CN1190801C - 各向异性导电性粘结膜 - Google Patents

各向异性导电性粘结膜 Download PDF

Info

Publication number
CN1190801C
CN1190801C CNB011123745A CN01112374A CN1190801C CN 1190801 C CN1190801 C CN 1190801C CN B011123745 A CNB011123745 A CN B011123745A CN 01112374 A CN01112374 A CN 01112374A CN 1190801 C CN1190801 C CN 1190801C
Authority
CN
China
Prior art keywords
adhesive layer
insulating properties
film
properties adhesive
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB011123745A
Other languages
English (en)
Other versions
CN1311511A (zh
Inventor
熊仓博之
山本宪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of CN1311511A publication Critical patent/CN1311511A/zh
Application granted granted Critical
Publication of CN1190801C publication Critical patent/CN1190801C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2400/00—Characterised by the use of unspecified polymers
    • C08J2400/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01045—Rhodium [Rh]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

在使用各向异性导电性粘结膜，将IC芯片等的电子部件安装在聚酯基的柔性印刷电路板上的情况下，提高粘结性和导通可靠性。各向异性导电性粘结膜1A由第1绝缘性粘结剂层(2)、第2绝缘 性粘结剂层(3)、以及导电颗粒(4)组成，其中，第2绝缘性粘结剂层(3)固化后的弹性率比第1绝缘性粘结剂层(2)固化后的弹性率低，而导电颗粒(4)分散到第1绝缘性粘结剂层(2)或第2绝缘性粘结剂层(3)的至少其中一个中。

Description

各向异性导电性粘结膜
技术领域
本发明涉及半导体芯片等电子部件和电路板等电气机械连接使用的各向异性导电性粘结膜，特别涉及适合在聚酯基的柔性印刷电路板上倒装安装半导体芯片情况的各向异性导电性粘结膜。
背景技术
以往，为了电气机械地将半导体芯片等电子部件和电路板之间、或电路板之间进行连接而使用各向异性导电性粘结膜(ACF)，但近年来特别在携带电话或IC卡等领域中，为了在柔性印刷电路板(FPC)上倒装安装(COF)IC芯片而广泛使用各向异性导电性粘结膜。
作为各向异性导电性粘结膜，一般使用将导电颗粒分散到环氧树脂系的单层的绝缘性粘结剂层中的单层结构的膜。此外，已知用同一组成的绝缘性粘结剂来分散导电颗粒的层和不分散的层的双层结构，或有分散导电颗粒的绝缘性粘结剂层和改变该绝缘性粘结剂组成的一部分的绝缘性粘结剂组成的层的双层结构的膜。
另一方面，在携带电话和IC卡等领域中，由于价格竞争，所以强烈要求降低成本。因此，作为在这些领域使用的柔性印刷电路板，相对于以前的聚酰亚胺基的柔性印刷电路板，大多使用聚酯基的柔性印刷电路板。
但是，聚酯基的柔性印刷电路板在其表面性的影响下与聚酰亚胺基的情况相比粘结性低，另一方面，使用现有的环氧树脂系的绝缘性粘结剂的各向异性导电性粘结膜弹性率提高，所以如果将安装电子部件的柔性印刷电路板从聚酰亚胺基的柔性印刷电路板变更为聚酯基的柔性印刷电路板，则存在电子部件和电路板之间的粘结性下降的问题。
与此相对，作为各向异性导电性粘结膜的绝缘性粘结剂，尝试使用粘结性高弹性率低的丙烯酸酯系的粘结剂，但在该情况下，即使粘结性提高，但仍存在导通可靠性差的问题。
因此，在聚酯基的柔性印刷电路板上安装IC芯片等电子部件的情况下，如果使用现有的各向异性导电性粘结膜，与粘结性或导通可靠性相关，产生不能满足规定的技术规范这样的问题。
发明内容
本发明的目的在于，解决这样的现有技术问题的发明，使用各向异性导电性粘结膜，即使在聚酯基的柔性印刷电路板上安装IC芯片等电子部件的情况下，也可以获得良好的粘结性和导通可靠性。
本发明人使用各向异性导电性粘结膜，在聚酯基的柔性印刷电路板上安装IC芯片等电子部件的情况下，将构成各向异性导电性粘结膜的绝缘性粘结剂层形成具有电子部件侧的层和柔性印刷电路板侧的层的多层结构，通过使柔性印刷电路板侧的绝缘性粘结剂层的固化后的弹性率比电子部件侧的绝缘性粘结剂层的固化后的弹性率低，发现粘结性和导通可靠性被同时提高，从而完成本发明。
就是说，本发明提供一种各向异性导电性粘结膜，由第1绝缘性粘结剂层、第2绝缘性粘结剂层、以及导电颗粒构成，其中，第2绝缘性粘结剂层的固化后的弹性率比第1绝缘性粘结剂层固化后的弹性率低，而导电颗粒分散到第1绝缘性粘结剂层或第2绝缘性粘结剂层的至少一个中，两层绝缘性粘结剂层由不同的材料制成，其中，第1绝缘性粘结剂层固化后的弹性率c1与第2绝缘性粘结剂层固化后的弹性率c2之比c1/c2在10以上，并且，将各向异性导电性粘结膜的第1绝缘性粘结剂层配置在半导体芯片侧，将第2绝缘性粘结剂层配置在电路板侧。
此外，本发明提供连接方法，使用上述的各向异性导电性粘结膜将半导体芯片和电路板进行电气机械连接。
而且，本发明提供连接结构体，使用上述的各向异性导电性粘结膜将半导体芯片和电路板进行电气机械连接。
附图说明
图1是本发明的连接方法的说明图。
图2是本发明的连接方法的说明图。
图3是本发明的连接方法的说明图。
具体实施方式
以下，参照附图来详细说明本发明。再有，在各图中，同一符号表示同一或同等的结构要素。
图1是使用本发明的各向异性导电性粘结膜1A来连接IC芯片10和电路板20的方法说明图。
各向异性导电性粘结膜1A有第1绝缘性粘结剂层2、第2绝缘性粘结剂层3的双层结构，导电颗粒4分别分散到双方的绝缘性粘结剂层2、3中。
在本发明的各向异性导电性粘结膜1A中，具有第1绝缘性粘结剂层2的固化后的弹性率c1比第2绝缘性粘结剂层3的固化后的弹性率c2大的特征。绝缘性粘结剂层2、3的固化后的弹性率之比c1/c2最好在10以上。由此，在使用各向异性导电性粘结膜1A来连接IC芯片10和电路板20的情况下，即使电路板20在聚酯基的基本材料膜21上设有布线电路22，通过将第1绝缘性粘结剂层2侧配置在IC芯片10侧，将绝缘性粘结剂层3配置连接在电路板20侧，与电路板为聚酰亚胺基的情况同样，也可以同时提高粘结性和导通可靠性。
作为这种使绝缘性粘结剂层2、3的固化后的弹性率不同的方法没有特别限制，但如果使用同种的绝缘性树脂，则即使调整固化剂的种类或添加量，也难以使固化后的弹性率完全不同，所以最好使用不同的绝缘性树脂。例如，由热固化性环氧系粘结剂等来形成第1绝缘性粘结剂层2，由热固化性丙烯酸酯系粘结剂等来形成第2绝缘性粘结剂层3。特别是从保存性和速固化性等特性方面来看，最好由使用咪唑系潜在性热固化剂的热固化性环氧系粘结剂来形成第1绝缘性粘结剂层2，由使用过氧化物系固化剂的热固化性丙烯酸酯系粘结剂来形成第2绝缘性粘结剂层3。这种情况下，热固化性环氧系粘结剂可以由双酚A型环氧树脂、双酚F型环氧树脂、四溴双酚A型环氧树脂等一般的环氧树脂来构成。此外，热固化性丙烯酸酯系粘结剂可以由具有反应性二重结合的氨基丙烯酸酯、聚酯丙烯酸酯、环氧丙烯酸酯等构成。
第1绝缘性粘结剂层2的厚度t1和第2绝缘性粘结剂层3的厚度t2之比t1/t2最好在0.15以上、7以下。如果该比t1/t2低于0.15，则第1绝缘性粘结剂层2的形成效果不能充分体现，导通可靠性下降。相反，如果t1/t2超过7，则第2绝缘性粘结剂层3的形成效果不能充分体现，粘结性下降。
第1绝缘性粘结剂层2的厚度t1和第2绝缘性粘结剂层3的厚度t2的相加厚度可以与现有的单层的各向异性导电性粘结膜相同，一般最好为10～100μm。
另一方面，作为导电颗粒4，例如可以使用由Ni、Ag、Cu或它们的合金等组成的金属粉、在球状树脂颗粒的表面上实施金属电镀的颗粒、在这些良好导体组成的颗粒表面上设有绝缘性树脂覆盖膜的颗粒等，可以使用在以往各向异性导电性粘结剂中使用的各种导电颗粒。导电颗粒的粒径最好为0.2～20μm。此外，分散到第1绝缘性粘结剂层2中的导电颗粒4、和分散到第2绝缘性粘结剂层3中的导电颗粒4可以使用相同的导电颗粒，也可以使用不同的导电颗粒。
作为各向异性导电性粘结膜1A的制造方法，按照一般方法将各自导电颗粒4分散到第1绝缘性粘结剂层形成用组成物和第2绝缘性粘结剂层形成用组成物中，进行成膜，通过将所得的2片薄膜重合压接来制造。此外，也可以在形成分散了导电颗粒4的第1绝缘性粘结剂层2或第2绝缘性粘结剂层3的一个之后，在其上还涂敷分散另一个导电颗粒4的绝缘性粘结剂形成用组成物，通过成膜来形成。从生产率来看，将各个膜重合的方法较好。
本发明的各向异性导电性粘结膜只要设有固化后的弹性率不同的2层绝缘性粘结剂层，就可以获得各种状态。例如，在上述的图1的各向异性导电性粘结膜1A中，将导电颗粒4分散到第1绝缘性粘结剂层2和第2绝缘性粘结剂层3双方，但如图2的各向异性导电性粘结膜1B所示，也可以不将导电颗粒4分散到第1绝缘性粘结剂层2中，而仅分散到第2绝缘性粘结剂层3中。由此，在凸缘面积小的微细图形的情况下，图形可以捕捉更多的导电颗粒。
此外，如图3所示，也可以不将导电颗粒4分散到第2绝缘性粘结剂层3中，而仅分散到第1绝缘性粘结剂层2中。
此外，在本发明的各向异性导电性粘结膜中，除了固化后的弹性率不同的2层的绝缘性粘结剂层以外，根据需要，也可以将其它的绝缘性粘结剂层设置在第1绝缘性粘结剂层2和第2绝缘性粘结剂层3之间而形成三层以上的多层结构。
本发明的各向异性导电性粘结膜可以用于各种电子部件和电路板之间的连接、或电路板之间的连接等。这种情况下，作为连接对象的电路板，可以列举出聚酯基的电路板、聚酰亚胺基的电路板等。
特别在将IC芯片等半导体芯片倒装安装在聚酯基的电路板上的情况下，通过将本发明的各向异性导电性粘结膜的第1绝缘性粘结剂层配置在半导体芯片侧，将第2绝缘性粘结剂层配置在电路板侧，与使用现有的各向异性导电性粘结膜的情况相比，可以显著地提高粘结性和导通可靠性。因此，本发明还包括这样的连接方法和通过这样的连接方法连接的连接结构体。
【实施例】
以下，根据实施例来具体说明本发明。
实施例1～10、比较例1～3
按表2或表3所示的厚度制作表1的配合组成的膜1～膜5，通过将所得的膜按表2或表3所示的组合重合、压接来制作双层结构的各向异性导电性粘结膜。此外，通过热压固化成为50μm厚的膜状的各膜1～5，通过动态粘弹性测定装置(オリエンテック社)求固化后的弹性率(0℃)。结果示于表1。
评价
夹入各实施例和比较例的各向异性导电性粘结膜并经加热加压(200℃、1N/冲击、10秒)来连接在PET基的基板膜上夹入粘结剂层形成的铝的布线图形的柔性印刷电路板、IC芯片(4×4mm2、IC芯片的厚度t＝0.15mm)。
如下评价所得的连接结构体的(1)连接强度、(2)导通可靠性、(3)耐冲击性。结果示于表2和表3。
(1)粘结强度
将IC芯片固定在玻璃上，将柔性印刷电路板在90°方向上以50mm/min的拉伸速度来剥离，测定此时的剥离速度。再有，如果剥离强度在4N/cm以上，则可得到充分的连接可靠性，如果在2N/cm以上，则可靠性有一些下降，但实用性充分，而如果低于2N/cm，则为NG。
(2)导通可靠性
60℃、95％RH、500小时的老化后的电阻值不足老化前的初期电阻值2倍的情况评价为○，2倍以上、5倍以下的情况评价为△，而5倍以上的情况评价为×。
(3)耐冲击性
用塑料制的棒对连接结构体的IC芯片周边施加1N左右的轻冲击后电阻值不足施加轻冲击前的初期电阻值2倍的情况评价为○，2倍以上、5倍以下的情况评价为△，而5倍以上的情况评价为×。
   【表1】
                                    (单位：重量份)
成分                     膜1    膜2      膜3       膜4      膜5
固态环氧树脂(*1)        35
热潜在性固化剂(*2)      65
丙烯酸橡胶(*3)                  55        55         55        55
聚氨丙烯酸酯(*4)                30        40         15
多官能丙烯酸酯(*5)              10                   25        40
过氧化物化合物(*6)              5         5          5         5
导电粒子(*7)            15      15        15         15        15
固化后的弹性率(30℃)      2       2×10-2  5×10-2   1×10-1  3×10-1
[GPa]
注：
(*1)油化シェルエポキシ社，EP1009
(*2)旭チバ社，HX3941HP
(*3)帝国化学社，WS-023
(*4)荒川化学工业社，ビ一ムセット504H
(*5)东亜合成社，アロニックスM315
(*6)日本油脂社，パ一キュアWO
(*7)Ni粒子，粒径5μm以下
【表2】
            实施例1   实施例2   实施例3   实施例4   实施例5   实施例6   实施例7
膜1         芯片侧     芯片侧     芯片侧     芯片侧     芯片侧     芯片侧     芯片侧
            25μm      20μm      15μm      10μm      5μm       15μm      15μm
膜2         基板侧     基板侧     基板侧     基板侧     基板侧     基板侧     基板侧
            5μm       10μm      15μm      20μm      25μm
膜3                                                                基板侧
                                                                   15μm
膜4                                                                           基板侧
                                                                              15μm
膜5
膜厚之比(芯片侧/基板侧)
            5          2          1          0.5        0.2        1          1
膜固化物弹性率比(芯片侧/基板侧)
            100        100        100        100        100        40         20
粘结强度    4.2        5.8        8.0        8.2        8.5        8.9        8.4
(N/cm)
导通可靠性  ○         ○         ○         ○         ○         ○         ○
耐冲击性    ○         ○         ○         ○         ○         ○         ○
【表3】
           实施例8  实施例9  实施例10  比较例1  比较例2  比较例3膜1        芯片侧    芯片侧    芯片侧     基板侧27μm     3μm      15μm      15μm     30μm
膜2        基板侧    基板侧               芯片侧3μm      27μm                15μm               30μm
膜3
膜4
膜5                            基板侧15μm
膜厚之比(芯片侧/基板侧)9         0.11      1          1         -         -
膜固化物弹性率比(芯片侧/基板侧)100       100       6.7        0.01      -         -
粘结强度   3.2       8.7       2.9        2.5       1.2       7.8(N/cm)
导通可靠性 ○        △        ○         ×        ○        ×
耐冲击性   ○        △        ○         ×        ○        ×
从表2、表3的结果可知，在使用单层环氧系的膜1(弹性率：2GPa)的比较例2中，粘结性低，在使用单层丙烯酸酯系的膜2(弹性率：2×10-2GPa)的比较例3中，导通可靠性和耐冲击性差。此外，即使在膜1和膜2的双层结构的情况下，在将膜1配置在基板侧，将膜2配置在芯片侧并进行连接的比较例1中，可知粘结强度比较低、导通可靠性和耐冲击性也差。
与此相对，可知在将环氧系的膜1(弹性率：2GPa)配置在芯片侧，将丙烯酸酯系的膜2～5(弹性率：2×10-2～3×10-1GPa)配置在基板侧进行连接的实施例1～10中，粘结强度、导通可靠性、耐冲击性都良好，特别是膜1和膜2～5的弹性率之比在10以上、厚度比在0.15以上、7以下的实施例1～7中，粘结强度、导通可靠性、耐冲击性更好。
根据本发明的各向异性导电性粘结膜，即使在聚酯基的柔性印刷电路板上安装IC芯片等电子部件的情况下，也可以获得良好的粘结性和导通可靠性。

Claims (8)

1.一种各向异性导电性粘结膜，其特征在于，由第1绝缘性粘结剂层、第2绝缘性粘结剂层、以及导电颗粒构成，其中，第2绝缘性粘结剂层的固化后的弹性率比第1绝缘性粘结剂层固化后的弹性率低，而导电颗粒分散到第1绝缘性粘结剂层或第2绝缘性粘结剂层的至少一个中，两层绝缘性粘结剂层由不同的材料制成，其中，第1绝缘性粘结剂层固化后的弹性率c1与第2绝缘性粘结剂层固化后的弹性率c2之比c1/c2在10以上，并且，将各向异性导电性粘结膜的第1绝缘性粘结剂层配置在半导体芯片侧，将第2绝缘性粘结剂层配置在电路板侧。
2.如权利要求1所述的各向异性导电性粘结膜，其特征在于，第1绝缘性粘结剂层的厚度t1与第2绝缘性粘结剂层的厚度t2之比t1/t2在0.15以上、7以下。
3.如权利要求1所述的各向异性导电性粘结膜，其特征在于，第1绝缘性粘结剂层由使用咪唑系潜在性固化剂的热固化性环氧系粘结剂组成，第2绝缘性粘结剂层由使用过氧化物系固化剂的热固化性丙烯酸酯系粘结剂组成。
4.如权利要求1所述的各向异性导电性粘结膜，其特征在于，导电颗粒分散到第2绝缘性粘结剂层中。
5.一种连接方法，其特征在于，使用权利要求1～4中任何一项所述的各向异性导电性粘结膜将半导体芯片和电路板进行电气机械连接。
6.如权利要求5的连接方法，其特征在于，电路板是聚酯基的电路板。
7.一种连接结构体，其特征在于，使用权利要求1～4中任何一项所述的各向异性导电性粘结膜将半导体芯片和电路板进行电气机械连接。
8.如权利要求7所述的连接结构体，其特征在于，电路板是聚酯基的电路板。
CNB011123745A 2000-02-25 2001-02-24 各向异性导电性粘结膜 Expired - Fee Related CN1190801C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP50180/2000 2000-02-25
JP2000050180A JP3491595B2 (ja) 2000-02-25 2000-02-25 異方導電性接着フィルム

Publications (2)

Publication Number Publication Date
CN1311511A CN1311511A (zh) 2001-09-05
CN1190801C true CN1190801C (zh) 2005-02-23

Family

ID=18571998

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011123745A Expired - Fee Related CN1190801C (zh) 2000-02-25 2001-02-24 各向异性导电性粘结膜

Country Status (5)

Country Link
US (1) US6592783B2 (zh)
JP (1) JP3491595B2 (zh)
KR (1) KR100639083B1 (zh)
CN (1) CN1190801C (zh)
TW (1) TWI244497B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102047401B (zh) * 2008-05-28 2012-11-28 索尼化学&信息部件株式会社 粘结膜
CN102585709B (zh) * 2007-08-08 2016-04-27 日立化成株式会社 粘接剂组合物、膜状粘接剂和电路部件的连接结构

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002226807A (ja) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続方法、接続構造体
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
US7109588B2 (en) * 2002-04-04 2006-09-19 Micron Technology, Inc. Method and apparatus for attaching microelectronic substrates and support members
JPWO2004029918A1 (ja) * 2002-09-25 2006-01-26 シチズン時計株式会社 表示装置
JP3871634B2 (ja) * 2002-10-04 2007-01-24 シャープ株式会社 Ｃｏｆ半導体装置の製造方法
JP3755824B2 (ja) * 2003-03-04 2006-03-15 株式会社らいふ 複数電極接着用の電子部品とその実装方法
JP2005019393A (ja) * 2003-06-05 2005-01-20 Sharp Corp 異方性導電物、表示装置、表示装置の製造方法および導電部材
JP4282417B2 (ja) * 2003-09-12 2009-06-24 ソニーケミカル＆インフォメーションデバイス株式会社 接続構造体
JP4191567B2 (ja) * 2003-09-18 2008-12-03 株式会社リコー 導電性接着剤による接続構造体及びその製造方法
TWI299502B (en) * 2004-01-05 2008-08-01 Au Optronics Corp Conductive material with a laminated structure
JP2005194393A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
KR100601341B1 (ko) * 2004-06-23 2006-07-14 엘에스전선 주식회사 이방 도전성 접착제 및 이를 이용한 접착필름
KR101150994B1 (ko) * 2004-11-11 2012-06-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
US8278751B2 (en) * 2005-02-08 2012-10-02 Micron Technology, Inc. Methods of adhering microfeature workpieces, including a chip, to a support member
US7605056B2 (en) 2005-05-31 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device including separation by physical force
KR100754241B1 (ko) * 2006-02-24 2007-09-05 (주)에이치제이 도전성 시트 및 그의 제조방법
US7452217B2 (en) * 2006-06-22 2008-11-18 Sankyo Kasei Co., Ltd. Connecting member for surface mounting circuit
WO2008012886A1 (fr) * 2006-07-26 2008-01-31 Panasonic Corporation Structure de connexion de cartes à circuits imprimés, procédé de connexion de cartes à circuits imprimés et appareil électronique
WO2008102476A1 (ja) * 2007-02-22 2008-08-28 Sharp Kabushiki Kaisha 電子回路装置、その製造方法及び表示装置
KR100844383B1 (ko) * 2007-03-13 2008-07-07 도레이새한 주식회사 반도체 칩 적층용 접착 필름
US8510935B2 (en) * 2007-07-10 2013-08-20 Joseph C Fjelstad Electronic assemblies without solder and methods for their manufacture
KR100929593B1 (ko) * 2007-09-20 2009-12-03 제일모직주식회사 이방 도전성 접착 조성물 및 그를 포함하는 이방 도전성 필름
US8017873B2 (en) * 2008-03-03 2011-09-13 Himax Technologies Limited Built-in method of thermal dissipation layer for driver IC substrate and structure thereof
JP5499448B2 (ja) 2008-07-16 2014-05-21 デクセリアルズ株式会社 異方性導電接着剤
JP2011198779A (ja) * 2008-07-22 2011-10-06 Sharp Corp 電子回路装置、その製造方法及び表示装置
JP5402109B2 (ja) * 2009-02-27 2014-01-29 デクセリアルズ株式会社 異方性導電フィルム及び発光装置
CN102695768B (zh) * 2010-01-15 2015-04-29 迪睿合电子材料有限公司 各向异性导电粘结剂
DE102010011127A1 (de) 2010-03-11 2011-09-15 Bundesdruckerei Gmbh Klebstoffzusammensetzung für ein Sicherheits-und/oder Wertdokument mit einem Schaltkreis
JP5512888B2 (ja) * 2010-06-29 2014-06-04 クーレッジ ライティング インコーポレイテッド 柔軟な基板を有する電子素子
US10141084B2 (en) * 2010-10-08 2018-11-27 Cheil Industries, Inc. Electronic device
WO2012057125A1 (ja) * 2010-10-26 2012-05-03 三洋電機株式会社 太陽電池モジュールの製造方法
JP5695881B2 (ja) * 2010-10-28 2015-04-08 デクセリアルズ株式会社 電子部品の接続方法及び接続構造体
KR101332436B1 (ko) * 2010-12-06 2013-11-22 제일모직주식회사 이방 전도성 필름
WO2013036561A2 (en) * 2011-09-07 2013-03-14 Cooledge Lighting, Inc. Broad-area lighting systems
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
KR20130091521A (ko) * 2012-02-08 2013-08-19 삼성디스플레이 주식회사 이방성 도전층을 포함하는 미세 전자 소자 및 미세 전자 소자 형성 방법
JP6064399B2 (ja) * 2012-07-12 2017-01-25 日立化成株式会社 回路接続部材、それを用いた回路接続方法及び回路接続構造体
TWI547538B (zh) 2012-08-24 2016-09-01 Dexerials Corp 異向性導電膜之製造方法及異向性導電膜
CN109166649B (zh) 2012-08-24 2021-04-13 迪睿合电子材料有限公司 各向异性导电膜及其制造方法
JP2014102943A (ja) * 2012-11-19 2014-06-05 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
KR102090456B1 (ko) 2012-11-30 2020-03-18 엘지디스플레이 주식회사 비 전도성 타입 접착수단과 이를 구비한 표시장치
JP6025532B2 (ja) * 2012-11-30 2016-11-16 三井金属鉱業株式会社 導電性フィルム及び電子部品パッケージ
US9365749B2 (en) 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
US9777197B2 (en) 2013-10-23 2017-10-03 Sunray Scientific, Llc UV-curable anisotropic conductive adhesive
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
JP6432416B2 (ja) * 2014-04-14 2018-12-05 日亜化学工業株式会社 半導体装置
JP6398416B2 (ja) * 2014-07-22 2018-10-03 日立化成株式会社 接続構造体の製造方法及び接続構造体
JP6535989B2 (ja) * 2014-07-30 2019-07-03 日立化成株式会社 異方導電性フィルムの製造方法及び接続構造体
KR102542797B1 (ko) * 2015-01-13 2023-06-14 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름
JP5925928B1 (ja) * 2015-02-26 2016-05-25 日本航空電子工業株式会社 電気接続構造および電気接続部材
JP6750197B2 (ja) * 2015-07-13 2020-09-02 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
EP3371855A1 (en) * 2015-11-04 2018-09-12 Google LLC Connectors for connecting electronics embedded in garments to external devices
KR102422077B1 (ko) * 2015-11-05 2022-07-19 삼성디스플레이 주식회사 도전성 접착 필름 및 이를 이용한 전자기기의 접착 방법
JP2017157724A (ja) * 2016-03-02 2017-09-07 デクセリアルズ株式会社 表示装置及びその製造方法、並びに発光装置及びその製造方法
KR102559841B1 (ko) 2016-08-18 2023-07-27 삼성디스플레이 주식회사 플렉서블 디스플레이 장치 및 그 제조방법
WO2018101107A1 (ja) * 2016-11-30 2018-06-07 デクセリアルズ株式会社 導電粒子配置フィルム、その製造方法、検査プローブユニット、導通検査方法
US9929484B1 (en) * 2016-12-20 2018-03-27 General Electric Company Electrical connector design for isolating electrical contacts in medical devices
CN108913057B (zh) 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
KR102351843B1 (ko) * 2017-06-07 2022-01-18 쇼와덴코머티리얼즈가부시끼가이샤 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치
US10795452B2 (en) * 2018-02-07 2020-10-06 Microsoft Technology Licensing, Llc Multi-stage cure bare die light emitting diode
EP4139411A1 (en) * 2020-04-24 2023-03-01 Henkel AG & Co. KGaA Heat separable two-layer adhesive system and process of adhesive debonding using the same
EP4212949A1 (en) 2022-01-17 2023-07-19 Freshape SA Light driven electrochromic display

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3460997A (en) * 1996-07-15 1998-02-09 Hitachi Chemical Company, Ltd. Film-like adhesive for connecting circuit and circuit board
WO1998007216A1 (fr) * 1996-08-08 1998-02-19 Nitto Denko Corporation Film conducteur anisotrope et procede de fabrication
JP3944795B2 (ja) * 1997-06-20 2007-07-18 日立化成工業株式会社 多層配線板
US6352775B1 (en) * 2000-08-01 2002-03-05 Takeda Chemical Industries, Ltd. Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102585709B (zh) * 2007-08-08 2016-04-27 日立化成株式会社 粘接剂组合物、膜状粘接剂和电路部件的连接结构
CN102047401B (zh) * 2008-05-28 2012-11-28 索尼化学&信息部件株式会社 粘结膜

Also Published As

Publication number Publication date
KR20010085434A (ko) 2001-09-07
KR100639083B1 (ko) 2006-10-27
JP3491595B2 (ja) 2004-01-26
CN1311511A (zh) 2001-09-05
US6592783B2 (en) 2003-07-15
JP2001240816A (ja) 2001-09-04
TWI244497B (en) 2005-12-01
US20030102466A1 (en) 2003-06-05

Similar Documents

Publication Publication Date Title
CN1190801C (zh) 各向异性导电性粘结膜
CN1110079C (zh) 电子元件装置
CN1290382C (zh) 带有增强板的柔性印刷电路板
TWI477229B (zh) Printed wiring board with shielding film and printed wiring board
JP6292808B2 (ja) 接着剤、及び発光装置
CN1723745A (zh) 带有极薄粘接剂层的铜箔及其制造方法
CN1337145A (zh) 多层印刷电路板及其制造方法
CN1296450C (zh) 粘接剂及电气装置
CN1217737A (zh) 粘接剂、液晶装置、液晶装置的制造方法和电子装置
CN1890339A (zh) 各向异性的导电粘合片材及连接结构体
JP2008106231A (ja) 電子機器用接着剤シート
CN1771773A (zh) 电路成形基板制造方法和用于制造电路成形基板的材料
CN1190115C (zh) 用于制造印刷线路板的复合材料
CN1359256A (zh) 柔性布线板以及柔性布线板的制造方法
CN1239654C (zh) 热固性粘合膜和基于其应用的粘合剂结构体
CN101079407A (zh) 布线基板及其制造方法以及半导体器件
CN1212049C (zh) 电路形成基板及电路形成基板的制造方法
CN1252206C (zh) 粘接剂和粘接膜
CN1523951A (zh) 膜上芯片用铜箔
CN1469460A (zh) 用于装配电子零件的薄膜承载带
CN1760302A (zh) 一种多层柔性印制电路用低流动性的改性丙烯酸酯胶粘剂及制备
CN1685775A (zh) 电路基板及其制造方法
JP5682554B2 (ja) 金属支持フレキシブル基板ならびにそれを用いたテープオートメーテッドボンディング用金属支持キャリアテープ、ｌｅｄ実装用金属支持フレキシブル回路基板および回路形成用銅箔積層済み金属支持フレキシブル回路基板
JP6430148B2 (ja) 接着剤及び接続構造体
CN1653610A (zh) 具有导电和导热性能的热固性粘合片

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20050223

Termination date: 20170224

CF01 Termination of patent right due to non-payment of annual fee