10-25 | 2018-05-03 | E. I. Du Pont De Nemours And Company | Retainer ring |
KR102037747B1 (ko) * | 2018-01-08 | 2019-10-29 | 에스케이실트론 주식회사 | 웨이퍼 연마 장치 |
CN110026877A (zh) * | 2018-01-11 | 2019-07-19 | 昆山瑞咏成精密设备有限公司 | 一种抛光机及抛光方法 |
CN111512425A (zh) * | 2018-06-27 | 2020-08-07 | 应用材料公司 | 化学机械抛光的温度控制 |
US12017322B2 (en) * | 2018-08-14 | 2024-06-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method |
KR102035345B1 (ko) * | 2019-01-16 | 2019-10-23 | 석성진 | 온열기능을 갖는 씨엔씨의 진공베드 |
US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
US11693435B2 (en) * | 2020-06-25 | 2023-07-04 | Applied Materials, Inc. | Ethercat liquid flow controller communication for substrate processing systems |
CN113770914B (zh) * | 2021-08-16 | 2023-03-24 | 江苏富勤机械制造有限公司 | 一种打磨设备用自动锁紧定位机构及其定位方法 |
CN114714237B (zh) * | 2022-03-28 | 2023-11-17 | 祐樘(南京)软件科技有限公司 | 一种空心石材罗马柱加工设备及加工方法 |
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US20050126708A1 (en) * | 2003-12-10 | 2005-06-16 | Applied Materials, Inc. | Retaining ring with slurry transport grooves |
-
2003
- 2003-06-30 JP JP2003188775A patent/JP4448297B2/ja not_active Expired - Fee Related
- 2003-12-26 KR KR1020057011782A patent/KR101053192B1/ko active IP Right Grant
- 2003-12-26 KR KR1020117025397A patent/KR101197736B1/ko active IP Right Grant
- 2003-12-26 US US10/539,245 patent/US7419420B2/en not_active Expired - Lifetime
- 2003-12-26 CN CN200910211501A patent/CN101693354A/zh active Pending
- 2003-12-26 KR KR1020107020587A patent/KR101150913B1/ko active IP Right Grant
- 2003-12-26 WO PCT/JP2003/017032 patent/WO2004060610A2/en active Application Filing
- 2003-12-26 AU AU2003295242A patent/AU2003295242A1/en not_active Abandoned
- 2003-12-26 TW TW092136990A patent/TWI268200B/zh not_active IP Right Cessation
-
2008
- 2008-07-31 US US12/184,032 patent/US7883394B2/en not_active Expired - Lifetime
-
2009
- 2009-11-13 US US12/618,033 patent/US8292694B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI630068B (zh) * | 2014-01-21 | 2018-07-21 | 日商荏原製作所股份有限公司 | 基板保持裝置及研磨裝置 |
Also Published As
Publication number | Publication date |
---|---|
TW200416108A (en) | 2004-09-01 |
KR101197736B1 (ko) | 2012-11-06 |
WO2004060610A3 (en) | 2004-11-25 |
AU2003295242A8 (en) | 2004-07-29 |
US7419420B2 (en) | 2008-09-02 |
KR101150913B1 (ko) | 2012-05-29 |
US20080318503A1 (en) | 2008-12-25 |
US20060205323A1 (en) | 2006-09-14 |
JP4448297B2 (ja) | 2010-04-07 |
KR101053192B1 (ko) | 2011-08-01 |
JP2004249452A (ja) | 2004-09-09 |
WO2004060610A2 (en) | 2004-07-22 |
KR20110124373A (ko) | 2011-11-16 |
US7883394B2 (en) | 2011-02-08 |
KR20060061927A (ko) | 2006-06-08 |
US8292694B2 (en) | 2012-10-23 |
CN101693354A (zh) | 2010-04-14 |
KR20100117673A (ko) | 2010-11-03 |
US20100062691A1 (en) | 2010-03-11 |
AU2003295242A1 (en) | 2004-07-29 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |