玖、發明說明： 【發明所屬之技術領域】 發明領域 本發明係關於一種貼合基板（板）的製造裝置，詳而言 之，疋關於一種以預定的間隔貼合2片基板，製造液晶顯示 裝置(Liquid Crystal Display; LCD)等之貼合基板(板)之裝置。 ϋ先前技3 發明背景 近年，LCD等之平面顯示板，逐漸走向大型化•輕量 化’且要求削減製造成本的呼聲更加高漲。因此，即使在 貼合2片的基板以製造平面顯示板之貼合基板製造裝置 中’雖因應面板尺寸而大型化，不過仍需要便宜且使生產 性提昇之製造裝置。 液晶顯示板係，例如，使多數薄膜晶體管(TFT)形成矩 陣狀之陣列基板與形成濾色片（紅、綠、藍）或遮光膜等之濾 色片基板以極為狹小之間隔（數"對向，並藉封入液晶於 這2片基板間來製造。 習知之液晶顯示板的製造，係使用將貼合基板放入真 玉槽，將液晶浸入注入口後，藉使該真空槽内回復成大氣， 在基板間注入液晶，並密封注入口的真空注入法。近年， 大多使用例如沿著陣列基板的周緣部形成密封材的框，在 其密封材的框内滴下規定量的液晶，在真空中貼合陣列基 板與渡色片基板之滴下注入法。（參照專利文獻1) 第10圖係表示藉滴下注入法貼合基板之習知之貼合基 板製造裝置11。 在貼合基板製造裝置11之真空處理室（腔室）12内，相互 對向配置帛1及第2保持平板13、14，在各保持平板13、14 上分別保持著基板W1、W2。真空處理室12，係由可以分 割成上下之上側容器12a與下側容器12b所構成。在真空處 理室12的上方設有加壓系統15，且在真空處理室12的下方 設有驅動系統16。第1保持平板13係藉第丨支柱17連接加壓 系統15，且第2保持平板14係藉第2支柱18連接驅動系統 16加壓糸統15係在進行基板wi、W2的貼合時，使加壓 力作用於基板Wl、W2。藉驅動系統16的動作進行基板W1、 W2的對位。上側波紋管2〇係設置成包圍連接支撐板19與真 空處理室12之第1支柱π。另外，下侧波紋管22係設置成包 圍連接支撐板21與真空處理室12之第2支柱18。 此外’藉驅動系統16的動作可施加負載於下側波紋管 22。為了充分吸收該負載，需要比較長的下側波紋管22。 較長的下側波紋管22，增大驅動系統16與真空處理室12之 間隔’在謀求貼合基板製造裝置11的小型化上形成障礙。 另外，因為下側波紋管22的内側空間增加真空處理室12的 容積，故真空泵23使真空處理室12減壓的時間變長。波紋 管20、22，配合耐用期間雖有必要定期地交換，不過相對 於在上侧波紋管20藉加壓系統15施加加壓時的負載，在波 紋管22則是藉加壓系統15施加在加壓時的負載，與藉驅動 系統16施加對位時之負載。因此，下侧波紋管22的耐用期 間比較短。交換下側波紋管22時，與交換上側波紋管20比 較’需要基板製造裝置11的大幅解體作業。因此，下側波 紋管22的交換作業繁雜，必須使基板製造裝置^長時間地 停止，使貼合基板的生產性降低。 相對於此，專利文獻2提出在真空處理室（腔室）内黏合 保持平板，藉驅動系統隨著真空處理室（腔室）使保持平板移 動，進行基板的對準(對位)之製造裝置。在該構造中，由於 第10圖之下側波紋管22及第2支柱18可以免除，所以可以減 少零件點數，且提昇維修性。 然而，專利文獻2的製造裝置，一旦在基板貼合時使真 空處理室内減壓，則由於該真空處理室的内部壓力和外部 的大氣壓之差，真空處理室會產生若干變形。保持平板直 接受真空處理室變形的影響，存在有產生保持平板表面的 %曲與2個保持平板的位置偏移之問題。在貼合相互對向之 2片基板所製造之液晶顯示板中，封入液晶後之基板間隔 (槽間隙）為例如5μπι且極為狹小。為了以預定之槽間隙貼合 2片基板，有必要將2片基板維持於高度之平行度。保持平 板表面的彎曲使2片基板的平行度降低，很難達成預定的槽 間隙。因此，有必要抑制保持平板表面的彎曲，也就是保 持平面的平面度的變化。 專利文獻1 特開2002_040398號公報 專利文獻2 特開2002-229044號公報（詳細說明書的段落[〇233] 〜[0236]、第 31 圖） H 明内 j 發明概要 本發明之目的，係提供一種便宜、維修性優良，且以 高精度貼合2片基板之貼合基板製造裝置。 本發明之第1形態係提供一種貼合基板製造裝置，在可 以減壓之處理室内，藉相互對向配置之第1及第2保持平 板，保持2片基板，並且貼合前述2片基板。加壓系統係設 置於前述處理室的外部，使貼合用之加壓力作用於2片基 板。藉第1支撐構件，連接前述加壓系統與前述第丨保持平 板’使第1保持平板，在貼合2片基板時，與處理室的内面 分開配置。第2保持板係藉第2支撐構件，被支撐於與前述 處理室的内面分開之位置。驅動系統係使處理室及第2保持 平板作水平移動及水平旋轉，以對位2片基板。驅動系統係 設置於處理室的外部，且與處理室連接。 本發明之第2形態係提供一種貼合基板製造裝置，在可 以減壓之處理室内，藉相互對向配置之第1及第2保持平 板，保持2片基板，並且貼合前述2片基板。設置於處理室 的外部之加壓系統，係使貼合用之加壓力作用於2片基板。 第1支撐構件連接加壓系統與前述第1保持平板，使第1保持 平板，在貼合2片基板時，與前述處理室的内面分開配置。 驅動系統係設置於處理室的内部，使第2保持平板作水平移 動及水平旋轉，以對位2片基板。驅動系統支撐第2保持板， 使第2保持平板，在對位2片基板時，與處理室的内面分開 配置。 200423229 圖式簡單說明 第1圖為本發明之第1實施形態之貼合基板製造裝置的 模式圖。 第2圖為貼合基板製造裝置之控制機構之區塊圖。 5 第3圖為本發明之第2實施形態之貼合基板製造裝置的 模式圖。 第4圖為本發明之第3實施形態之貼合基板製造裝置的 模式圖。 第5圖為本發明之其他形態之貼合基板製造裝置的模 10 式圖。 第6圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第7圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 15 第8圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第9圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第10圖為習知之貼合基板製造裝置的模式圖。 20 【實施方式】 較佳實施例之詳細說明 以下，依照圖式說明本發明之第1實施形態之貼合基板 製造裝置。 第1圖為表示第1實施型態的貼合基板製造裝置。貼合 200423229 基板製造製造裝置31，包含有底板33，與固定於其底板μ 之門狀之支樓框33。底板32及支撐框33係由具有相當高剛 性之之材質所形成。在支撐框33内側之略中央，設置進行 基板W卜W2的貼合處理之真空處理室（腔室）。在真空處理 5室34的上方，設置有使貼合用之加壓力作用於基板W1、 W2之加壓糸統35。在真空處理室34的下方，設置有進行基 板Wl、W2的對位之驅動系統36。 首先，針對加壓系統35加以說明。加壓系統35包含導 執38a、38b，線性導執39a、39b，第1〜第3支撐板41〜43， 10及馬達44。導執38a、38b，係安裝於支撐框33的支柱部内 侧面的兩側，線性導執39a、39b係藉該導軌38a、38b支撐 成可以上下移動。在兩側之線性導執39a、39b之間，架設 有第1及第2支撐板41、42。第1支撐板41係藉由利用安裝於 支撐框33的上部之馬達44上下運動之第3支撐板43來懸 15吊。第3支概43係由上板、下板及連接板所形成 。該上板 設置有螺帽46，該下板則絲有多數(本實施形態中為物） 測力器48。該連接板連接上板與下板。滾珠螺桿45係整體 可以旋轉地連結於馬達44的輸出軸，第3支撐板43的螺帽如 螺合滾珠螺桿45。因此，馬達44可藉正/反旋轉驅動滾珠螺 20桿45，使第3支撐板43上下移動。 真空處理室34係由上下可以分割之上侧容器3如與下 測谷盗34b所形成，用以減壓真空處理室％之真空聚％係藉 真空配管49與真空處理室34連接。在真空處理室Μ内，相 互對向地設置有具有用以分別吸著保持基板W1之吸 10 盤機構之第丨及第2保持平板51、52。又，藉吸盤機構，基 板W卜W2的吸著保持係使用真空吸盤(吸引吸著）及靜電吸 盤(靜電吸著）中之至少一者來進行。 第1保持平板51係設置於上侧容器34a内。第1保持平板 51係透過4根第1支柱，藉第2支撐板42懸掛支撐。在基板貼 合時，設定第1支柱53的長度，使第1保持平板51與真空處 理室34的上内面分開配置，也就是使第丨保持平板51不與真 空處理室34的上内面接觸。另外，在第2支撐板42與上側容 器34a之間，設置著彈性體（波紋管）54以包圍各支柱53。上 側容器34a係藉波紋管54，懸掛支撐於第2支撐板42。在波 紋管54的兩端，形成有具有〇環(省略圖示）之凸緣部。藉〇 環密封第2支撐板42與上側容器34a之間，並保持真空處理 室34内之氣密。 弟2保持平板52係設置於下側容器34b内。第2保持平板 52係藉4根第2支柱56與支撐板57連接，而下側容器34b則藉 4根第3支柱58與支撐板57連接。支撐板57係藉多數驅動機 構59支撐，且驅動機構59固定於底板32。在支撐於驅動機 構59之支撐板57上之預定位置上，立設有第2支柱56與第3 支柱58。而且，藉第2支柱56支撐第2保持平板52，藉第3支 柱58支撐著下側容器34b。第2支柱56比第3支柱58長，第2 支柱56的長度係設定成使第2保持平板，與真空處理室料的 下内面分開配置，也就是，使第2保持平板52不與真空處理 室34的下内面接觸。 驅動機構59使用驅動用馬達64(第2圖），使支撐板57於 200423229 X方向及Y方向水平移動，且使其水平旋轉方向）。驅動 系統36包含驅動機構59與支撐板57與驅動用馬達。 收容各第2支柱56之貫通孔係形成於下側容器34b，而〇 環60喪入各貫通孔。〇環6〇堵塞第2支柱56與下側容器34b 5之間之間隙，且保持真空處理室34的氣密。 其次’使用第2圖說明貼合基板製造裝置31的控制機 構。又，在第2圖中，對於與在第丨圖說明之構造相同之構 造部分，則賦予相同符號。 貼合基板製造裝置31包含有真空處理室34的壓力（真 10空泵50)，貼合用之加壓力（加壓用馬達44)，及用以控制基 板的對位（驅動系統36)之控制裝置61。控制裝置61為，例 如’ 一般之PLC(Programmable Logic Controllers)。在控制 裝置61連接測力器48，影像處理裝置62，壓力傳感器63， 加壓用馬達44,驅動系統36的驅動用馬達64,及真空果50。 15 控制裝置61算出由各測力器48的輸出信號賦予基板 W卜W2之負載，並因應所算出之負載產生馬達驅動信號， 將其馬達驅動信號供給至加壓用馬達44。加壓用馬達44則 依照馬達驅動信號驅動，使第1保持平板51上升或下降。 另外，控制裝置61依據由影像處理裝置62之輸出信 20 號，將所產生之馬達驅動信號供給至驅動馬達64，詳而言 之，貼合基板製造裝置31包含有在基板貼合時攝影用以作 兩基板Wl、W2的對位之對準符號之CCD攝影機（省略圖 示）。該CCD攝影機，係在貼合時攝影形成於基板W1、W2 之對準符號，將其影像資料供給至影像處理裝置62。控制 12 200423229 裝置Q因應其影像處理裝置62的演算結果(位置偏移量的 算出資料)，產生馬達驅動信號，並將其馬達驅動信號供給 至驅動用馬達64。驅動用馬達64依照馬達驅動信號旋轉， 且作動驅動機構59。藉驅動機構59的作動，移動支撐板57、 第2保持平板52及下側容器34b，進行兩基板W1、W2之對 位0 壓力傳感器63係配置於真空處理室34内之第i及第3保 持平板51、52之附近，輸出因應該真空處理室34内之壓力 之檢出信號。在減壓下，為了貼合基板臂丨、W2，控制裝 1〇置61，係依據壓力傳感器63之檢出信號，調節真空泵5〇的 蘇動與ό又置於真空配管49之閥（省略圖示）的開關。藉真空粟 50及閥的控制，將真空處理室34調節成所希望的減壓狀態。 其次’針對貼合基板製造裝置31的動作加以說明。 在貼合基板製造裝置31中，若第3支撐板43，藉加壓用 15馬達44之驅動作上下移動，則線性導執39a、39b藉測力器 48及第1支撐板41，沿著導執38a、38b作上下移動，上側容 器34a，則藉第2支撐板42及波紋管54作上下移動。上侧容 器34a，藉下降至與下侧容器34b抵接為止，閉塞真空處理 室34。 20 其後，若驅動真空泵50，則真空處理室34被減壓。在 該狀態，進一步，若旋轉加壓用馬達44，使線性導執39a、 39b下降，則上侧容器34a不會下降，且第2支撐板42、第1 支柱53及第1保持平板51下降，並壓縮波紋管54。 第2保持平板52係藉第2支柱56支撐於支撐板57，下側 13 200423229 容器34b(被閉塞之真空處理室34)，係藉第3支柱58支撐於支 撐板57。在該狀態下，若驅動系統36動作，則第2保持平板 52與真空處理室34形成一體，於X方向及γ方向水平移動， 並且水平旋轉（Θ方向），進行基板Wl、W2的對位。在該對 5 位時，伴隨X方向及Y方向的移動與水平旋轉之負載係藉由 波紋管54吸收。另外，由於剛體性地連接於驅動系統36之 支撐板57以使第2保持平板52與真空處理室34 —體地移 動，在基板Wl、W2之對位時，不會施加負載於設置在下 侧容器34b與第2支柱56之間之Ο環60。 0 而且，貼合基板製造裝置31在進行保持於第1保持平板 51及第2保持平板52之基板Wl、W2之對位後，藉加壓系統 35，施加加壓力於各基板W1、W2間，以進行貼合。 其次，將本發明之第1實施形態之貼合基板製造裝置31 之特徵記載於如下。 5 (1)在基板W1、W2的對位時，一體地移動真空處理室 34與第2保持平板52，在第2支柱56與真空處理室34的接觸 部分(〇環），幾乎不施加負載，因此，可以使用便宜之〇環， 替代第10圖所示之下側波紋管22，作為氣密保持構件，可 以削減製造裝置31的製造成本。另外，如第1G圖所示，由 0於沒有必要設置下側波紋管22，所以可以縮短減壓真空處 理至34時之純時間。進—步，可縮短連接第2保持平板^ 與驅動系統36之第2支柱56，製造裝置31可以小型化。 (2)第1保持平板51，係作為與真空處理室34分開之第1 支揮構件之支擇於第i支柱53，第2保持平板52，係作為與 14 真空處理室34分開之第2支撐構件之支撐於第2支柱56。藉 該構造，在基板貼合時之減壓下，即使在真空處理室34產 生變形時，由於可以防止其力作用於第1及第2保持平板 51、52，所以即使在該減壓下，亦不會對基板Wl、W2的 相對位置與平行度產生影響。藉此，可以正確地進行基板 W卜W2的對位，並可以進行精度佳的基板Wl、W2的貼合。 以下，針對本發明之第2實施形態加以說明。 第2實施形態中，針對與第1實施型態的構造相同者， 賦予相同的符號，並且簡略化其說明。以下以與第1實施形 態之不同點為中心加以說明。 如第3圖所示，在第2實施形態之貼合基板製造裝置3ia 中，驅動系統36之驅動機構59設置於真空處理室34内部， 且第2保持平板52直接連接於該驅動機構59。 詳而言之，多數驅動機構59固定於底板32上，並藉各 驅動機構59支撐著第2保持平板52。該驅動機構59與第1實 施形態同樣地動作，使第2保持平板52水平移動(X方向及γ 方向），並且水平旋轉（0方向）。 在下側容器34b的下面，設置有包圍驅動機構59之剛體 筒71 ’且下側容器34b藉其剛體筒71支撐於底板32上。另 外，該剛體筒71作為用以保持真空處理室34的氣密之氣密 保持構件之功能之構件，且在兩端之凸緣部具有〇環（省略 圖示）。藉其〇環密封下側容器34b與底板32之間，剛體筒71 的内側之空間與處理室34的内部空間連通。因此，剛體筒 71分劃處理室34的一部份。 200423229 在剛體筒71的側面，設置有面向驅動機構59之排氣口 71a，而排氣口 71a係藉配管72與真空泵73連接。該真空泵 73另外設置有用以在真空狀態下使真空處理室34減壓之前 述真空泵50。 5 本實施形態之貼合基板製造裝置之控制機構，如第 2圖之虛線所示，追加有真空泵73與壓力傳感器74。在該貼 合基板製造裝置31a中，於真空處理室34内，第1壓力傳感 器63係配置於保持平板51、52的附近，第2壓力傳感器74係 配置於驅動機構59的附近。也就是，第1壓力傳感器63檢出 10 基板Wl、W2的附近之壓力，且第2壓力傳感器74檢出驅動 機構59的附近之壓力。 控制裝置61，係依據各壓力傳感器63、74之檢出信號， 控制各真空泵50、73。具體而言，控制裝置61，首先驅動 第2真空泵73，在減壓至驅動機構59的附近之大氣被排氣到 15預定壓力之階段，驅動第1真空泵50。 貼合基板製造裝置31a係與第1實施形態之貼合基板製 造裝置31相同，藉驅動加壓系統35之馬達44，使上側容器 34a下降，密封該上側容器34a與下側容器34b，並閉塞真空 處理室34。而且，在該狀態下進一步若使馬達44向下降方 20向旋轉，則推壓波紋管54，藉第2支撐版42、第1支柱53， 僅使第1保持平板51下降。 此時，驅動系統36之驅動機構59動作，進行基板W1、 W2的對位。具體而言，藉驅動機構59的動作，該驅動機構 59上之第2保持平板52 ，於X方向及Y方向水平移動，並且 16 200423229 水平旋轉（0方向），適當地進行基版界丨、W2的對位。 在該對位時，因隨著驅動機構59的動作之摩耗，會有 由该驅動機構59發生粒子的情形。在本實施形態中係採用 了驅動機構59的附近之氣體，藉排氣口 71a及配管72由真空 5泵73排氣之構造作為對策。因此，即使由驅動機構59發生 粒子，亦可以防止粒子向基板Wl、W2飛揚。特別是，藉 第1真空泵50先行真空處理室34的排氣，再藉第2真空栗73 進行排氣，可以確實地防止粒子的飛揚，可以提高真空處 理室34的清潔度。 10 其次，將本發明之第2實施形態之貼合基板製造裝置 31a的特徵記載如下。 (1) 在貼合基板製造裝置31a中，將驅動機構59設置於真 空處理室34内，在基板Wl、W2的對位時，由於為僅使第2 保持平板52移動之構造，所以在包圍第1支柱53之波紋管54 15 上，不會施加隨著驅動機構59移動之負載。因此，波紋管 54的使用期限可以延長。 (2) 由於驅動機構59直接的連接於第2保持平板52,所以 沒有必要如第1實施形態，設置支撐第2保持平板52之第2支 柱56，與支撐下側容器34b之第3支柱58。因此，可以謀求 20 製造裝置31a的製造成本的削減與製造裝置31a的小型化。 (3) 在剛體筒71的側面，設置著面向驅動機構59之排氣 口 71a，藉其排氣口 71a的排氣，可以去除在驅動機構59發 生之粒子。藉此，可以將真空處理室34内保持於清潔的狀 態。 17 756 200423229 (4)用以由棑氣口 71 a去除粒子之第2真空泵π，係設置 在與用以將真空處理室34減壓至真空狀態之第i真空泵5〇 不同之處。在該情形下，由於可以在為了去除粒子的最適 當時機進行排氣，所以可以提高真空處理室34内之清潔度。 5 (5)將構成驅動糸統36之驅動用馬達64，與驅動機構59 等之中之僅驅動機構59，配置於真空處理室34内。在該情 形下，可以抑制真空處理室34的容器的增加，實用上較佳。 以下，針對本發明之第3實施形態加以說明。 第4圖為表示第3實施形態之貼合基板製造裝置^丨^。但 10 是，對於與上述之第1實施形態的構造相同者，則賦予相同 的符號，並且簡化其說明。另外，支撐框33與加壓系統35 的構造，係與第1實施形態相同，在第4圖省略其圖示。 詳而言之，在真空處理室34(下側容器34b)，固定有多 數(在本實施例為4個）之支撐台座75，在該支撐台座75的上 15面’固之有苐2保持平板52。支撑台座75，係分別設置於第 2保持平板52的下面之四角。如此，使支撐台座75介於第2 保持平板52與真空處理室34之間，且第2保持平板52係與真 空處理室34的内面分開配置。 另外，真空處理室34的下側容器34b係藉支撐處理室34 2〇全體之支柱76，支撐於驅動系統36的支撐板57上。該支柱 76係形成於四角錐台狀之剛體，且支柱76的上面係抵接於 真空處理室34，而支柱76的下面則抵接於支撐板57。支柱 76的上面之面積比下面的面積大，支柱76的上面之面積， 以與真空處理室34的下面之面積相等較佳。 18 在貼合基板製造裝置31b中，亦與第丨實施形態同樣 i士， 旦驅動系統36動作，則真空處理室34與第2保持平板 52形成—體，於X方向及γ方向水平移動，並且水平旋轉 方向），可以進行基板Wl、W2的對位。 其次，將本發明之第3貫施形態之貼合基板製造裝置 31b的特徵記載於如下。 (1) 貼合基板製造裝置31b，由於可以免除真空處理室34 與驅動系統36之間之下側波紋管22(第10圖），所以可以削減 基板製造裝置31a的製造成本。另外，可以縮短減壓真空處 理室34時之排氣時間，進一步，可以謀求基板製造裝置31a 的小型化。 (2) 由於真空處理室34全體係藉支柱76所支撐，所以可 以防止隨著減壓真空處理室34的變形。進一步，在作為第2 支撐構件之支撐台座75上，固定第2保持平板52，藉分開設 置第2保持平板52與真空處理室34,可以抑制因隨著減壓真 空處理室34的變形所造成之基板W1、W2之位置偏移。 (3) 藉以四角錐台狀之支柱％支撐真空處理室料全體， 可以確實地抑制減壓時之真空處理室34的變形。另外，支 柱6若與使用四角柱狀之支柱的情形相比較，由於重量 杈輕，所以可以得到輕量之貼合基板製造裝置31b。 各實施形態亦可作如以下之變更。 •貼合基板製造裝置31，雖為設置有4根第1〜第3支柱 53 56、58者’不過並不限制於此，亦可設置有4根以外數 目之支柱者。當然，第1〜第3支柱53、56、58亦可使其為分 200423229 別不同數目者，例如亦可為僅設置1根第2支柱56之構造。 •貼合基板製造裝置31，亦可為如第5圖〜第7圖所示變 更第2保持平板52與驅動系統36之連接部分之構造。 在第5圖所示之構造中，在真空處理室34的内部，具有 5位在该真空處理室34的底面與第2保持平板52之間之〇琿 6〇，藉該〇環60保持真空處理室34的氣密。詳而言之，在第 2保持平板52的下面與第2支柱56之間，設置有圓盤狀之支 撐台座78，且其抵接於其支撐台座78的下面之外緣部配置 有〇環60。也就是，該〇環60係設置成包圍第2支柱％之上 1〇端(位於處理室34内之端部）的外周，藉該Ο環60密封支撐台 座78與真空處理室34之間，可以保持該真空處理室％的氣 密。另外，在該構造中，考慮減壓時之真空處理室34的變 形，選定吸收其變形且可以充分保持真空處理室34的氣密 之〇環60。在該構造中亦具有與第丨實施形態相同的特徵: 15 在第6圖所示之構造中，在真空處理室34的内部，具有 位於該真空處理室34的底面與第2保持平板52之間之波紋 管79,藉該波紋管79保持真空處理室料的氣密。詳而言之， 波紋管79係在上下兩端之凸緣部具有〇環(省略圖示），且設 置成包圍第2支柱56之上端（位於處理室34内之端部）的外 20周。波紋管79上端之凸緣部連接於第2保持平板52的下面， 而下側之凸緣部則連接於下側容器34b的内側，藉各凸緣部 之〇環，密封於第2保持平板52與真空處理室34之間，可以 保持該真空處理室34的氣密。在該構造中，隨著在基板 Wl、W2的對位時之驅動系統36的移動之負載，由於不會 20 200423229 加於波紋管79，所以波紋管79只要是具有可保持氣密之密 封功能者即可，沒有必要如習知技術具有可吸收負載之彈 性功能。因此，可以使用長度較短之波紋管79，具有與第1 實施形態相同之特徵。 5 在第7圖所示之構造中，在驅動系統36的支撐板57上， 藉第2支柱56支撐第2保持平板52，藉剛體筒81支撐下側容 器34b。剛體筒81係配置成包圍第2支柱56，具有作為可保 持真空處理室34的氣密之氣密保持構件之功能。也就是， 剛體同81在兩端之凸緣部具有〇環(省略圖示），藉該〇環密 10封於下侧谷為34b與支撲板57之間，可以保持真空處理室34 的氣密。在該構造中，亦具有與第1實施形態相同之構造。 •在第3實施形態之貼合基板製造裝置31b中，亦可移 除支撐處理室34下面之全體支柱76。此時，如第8圖所示， 宜移除驅動系統36之支撐板57,且將用以支撐第2保持平板 15 52之支撐台座75配置於形成驅動機構59的正上方之位置。 在下側容器34b與驅動機構59之連接部位，為了抑制減壓時 的變形，在其部位（驅動機構59)的正上方，藉配置支撐台座 75，可以防止因真空處理室34的變形而產生之基板W1、 W2的位置偏移。 20 •在各實施形態中，真空處理室34雖為分割成上下之 構造，不過並不限定於此，例如亦可為如第9圖所示之真空 處理室83的構造。另外，在第9圖之構造中，與第丨實施形 態不同之點係設置有用以包圍第1支柱53波紋管84及磁氣 密封85。 21 詳而言之，真空處理室83係具有用以開關該處理室83 之閘閥86。在該真空處理室83内，對向設置第1及第2保持 平板51、52，且第1保持平板51係藉第1支柱53懸掛支撐於 第2支撐板42上’而第2保持平板52係藉第2支柱56支撐於驅 動系統36之支撐板57上。真空處理室83的上面係藉設置包 圍第1支柱53之波紋㈣與磁氣密封μ，可以氣密地與第〕 支撐板42連接。該波紋管84與魏密封％係相互連接，具 ，作為用以保持真空處理室83的氣密之氣密保持構件之功 能。另外，真空處理室83的下面係藉0環60密封與第2支柱 %接觸之部分，可以保持氣密。此外，加壓系統％係與第】 實施形態者相同。 即使為使用具有如上述之構造之真空處理室趵之第9 圖之貼合基板製造裝置，亦具有與第丨實施形態相同之特 徵。另外，藉使用由波紋管84與磁氣密封85所形成之氣密 保持構件，可以確實地吸收因驅動系統36的移動所產生之 負載。也就是，在對位基板Wl、W2時，藉驅動系統36使 真空處理室34於X方向及γ方向直線移動時，波紋管料可吸 收其直線移動之負載，而當真空處理室34水平旋轉時（0方 向磁氣密封85可吸收其旋轉的負載。 【阖式簡單說明3 第1圖為本發明之第1實施形態之貼合基板製造裝置的 模式圖。 第2圖為貼合基板製造裝置之控制機構之區塊圖。 第3圖為本發明之第2實施形態之貼合基板製造褒置的 200423229 模式圖。 第4圖為本發明之第3實施形態之貼合基板製造裝置的 模式圖。 第5圖為本發明之其他形態之貼合基板製造裝置的模 5 式圖。 第6圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第7圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 10 第8圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第9圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第10圖為習知之貼合基板製造裝置的模式圖。 15 【圖式之主要元件代表符號表】 41…第1支撐板 43…第3支撐板 45…滾珠螺桿 12…真空處理室 14、52…第2保持平板 16、36…驅動系統 18、56…第2支柱 20…上側波紋管 32…底板 11、31…基板製造裝置 13、51…第1保持平板 15、35…加壓系統 17…第1支柱 19、21…支撐板 22…下側波紋管 33…支撐框 34a、12a…上側容器 38a、38b…導執 23 200423229 34…真空處理室(腔室） 61…控制裝置 34b、12b…下側容器 62…影像處理裝置 39a、39b…線性導軌 63、74…壓力傳感器 42…第2支撐板 64…驅動用馬達 44…馬達(加壓用） 71、81···剛體筒 46…螺帽 71a…排氣口 48…測力器 72…配管 50…真空泵 73…真空泵 53…支柱 76…支柱 54、79、84…波紋管 83…真空處理室 57…支撐板 85···磁氣密封 58…第3支柱 86…閘閥 59…驅動機構 Wl、W2…基板 60···Ο環 24说明 Description of the invention: [Technical field to which the invention belongs] Field of the invention The present invention relates to a manufacturing apparatus for bonding substrates (boards). In particular, 疋 relates to a method for bonding two substrates at predetermined intervals to manufacture a liquid crystal display. Device (Liquid Crystal Display; LCD) and other devices for laminating substrates (boards). ϋ Prior Art 3 Background of the Invention In recent years, flat display panels such as LCDs have gradually become larger and lighter, and the demand for reducing manufacturing costs has increased. Therefore, even in a bonded substrate manufacturing apparatus for bonding two substrates to manufacture a flat display panel, although the size is increased in accordance with the size of the panel, a manufacturing apparatus that is inexpensive and improves productivity is still required. The liquid crystal display panel is, for example, an array substrate in which a plurality of thin film transistors (TFTs) are formed in a matrix and a color filter substrate (red, green, blue) or a light-shielding film is formed at an extremely narrow interval (number " Opposite, and it is manufactured by sealing liquid crystal between these two substrates. The manufacturing of the conventional liquid crystal display panel is to put the bonded substrate into a real jade tank, immerse the liquid crystal into the injection port, and then restore the vacuum chamber to In the atmosphere, a vacuum injection method is used to inject liquid crystal between substrates and seal the injection port. In recent years, for example, a frame in which a sealing material is formed along the peripheral edge portion of an array substrate is often used. The method of dropping and injecting the array substrate and the color chip substrate in the middle bonding (refer to Patent Document 1). FIG. 10 shows a conventional bonded substrate manufacturing apparatus 11 for bonding substrates by the dropping injection method. In the bonded substrate manufacturing apparatus 11 In the vacuum processing chamber (cavity) 12, the first and second holding plates 13, 14 are arranged to face each other, and the substrates W1 and W2 are held on the holding plates 13, 14, respectively. The vacuum processing chamber 12 is provided by It is divided into upper and lower upper containers 12a and 12b. A pressure system 15 is provided above the vacuum processing chamber 12, and a drive system 16 is provided below the vacuum processing chamber 12. The first holding plate 13 is The pressure system 15 is connected via the first support 17 and the drive system 16 is connected to the second holding plate 14 via the second support 18. The pressure system 15 is used to attach the substrates wi and W2 to the substrate. W1, W2. The alignment of the substrates W1 and W2 is performed by the operation of the drive system 16. The upper bellows 20 is provided to surround the first pillar π connecting the support plate 19 and the vacuum processing chamber 12. The lower bellows 22 It is provided to surround the second pillar 18 connecting the support plate 21 and the vacuum processing chamber 12. In addition, a load can be applied to the lower bellows 22 by the operation of the drive system 16. In order to fully absorb the load, a relatively long lower bellows is required. Tube 22. The longer lower bellows 22 increases the distance between the drive system 16 and the vacuum processing chamber 12, which is an obstacle to miniaturization of the bonded substrate manufacturing apparatus 11. The inner side of the lower bellows 22 Increased vacuum processing 12 volume, so the vacuum pump 23 decompresses the vacuum processing chamber 12 for a longer time. Although the bellows 20 and 22 need to be exchanged regularly during the durability period, it is applied by the pressure system 15 on the upper bellows 20 The load during pressurization is the load applied to the bellows 22 by the pressurizing system 15 during pressurization, and the load applied when the alignment is applied by the drive system 16. Therefore, the durability period of the lower side bellows 22 is relatively short. When the lower corrugated tube 22 is exchanged, a large disassembly operation of the substrate manufacturing apparatus 11 is required compared with the replacement of the upper corrugated tube 20. Therefore, the exchange operation of the lower corrugated tube 22 is complicated, and the substrate manufacturing apparatus must be stopped for a long time so that The productivity of the bonded substrate is reduced. On the other hand, Patent Document 2 proposes a manufacturing device that adheres and holds a flat plate in a vacuum processing chamber (chamber), and moves the holding plate along with the vacuum processing chamber (chamber) by a driving system to perform alignment (alignment) of the substrate. . In this structure, since the lower side corrugated tube 22 and the second pillar 18 in Fig. 10 can be eliminated, the number of parts can be reduced and maintainability can be improved. However, in the manufacturing apparatus of Patent Document 2, once the vacuum processing chamber is decompressed during substrate bonding, the vacuum processing chamber is slightly deformed due to the difference between the internal pressure of the vacuum processing chamber and the external atmospheric pressure. Retaining the flat plate Straightly receiving the influence of the deformation of the vacuum processing chamber, there is a problem that the% curvature of the surface of the holding plate and the position of the two holding plates are shifted. In a liquid crystal display panel manufactured by bonding two substrates facing each other, the substrate interval (slot gap) after sealing the liquid crystal is, for example, 5 μm and is extremely narrow. In order to bond two substrates with a predetermined slot gap, it is necessary to maintain the parallelism of the two substrates at a height. Maintaining the curvature of the flat plate surface reduces the parallelism of the two substrates, making it difficult to achieve a predetermined slot gap. Therefore, it is necessary to suppress the variation of the flatness of the surface of the holding plate, that is, the flatness of the holding plane. Patent Document 1 JP 2002_040398 Patent Document 2 JP 2002-229044 (paragraphs [0213] to [0236] in the detailed description, FIG. 31) H Mingnej Summary of the Invention The object of the present invention is to provide a A bonded substrate manufacturing device that is inexpensive, has excellent maintainability, and bonds two substrates with high accuracy. A first aspect of the present invention is to provide a bonded substrate manufacturing apparatus, which holds two substrates by first and second holding flat plates arranged facing each other in a processing chamber capable of reducing pressure, and bonds the two substrates. The pressurizing system is placed outside the aforementioned processing chamber, and the pressing force for bonding is applied to two substrates. The first holding member is connected to the pressurizing system and the first holding plate, so that the first holding plate is disposed separately from the inner surface of the processing chamber when the two substrates are bonded. The second holding plate is supported by a second supporting member at a position separated from the inner surface of the processing chamber. The driving system moves the processing chamber and the second holding plate horizontally and rotates horizontally to align the two substrates. The drive system is provided outside the processing chamber and is connected to the processing chamber. A second aspect of the present invention is to provide a bonded substrate manufacturing apparatus, which holds two substrates by first and second holding flat plates arranged facing each other in a processing chamber capable of reducing pressure, and bonds the two substrates. A pressurizing system installed outside the processing chamber causes the pressing force for bonding to be applied to two substrates. The first supporting member is connected to the pressurizing system and the first holding plate, and the first holding plate is arranged separately from the inner surface of the processing chamber when the two substrates are bonded. The driving system is installed inside the processing chamber, and horizontally moves and rotates the second holding plate to align the two substrates. The driving system supports the second holding plate so that the second holding plate is arranged separately from the inner surface of the processing chamber when the two substrates are aligned. 200423229 Brief Description of Drawings Fig. 1 is a schematic diagram of a bonded substrate manufacturing apparatus according to a first embodiment of the present invention. Fig. 2 is a block diagram of a control mechanism of a bonded substrate manufacturing apparatus. 5 Fig. 3 is a schematic view of a bonded substrate manufacturing apparatus according to a second embodiment of the present invention. Fig. 4 is a schematic view of a bonded substrate manufacturing apparatus according to a third embodiment of the present invention. Fig. 5 is a pattern diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. Fig. 6 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. Fig. 7 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. 15 FIG. 8 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. Fig. 9 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. FIG. 10 is a schematic diagram of a conventional bonded substrate manufacturing apparatus. [Embodiment] Detailed description of a preferred embodiment Hereinafter, a bonded substrate manufacturing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a bonded substrate manufacturing apparatus showing a first embodiment. The 200423229 substrate manufacturing device 31 includes a bottom plate 33 and a door-shaped branch frame 33 fixed to the bottom plate μ. The bottom plate 32 and the support frame 33 are formed of a material having a relatively high rigidity. A vacuum processing chamber (chamber) for attaching the substrates W2 and W2 is provided at a slightly center of the inside of the support frame 33. Above the vacuum processing chamber 34, a pressurizing system 35 is provided which applies a pressing force for bonding to the substrates W1 and W2. Below the vacuum processing chamber 34, a drive system 36 for positioning the substrates W1 and W2 is provided. First, the pressurizing system 35 will be described. The pressurizing system 35 includes guides 38a, 38b, linear guides 39a, 39b, first to third support plates 41 to 43, 10, and a motor 44. The guides 38a and 38b are mounted on both sides of the inner side of the support portion of the support frame 33, and the linear guides 39a and 39b are supported by the guide rails 38a and 38b so as to be movable up and down. Between the linear guides 39a and 39b on both sides, first and second support plates 41 and 42 are erected. The first support plate 41 is suspended by a third support plate 43 which is vertically moved by a motor 44 mounted on an upper portion of the support frame 33. The third branch 43 is formed by an upper plate, a lower plate and a connecting plate. The upper plate is provided with a nut 46, and the lower plate is provided with a plurality of wires (objects in this embodiment) and a load cell 48. The connecting plate connects the upper plate and the lower plate. The ball screw 45 is integrally rotatably connected to the output shaft of the motor 44, and the nut of the third support plate 43 is, for example, a ball screw 45 which is screwed on. Therefore, the motor 44 can drive the ball screw 20 lever 45 forward / reverse to move the third support plate 43 up and down. The vacuum processing chamber 34 is formed by the upper container 3 which can be divided up and down, and is connected to the lower measuring valley pirate 34b. The vacuum concentration of the vacuum processing chamber% is connected to the vacuum processing chamber 34 through a vacuum pipe 49. In the vacuum processing chamber M, second and second holding plates 51 and 52 each having a suction 10 disk mechanism for holding and holding the substrate W1 are provided opposite to each other. In addition, the suction and holding of the substrates W2 and W2 is performed by at least one of a vacuum chuck (suction suction) and an electrostatic chuck (electrostatic suction) by a chuck mechanism. The first holding plate 51 is provided in the upper container 34a. The first holding plate 51 is suspended and supported by the second support plate 42 through the four first pillars. When the substrates are bonded, the length of the first stay 53 is set so that the first holding plate 51 and the upper inner surface of the vacuum processing chamber 34 are arranged separately, that is, the first holding plate 51 does not contact the upper inner surface of the vacuum processing chamber 34. An elastic body (corrugated tube) 54 is provided between the second support plate 42 and the upper container 34a so as to surround each of the pillars 53. The upper container 34a is suspended and supported by the second support plate 42 by a bellows 54. Flange portions having o-rings (not shown) are formed at both ends of the corrugated tube 54. A ring is used to seal the space between the second support plate 42 and the upper container 34a, and the airtightness in the vacuum processing chamber 34 is maintained. The second brother holding plate 52 is installed in the lower container 34b. The second holding plate 52 is connected to the support plate 57 by four second pillars 56 and the lower container 34b is connected to the support plate 57 by four third pillars 58. The support plate 57 is supported by a plurality of driving mechanisms 59, and the driving mechanism 59 is fixed to the bottom plate 32. At a predetermined position supported on the support plate 57 of the driving mechanism 59, a second pillar 56 and a third pillar 58 are erected. The second holding plate 52 is supported by the second support 56 and the lower container 34b is supported by the third support 58. The second pillar 56 is longer than the third pillar 58, and the length of the second pillar 56 is set so that the second holding plate is disposed separately from the lower inner surface of the vacuum processing chamber material, that is, the second holding plate 52 is not subjected to vacuum processing. The lower inner surface of the chamber 34 is in contact. The driving mechanism 59 uses a driving motor 64 (Fig. 2) to move the support plate 57 horizontally in the 200423229 X direction and the Y direction, and to make it rotate horizontally). The drive system 36 includes a drive mechanism 59, a support plate 57 and a drive motor. The through holes for accommodating the second pillars 56 are formed in the lower container 34b, and the o-ring 60 is inserted into each of the through holes. The 〇ring 60 closes the gap between the second pillar 56 and the lower container 34b 5 and maintains the airtightness of the vacuum processing chamber 34. Next, the control mechanism of the bonded substrate manufacturing apparatus 31 will be described using FIG. 2. In Fig. 2, the same reference numerals are given to the same structural portions as those described in Fig. 1A. The bonded substrate manufacturing apparatus 31 includes the pressure of the vacuum processing chamber 34 (true 10 empty pump 50), the pressure applied for bonding (pressurizing motor 44), and the control for positioning the substrate (drive system 36). Controller 61. The control device 61 is, for example, a general PLC (Programmable Logic Controllers). The control device 61 is connected with a load cell 48, an image processing device 62, a pressure sensor 63, a pressure motor 44, a drive motor 64 of the drive system 36, and a vacuum fruit 50. 15 The control device 61 calculates the load given to the substrate W2 and W2 by the output signal of each load cell 48, generates a motor drive signal in accordance with the calculated load, and supplies the motor drive signal to the pressure motor 44. The pressurizing motor 44 is driven in accordance with a motor drive signal to raise or lower the first holding plate 51. In addition, the control device 61 supplies the generated motor drive signal to the drive motor 64 based on the output signal 20 of the image processing device 62. Specifically, the bonded substrate manufacturing device 31 includes a device for photographing when the substrates are bonded. A CCD camera (not shown) used as an alignment mark for the alignment of the two substrates W1 and W2. This CCD camera shoots the alignment symbols formed on the substrates W1 and W2 at the time of bonding, and supplies the image data to the image processing device 62. Control 12 200423229 The device Q generates a motor drive signal in accordance with the calculation result (position offset calculation data) of the image processing device 62, and supplies the motor drive signal to the drive motor 64. The driving motor 64 rotates in accordance with a motor driving signal, and operates the driving mechanism 59. By the operation of the driving mechanism 59, the support plate 57, the second holding plate 52, and the lower container 34b are moved to align the two substrates W1 and W2. The pressure sensor 63 is the i-th and the third ones arranged in the vacuum processing chamber 34. In the vicinity of the holding plates 51 and 52, a detection signal corresponding to the pressure in the vacuum processing chamber 34 is output. Under the reduced pressure, in order to fit the substrate arms 丨 and W2, the control device 10 is set 61. Based on the detection signal of the pressure sensor 63, the movement of the vacuum pump 50 and the valve of the vacuum piping 49 (omitted) (Illustrated). By controlling the vacuum pump 50 and the valve, the vacuum processing chamber 34 is adjusted to a desired reduced pressure state. Next, the operation of the bonded substrate manufacturing apparatus 31 will be described. In the bonded substrate manufacturing apparatus 31, if the third support plate 43 is moved up and down by the driving of the pressure 15 motor 44, the linear guides 39a and 39b borrow the dynamometer 48 and the first support plate 41, The guides 38a and 38b move up and down, and the upper container 34a moves up and down by the second support plate 42 and the bellows 54. The upper container 34a is lowered until it comes into contact with the lower container 34b, and the vacuum processing chamber 34 is closed. 20 Thereafter, when the vacuum pump 50 is driven, the vacuum processing chamber 34 is decompressed. In this state, when the pressure motor 44 is rotated to lower the linear guides 39a and 39b, the upper container 34a is not lowered, and the second support plate 42, the first pillar 53, and the first holding plate 51 are lowered. And compress the bellows 54. The second holding plate 52 is supported on the supporting plate 57 by the second support 56 and the lower side 13 200423229 container 34b (the closed vacuum processing chamber 34) is supported on the supporting plate 57 by the third support 58. In this state, if the drive system 36 operates, the second holding plate 52 and the vacuum processing chamber 34 are integrated, and move horizontally in the X and γ directions, and rotate horizontally (the Θ direction) to align the substrates W1 and W2. . In the pair of 5 positions, the loads accompanying the movements in the X and Y directions and horizontal rotation are absorbed by the bellows 54. In addition, since the support plate 57 of the driving system 36 is rigidly connected to move the second holding plate 52 and the vacuum processing chamber 34 as one body, no load is applied to the lower side when the substrates W1 and W2 are aligned. O ring 60 between the container 34b and the second pillar 56. 0 Furthermore, the bonded substrate manufacturing apparatus 31 performs alignment of the substrates W1 and W2 held on the first holding plate 51 and the second holding plate 52, and then applies a pressing force between the substrates W1 and W2 through the pressurizing system 35. To fit. Next, features of the bonded substrate manufacturing apparatus 31 according to the first embodiment of the present invention will be described below. 5 (1) When the substrates W1 and W2 are aligned, the vacuum processing chamber 34 and the second holding plate 52 are moved integrally, and the contact portion (o-ring) between the second pillar 56 and the vacuum processing chamber 34 is hardly applied with a load. Therefore, instead of the lower bellows 22 shown in FIG. 10, an inexpensive O-ring can be used as an airtight holding member, and the manufacturing cost of the manufacturing apparatus 31 can be reduced. In addition, as shown in Fig. 1G, since it is not necessary to provide the lower bellows 22, it is possible to shorten the pure time of the reduced-pressure vacuum processing to 34 hours. Further, the second holding plate ^ and the second pillar 56 of the driving system 36 can be shortened, and the manufacturing apparatus 31 can be miniaturized. (2) The first holding plate 51 is selected as the first support member separated from the vacuum processing chamber 34 as the i-th pillar 53, and the second holding plate 52 is provided as the second separated from the 14 vacuum processing chamber 34. The support member is supported by the second pillar 56. With this structure, even when the vacuum processing chamber 34 is deformed under reduced pressure at the time of substrate bonding, the force can be prevented from acting on the first and second holding plates 51 and 52. Therefore, even under this reduced pressure, Nor does it affect the relative positions and parallelism of the substrates W1, W2. Accordingly, the substrates W2 and W2 can be accurately aligned, and the substrates W1 and W2 can be bonded with high accuracy. Hereinafter, a second embodiment of the present invention will be described. In the second embodiment, the same reference numerals are given to the same structures as those in the first embodiment, and the description is simplified. The following description focuses on the differences from the first embodiment. As shown in FIG. 3, in the bonded substrate manufacturing apparatus 3ia of the second embodiment, the driving mechanism 59 of the driving system 36 is provided inside the vacuum processing chamber 34, and the second holding plate 52 is directly connected to the driving mechanism 59. In detail, most of the driving mechanisms 59 are fixed to the bottom plate 32, and each of the driving mechanisms 59 supports the second holding plate 52. This driving mechanism 59 operates in the same manner as the first embodiment, and moves the second holding plate 52 horizontally (X direction and γ direction) and rotates horizontally (0 direction). A rigid body cylinder 71 'surrounding the drive mechanism 59 is provided under the lower container 34b, and the lower container 34b is supported on the bottom plate 32 by the rigid body cylinder 71'. In addition, the rigid body cylinder 71 serves as a member for maintaining the airtight and airtight holding member of the vacuum processing chamber 34, and has o-rings (not shown) at flange portions at both ends. The space between the lower container 34 b and the bottom plate 32 is sealed by the O-ring, and the space inside the rigid body tube 71 communicates with the internal space of the processing chamber 34. Therefore, the rigid body cylinder 71 delimits a part of the processing chamber 34. 200423229 On the side of the rigid body cylinder 71, an exhaust port 71a facing the driving mechanism 59 is provided, and the exhaust port 71a is connected to the vacuum pump 73 through a pipe 72. The vacuum pump 73 is additionally provided with the vacuum pump 50 described previously to decompress the vacuum processing chamber 34 in a vacuum state. 5 The control mechanism of the bonded substrate manufacturing apparatus of this embodiment is shown by a dotted line in FIG. 2, and a vacuum pump 73 and a pressure sensor 74 are added. In this bonded substrate manufacturing apparatus 31a, in the vacuum processing chamber 34, a first pressure sensor 63 is disposed near the holding plates 51 and 52, and a second pressure sensor 74 is disposed near the driving mechanism 59. That is, the first pressure sensor 63 detects the pressure near the substrates W1 and W2, and the second pressure sensor 74 detects the pressure near the driving mechanism 59. The control device 61 controls the vacuum pumps 50 and 73 based on the detection signals from the pressure sensors 63 and 74. Specifically, the control device 61 first drives the second vacuum pump 73, and drives the first vacuum pump 50 at a stage where the pressure in the vicinity of the driving mechanism 59 is exhausted to a predetermined pressure of 15 °. The bonded substrate manufacturing apparatus 31a is the same as the bonded substrate manufacturing apparatus 31 of the first embodiment. The upper container 34a is lowered by driving the motor 44 of the pressurizing system 35, and the upper container 34a and the lower container 34b are sealed and closed. Vacuum processing chamber 34. When the motor 44 is further rotated in the lowering direction 20 in this state, the bellows 54 is pushed, and only the first holding plate 51 is lowered by the second support plate 42 and the first support 53. At this time, the driving mechanism 59 of the driving system 36 is operated, and the substrates W1 and W2 are aligned. Specifically, by the action of the driving mechanism 59, the second holding plate 52 on the driving mechanism 59 moves horizontally in the X direction and the Y direction, and 16 200423229 rotates horizontally (direction 0) to appropriately perform the basic plate boundary. W2 alignment. During this alignment, particles may be generated by the driving mechanism 59 due to friction caused by the operation of the driving mechanism 59. In the present embodiment, the gas in the vicinity of the driving mechanism 59 is adopted, and the exhaust port 71a and the piping 72 are exhausted by a vacuum pump 73 as a countermeasure. Therefore, even if particles are generated by the driving mechanism 59, the particles can be prevented from flying toward the substrates W1 and W2. In particular, the first vacuum pump 50 first evacuates the vacuum processing chamber 34 and then the second vacuum pump 73 to evacuate the particles, thereby reliably preventing particles from flying and improving the cleanliness of the vacuum processing chamber 34. 10 Next, features of the bonded substrate manufacturing apparatus 31a according to the second embodiment of the present invention will be described below. (1) In the bonded substrate manufacturing apparatus 31a, the driving mechanism 59 is provided in the vacuum processing chamber 34, and when the substrates W1 and W2 are aligned, the structure is such that only the second holding plate 52 is moved. The bellows 54 15 of the first pillar 53 does not apply a load that moves with the driving mechanism 59. Therefore, the life of the bellows 54 can be extended. (2) Since the driving mechanism 59 is directly connected to the second holding plate 52, it is not necessary to provide the second support 56 supporting the second holding plate 52 and the third support 58 supporting the lower container 34b as in the first embodiment. . Therefore, it is possible to reduce the manufacturing cost of the manufacturing apparatus 31a and miniaturize the manufacturing apparatus 31a. (3) An exhaust port 71a facing the driving mechanism 59 is provided on the side of the rigid body cylinder 71, and particles generated in the driving mechanism 59 can be removed by exhausting the exhaust port 71a. Thereby, the inside of the vacuum processing chamber 34 can be kept in a clean state. 17 756 200423229 (4) The second vacuum pump π for removing particles from the gas port 71 a is provided at a position different from the i-th vacuum pump 50 for decompressing the vacuum processing chamber 34 to a vacuum state. In this case, since the exhaust can be performed at an optimum timing for removing particles, the cleanliness in the vacuum processing chamber 34 can be improved. 5 (5) The driving motor 64 constituting the driving system 36 and only the driving mechanism 59 among the driving mechanisms 59 and the like are arranged in the vacuum processing chamber 34. In this case, it is possible to suppress an increase in the number of containers in the vacuum processing chamber 34, which is practically preferable. Hereinafter, a third embodiment of the present invention will be described. FIG. 4 shows a bonded substrate manufacturing apparatus according to a third embodiment. However, the same reference numerals are assigned to those having the same structure as the first embodiment described above, and the description is simplified. The structures of the support frame 33 and the pressurizing system 35 are the same as those of the first embodiment, and their illustration is omitted in FIG. 4. Specifically, in the vacuum processing chamber 34 (the lower container 34 b), a plurality of (four in this embodiment) support bases 75 are fixed, and the upper 15 faces of the support bases 75 are fixed and held. Tablet 52. The support pedestals 75 are provided at the four corners of the lower surface of the second holding plate 52, respectively. In this way, the support base 75 is interposed between the second holding plate 52 and the vacuum processing chamber 34, and the second holding plate 52 is disposed separately from the inner surface of the vacuum processing chamber 34. In addition, the lower container 34 b of the vacuum processing chamber 34 is supported by a support plate 57 of the drive system 36 via a pillar 76 supporting the entire processing chamber 34 2 0. The pillar 76 is formed in a quadrangular pyramid-shaped rigid body. The upper surface of the pillar 76 is in contact with the vacuum processing chamber 34, and the lower surface of the pillar 76 is in contact with the support plate 57. The area of the upper surface of the pillar 76 is larger than the area of the lower surface. The area of the upper surface of the pillar 76 is preferably equal to the area of the lower surface of the vacuum processing chamber 34. 18 In the bonded substrate manufacturing device 31b, as in the first embodiment, once the driving system 36 operates, the vacuum processing chamber 34 and the second holding plate 52 form a body, and move horizontally in the X direction and the γ direction. And horizontal rotation direction), the substrate W1, W2 can be aligned. Next, the characteristics of the bonded substrate manufacturing apparatus 31b according to the third embodiment of the present invention will be described below. (1) Since the bonded substrate manufacturing apparatus 31b can eliminate the lower bellows 22 (Fig. 10) between the vacuum processing chamber 34 and the drive system 36, the manufacturing cost of the substrate manufacturing apparatus 31a can be reduced. In addition, the exhaust time at the time of the reduced-pressure vacuum processing chamber 34 can be shortened, and further, the size of the substrate manufacturing apparatus 31a can be reduced. (2) Since the entire system of the vacuum processing chamber 34 is supported by the pillars 76, it is possible to prevent deformation of the vacuum processing chamber 34 due to the decompression. Further, the second holding plate 52 is fixed to the supporting base 75 as the second supporting member, and by providing the second holding plate 52 and the vacuum processing chamber 34 separately, the deformation caused by the decompression vacuum processing chamber 34 can be suppressed. The positions of the substrates W1 and W2 are shifted. (3) By supporting the entire vacuum processing chamber material with a square pyramid-shaped pillar%, it is possible to reliably suppress the deformation of the vacuum processing chamber 34 during decompression. In addition, compared with the case where a quadrangular pillar-shaped pillar is used, the pillar 6 is light in weight, so that a light-weight bonded substrate manufacturing apparatus 31b can be obtained. Each embodiment can be modified as follows. • The bonded substrate manufacturing apparatus 31 is provided with four first to third pillars 53 56, 58 and 58 ', but is not limited to this, and a number of pillars other than four may be provided. Of course, the first to third pillars 53, 56, and 58 can also be made into different numbers, such as 200423229. For example, a structure in which only one second pillar 56 is provided. The bonded substrate manufacturing apparatus 31 may have a structure in which the connection portion between the second holding plate 52 and the drive system 36 is changed as shown in Figs. 5 to 7. In the structure shown in FIG. 5, inside the vacuum processing chamber 34, there are 5 to 60 between the bottom surface of the vacuum processing chamber 34 and the second holding plate 52, and the vacuum is maintained by the 0 ring 60. The processing chamber 34 is airtight. Specifically, a disc-shaped support base 78 is provided between the lower surface of the second holding plate 52 and the second pillar 56, and an outer ring portion is arranged to abut the lower surface of the support base 78. 60. That is, the O-ring 60 is provided so as to surround the outer periphery of the end 10 (the end located in the processing chamber 34) above the second pillar%, and the O-ring 60 is used to seal the support stand 78 and the vacuum processing chamber 34. The vacuum processing chamber can be kept hermetically sealed. In addition, in this structure, considering the deformation of the vacuum processing chamber 34 when the pressure is reduced, the airtight ring 60 that absorbs the deformation and sufficiently maintains the vacuum processing chamber 34 is selected. This structure also has the same features as the first embodiment: 15 In the structure shown in FIG. 6, the inside of the vacuum processing chamber 34 includes the bottom surface of the vacuum processing chamber 34 and the second holding plate 52. The intermediate bellows 79 is used to maintain the airtightness of the vacuum processing chamber material. Specifically, the bellows 79 is provided with o-rings (not shown) on the flange portions at the upper and lower ends, and is provided so as to surround the outer periphery of the upper end of the second pillar 56 (the end portion located in the processing chamber 34). . The flange portion at the upper end of the bellows 79 is connected to the lower surface of the second holding plate 52, and the lower flange portion is connected to the inside of the lower container 34b, and is sealed to the second holding plate by a ring of each flange portion. The airtightness of the vacuum processing chamber 34 can be maintained between 52 and the vacuum processing chamber 34. In this structure, as the load of the driving system 36 moves during the alignment of the substrates W1 and W2, since 20 200423229 is not added to the bellows 79, the bellows 79 may have a sealing function capable of maintaining airtightness. It is only necessary that there is no need to have the elastic function of absorbing load as in the conventional technology. Therefore, the corrugated tube 79 having a short length can be used, and has the same characteristics as those of the first embodiment. 5 In the structure shown in FIG. 7, on the support plate 57 of the drive system 36, the second holding plate 52 is supported by the second support 56 and the lower container 34b is supported by the rigid body tube 81. The rigid body cylinder 81 is arranged so as to surround the second pillar 56 and functions as an airtight holding member capable of holding the airtightness of the vacuum processing chamber 34. That is, the rigid body has 81 rings (not shown) at the flange portions at both ends, and the 0 ring is tightly sealed between the lower valley 34b and the flapper plate 57 to maintain the vacuum processing chamber 34. airtight. This structure also has the same structure as that of the first embodiment. In the bonded substrate manufacturing apparatus 31b of the third embodiment, it is also possible to remove all the pillars 76 supporting the processing chamber 34 below. At this time, as shown in FIG. 8, the supporting plate 57 of the driving system 36 should be removed, and a supporting base 75 for supporting the second holding plate 15 52 should be disposed directly above the driving mechanism 59. In order to prevent the deformation of the vacuum processing chamber 34 due to the deformation of the vacuum processing chamber 34, a support stand 75 is arranged directly above the position (driving mechanism 59) of the connection portion between the lower container 34b and the driving mechanism 59 to suppress deformation during decompression. The positions of the substrates W1 and W2 are shifted. 20 In each embodiment, although the vacuum processing chamber 34 is divided into a vertical structure, it is not limited to this. For example, the vacuum processing chamber 83 may have a structure as shown in FIG. 9. In addition, in the structure shown in Fig. 9, a point different from the first embodiment is provided to surround the first pillar 53 with a bellows 84 and a magnetic seal 85. 21 In detail, the vacuum processing chamber 83 has a gate valve 86 for opening and closing the processing chamber 83. In the vacuum processing chamber 83, first and second holding plates 51 and 52 are provided opposite to each other, and the first holding plate 51 is suspended and supported on the second support plate 42 by the first support 53 and the second holding plate 52 The second support 56 is supported on the support plate 57 of the drive system 36. The upper surface of the vacuum processing chamber 83 is provided with a corrugated tube surrounding the first pillar 53 and a magnetic seal μ, and can be air-tightly connected to the first support plate 42. The bellows 84 and the Wei seal are connected to each other and have a function as an airtight holding member for holding the airtightness of the vacuum processing chamber 83. In addition, the lower surface of the vacuum processing chamber 83 is sealed by the 0 ring 60, and the portion in contact with the second pillar% can be kept airtight. The pressurization system% is the same as that in the first embodiment. Even if the bonded substrate manufacturing apparatus of the ninth figure having the vacuum processing chamber 构造 structured as described above is used, it has the same characteristics as the first embodiment. In addition, by using the airtight holding member formed by the bellows 84 and the magnetic seal 85, it is possible to reliably absorb the load caused by the movement of the drive system 36. That is, when the substrates W1 and W2 are aligned, when the vacuum processing chamber 34 is linearly moved in the X and γ directions by the driving system 36, the corrugated tube material can absorb the load of the linear movement, and when the vacuum processing chamber 34 is horizontally rotated (0 direction magnetic seal 85 can absorb its rotating load. [Simplified description of the formula 3] Figure 1 is a schematic diagram of a bonded substrate manufacturing apparatus according to the first embodiment of the present invention. Figure 2 is a bonded substrate manufacturing Block diagram of the control mechanism of the device. Fig. 3 is a 200423229 pattern diagram of a bonded substrate manufacturing apparatus according to the second embodiment of the present invention. Figure 4 is a schematic diagram of a bonded substrate manufacturing apparatus according to the third embodiment of the present invention. Schematic diagram. Fig. 5 is a pattern diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. Fig. 6 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. 10 is a schematic view of a bonded substrate manufacturing apparatus of another form of the present invention. FIG. 9 is a schematic view of a bonded substrate manufacturing apparatus of another form of the present invention. . Fig. 10 is a schematic diagram of a conventional bonded substrate manufacturing apparatus. 15 [Representative symbols of main components of the drawing] 41 ... the first support plate 43 ... the third support plate 45 ... the ball screw 12 ... the vacuum processing chambers 14, 52 ... 2nd holding plate 16, 36 ... drive system 18, 56 ... 2nd pillar 20 ... upper bellows 32 ... bottom plate 11, 31 ... substrate manufacturing apparatus 13, 51 ... 1st holding plate 15, 35 ... pressurizing system 17 ... 1 pillars 19, 21 ... support plate 22 ... lower bellows 33 ... support frames 34a, 12a ... upper containers 38a, 38b ... guide 23 200423229 34 ... vacuum processing chamber (chamber) 61 ... control device 34b, 12b ... lower Side container 62 ... Image processing devices 39a, 39b ... Linear guides 63, 74 ... Pressure sensor 42 ... Second support plate 64 ... Drive motor 44 ... Motor (for pressurization) 71, 81 ... Rigid body tube 46 ... Nuts 71a ... exhaust port 48 ... force gauge 72 ... pipe 50 ... vacuum pump 73 ... vacuum pump 53 ... pillar 76 ... pillars 54,79,84 ... corrugated tube 83 ... vacuum processing chamber 57 ... support plate 85 ... magnetic seal 58 ... the third pillar 86 ... the gate valve 59 ... the drive mechanisms Wl, W2 ... the substrate 60 ·· ΟΟ24 24