TWI246376B - Method for measuring amount of heat in metal foil, method for adjusting surface characteristics, laser drilling method, and apparatus for measuring amount of heat - Google Patents

Method for measuring amount of heat in metal foil, method for adjusting surface characteristics, laser drilling method, and apparatus for measuring amount of heat Download PDF

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Publication number
TWI246376B
TWI246376B TW092130651A TW92130651A TWI246376B TW I246376 B TWI246376 B TW I246376B TW 092130651 A TW092130651 A TW 092130651A TW 92130651 A TW92130651 A TW 92130651A TW I246376 B TWI246376 B TW I246376B
Authority
TW
Taiwan
Prior art keywords
heat
metal
laser
metal foil
laser light
Prior art date
Application number
TW092130651A
Other languages
English (en)
Chinese (zh)
Other versions
TW200414851A (en
Inventor
Masaru Sakamoto
Eita Arai
Jiangtao Wang
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Publication of TW200414851A publication Critical patent/TW200414851A/zh
Application granted granted Critical
Publication of TWI246376B publication Critical patent/TWI246376B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/005—Investigating or analyzing materials by the use of thermal means by investigating specific heat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Laser Beam Processing (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
TW092130651A 2002-11-12 2003-11-03 Method for measuring amount of heat in metal foil, method for adjusting surface characteristics, laser drilling method, and apparatus for measuring amount of heat TWI246376B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002327694A JP3869352B2 (ja) 2002-11-12 2002-11-12 金属箔の熱量測定方法、表面特性の調整方法、レーザー穴開け方法又は熱量測定装置

Publications (2)

Publication Number Publication Date
TW200414851A TW200414851A (en) 2004-08-01
TWI246376B true TWI246376B (en) 2005-12-21

Family

ID=32310522

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092130651A TWI246376B (en) 2002-11-12 2003-11-03 Method for measuring amount of heat in metal foil, method for adjusting surface characteristics, laser drilling method, and apparatus for measuring amount of heat

Country Status (5)

Country Link
JP (1) JP3869352B2 (ko)
KR (2) KR100934160B1 (ko)
CN (2) CN100516851C (ko)
TW (1) TWI246376B (ko)
WO (1) WO2004044568A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100969365B1 (ko) * 2007-11-15 2010-07-09 현대자동차주식회사 자동변속기의 변속 제어 방법
DK2733492T3 (en) 2008-08-05 2016-04-25 Toray Industries Method for detection of cancer
CN104924078A (zh) * 2015-06-22 2015-09-23 苏州璟瑜自动化科技有限公司 带热成像检测与定位的钣金冲孔装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62133345A (ja) * 1985-12-06 1987-06-16 Fuji Electric Co Ltd 熱定数測定装置
JP2529851B2 (ja) * 1987-05-27 1996-09-04 東芝セラミックス株式会社 高熱伝導性薄板の熱拡散率測定方法およびその装置
JPH07102283B2 (ja) * 1990-03-06 1995-11-08 株式会社クボタ 沈砂池構造
US5212540A (en) * 1991-11-22 1993-05-18 Micron Technology, Inc. Method for measuring a thickness of a printed circuit board
WO1995009068A1 (en) * 1993-09-30 1995-04-06 Cymer Laser Technologies Full field mask illumination enhancement methods and apparatus
JP3860879B2 (ja) * 1997-05-09 2006-12-20 大日本印刷株式会社 レーザ加工状態検出方法及びレーザ加工システム
JP2001068816A (ja) * 1999-08-24 2001-03-16 Mitsui Mining & Smelting Co Ltd 銅張積層板及びその銅張積層板を用いたレーザー加工方法
JP3330925B2 (ja) * 2000-04-05 2002-10-07 株式会社日鉱マテリアルズ レーザー穴開け用銅箔
JP3690962B2 (ja) * 2000-04-26 2005-08-31 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板

Also Published As

Publication number Publication date
JP3869352B2 (ja) 2007-01-17
KR100934160B1 (ko) 2009-12-29
KR20070116625A (ko) 2007-12-10
CN101306490B (zh) 2011-08-17
CN101306490A (zh) 2008-11-19
KR20050086472A (ko) 2005-08-30
TW200414851A (en) 2004-08-01
CN100516851C (zh) 2009-07-22
CN1705876A (zh) 2005-12-07
JP2004163190A (ja) 2004-06-10
WO2004044568A1 (ja) 2004-05-27

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