TWI244497B - Anisotropic conductive adhering film - Google Patents

Anisotropic conductive adhering film Download PDF

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Publication number
TWI244497B
TWI244497B TW090102862A TW90102862A TWI244497B TW I244497 B TWI244497 B TW I244497B TW 090102862 A TW090102862 A TW 090102862A TW 90102862 A TW90102862 A TW 90102862A TW I244497 B TWI244497 B TW I244497B
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TW
Taiwan
Prior art keywords
adhesive layer
film
insulating adhesive
anisotropic conductive
circuit board
Prior art date
Application number
TW090102862A
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English (en)
Inventor
Hiroyuki Kumakura
Satoshi Yamamoto
Original Assignee
Sony Chemicals Corp
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Publication of TWI244497B publication Critical patent/TWI244497B/zh

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
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Description

1244497 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（/ ) [發明之詳細說明] [發明所屬之技術領域] 本發明係關於一種在將半導體晶片等之電子元件與電 路基板做電氣、機械連接時所使用之異向導電性接著膜， 尤其是關於一種將半導體晶片以倒裝片(flip-chip)方式實裝 於以聚酯成分爲主之軟性電路基板時較佳之異向導電性接 著膜。 [習知技術] 以往，爲了將半導體晶片等之電子元件與電路基板、 或是電路基板彼此間做電氣、機械連接，係使用異向導電 性接著膜(ACF)，惟近年來尤其是在行動電話、1C卡等之 領域方面，爲了將1C晶片以倒裝片實裝(COF)方式組裝至 軟性電路基板(FPC)上，係廣泛地使用著異向導電性接著膜 〇 作爲異向導電性接著膜，一般係使用在環氧樹脂系之 單層的絕緣性接著劑層中分散導電粒子所得之單層構造之 物。又，採用同一組成之絕緣性接著劑，由分散著導電粒 子之層與未分散著導電粒子之層所形成之二層構造之物； 或是由分散著導電粒子之絕緣性接著劑層與在組成之一部 分不同於該絕緣性接著劑之絕緣性接著劑層所構成之二層 構造之物也爲人所知。 另一方面，在行動電話、1C卡等之領域，因價格競爭 的緣故乃極需降低成本。是以，在該等領域所使用之軟性 電路基板中，相對於以往之以聚醯亞胺爲主之物，乃逐漸 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂---------. 1244497 A7 B7 五、發明說明（丄） 多採用以聚酯爲主之物。 [發明所欲解決之課題] (請先閱讀背面之注意事項再填寫本頁) 惟，以聚酯爲主之軟性電路基板因受到本身表面性的 影響，接著性較以聚醯亞胺爲主之物來得低，另一方面’ 由於使用以往之環氧樹脂系之絕緣性接著劑的異向導電性 接著膜具高彈性率，若將實裝電子零件之軟性電路基板中 以聚醯亞胺爲主之物變更爲以聚酯爲主之物，則電子元件 與電路基板之接著性會下降，此爲問題所在。 相對地，作爲異向導電性接著膜之絕緣性接著劑，亦 嚐試著使用接著性高、彈性率低之丙烯酸酯系之物，惟此 時會出現雖接著性可提升，然導通可靠度變差之問題。 是以，在以聚酯爲主之軟性電路基板實裝1C晶片等之 電子元件時若採用以往之異向導電性接著膜，相關之接著 性、導通可靠度將無法滿足既定之規格，此爲問題所在。 本發明係用以解決上述習知技術所遭遇之問題所得者 ，其目的在於，即使藉由異向導電性接著膜，將1C晶片等 之電子元件實裝至以聚酯爲主之軟性電路基板的情況，仍 可得到高接著性、高導通可靠度。 經濟部智慧財產局員工消費合作社印製 [用以解決課題之手段] 本發明者發現，在使用異向導電性接著膜，將1C晶片 等之電子元件實裝至以聚酯爲主之軟性電路基板之時，若 將構成異向導電性接著膜之絕緣性接著劑層設定成具有電 子元件側層與軟性電路基板側層之複層構成，且讓軟性電 路基板側之絕緣性接著劑層之硬化後的彈性率低於電子元 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1244497 A7 B7 五、發明說明u ) 件側之絕緣性接著劑層之硬化後的彈性率，則可同時提昇 接著性與導通可靠度，也從而完成了本發明。 亦即，本發明係提供一種異向導電性接著膜’由： 第1絕緣性接著劑層；第2絕緣性接著劑層’其硬化 後之彈性率較第1絕緣性接著劑層之硬化後的彈性率爲低 ;以及，導電粒子，其分散於第1絕緣性接著劑層或第2 絕緣性接著劑層之至少一者中；所構成。 又，本發明係提供一種連接方法，係以上述之異向導 電性接著膜來將半導體晶片與電路基板做電氣、機械連接 ;其中，異向導電性接著膜之第1絕緣性接著劑層係配置 於半導體晶片側，第2絕緣性接著劑層係配置於電路基板 側。 再者，本發明係提供一種連接構造體，係以上述之異 向導電性接著膜來將半導體晶片與電路基板做電氣、機械 連接所得者；其中，異向導電性接著膜之第1絕緣性接著 劑層之硬化物係與半導體晶片接著，第2絕緣性接著劑層 之硬化物係與電路基板接著。 [發明之實施形態] 以下參照圖示詳細說明本發明。又，在各圖中同一符 號係表示著同一或同等之構成要素。 圖1係使用本發明之異向導電性接著膜1A來連接1C 晶片10與電路基板20之方法的說明圖。 異向導電性接著膜1A係由第1絕緣性接著劑層2與 第2絕緣性接著劑層3所成之二層構造，於該兩者之絕緣 5 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ----------訂---------. 經濟部智慧財產局員工消費合作社印製 1244497 A7 B7 _ 五、發明說明（f ) 性接著劑層2、3中分別分散著導電粒子4。 在本發明之異向導電性接著膜1A中，其特徵爲，第1 絕緣性接著劑層2之硬化後的彈性率Cl大於第2絕緣性接 著劑層3之硬化後的彈性率c2。絕緣性接著劑層2、3之硬 化後的彈性率比〜/(：2較佳爲10以上。藉此，當以異向導 電性接著膜1A來連接1C晶片10與電路基板20之時，即 使在電路基板20之以聚酯爲主之基材薄膜21上設置配線 電路22，藉由將第1絕緣性接著劑層2側配置於1C晶片 10側、將第2絕緣性接著劑層3配置於電路基板20側來 進行連接，則可將接著性與導通可靠度之兩者提昇至與電 路基板係以聚醯亞胺爲主之情形的同等以上。 作爲讓上述絕緣性接著劑層2、3之硬化後的彈性率相 異的方法雖無特別之限定，惟若使用同種之絕緣性樹脂， 則即使調整硬化劑之種類與添加量等，要使得硬化後之彈 性率有極大的差異仍有困難，故以使用不同種類之絕緣性 樹脂爲佳。例如，以熱硬化性環氧系接著劑等來形成第1 絕緣性接著劑層2，以熱硬化性丙烯酸酯系接著劑等來形 成第2絕緣性接著劑層3。尤其，從保存性與速硬化性的 特性面來考量，較佳係以使用著咪唑系潛在性硬化劑之熱 硬化性環氧系接著劑來形成第1絕緣性接著劑層2,以使 用著過氧化物系硬化劑之熱硬化性丙烯酸酯系接著劑來形 成第2絕緣性接著劑層3。此時，熱硬化性環氧系接著劑 可由雙酚A型環氧樹脂、雙酚F型環氧樹脂、四溴雙酚A 型環氧樹脂等之一般的環氧樹脂來構成。又，熱硬化性丙 6 (請先閱讀背面之注意事項再填寫本頁) ----- ΙΠΠΓ 1 fm、〆 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1244497 A7 B7 五、發明說明（t) 烯酸酯接著劑可由具有反應性雙鍵之聚氨酯丙烯酸酯、聚 酯丙烯酸酯、環氧丙烯酸酯等所構成。 第1絕緣性接著劑層2之厚度tl與第2絕緣性接著劑 層3之厚度t2的比屮t2以0.15〜7爲佳。若該比V t2未滿 0.15，則第1絕緣性接著劑層2之形成效果無法充分地顯 現，導通可靠度會降低。相反地，若比t!/ t2超過7，則第 2絕緣性接著劑層3之形成效果無法充分地顯現，接著性 會降低。 第1絕緣性接著劑層2之厚度tl與第2絕緣性接著劑 層3之厚度12的合計厚度可與以往之單層異向導電性接著 膜同樣，一般，以10〜1〇〇//m爲佳。 另一方面，作爲導電粒子4，可使用例如由Ni、Ag、 Cu或該等之合金等所構成之金屬粉、於球狀樹脂粒子之表 面施以金屬鏟敷所得者、於該等電氣良導體所構成之粒子 之表面設置絕緣性樹脂被膜者等等之以往於異向導電性接 著劑所使用之各種的導電性粒子。又，分散於第1絕緣性 接著劑層2之導電粒子4與分散於第2絕緣性接著劑層3 之導電粒子4可使用同一種或不同種。 作爲異向導電性接著膜1A之製造方法，能以一般方 法將導電粒子4分別分散於第1絕緣性接著劑層形成用組 成物與第2絕緣性接著劑層形成用組成物中，加以薄膜化 ，讓所得之兩片薄膜疊合、壓接來製造。又，亦可先形成 分散有導電粒子4之第1絕緣性接著劑層2或第2絕緣性 接著劑層3之一者後，於其上面塗佈另一者之分散有導電 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) tr---------雜 經濟部智慧財產局員工消費合作社印製 1244497 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（έ ) 粒子4之絕緣性接著劑層形成用組成物，加以薄膜化來形 成。由生產性的觀點來看，以疊合各個薄膜之方法爲佳。 本發明之異向導電性接著膜，只要設有硬化後之彈性 率彼此不同之2層的絕緣性接著劑層者，可採行各種的態 樣。例如’雖在上述圖丨之異向導電性接著膜1A中，導 電粒子4係分散於第丨絕緣性接著劑層2與第2絕緣性接 著劑層3之兩者’惟亦可如圖2之異向導電性接著膜1B 般’不對於第1絕緣性接著劑層2分散導電粒子4，而僅 分散於第2絕緣性接著劑層3。藉此，在凸塊面積小的微 細圖案之情形下，圖案可捕捉更多的導電粒子，故爲所希 望的。 又’亦可如圖3所示，不對於第2絕緣性接著劑層3 分散導電粒子4，而僅分散於第1絕緣性接著劑層2。 又’在本發明之異向導電性接著膜中，除了硬化後彈 性率相異的2層之絕緣性接著劑層以外，尙可依必要性在 第1絕緣性接著劑層2與第2絕緣性接著劑層3之間設置 其他之絕緣性接著劑層，而成爲至少三層之多層構造。 本發明之異向導電性接著膜，可使用於各種之電子元 件與電路基板之連接、電路基板彼此間之連接等。此時， 爲連接對象之電路基板，可舉出以聚酯爲主之電路基板、 以聚醯亞胺爲主之電路基板等。 尤其是，將1C晶片等之電子元件以倒晶片方式實裝至 以聚酯爲主之電路基板之時，若將本發明之異向導電性接 著膜之第1絕緣性接著劑層配置於半導體晶片側，將第2 8 (請先閱讀背面之注意事項再填寫本頁) 裝 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1244497 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（9) 絕緣性接著劑層配置於電路基板側來連接’則相較於使用 以往之異向導電性接著膜，可顯著地提昇接著性、導通可 靠度。從而，本發明亦包含相關之連接方法、藉由相關之 連接方法所連接之連接構造體。 [實施例] 以下，依照實施例具體地說明本發明° 實施例1〜10、比較例1〜3 以表2或表3所示之厚度製作表1之配合組成的薄膜 1〜薄膜5，將所得之薄膜以表2或表3所示之組合來重疊 ，壓接後乃製作出二層構造之異向導電性接著膜。又’以 熱壓的方式將各薄膜1〜5硬化成50//m厚度之薄膜狀’藉 由動黏彈性測定裝置（東方技術公司）來計算硬化後之彈性 率(3〇°C)。結果係示於表1。 評價 讓軟性電路基板(在以PET爲主之基材薄膜上透過黏 著劑層來形成鋁之配線圖案)與1C晶片(4X4mm(II ’ 1C晶 片之厚度t=0.15mm)透過各實施例與比較例之異向導電性 接著膜來加熱加壓(200°C、1N/凸塊，10秒)來連接。 以下述之方式來評價所得之連接構造體之（1)接著強度 ，（2)導通可靠度，（3)耐衝擊性。結果係示於表2與表3。 (1)接著強度 將1C晶片固定於玻璃上，對於軟性電路基板以90° 方向50mm/min之拉扯速度來剝離，測定此時之剝離強度 。又，若剝離強度爲4N/cm以上則可得到充分之連接可靠 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝-----———訂---------^9 1244497 A7 B7 五、發明說明u ) 度，達2N/cm以上雖有若干可靠度的降低，但仍具充分之 實用性，若未滿2N/cm則爲不佳(NG)。 (2) 導通可靠度 若在60°C、95%RH、500小時之老化後的電阻値爲老 化前之初期電阻値的2倍以內則評定爲〇，介於2〜5倍者 評定爲△，超過5倍者評定爲X。 (3) 耐衝擊性 若對於連接構造體之1C晶片的周邊，以塑膠製之棒施 以1N左右之輕微衝擊後之電阻値爲施以輕微衝擊前之初 期電阻値的2倍以內則評定爲〇，介於2〜5倍者評定爲△ ’超過5倍者評定爲X。 [表1] (單位：重量份) 成分 固形環氧樹脂(*1) 薄膜1 薄膜2 薄膜3 薄膜4 薄膜5 35 熱潛在性硬化劑(*2) 65 丙烯酸橡膠(*3) 55 <—— <— <—— 聚氨酯丙烯酸酯(*4) 30 40 15 多官能丙烯酸酯(*5) 10 25 40 過氧化物(*6) 5 <—— <— <— 導電粒子(*7) 15 <—— <—— <— <— 硬化後之彈性率(30〇C )[GPa] 2 2X10'2 5X10-2 1X10] 3XHT1 註 (*1)油化殻牌環氧公司，EP1009 10 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) I 1 ϋ n ϋ —ϋ 1 一口、I m ^^1 1_1 emtm l 11 I _ 經濟部智慧財產局員工消費合作社印製 1244497 A7 B7 五、發明說明（？）
(*2)旭吉巴公司，HX3941HP (*3)帝國化學公司，WS-023
(*4)荒川化學工業公司，比姆謝特504H (*5)東亞合成公司，阿羅尼克斯M315
(*6)日本油脂公司，帕吉亞WO (*7)Ni粒子，粒徑5//m以下 [表2] 實施例1 實施例2實施例3實施例4實施例5 實施例6實施例7 薄膜1 晶片側 晶片側 晶片側 晶片側 晶片側 晶片側 晶片側 25//m 20 μ m 15/zm 10//m 5//m 15//m 15//m 薄膜2 基板側 基板側 基板側 基板側 基板側 基板側 基板側 5 jum 10/zm 15/zm 20//m 25 μ m 薄膜3 基板側 15//m 薄膜4 基板側 15//m 薄膜5 薄膜厚度之比(晶片側/基板側） 5 2 1 0.5 0.2 1 1 薄膜硬化物彈性率比(晶片側/基板側） 100 100 100 100 100 40 20 接著強度4.2 5.8 8.0 8.2 8.5 8.9 8.4 (N/cm) 導通可靠〇 度 〇 〇 〇 〇 〇 〇 耐衝擊性〇 〇 〇 〇 〇 〇 〇 11 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ---------訂----- 丨堯 經濟部智慧財產局員工消費合作社印製 1244497 A7 B7 五、發明說明（） [表3]
實施例8 實施例9 實施例10 比較例1 比較例2 比較例3 薄膜1 晶片側 晶片側 晶片側 基板側 27//m 3 /zm 15//IX1 \5 μχη 30^m 薄膜2 基板側 基板側 晶片側 3/zm 27/zm 15βτη 30βπι 薄膜3 薄膜4 薄膜5 基板側 15//m 薄膜厚度之比(晶片側/基板側） 9 0.11 1 1 一 — 薄膜硬化物彈性率比(晶片側/基板側） 100 100 6.7 0.01 — 一 接著強度3.2 8.7 2.9 2.5 1.2 7.8 (N/cm) 導通可靠〇 Δ 〇 X 〇 X 度 耐衝擊性〇 Δ 〇 X 〇 X 由表2、表3之結果可知，使用單層之環氧系的薄膜 1(彈性率：2GPa)之比較例2，其接著性低；使用單層之丙 烯酸系的薄膜2(彈性率：2Xl(T2GPa)之比較例3，在導通 可靠度與耐衝擊性不佳。又，即使是由薄膜1與薄膜2所 成之二層構造的情形，就薄膜1配置於基板側、薄膜2配 置於晶片側來連接之比較例1而言，其接著強度較低，在 導通可靠度與耐衝擊性也不佳。 相對於此，將環氧系的薄膜1(彈性率：2GPa)配置於 晶片側、且丙烯酸系的薄膜2〜5(彈性率：2X10_2〜3χ10_ WPa)配置於基板側來連接之實施例1〜10而言，不論在接 著強度、導通可靠度、耐衝擊性各方面皆優異，尤其，在 12 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) tT--------- 經濟部智慧財產局員工消費合作社印製 1244497 A7 五、發明說明（ί丨） 薄膜1與薄膜2〜5之彈性率之比爲10以上、厚度比爲 0.15〜7之實施例1〜7方面，已知其接著強度、導通可靠度 、耐衝擊性更爲優異。 [發明效果] 依據本發明之異向導電性接著膜，即使將1C晶片等之 電子元件實裝至以聚酯爲主之軟性電路基板的情況，仍可 得到高接著性、高導通可靠度。 [圖式之簡單說明] 圖1所示係本發明之連接方法的說明圖。 圖2所示係本發明之連接方法的說明圖。 圖3所示係本發明之連接方法的說明圖。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 [符號說明] 1A、IB、1C 異向導電性接著膜 2 第1絕緣性接著劑層 3 第2絕緣性接著劑層 4 導電粒子 10 1C晶片 20 電路基板 21 基材薄膜 22 配線電路 13 II---------^9. 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）

Claims (1)

  1. 2
    7 A8B8C8D8 六、申請專利範圍 劑層係配置於半導體晶片側，第2絕緣性接著劑層係配置 於電路基板側。 7·如申請專利範圍第6項之連接方法，其中，電路基 板係以聚酯爲主之電路基板。 8_—種連接構造體，係以申請專利範圍第1〜5項中任 一項之異向導電性接著膜來將半導體晶片與電路基板做電 氣、機械連接所得者；其中，異向導電性接著膜之第1絕 緣性接著劑層之硬化物係與半導體晶片接著，第2絕緣性 接著劑層之硬化物係與電路基板接著。 9·如申請專利範圍第8項之連接構造體，其中，電路 基板係以聚酯爲主之電路基板。 (請先閱讀背面之注意事項再塡寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014083875A1 (ja) * 2012-11-30 2014-06-05 三井金属鉱業株式会社 導電性フィルム及び電子部品パッケージ

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002226807A (ja) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続方法、接続構造体
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
US7109588B2 (en) * 2002-04-04 2006-09-19 Micron Technology, Inc. Method and apparatus for attaching microelectronic substrates and support members
WO2004029918A1 (ja) * 2002-09-25 2004-04-08 Citizen Watch Co., Ltd. 表示装置
JP3871634B2 (ja) * 2002-10-04 2007-01-24 シャープ株式会社 Ｃｏｆ半導体装置の製造方法
JP3755824B2 (ja) * 2003-03-04 2006-03-15 株式会社らいふ 複数電極接着用の電子部品とその実装方法
JP2005019393A (ja) * 2003-06-05 2005-01-20 Sharp Corp 異方性導電物、表示装置、表示装置の製造方法および導電部材
JP4282417B2 (ja) * 2003-09-12 2009-06-24 ソニーケミカル＆インフォメーションデバイス株式会社 接続構造体
JP4191567B2 (ja) * 2003-09-18 2008-12-03 株式会社リコー 導電性接着剤による接続構造体及びその製造方法
TWI299502B (en) * 2004-01-05 2008-08-01 Au Optronics Corp Conductive material with a laminated structure
JP2005194393A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
KR100601341B1 (ko) * 2004-06-23 2006-07-14 엘에스전선 주식회사 이방 도전성 접착제 및 이를 이용한 접착필름
EP1810334B1 (en) * 2004-11-11 2011-12-28 Semiconductor Energy Laboratory Co., Ltd. Method for Manufacturing a Semiconductor Device
US8278751B2 (en) * 2005-02-08 2012-10-02 Micron Technology, Inc. Methods of adhering microfeature workpieces, including a chip, to a support member
US7605056B2 (en) * 2005-05-31 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device including separation by physical force
KR100754241B1 (ko) * 2006-02-24 2007-09-05 (주)에이치제이 도전성 시트 및 그의 제조방법
US7452217B2 (en) * 2006-06-22 2008-11-18 Sankyo Kasei Co., Ltd. Connecting member for surface mounting circuit
WO2008012886A1 (fr) * 2006-07-26 2008-01-31 Panasonic Corporation Structure de connexion de cartes à circuits imprimés, procédé de connexion de cartes à circuits imprimés et appareil électronique
US20100321908A1 (en) * 2007-02-22 2010-12-23 Motoji Shiota Electronic circuit device, production method thereof, and display device
KR100844383B1 (ko) * 2007-03-13 2008-07-07 도레이새한 주식회사 반도체 칩 적층용 접착 필름
US8510935B2 (en) * 2007-07-10 2013-08-20 Joseph C Fjelstad Electronic assemblies without solder and methods for their manufacture
KR101385391B1 (ko) * 2007-08-08 2014-04-14 히타치가세이가부시끼가이샤 접착제 조성물, 필름상 접착제 및 회로 부재의 접속 구조
KR100929593B1 (ko) * 2007-09-20 2009-12-03 제일모직주식회사 이방 도전성 접착 조성물 및 그를 포함하는 이방 도전성 필름
US8017873B2 (en) * 2008-03-03 2011-09-13 Himax Technologies Limited Built-in method of thermal dissipation layer for driver IC substrate and structure thereof
JP5422921B2 (ja) * 2008-05-28 2014-02-19 デクセリアルズ株式会社 接着フィルム
JP5499448B2 (ja) * 2008-07-16 2014-05-21 デクセリアルズ株式会社 異方性導電接着剤
JP2011198779A (ja) * 2008-07-22 2011-10-06 Sharp Corp 電子回路装置、その製造方法及び表示装置
JP5402109B2 (ja) * 2009-02-27 2014-01-29 デクセリアルズ株式会社 異方性導電フィルム及び発光装置
US8384121B2 (en) 2010-06-29 2013-02-26 Cooledge Lighting Inc. Electronic devices with yielding substrates
US8790547B2 (en) * 2010-01-15 2014-07-29 Dexerials Corporation Anisotropic conductive adhesive
DE102010011127A1 (de) 2010-03-11 2011-09-15 Bundesdruckerei Gmbh Klebstoffzusammensetzung für ein Sicherheits-und/oder Wertdokument mit einem Schaltkreis
US10141084B2 (en) * 2010-10-08 2018-11-27 Cheil Industries, Inc. Electronic device
WO2012057125A1 (ja) * 2010-10-26 2012-05-03 三洋電機株式会社 太陽電池モジュールの製造方法
JP5695881B2 (ja) * 2010-10-28 2015-04-08 デクセリアルズ株式会社 電子部品の接続方法及び接続構造体
KR101332436B1 (ko) * 2010-12-06 2013-11-22 제일모직주식회사 이방 전도성 필름
US20130056749A1 (en) * 2011-09-07 2013-03-07 Michael Tischler Broad-area lighting systems
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
KR20130091521A (ko) * 2012-02-08 2013-08-19 삼성디스플레이 주식회사 이방성 도전층을 포함하는 미세 전자 소자 및 미세 전자 소자 형성 방법
JP6064399B2 (ja) * 2012-07-12 2017-01-25 日立化成株式会社 回路接続部材、それを用いた回路接続方法及び回路接続構造体
KR102259384B1 (ko) 2012-08-24 2021-06-02 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법 및 이방성 도전 필름
TWI810505B (zh) 2012-08-24 2023-08-01 日商迪睿合股份有限公司 中間產物膜、異向性導電膜、連接構造體、及連接構造體之製造方法
JP2014102943A (ja) * 2012-11-19 2014-06-05 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
KR102090456B1 (ko) 2012-11-30 2020-03-18 엘지디스플레이 주식회사 비 전도성 타입 접착수단과 이를 구비한 표시장치
US9777197B2 (en) 2013-10-23 2017-10-03 Sunray Scientific, Llc UV-curable anisotropic conductive adhesive
US9365749B2 (en) 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
JP6432416B2 (ja) 2014-04-14 2018-12-05 日亜化学工業株式会社 半導体装置
JP6398416B2 (ja) * 2014-07-22 2018-10-03 日立化成株式会社 接続構造体の製造方法及び接続構造体
JP6535989B2 (ja) * 2014-07-30 2019-07-03 日立化成株式会社 異方導電性フィルムの製造方法及び接続構造体
KR101929951B1 (ko) * 2015-01-13 2018-12-18 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름
JP5925928B1 (ja) * 2015-02-26 2016-05-25 日本航空電子工業株式会社 電気接続構造および電気接続部材
JP6750197B2 (ja) * 2015-07-13 2020-09-02 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
WO2017079484A1 (en) * 2015-11-04 2017-05-11 Google Inc. Connectors for connecting electronics embedded in garments to external devices
KR102422077B1 (ko) * 2015-11-05 2022-07-19 삼성디스플레이 주식회사 도전성 접착 필름 및 이를 이용한 전자기기의 접착 방법
JP2017157724A (ja) * 2016-03-02 2017-09-07 デクセリアルズ株式会社 表示装置及びその製造方法、並びに発光装置及びその製造方法
KR102559841B1 (ko) 2016-08-18 2023-07-27 삼성디스플레이 주식회사 플렉서블 디스플레이 장치 및 그 제조방법
CN109983628B (zh) 2016-11-30 2021-12-24 迪睿合株式会社 导电粒子配置膜、其制造方法、检查探头单元、导通检查方法
US9929484B1 (en) * 2016-12-20 2018-03-27 General Electric Company Electrical connector design for isolating electrical contacts in medical devices
CN108913057B (zh) * 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
WO2018225191A1 (ja) * 2017-06-07 2018-12-13 日立化成株式会社 半導体用フィルム状接着剤、半導体装置の製造方法及び半導体装置
US10795452B2 (en) * 2018-02-07 2020-10-06 Microsoft Technology Licensing, Llc Multi-stage cure bare die light emitting diode
WO2021213815A1 (en) * 2020-04-24 2021-10-28 Henkel Ag & Co. Kgaa Heat separable two-layer adhesive system and process of adhesive debonding using the same
EP4212949A1 (en) 2022-01-17 2023-07-19 Freshape SA Light driven electrochromic display

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998003047A1 (en) * 1996-07-15 1998-01-22 Hitachi Chemical Company, Ltd. Film-like adhesive for connecting circuit and circuit board
JP3179503B2 (ja) * 1996-08-08 2001-06-25 日東電工株式会社 異方導電性フィルムおよびその製造方法
JP3944795B2 (ja) * 1997-06-20 2007-07-18 日立化成工業株式会社 多層配線板
US6352775B1 (en) * 2000-08-01 2002-03-05 Takeda Chemical Industries, Ltd. Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014083875A1 (ja) * 2012-11-30 2014-06-05 三井金属鉱業株式会社 導電性フィルム及び電子部品パッケージ

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