TWI222671B - Apparatus for fabricating bonded substrate - Google Patents

Apparatus for fabricating bonded substrate Download PDF

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Publication number
TWI222671B
TWI222671B TW092109783A TW92109783A TWI222671B TW I222671 B TWI222671 B TW I222671B TW 092109783 A TW092109783 A TW 092109783A TW 92109783 A TW92109783 A TW 92109783A TW I222671 B TWI222671 B TW I222671B
Authority
TW
Taiwan
Prior art keywords
processing chamber
holding plate
substrates
bonded substrate
substrate manufacturing
Prior art date
Application number
TW092109783A
Other languages
English (en)
Chinese (zh)
Other versions
TW200423229A (en
Inventor
Katsuhiro Nakashima
Noriaki Kasuya
Takuya Ohno
Yoshimasa Miyajima
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TWI222671B publication Critical patent/TWI222671B/zh
Publication of TW200423229A publication Critical patent/TW200423229A/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
TW092109783A 2003-04-25 2003-04-25 Apparatus for fabricating bonded substrate TWI222671B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/005359 WO2004097509A1 (ja) 2003-04-25 2003-04-25 貼合せ基板製造装置

Publications (2)

Publication Number Publication Date
TWI222671B true TWI222671B (en) 2004-10-21
TW200423229A TW200423229A (en) 2004-11-01

Family

ID=33398114

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092109783A TWI222671B (en) 2003-04-25 2003-04-25 Apparatus for fabricating bonded substrate

Country Status (4)

Country Link
JP (1) JP4087385B2 (ja)
CN (2) CN100424546C (ja)
TW (1) TWI222671B (ja)
WO (1) WO2004097509A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI473196B (zh) * 2009-08-17 2015-02-11 Ap Systems Inc 對準基板的方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4679890B2 (ja) * 2004-11-29 2011-05-11 東京応化工業株式会社 サポートプレートの貼り付け装置
TWI363212B (en) 2006-05-26 2012-05-01 Advanced Display Proc Eng Co Adhesive chuck, and apparatus and method for assembling substrates using the same
CN100495149C (zh) * 2006-08-17 2009-06-03 株式会社爱发科 贴合方法及贴合基板制造装置
CN102209621B (zh) * 2008-11-06 2014-09-03 芝浦机械电子装置股份有限公司 贴合装置以及贴合方法
JP4954968B2 (ja) * 2008-12-01 2012-06-20 アドヴァンスド・ディスプレイ・プロセス・エンジニアリング・コーポレーション・リミテッド 粘着チャック及びこれを有する基板合着装置
KR101623325B1 (ko) * 2012-07-30 2016-05-20 시바우라 메카트로닉스 가부시끼가이샤 기판 접합 장치 및 기판 접합 방법
WO2021084582A1 (ja) * 2019-10-28 2021-05-06 パナソニックＩｐマネジメント株式会社 真空貼合装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3707990B2 (ja) * 2000-03-30 2005-10-19 株式会社 日立インダストリイズ 基板組立装置
JP4689797B2 (ja) * 2000-07-19 2011-05-25 Ｎｅｃ液晶テクノロジー株式会社 液晶表示装置の製造装置及びその製造方法
JP3742000B2 (ja) * 2000-11-30 2006-02-01 富士通株式会社 プレス装置
JP3577545B2 (ja) * 2001-02-06 2004-10-13 株式会社 日立インダストリイズ 基板貼り合せ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI473196B (zh) * 2009-08-17 2015-02-11 Ap Systems Inc 對準基板的方法

Also Published As

Publication number Publication date
CN100424546C (zh) 2008-10-08
CN1682145A (zh) 2005-10-12
CN100480805C (zh) 2009-04-22
TW200423229A (en) 2004-11-01
WO2004097509A1 (ja) 2004-11-11
JPWO2004097509A1 (ja) 2006-07-13
CN101063764A (zh) 2007-10-31
JP4087385B2 (ja) 2008-05-21

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MM4A Annulment or lapse of patent due to non-payment of fees