WO2008012886A1 - Structure for connecting circuit boards, method for connecting circuit boards and electronic apparatus - Google Patents

Structure for connecting circuit boards, method for connecting circuit boards and electronic apparatus Download PDF

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Publication number
WO2008012886A1
WO2008012886A1 PCT/JP2006/314810 JP2006314810W WO2008012886A1 WO 2008012886 A1 WO2008012886 A1 WO 2008012886A1 JP 2006314810 W JP2006314810 W JP 2006314810W WO 2008012886 A1 WO2008012886 A1 WO 2008012886A1
Authority
WO
WIPO (PCT)
Prior art keywords
anisotropic conductive
circuit board
conductive adhesive
connecting portion
adhesive
Prior art date
Application number
PCT/JP2006/314810
Other languages
French (fr)
Japanese (ja)
Inventor
Masahito Kawabata
Yoshihito Fujiwara
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to PCT/JP2006/314810 priority Critical patent/WO2008012886A1/en
Publication of WO2008012886A1 publication Critical patent/WO2008012886A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0379Stacked conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09881Coating only between conductors, i.e. flush with the conductors

Abstract

To provide a structure for connecting circuit boards, a method for connecting circuit boards and an electronic apparatus in which repair work can be performed easily and surely while suppressing adverse electrical effects. The structure (10) for connecting circuit boards comprises a first circuit board (12) having a first connecting section (15) where a plurality of circuit patterns (16) are formed in parallel on a first substrate (14), a second circuit board (13) having a second connecting section (18) where a plurality of circuit patterns (19) are formed in parallel on a second substrate (17), and a bonding portion (20) for connecting the first connecting section (15) and the second connecting section (18). The bonding portion (20) has a first adhesive layer (22) of a first anisotropic adhesive (21) and a second adhesive layer (24) of a second anisotropic adhesive (23), and modulus of elasticity of the second anisotropic adhesive (23) is set higher than that of the first anisotropic adhesive (21).

Description

Specification

Connection structure for a circuit board, the connection method and electronic device of the circuit board

Technical field

[0001] The present invention is a connection structure of repairable circuit board in a state in which the first circuit board and the second circuit board are connected via an anisotropic conductive adhesive, the connection method of the circuit board, and the circuit board an electronic device using the connecting structure.

BACKGROUND

[0002] The circuit board connection structure is formed on the first circuit board having a first connection portion in which a plurality of circuit patterns on the first substrate is formed in parallel, a plurality of circuit patterns on the second substrate are parallel and a second circuit board having a second connecting portion that is.

[0003] circuit board connection structure is facing disposing the first connecting portion and the second connecting portion through the paste or sheet-like anisotropic conductive adhesives containing conductive particles in 榭脂 pair of the pressing jig by connecting step the first and second substrates pressurized while being heated in a direction approaching along the thickness direction to each other, is solidified by melting anisotropic conductive adhesive, which conduction of the first connecting portion and the second connecting portion while being secured, the first and second substrates are fixed to each other by.

[0004] Incidentally, in the connecting structure of such a circuit board, defective products can not be ensured conduction of the first connecting portion and the second connecting portion, to soften the anisotropic conductive adhesive by heating the connection locations Te force even relatively peeling the first substrate and the second substrate, an anisotropic conductive adhesive which remains so as to cover the second connecting portion beauty Oyo first connecting portion with a solvent or spatula, etc. after dividing removed by repair work to connect the first circuit board and the second circuit board is applied by connecting step described above again.

[0005] However, such restoration work, it is necessary to carry out after removal of the anisotropic conductive adhesive remaining, the first connecting portion with a complicated circuit pattern and the second connection section There is a possibility of damaging the circuit pattern, improvement has been demanded.

For such a demand, after peeled first substrate and second substrate, it is proposed repair method of the electronic component be made without removing the anisotropic conductive adhesive which remains! ヽthat (for example, Patent Document 1).

[0006] According to Patent Document 1, the first anisotropic conductive adhesive is contained metal particles, the second anisotropic conductive adhesive is a polymer nuclei used in the repair work using initially by allowed to contain the formed particles of the metal thin film on wood, the repair work easier, and is reliably performed.

Patent Document 1: JP-A 6 188 548 JP

Disclosure of the Invention

Problems that the Invention is to you'll solve

[0007] However, Patent Document 1, since the conductive particles contained in the first anisotropic conductive adhesive and the second anisotropic conductive adhesives are different, the first connecting portion and second connecting portion electronic migration is caused by the potential difference between the conductive particles in the electric resistance value or different from the design value, or the first anisotropic conductive adhesive of the conductive particles and the second anisotropic conductive adhesive between, the ions' migration is also 虡 cause can bow I.

The ion migration is a phenomenon that moves by being pulled by the metal power electric field Ioni spoon in the presence of moisture. Mainly occur between wiring of the printed wiring board or a semiconductor package.

[0008] The present invention has been made in order to solve the aforementioned problems, and its object is to repair easily and with certainty can be performed, the electric adverse hardly occurs the circuit board connection structure, the circuit and to provide a connection method and an electronic device substrate.

Means for Solving the Problems

[0009] connection structure for a circuit board of the present invention includes a first circuit board having a first connection portion in which a plurality of circuit patterns on the first substrate is formed, a plurality of circuit patterns on the second substrate is formed and a second circuit board having a second connecting portion, and a bonding portion for connecting the first connecting portion and the second connecting portion, the bonding portion, an anisotropic conductive containing conductive particles in the resin disposed opposite said first connecting portion and the second connecting portion through the sexual adhesive, a connecting structure of the connected circuit board, the bonding portion, first by the first anisotropic conductive adhesive a second adhesive layer by first adhesive layer and the second anisotropic conductive adhesive, 榭脂 in the second anisotropic conductive adhesive than the elastic modulus of the first anisotropic conductive adhesive wherein the elastic modulus of the high.

[0010] than the elastic modulus of the first anisotropic conductive adhesive by increasing the elastic modulus of the second anisotropic conductive adhesive, the first anisotropic conductive the second anisotropic conductive adhesive It was harder than sex adhesive.

Thus, for example, a high modulus of elasticity when repair process! In Rukoto used ヽ second anisotropic conductive adhesive, the second anisotropic conductive adhesive agent during pressure contact, existing (being molten again already solidified) first anisotropic conductive by crushing an adhesive (swept away by) is removed from the front surface of the circuit pattern (including the end face).

[0011] Thus, the first connecting portion and the second connecting portion is the same adhesive (i.e., the second anisotropic conductive adhesive) is connected via a.

Therefore, the first connecting portion and the second connecting portion, the existing first anisotropic conductive adhesive separately be removed in the work Nag first connecting portion and the second connecting portion and the second anisotropic conductive adhesive It can be connected at the agent.

[0012] Further, the present invention, the first anisotropic conductive adhesive, characterized in that the sub ingredients with the main component is a thermosetting 榭脂 is thermoplastic 榭脂.

[0013] The subcomponents of the first anisotropic conductive adhesive With thermoplastic 榭脂, you!, Te first anisotropic conductive adhesive at the second anisotropic conductive adhesive to repair work agent Ru can be a crushing easily press (which can wash away).

[0014] Further, by the sub-components of the first anisotropic conductive adhesive and thermoplastic 榭脂, it becomes possible to easily perform forced delamination during repair, the first connecting portion and the second it is possible to suppress the damage to the connection part.

Therefore, since the repair mistakes can be prevented due to damage of the first connecting portion and second connecting portion, to improve the yield of the repair, the higher quality 'reliability of the restoration.

[0015] Furthermore, the present invention is characterized in that the main component of the second anisotropic conductive adhesive is a thermosetting 榭脂.

[0016] Further, the present invention is the main component of the first anisotropic conductive adhesive are both If it is acrylic 榭脂 a main component epoxy system of the second anisotropic conductive adhesive 榭脂and characterized in that.

[0017] Furthermore, the connection method of the circuit board of the present invention includes a first circuit board having a first connection portion in which a plurality of circuit patterns on the first substrate is formed, a plurality of circuit patterns on the second substrate to connect the second circuit board having a second connecting portion formed, the first connection and via a first anisotropic conductive adhesive having containing conductive particles in 榭脂 first were allowed to pair toward arranging two connecting portions, after forming the first adhesive layer by a connection step of pressing the along connexion approaching each other direction in the thickness direction while heating the first substrate and the second substrate, wherein thereby separating the first circuit board and the second circuit board by breaking the first adhesive layer, through a second anisotropic conductive adhesive containing conductive particles in 榭脂 by:! ヽIt was allowed to face each of the first connecting section and the second connecting portion, the first by the connecting step A method for connecting the circuit board to form a second adhesive layer stacked wear layer, elasticity of the resin in the first anisotropic conductive than the elastic modulus of the adhesive and the second anisotropic conductive adhesive wherein the high rate.

[0018] According to the circuit connection method of a substrate, like the connection structure for a circuit board as described above, the elastic modulus of the second anisotropic conductive adhesive than the elastic modulus of the first anisotropic conductive adhesive by increasing, the second anisotropic conductive adhesive by harder than the first anisotropic conductive adhesive, the second anisotropic conductive adhesive during the repair process, the existing first different by crushing the anisotropic conductive adhesive (push flowed) is removed from the surface (including end faces) of each circuit pattern.

[0019] Thus, the first connecting portion and the second connecting portion, the existing first anisotropic conductive adhesive separately be removed in the work Nag first connecting portion and the second connecting portion and the second anisotropic It can be connected with a conductive adhesive.

[0020] Further, electronic equipment of the present invention is characterized in that it is an apparatus using the connection structure for a circuit board as described above.

Effect of the invention

[0021] connection structure for a circuit board of the present invention, according to the connection method and the electronic apparatus of the circuit board, by the second anisotropic conductive adhesive harder than the first anisotropic conductive adhesive, repair It works easily and with certainty can be performed, electrical adverse effects to have a effect of "in place.

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] is a sectional view showing a connection structure for a circuit board according to [1] The present invention (first embodiment).圆 2 is a diagram that describes an example of separating the circuit board in the connection method of the circuit board according to the first embodiment.

圆 3 is a diagram that describes an example of connecting the circuit board in the connection method of the circuit board according to the first embodiment.

圆 4 is a cross-sectional view showing a connection structure for a circuit board according to the present invention (second embodiment).圆 5 is a diagram for explaining a connection method of the circuit board according to the second embodiment 圆 6 is an enlarged sectional view showing a main part of a connection structure for a circuit board according to Embodiment] The second embodiment.

DESCRIPTION OF SYMBOLS

10, 30 circuit board connection structure

11 mobile terminal (electronic equipment)

12 first circuit board

13 second circuit board

14 first base member

15 first connecting portion

16, 19 circuit pattern

17 second base material

18 second connecting portion

20 adhesive portion

21 first anisotropic conductive adhesive

22 first adhesive layer

23 second anisotropic conductive adhesive

24 second adhesive layer

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment)

Hereinafter, the connection structure for a circuit board according to an embodiment of the present invention, a method for connecting and electronics circuit board will be described with reference to the drawings.

As shown in FIG. 1, the connecting structure 10 of a circuit board according to the first embodiment is housed in a housing of an electronic device Der Ru portable terminal 11, the first circuit board 12, a second circuit board 13, and a bonding portion 2 0 that connects the second connection portion 18 of the first connecting portion 15 and the second circuit board 13 of the first circuit board 12.

[0025] The first circuit board 12 includes a first connecting portion 15 in which a plurality of circuit patterns 16 on the first substrate 14 is formed in parallel.

The second circuit board 13 includes a second connecting portion 18 in which a plurality of circuit patterns 19 on the second substrate 17 are formed in parallel.

[0026] adhesive portion 20, the first connecting portion 15 and the second connecting portion 18 by opposed, first substrate

It is intended to be connected by Rukoto to pressurize toward each other along the thickness direction while heating the 14 and second substrate 17.

The bonding section 20 has a second adhesive layer 24 by the first adhesive layer 22 and the second anisotropic conductive adhesive 23 according to the first anisotropic conductive adhesive 21.

[0027] The first adhesive layer 22, of the second substrate 17 of the second circuit board 13, between the circuit patterns 19, substantially the same height with respect to the surface 19A of the circuit pattern 19, or the surface 19A It is provided to low for height.

In other words, the adhesive layer 22, of the second connecting portion 18 (a portion in which a plurality of circuit patterns 19 on the second substrate 17 are formed in parallel), the portion excluding the surface 19A of the circuit patterns 19 is provided at a lower height with respect to substantially the same height or surface 19A, with respect to the surface 19A of the circuit patterns 19.

[0028] The second adhesive layer 24, the first connecting portion 15 (i.e., a plurality of circuit patterns 16 on the first base material 14 portions formed in parallel) provided, and the adhesive layer 22 and the circuit It is formed so as to contact with the surface 19A of the pattern 19.

Thus, the first connecting portion 15 and the second connecting portion 18, a second adhesive layer 24 (i.e., the second anisotropic conductive adhesive 23) because they are connected only through the generation of electrical adverse it is possible to suppress obtain.

[0029] The second anisotropic conductive adhesive 23 of the second adhesive layer 24, a first anisotropic conductive adhesive 21 as compared to the elastic modulus of the first adhesive layer 22 is high, the 榭脂 used It is in! /, Ru.

[0030] The first anisotropic conductive adhesive 21, the main component is a subcomponent together with a thermosetting 榭脂 thermoplastic 榭脂, containing conductive particles in each 榭脂.

Thermosetting 榭脂 of the main component is, for example, acrylic 榭脂 is used.

The content of each component, for example, the main component is 50 wt.%, Subcomponent substantially Ru 20 weight% der. In this state, the adhesive layer 22 is an elastic modulus, 200MPa~l. Of 2 GPa, can be realized while holding the low modulus.

[0031] Here, as the relationship between the principal component and subcomponent for explaining the relationship between the main component and sub-component of the first anisotropic conductive adhesive 21, for example, absolute amount (e.g., weight%) is master-slave relationship cases are considered in the (main component> subcomponent).

Also, dominant factors showed a thermosetting tend to determine the characteristics of the second anisotropic conductive adhesive Nag the quantitative relationship, sometimes secondary factors exhibit thermoplastic tendency. For example, even in trace amounts by using a very high 榭脂 thermosetting is small Chi the absolute amount of the main component from the sub-component, it is allowed Live to without.

[0032] Major and as is in! Ru conductive particles contained in the auxiliary component, Ni, Ni having a Au film, Co, Ag relatively it is desirable instrument deposited using high hardness metal powder such as it is desirable to consider the Koburanariti substrate electrodes to be adjusting the particle diameter. 2 to 10 mu m.

Further, if the circuit pattern 16, 19 of the low current circuit, the core 榭脂, it is also possible to use conductive particles metal coating is made form.

[0033] The second anisotropic conductive adhesive 23, the main component is a thermosetting type 榭脂, containing conductive particles child during 榭脂.

Conductive particles of the second anisotropic conductive adhesive 23, the same as the conductive particles children of the first anisotropic conductive adhesive 21 is used.

Thermosetting resin of the main component of the second anisotropic conductive adhesive 23 is thermosetting 榭脂 as compared to the elastic modulus of the first anisotropic conductive adhesive 21 is high, an epoxy 榭脂 etc. It is used. For example, the second adhesive layer 24, an elastic modulus, from 1.2 to 2. That 5 GPa, can be realized while holding the high modulus.

[0034] Next, FIG. 2 (A) ~ a connection method of the circuit board for connecting the connection structure 10 of the circuit board of the first embodiment (B), based on FIG. 3 (A) ~ (C), Te explain. In connection process in FIG. 2 (A), i.e., to connect the first circuit board 12 and the second circuit board 13, the first connecting portion 15 and the second connecting portion via a first anisotropic conductive adhesive 21 1 8 are opposed arranged, the first connecting portion 15 and the second connecting portion 18 by pressurizing toward each other along the thickness direction while heating the first substrate 14 and second substrate 17 first connected by an anisotropic conductive adhesive 21.

The first anisotropic conductive adhesive 21 becomes the adhesive layer 22.

[0035] If the connect connection continuity test after step is found to be defective, 2 in the step of separating (B), the first circuit by breaking the first adhesive layer 22 the substrate 12 and the second separating the circuit board 13.

[0036] when separating the first circuit board 12 and the second circuit board 13 heats the whole in a state of connecting the first circuit board 12 and second circuit board 13, a first anisotropic it is desirable to soften the conductive adhesives 21.

For example, the first anisotropic conductive adhesive 21 is, when the glass transition temperature of acrylic 榭脂 of 60 to 120 ° C, the heating temperature at the time of separation, above the glass transition temperature (100 to 150 ° C) It is set to.

[0037] The first anisotropic conductive adhesive 21 has a low modulus of elasticity, i.e., a soft 榭脂.

Thus, the separation operation shielding immediately further in the first circuit board 12 and the second circuit board 13, damage to the first circuit board 12 and the second circuit board 13 (breakage, warping, etc.) as possible out be suppressed.

[0038] As a separation method, a method of applying stress in a direction that does not destroy the circuit patterns 16, 19 is desirable.

For example, if the circuit pattern 16, 19 are arranged in parallel, the circuit pattern 16, 19 perpendicular to direction or is peeled off by 90 ° peel method in a parallel direction.

Also, if you are arranged in a circular electrode power grid-like as a circuit pattern 16, 19, or peeling off the horizontal, or twist while using a method peeling horizontally.

[0039] In the step of FIG. 3 (A), after separation of the first circuit board 12 and the second circuit board 13, to replace the first circuit board 12 and the new first circuit board 12. A first connecting portion 15 of the new first circuit board 12, and a second connecting portion 18 is paired countercurrent arrangement of the second circuit board 13, the second anisotropically between the first connecting portion 15 and the second connecting portion 18 interposing the sexual conductive adhesive 23.

[0040] In the step of FIG. 3 (B), the pressurized toward each other along the thickness direction while heating the first substrate 14 and second substrate 17.

It melted already existing first adhesive layer 22 which has been solidified again, the first anisotropic conductive adhesive 21.

[0041] Meanwhile, the first anisotropic conductive adhesive 21 is a relatively low temperature is a main component acrylic 榭脂, it is possible to short-lived connections.

Specifically, at 80 to 150 ° C (glass transition temperature + 20 ° about C), was thermally cured at 5-20 seconds, it is possible to connect 'adhesion. Hue while thermosetting becomes white muddy color (milky).

[0042] Accordingly, it is possible to set a relatively low heating temperature, and the first circuit board 12 and the second circuitry substrate 13, the degradation of the other connection object after giving difficulty immediately repair the thermal effects on electronic parts It can be suppressed.

[0043] On the other hand, a second anisotropic conductive adhesive 23 is at a relatively high temperature is mainly composed of epoxy 榭脂, it is possible to connect in a short time.

Specifically, at 120 to 200 [° C, and thermally cured at 5-20 seconds, connection 'enables adhesion. The hue of the heat hard phased state is a red brown-dark brown color.

[0044] modulus of the second anisotropic conductive adhesive 23 is higher than the elastic modulus of the first anisotropic conductive adhesive 21 (i.e., hard).

Therefore, when the pressure, the second anisotropic conductive adhesive 23, also the surface 19A (the end surface of the crushed first anisotropic conductive adhesive 21 is melted (swept away by) the circuit pattern 19 including) or al arrow to remove as.

[0045] As shown in FIG. 3 (C), the first connecting portion 15 and the second connecting portion 18 is the same adhesive (i.e.

It is connected via the second anisotropic conductive adhesive) 23.

The first anisotropic conductive adhesive 21 and the second anisotropic conductive adhesive 23 is a first adhesive layer 22 and the second adhesive layer 24, respectively.

[0046] Thus, the surface 16A of the first connecting portion 15 and the second connecting portion 18, the circuit pattern 16 of the first connecting portion 15 which Nag be removed in separate operations the existing first anisotropic conductive adhesive 21 When, can be connected to the surface 19A of the circuit pattern 19 of the second connecting portion 18 identical adhesive (i.e., the second anisotropic conductive adhesive) at 23.

[0047] In this state, the second anisotropic conductive adhesive 23 for repair, red brown-dark brown, and white cloudy first anisotropic conductive adhesive 21, the appearance difference of different hues It is obtained.

Than this, a circuit connection structure of the substrate 10 was repaired, and those that do not, can clearly distinguish in appearance, marking of repair presence is not required, it can be shortened I spoon of the process.

[0048] Further, since the resin of the second anisotropic conductive adhesive 23 is harder than 榭脂 the first anisotropic conductive adhesive 21, by crushing the first anisotropic conductive adhesive 21 (swept away by) it can be removed from the surface 19A of the circuit patterns 19 (including the end face).

Therefore, their respective can employ the same conductive particles in the first anisotropic conductive adhesive 21 and the second anisotropic conductive adhesive 23.

Therefore, it is the design value and the different resistance values ​​as in the prior art, no or cause ions' migration Chillon.

[0049] Further, when separating the first circuit board 12 and the second circuit board 13, required to remove the first anisotropic conductive adhesive 21 remaining on the second connecting portion 18 of the second circuit board 13 there is no. Therefore, there is no possibility of damaging the circuit pattern 19 of the second connecting portion 18.

[0050] Further, the first anisotropic conductive adhesive 21, the main component and a thermosetting 榭脂, subcomponents was heat-friendly plastic 榭脂.

The first sub-component of the anisotropic conductive adhesive 21 by a thermoplastic 榭脂, the repair work Te Contact V ヽ second anisotropic conductive adhesive 23 in the first anisotropic conductive adhesive 21 can and this crush easily press (which can wash away).

[0051] Further, by the sub-components of the first anisotropic conductive adhesive 21 and thermoplastic 榭脂, it becomes possible to easily perform forced delamination during repair, Ya first connecting portion 15 it is possible to suppress the damage to the second connecting portion 18 give 〖this.

Therefore, since the repair mistakes due to damage of the first connecting portion 15 and the second connecting portion 18 can be prevented, improved repair of the yield, the higher quality 'reliability of the restoration.

[0052] (Second Embodiment) Next, a description will be given of a connection structure 30 of circuit board according to the second embodiment in FIGS. 4 to 6. Incidentally, those in the connection structure 30 of circuit board according to the second embodiment, the configuration of the same connection structure 10 of the circuit board similar to the first embodiment are allocated the same reference numerals and explanation.

[0053] As shown in FIGS. 4-5, the connection structure 30 of circuit board according to the second embodiment has replaced the adhesion portion 20 of the connecting structure 10 of a circuit board according to the first embodiment to the adhesive portion 31 but, the other structures are the same as the connection structure 10 of circuit board according to the first embodiment.

Adhesive portion 31, the first connecting portion 15 and the second connecting portion 18 by opposed, that pressurize toward each other along the thickness direction while heating the first substrate 14 and second substrate 17 those formed by.

[0054] The adhesive 31, the adhesive layer 22 by the first anisotropic conductive adhesive 21 is provided on the first circuit board 12 and the second circuit board 13 side, the first connecting portion 15 and the the second anisotropic conductive adhesive 23 second adhesive layer 24 is provided between the second connecting portion 18.

[0055] The first adhesive layer 22 of the first circuit board 12 side, of the first substrate 14 of the first circuit board 12, in other words between the circuit pattern 16 (out of the first connecting portion 15, the circuit pattern 16 the surface 16A of the provided region) was divided, substantially the same height with respect to the surface 16A of the circuit patterns 16, or to the surface 16A low, is formed to a height !, Ru.

[0056] The first adhesive layer 22 of the second circuit board 13 side, of the second substrate 17 of the second circuit board 13, in other words between the circuit pattern 19 (out of the first connecting portion 18, the circuit pattern the surface 19A of the 19 provided on the site) was divided, low for substantially the same height or surface 19A, with respect to the surface 19A of the circuit patterns 19, it is formed to a height !, Ru.

[0057] The second adhesive layer 24, one surface 24A contacts the surface 16A of the first circuit first adhesive layer 22 and the circuit Notan 16 of the substrate 12 side, the other surface 24B of the second circuit board 13 side is formed so as to contact with the surface 19A of the first adhesive layer 22 and the circuit pattern 19!, Ru.

Thus, since the first connecting portion 15 and the second connecting portion 18 are connected only via the second adhesive layer 24 (i.e., the second anisotropic conductive adhesive 23) to suppress the generation of electrical adverse be able to.

[0058] Next, based the connection method of the circuit board for connecting the circuit connection structure 30 of the substrate of the second embodiment in FIG. 2 (A) ~ (B) and FIG. 6 (A) ~ (C), Te explain.

In the step of FIG. 2 (A) ~ (B), if the connection of the first circuit board 12 and the second circuit board 13 is found to be defective, the first circuit board by breaking the first adhesive layer 22 12 and the

To separate the second circuit board 13.

[0059] In step of FIG. 6 (A), the After separating the first circuit board 12 and the second circuit board 13

A first connecting portion 15 of the first circuit board 12 which is separated and disposed opposite the second connecting portion 18 of the second circuit board 13 separated, the second between the first connecting portion 15 and the second connecting portion 18 interposing an anisotropic conductive adhesive 23.

[0060] In step of FIG. 6 (B), the pressurized toward each other along the thickness direction while heating the first substrate 14 and second substrate 17.

Existing first adhesive layer 22 which has already been solidified is melted again, the first anisotropic conductive adhesive

It is 21.

[0061] high Here, the elastic modulus of the second anisotropic conductive adhesive 23 than the elastic modulus of the first anisotropic conductive adhesive 21 (i.e., hard).

Therefore, when the pressure, the second anisotropic conductive adhesive 23 is, by crushing the first anisotropic conductive adhesive 21 is melted (swept away by), the surface 16A (the end surface of the circuit pattern 16 including) the force is also thereby removing as arrows, including the surface 19A (the end surface of the circuit pattern 19) karaya as indicia removed.

[0062] As shown in FIG. 6 (C), the first connecting portion 15 and the second connecting portion 18 is the same adhesive (i.e.

It is connected via the second anisotropic conductive adhesive) 23.

The first anisotropic conductive adhesive 21 and the second anisotropic conductive adhesive 23 is a first adhesive layer 22 and the second adhesive layer 24, respectively.

[0063] Thus, the first connecting portion 15 and the second connecting portion 18, the existing first anisotropic conductive adhesive

And the surface 16A of the circuit pattern 16 of the first connecting portion 15 which Nag be removed 21 by a separate task, the same adhesive surface 19A of the circuit pattern 19 of the second connecting portion 18 (i.e., the second anisotropic conductive adhesive agent) can be connected at 23.

[0064] As described above, according to the circuit board connection structure 30 of the second embodiment, the same effect as the circuit connection structure 10 of the substrate in the first embodiment can be obtained. Further, according to the circuit board connection structure 30 of the second embodiment, after the first anisotropic conductive adhesive 21 is broken, the first circuit board 12 and the second circuit board 13 separated second different to bond with anisotropic conductive adhesive 23, so that the second adhesive layer 24 is sandwiched between the first adhesive layer 22 of the pair of the first anisotropic conductive adhesive 21.

Industrial Applicability

The present invention is a connection structure of a circuit board and the first circuit board and the second circuit board are connected via an anisotropic conductive adhesive, the connection method of the circuit board, and that electronic equipment had use a connection structure of a circuit board , broad, available in a manufacturing process for microelectronic devices, as connectors and sockets, by not using the intervening component, is useful to use as an electrode connecting method of an electronic device to reduce the size and thickness' lightweight I spoon .

Claims

The scope of the claims
[1] the second circuit having a first circuit board having a first connecting portion a plurality of circuit patterns formed on the first substrate, the second connecting portion in which a plurality of circuit patterns on the second substrate is formed comprising a substrate and a bonding portion for connecting the first connecting portion and the second connecting portion,
The adhesive portion is disposed opposite said first connecting portion and the second connecting portion through an anisotropic conductive adhesive containing conductive particles in a resin, a connection structure of the connected circuit board ,
The adhesive portion has a second adhesive layer of the first adhesive layer and the second anisotropic conductive adhesive according to the first anisotropic conductive adhesive,
Connection structure for a circuit board, wherein the modulus of elasticity of 榭脂 high that put on the second anisotropic conductive adhesive than the elastic modulus of the first anisotropic conductive adhesive.
[2] the first anisotropic conductive adhesive, the connection of the circuit board according to claim 1, wherein the main component sub component with a thermosetting 榭脂 is thermoplastic 榭脂Construction.
[3] The connection structure for a circuit board according to 請 Motomeko 1 main component of the second anisotropic conductive adhesive, characterized in that a thermosetting 榭脂.
[4] with the main component of the first anisotropic conductive adhesive is an acrylic 榭脂, the main component of the second anisotropic conductive adhesive, characterized in that an epoxy-based 榭脂connection structure for a circuit board according to claim 1 〖this description.
[5] The second circuit having a first circuit board having a first connection portion in which a plurality of circuit patterns on the first substrate is formed, the second connecting portion in which a plurality of circuit patterns on the second substrate is formed in order to connect the board,
Said first connection portion through the first anisotropic conductive adhesive containing conductive particles and the second connecting portion in the resin were allowed to face each, the first substrate and the second substrate after forming the first contact adhesive layer by a connection step of pressing toward each other along the thickness direction while heating,
Thereby separating the first circuit board and the second circuit board by breaking the first adhesive layer,
The second the first contact through the anisotropic conductive adhesive connection portion and the second connecting portion containing the conductive particles in 榭脂 were allowed to face each with the following ヽ, said by the connecting step first a method for connecting the circuit board to form a second adhesive layer stacked contact adhesive layer,
Connection method of the circuit board, wherein the modulus of elasticity of 榭脂 high that put on the second anisotropic conductive adhesive than the elastic modulus of the first anisotropic conductive adhesive.
Electronic device using claim 1 that! ヽ to one of claims 4, a connection structure for a circuit board as described Zureka 〖this.
PCT/JP2006/314810 2006-07-26 2006-07-26 Structure for connecting circuit boards, method for connecting circuit boards and electronic apparatus WO2008012886A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/314810 WO2008012886A1 (en) 2006-07-26 2006-07-26 Structure for connecting circuit boards, method for connecting circuit boards and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/314810 WO2008012886A1 (en) 2006-07-26 2006-07-26 Structure for connecting circuit boards, method for connecting circuit boards and electronic apparatus

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07197001A (en) * 1993-12-28 1995-08-01 Sony Chem Corp Anisotropically conductive thermosetting adhesive
JPH09259635A (en) * 1996-03-22 1997-10-03 Toshiba Chem Corp Anisotropic conductive film
JP2001240816A (en) * 2000-02-25 2001-09-04 Sony Chem Corp Anisotropically conductive adhesive film
JP2002226807A (en) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd Adhesive for connecting circuit, method for connecting circuit by using the same, and connecting structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07197001A (en) * 1993-12-28 1995-08-01 Sony Chem Corp Anisotropically conductive thermosetting adhesive
JPH09259635A (en) * 1996-03-22 1997-10-03 Toshiba Chem Corp Anisotropic conductive film
JP2001240816A (en) * 2000-02-25 2001-09-04 Sony Chem Corp Anisotropically conductive adhesive film
JP2002226807A (en) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd Adhesive for connecting circuit, method for connecting circuit by using the same, and connecting structure

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