WO2008012886A1 - Structure de connexion de cartes à circuits imprimés, procédé de connexion de cartes à circuits imprimés et appareil électronique - Google Patents

Structure de connexion de cartes à circuits imprimés, procédé de connexion de cartes à circuits imprimés et appareil électronique Download PDF

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Publication number
WO2008012886A1
WO2008012886A1 PCT/JP2006/314810 JP2006314810W WO2008012886A1 WO 2008012886 A1 WO2008012886 A1 WO 2008012886A1 JP 2006314810 W JP2006314810 W JP 2006314810W WO 2008012886 A1 WO2008012886 A1 WO 2008012886A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
anisotropic conductive
conductive adhesive
adhesive
connection
Prior art date
Application number
PCT/JP2006/314810
Other languages
English (en)
Japanese (ja)
Inventor
Masahito Kawabata
Yoshihito Fujiwara
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to PCT/JP2006/314810 priority Critical patent/WO2008012886A1/fr
Publication of WO2008012886A1 publication Critical patent/WO2008012886A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors

Definitions

  • Circuit board connection structure circuit board connection method, and electronic device
  • the present invention relates to a circuit board connection structure that can be repaired in a state where the first circuit board and the second circuit board are connected via an anisotropic conductive adhesive, a circuit board connection method, and a circuit board connection
  • the present invention relates to an electronic device using a connection structure.
  • a circuit board connection structure includes a first circuit board having a first connection portion in which a plurality of circuit patterns are formed in parallel on a first base material, and a plurality of circuit patterns formed in a second base material in parallel. And a second circuit board having the second connection portion.
  • a circuit board connection structure has a first connection portion and a second connection portion facing each other through a paste-like or sheet-like anisotropic conductive adhesive containing conductive particles in a resin.
  • the anisotropic conductive adhesive is melted and solidified by a connecting process in which the first base material and the second base material are heated and pressed in a direction approaching each other along the thickness direction by the pressure jig.
  • a connecting process in which the first base material and the second base material are heated and pressed in a direction approaching each other along the thickness direction by the pressure jig.
  • Patent Document 1 a method for repairing electronic components has been proposed that can be performed without removing the residual anisotropic conductive adhesive after the first and second substrates are peeled off!
  • the first anisotropic conductive adhesive used initially contains metal particles
  • the second anisotropic conductive adhesive used for repair work has a polymer nucleus. It is said that repair work can be performed easily and reliably by containing particles with a metal thin film in the material.
  • Patent Document 1 JP-A-6-188548
  • Patent Document 1 since the conductive particles contained in the first anisotropic conductive adhesive and the second anisotropic conductive adhesive are different, the first connection portion and the second connection portion In the meantime, the electric resistance value is different from the design value, or the electron transfer occurs due to the potential difference between the conductive particles of the first anisotropic conductive adhesive and the conductive particles of the second anisotropic conductive adhesive, There is also a trap that causes Ion 'migration.
  • Ion migration is a phenomenon in which ions move in the presence of moisture by being pulled by an ionized metal force electric field. It occurs mainly between wiring in printed wiring boards and semiconductor packages.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a circuit board connection structure and circuit that can easily and surely perform repair work and are less susceptible to electrical adverse effects. It is an object to provide a substrate connection method and an electronic device.
  • the circuit board connection structure of the present invention includes a first circuit board having a first connection portion in which a plurality of circuit patterns are formed on a first base material, and a plurality of circuit patterns formed on a second base material.
  • a second circuit board having a second connection part, and an adhesive part for connecting the first connection part and the second connection part, wherein the adhesive part contains conductive particles in a resin.
  • a circuit board connection structure in which the first connection portion and the second connection portion are arranged to be opposed to each other via a conductive adhesive, and the bonding portion is formed by a first anisotropic conductive adhesive.
  • An adhesive layer and a second adhesive layer made of a second anisotropic conductive adhesive, and a resin in the second anisotropic conductive adhesive rather than an elastic modulus of the first anisotropic conductive adhesive.
  • High elastic modulus It is characterized by that.
  • the elastic modulus of the second anisotropic conductive adhesive is made higher than that of the first anisotropic conductive adhesive, and the second anisotropic conductive adhesive is used as the first anisotropic conductive adhesive. Harder than adhesive.
  • the elastic modulus is high during the repair process! ⁇
  • the second anisotropic conductive adhesive is converted into the existing first anisotropic conductive (already solidified and melted again) during pressure welding. Squeeze the adhesive (push it away) and remove it from the surface (including the end face) of each circuit pattern.
  • connection portion and the second connection portion are connected via the same adhesive (that is, the second anisotropic conductive adhesive).
  • first and second connection parts that do not have to be removed from the first connection part and the second connection part by a separate work are bonded to the second anisotropic conductive adhesive. Can be connected with an agent.
  • the first anisotropic conductive adhesive is characterized in that a main component is a thermosetting resin and a subcomponent is a thermoplastic resin.
  • the first anisotropic conductive adhesive can be used for restoration work by using the second anisotropic conductive adhesive.
  • the agent can be easily crushed (can be swept away).
  • thermoplastic resin as a subcomponent of the first anisotropic conductive adhesive, forcible peeling at the time of restoration can be easily performed, and the first connecting portion and the second Damage to the connection can be suppressed.
  • the present invention is characterized in that a main component of the second anisotropic conductive adhesive is a thermosetting resin.
  • the main component of the first anisotropic conductive adhesive is an acrylic resin
  • the main component of the second anisotropic conductive adhesive is an epoxy resin. It is characterized by that.
  • a plurality of circuit patterns are formed on the first base material.
  • the conductive material is contained in the resin.
  • the first connection portion and the second connection portion are arranged opposite to each other via the first anisotropic conductive adhesive containing particles, and then the first base material and the second base material are heated.
  • the first circuit board and the second circuit board are separated by tearing the first adhesive layer after forming the first adhesive layer by a connection process in which pressure is applied in the direction of approaching each other along the thickness direction. !
  • the first connecting portion and the second connecting portion are arranged to face each other via a second anisotropic conductive adhesive containing conductive particles in the boiled resin, and then the first connecting step is performed by the connecting step.
  • the elastic modulus of the second anisotropic conductive adhesive is set higher than the elastic modulus of the first anisotropic conductive adhesive, as in the above-described circuit board connection structure.
  • the second anisotropic conductive adhesive becomes the first different from the existing first one during the repair process. Squeeze away the isotropic conductive adhesive and remove it from the surface (including the end face) of each circuit pattern.
  • first connecting portion and the second connecting portion that do not have to remove the existing first anisotropic conductive adhesive from the first connecting portion and the second connecting portion by separate work are second anisotropic. Can be connected with conductive adhesive.
  • an electronic device of the present invention is a device using the circuit board connection structure described above.
  • the second anisotropic conductive adhesive is made harder than the first anisotropic conductive adhesive, thereby repairing the circuit board. The work can be done easily and reliably, and there is an effect that electrical adverse effects can occur.
  • FIG. 1 is a cross-sectional view showing a circuit board connection structure (first embodiment) according to the present invention.
  • FIG. 2 is a diagram illustrating an example of separating circuit boards in the circuit board connection method according to the first embodiment.
  • FIG. 3 A diagram for explaining an example of connecting circuit boards in the circuit board connecting method according to the first embodiment.
  • FIG. 4 A cross-sectional view showing a circuit board connection structure (second embodiment) according to the present invention.
  • ⁇ 5] A cross-sectional view showing an enlarged main part of the circuit board connection structure according to the second embodiment.
  • ⁇ 6 A diagram illustrating a circuit board connection method according to the second embodiment.
  • the circuit board connection structure 10 is an electronic device. Is connected to the first circuit board 12, the second circuit board 13, the first connection part 15 of the first circuit board 12, and the second connection part 18 of the second circuit board 13. And an adhesive portion 20 to be provided.
  • the first circuit board 12 has a first connection part 15 in which a plurality of circuit patterns 16 are formed in parallel on a first base material 14.
  • the second circuit board 13 has a second connection part 18 in which a plurality of circuit patterns 19 are formed in parallel on a second base material 17.
  • the bonding portion 20 has the first base material 15 after the first connection portion 15 and the second connection portion 18 are arranged to face each other.
  • the 14 and the second base material 17 are connected by pressing in the direction approaching each other along the thickness direction while heating.
  • the adhesive portion 20 includes a first adhesive layer 22 made of the first anisotropic conductive adhesive 21 and a second adhesive layer 24 made of the second anisotropic conductive adhesive 23.
  • the first adhesive layer 22 has a height substantially equal to the surface 19A of the circuit pattern 19 between the circuit patterns 19 in the second base material 17 of the second circuit board 13, or the surface 19A. It is provided at a low height.
  • the first adhesive layer 22 is formed on the portion of the second connection portion 18 (the portion where the plurality of circuit patterns 19 are formed in parallel on the second base material 17) excluding the surface 19A of the circuit pattern 19.
  • the circuit pattern 19 is provided at substantially the same height with respect to the surface 19A or lower than the surface 19A.
  • the second adhesive layer 24 is provided at the first connection portion 15 (that is, the portion where the plurality of circuit patterns 16 are formed in parallel on the first base material 14), and the first adhesive layer 22 and the circuit are provided.
  • the pattern 19 is formed so as to come into contact with the surface 19A.
  • first connection portion 15 and the second connection portion 18 are connected only through the second adhesive layer 24 (that is, the second anisotropic conductive adhesive 23), so that no adverse electrical effects occur. Can be suppressed.
  • the second anisotropic conductive adhesive 23 of the second adhesive layer 24 has a higher elastic modulus than that of the first anisotropic conductive adhesive 21 of the first adhesive layer 22, and uses a resin. Being! /
  • the first anisotropic conductive adhesive 21 has a main component of thermosetting resin and a minor component of heat-sensitive resin. It is a plastic resin and contains conductive particles in each resin.
  • thermosetting resin acrylic resin is used.
  • the content of each component is, for example, more than 50% by weight of the main component and about 20% by weight of the minor component.
  • the first adhesive layer 22 can realize a state having a low elastic modulus of 200 MPa to l.2 GPa.
  • an absolute amount for example, weight% is a master-slave relationship. There may be cases where (main component> subcomponent).
  • the dominant factor that determines the characteristics of the second anisotropic conductive adhesive which is not quantitatively related, may be a thermosetting tendency
  • the secondary factor may be a thermoplastic tendency.
  • the conductive particles contained in the main component and subcomponents it is desirable to use metal powders with relatively high hardness such as Ni, Co, Ag, etc. with Ni, Au coating. It is desirable to adjust the particle size to 2 to 10 ⁇ m in consideration of the cobraness of the substrate electrode.
  • circuit patterns 16 and 19 are low current circuits, it is possible to use conductive particles having a metal film formed with a resin core.
  • the second anisotropic conductive adhesive 23 has a thermosetting resin as a main component, and contains conductive particles in the resin.
  • the conductive particles of the second anisotropic conductive adhesive 23 are the same as the conductive particles of the first anisotropic conductive adhesive 21.
  • thermosetting resin the main component of the second anisotropic conductive adhesive 23 has a higher elastic modulus than the thermosetting resin of the first anisotropic conductive adhesive 21, such as epoxy resin. Is used.
  • the second adhesive layer 24 can realize a state having a high elastic modulus of 1.2 to 2.5 GPa.
  • the first circuit board 12 and the second circuit board 13 are connected, that is, the first connection part 15 and the second connection part 1 via the first anisotropic conductive adhesive 21.
  • the first connecting part 15 and the second connecting part 18 are pressed in the direction of approaching each other along the thickness direction while heating the first base 14 and the second base 17 while the first base 14 and the second base 17 are heated. Connect with anisotropic conductive adhesive 21.
  • the first anisotropic conductive adhesive 21 becomes the first adhesive layer 22.
  • connection test reveals that the connection is defective, the first circuit board 12 and the second circuit board 2 are separated by tearing the first adhesive layer 22 in the separation process of FIG. The circuit board 13 is separated.
  • the heating temperature during separation is equal to or higher than the glass transition temperature (100 to 150 ° C).
  • the first anisotropic conductive adhesive 21 has a low elastic modulus, that is, a soft grease.
  • the separation work of the first circuit board 12 and the second circuit board 13 can be quickly performed, and damage (breakage, warpage, etc.) to the first circuit board 12 and the second circuit board 13 can be suppressed.
  • circuit patterns 16 and 19 are arranged in parallel, they are peeled by a 90 ° peel method in a direction perpendicular to or parallel to the circuit patterns 16 and 19.
  • circuit patterns 16 and 19 are arranged in a circular electrode force grid pattern, a method of horizontally peeling or horizontally peeling while twisting is used.
  • the first circuit board 12 is replaced with a new first circuit board 12.
  • the first connecting part 15 of the new first circuit board 12 and the second connecting part 18 of the second circuit board 13 are arranged opposite to each other, and the second anisotropic is between the first connecting part 15 and the second connecting part 18.
  • Conductive conductive adhesive 23 is interposed.
  • the first base material 14 and the second base material 17 are pressurized in a direction approaching each other along the thickness direction while heating.
  • the existing first adhesive layer 22 that has already solidified is melted again to become the first anisotropic conductive adhesive 21.
  • the first anisotropic conductive adhesive 21 is mainly composed of acrylic resin, and can be connected in a short time at a relatively low temperature.
  • the heating temperature can be set relatively low, the quality of the connected product after repair that hardly affects the first circuit board 12 and the second circuit board 13 and other electronic components is reduced. Can be suppressed.
  • the second anisotropic conductive adhesive 23 is mainly composed of epoxy resin, and can be connected in a short time at a relatively high temperature.
  • the hue in the heat-cured state is red brown to dark brown.
  • the elastic modulus of the second anisotropic conductive adhesive 23 is higher than the elastic modulus of the first anisotropic conductive adhesive 21 (that is, hard).
  • the second anisotropic conductive adhesive 23 crushes (spreads) the melted first anisotropic conductive adhesive 21, and the surface 19 A (the end face also) of the circuit pattern 19. Removed) as shown by the arrows.
  • the first connecting portion 15 and the second connecting portion 18 are made of the same adhesive (that is,
  • Second anisotropic conductive adhesive 23.
  • the first anisotropic conductive adhesive 21 and the second anisotropic conductive adhesive 23 become the first adhesive layer 22 and the second adhesive layer 24, respectively.
  • the existing first anisotropic conductive adhesive from the first connecting portion 15 and the second connecting portion 18 The surface 16A of the circuit pattern 16 of the first connection part 15 and the surface 19A of the circuit pattern 19 of the second connection part 18 are removed with the same adhesive (i.e., second anisotropic conductive). It can be connected with 23).
  • the second anisotropic conductive adhesive 23 for restoration is red brown to dark brown, and the appearance difference that the hue is different from the cloudy color of the first anisotropic conductive adhesive 21. Is obtained.
  • circuit board connection structure 10 that has been repaired and those that are not can be clearly distinguished from each other in appearance, so that no marking is required for repairs and the process can be shortened.
  • the resin of the second anisotropic conductive adhesive 23 is harder than the resin of the first anisotropic conductive adhesive 21, the first anisotropic conductive adhesive 21 is crushed. It can be removed from the surface 19A (including the end face) of the circuit pattern 19 (by pushing it).
  • the same conductive particles can be employed for the first anisotropic conductive adhesive 21 and the second anisotropic conductive adhesive 23, respectively.
  • the resistance value differs from the design value as in the prior art, and no ion migration occurs.
  • the first anisotropic conductive adhesive 21 has a thermosetting resin as a main component and a thermoplastic resin as a subcomponent.
  • the second anisotropic conductive adhesive 23 is used as the first anisotropic conductive adhesive 23 for restoration work. 21 can be easily crushed (can be swept away).
  • thermoplastic resin as a subcomponent of the first anisotropic conductive adhesive 21, it becomes possible to easily perform forced peeling at the time of repair, Damage to the second connecting part 18 mm can be suppressed.
  • circuit board connection structure 30 according to a second embodiment will be described with reference to FIGS. Note that in the circuit board connection structure 30 according to the second embodiment, the same reference numerals are given to the same or similar components as those of the circuit board connection structure 10 according to the first embodiment, and the description thereof will be omitted.
  • the adhesive portion 20 of the circuit board connection structure 10 according to the first embodiment is replaced with an adhesive portion 31.
  • other configurations are the same as those of the circuit board connection structure 10 according to the first embodiment.
  • the adhesive part 31 pressurizes the first connection part 15 and the second connection part 18 so as to approach each other along the thickness direction while heating the first base material 14 and the second base material 17 after the first connection part 15 and the second connection part 18 are opposed to each other. It is formed by this.
  • the first adhesive layer 22 made of the first anisotropic conductive adhesive 21 is provided on the first circuit board 12 and the second circuit board 13 side, and the first connection portion 15 and the first A second adhesive layer 24 made of a second anisotropic conductive adhesive 23 is provided between the two connecting portions 18.
  • the first adhesive layer 22 on the first circuit board 12 side is between the circuit patterns 16 of the first base material 14 of the first circuit board 12 (in other words, the circuit pattern of the first connection portion 15).
  • the circuit pattern 16 is formed at the same height as the surface 16A of the circuit pattern 16 or at a low height relative to the surface 16A !.
  • the first adhesive layer 22 on the second circuit board 13 side is between the circuit patterns 19 in the second base material 17 of the second circuit board 13 (in other words, the circuit pattern in the first connection portion 18).
  • the circuit pattern 19 is formed so as to have substantially the same height as the surface 19A of the circuit pattern 19 or low and high with respect to the surface 19A!
  • the second adhesive layer 24 has one surface 24A in contact with the first adhesive layer 22 on the first circuit board 12 side and the surface 16A of the circuit notch 16, and the other surface 24B on the second circuit board 13 side. Formed so as to contact the first adhesive layer 22 and the surface 19A of the circuit pattern 19 !.
  • the first connection portion 15 and the second connection portion 18 are connected only through the second adhesive layer 24 (that is, the second anisotropic conductive adhesive 23), thereby suppressing the occurrence of adverse electrical effects. be able to.
  • the first connection part 15 of the separated first circuit board 12 and the second connection part 18 of the separated second circuit board 13 are arranged opposite to each other, and the second connection part 15 is connected between the first connection part 15 and the second connection part 18.
  • Anisotropic conductive adhesive 23 is interposed.
  • the first base material 14 and the second base material 17 are pressurized in a direction approaching each other along the thickness direction while heating.
  • the existing first adhesive layer 22 that has already solidified is melted again to form the first anisotropic conductive adhesive.
  • the elastic modulus of the second anisotropic conductive adhesive 23 is higher (that is, harder) than the elastic modulus of the first anisotropic conductive adhesive 21.
  • the second anisotropic conductive adhesive 23 crushes (spreads) the melted first anisotropic conductive adhesive 21, and the surface 16A (end face) of the circuit pattern 16 is obtained.
  • the force is also removed as indicated by the arrow, and is removed from the surface 19A (including the end face) of the circuit pattern 19 as indicated by the arrow.
  • the first connecting portion 15 and the second connecting portion 18 are made of the same adhesive (ie,
  • Second anisotropic conductive adhesive 23.
  • the first anisotropic conductive adhesive 21 and the second anisotropic conductive adhesive 23 become the first adhesive layer 22 and the second adhesive layer 24, respectively.
  • the same adhesive (that is, second anisotropic conductive adhesive) is used for the surface 16A of the circuit pattern 16 of the first connection 15 and the surface 19A of the circuit pattern 19 of the second connection 18 without removing 21 separately. Agent) Can be connected at 23.
  • the circuit board connection structure 30 of the second embodiment As described above, according to the circuit board connection structure 30 of the second embodiment, the same effects as those of the circuit board connection structure 10 of the first embodiment can be obtained. Further, according to the circuit board connection structure 30 of the second embodiment, after the first anisotropic conductive adhesive 21 is broken, the separated first circuit board 12 and second circuit board 13 are separated from each other by a second difference. In order to bond with the anisotropic conductive adhesive 23, the second adhesive layer 24 is sandwiched between the pair of first adhesive layers 22 by the first anisotropic conductive adhesive 21.
  • the present invention relates to a circuit board connection structure in which a first circuit board and a second circuit board are connected via an anisotropic conductive adhesive, a circuit board connection method, and an electronic device using the circuit board connection structure. It can be used in a wide range of manufacturing processes for microelectronic devices, and is useful as an electrode connection method for electronic devices that are compact, thin, and lightweight by not using interposers such as connectors and sockets. .

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne une structure de connexion de cartes à circuits imprimés, un procédé de connexion de cartes à circuits imprimés et un appareil électronique qui permettent l'exécution facile et sûre d'un travail de réparation, tout en supprimant les effets électriques néfastes. La structure (10) de connexion de cartes à circuits imprimés comprend une première carte à circuits imprimés (12) ayant une première section de connexion (15) dans laquelle une pluralité de tracés de circuits (16) est formée en parallèle sur un premier substrat (14), une seconde carte à circuits imprimés (13) ayant une seconde section de connexion (18) dans laquelle une pluralité de tracés de circuits (19) est formée en parallèle sur un second substrat (17), et une partie de collage (20) pour connecter la première section de connexion (15) et la seconde section de connexion (18). La partie de collage (20) comprend une première couche adhésive (22) constituée d'un premier adhésif anisotrope (21) et une seconde couche adhésive (24) constituée d'un second adhésif anisotrope (23), et le module d'élasticité du second adhésif anisotrope (23) est défini de façon à être plus grand que celui du premier adhésif anisotrope (21).
PCT/JP2006/314810 2006-07-26 2006-07-26 Structure de connexion de cartes à circuits imprimés, procédé de connexion de cartes à circuits imprimés et appareil électronique WO2008012886A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/314810 WO2008012886A1 (fr) 2006-07-26 2006-07-26 Structure de connexion de cartes à circuits imprimés, procédé de connexion de cartes à circuits imprimés et appareil électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/314810 WO2008012886A1 (fr) 2006-07-26 2006-07-26 Structure de connexion de cartes à circuits imprimés, procédé de connexion de cartes à circuits imprimés et appareil électronique

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WO2008012886A1 true WO2008012886A1 (fr) 2008-01-31

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PCT/JP2006/314810 WO2008012886A1 (fr) 2006-07-26 2006-07-26 Structure de connexion de cartes à circuits imprimés, procédé de connexion de cartes à circuits imprimés et appareil électronique

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07197001A (ja) * 1993-12-28 1995-08-01 Sony Chem Corp 熱硬化型異方性導電性接着剤
JPH09259635A (ja) * 1996-03-22 1997-10-03 Toshiba Chem Corp 異方性導電膜
JP2001240816A (ja) * 2000-02-25 2001-09-04 Sony Chem Corp 異方導電性接着フィルム
JP2002226807A (ja) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続方法、接続構造体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07197001A (ja) * 1993-12-28 1995-08-01 Sony Chem Corp 熱硬化型異方性導電性接着剤
JPH09259635A (ja) * 1996-03-22 1997-10-03 Toshiba Chem Corp 異方性導電膜
JP2001240816A (ja) * 2000-02-25 2001-09-04 Sony Chem Corp 異方導電性接着フィルム
JP2002226807A (ja) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続方法、接続構造体

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