玖、發明說明： 【發明所屬之技術領域3 發明領域 本發明係關於一種貼合基板(板）的製造裝置，詳而t 之，是關於一種以預定的間隔貼合2片基板，製造液晶顯示 裝置(Liquid Crystal Display; LCD)等之貼合基板(板)之裝置。 【先前技術3 發明背景 近年，LCD荨之平面顯示板，逐漸走向大型化· _量 化，且要求削減製造成本的呼聲更加高漲。因此，即使在 貼合2片的基板以製造平面顯示板之貼合基板製造裝置 中，雖因應面板尺寸而大型化，不過仍需要便宜且使生產 性提昇之製造裝置。 液晶顯示板係，例如，使多數薄膜晶體管(TFT)形成矩 狀之陣列基板與开》成渡色片（紅、綠、藍）或遮光膜等之漁 色片基板以極為狹小之_(數"m)對向，並藉封 於 這2片基板間來製造。 、 空槽’將液晶浸入注入口後，藉使該真空槽内： 在,板間注入液晶，並密封注入口的真空注入法。^ 复:使用例如沿著陣列基板的周緣部形成密封材的相 广封材的框内滴下規（量的液晶，在真空中貼合啤 反與^色片基板之滴下注人法。（參照專利文獻〇 弟1 〇圖係表示藉滴下注人法貼合基板之習知之銳 板製造裝置11。 在貼合基板製造裝置U之真空處理室(腔室）12内，相互 對向配置第1及第2_平板13、14，在各㈣平板13、14 上分別保持著基板Wl、W2。真空處理室12，係由可以分 割成上下之上側容器12a與下側容器⑶所構成。在真空處 理室12的上方設有加㈣統15，且在真空處理室12的下方 設有驅動系統16。第1鋪平板丨3補第1纽17連接加麼 系統15，且第2保持平板14係、藉第2支柱18連接驅動系統 16 °加壓系統15係在進行基板W1、W2的貼合時使加壓 力作用於基板WhW2。藉驅動系統16的動作進行基板们、 W2的對位。上側波紋管2〇係設置成包圍連接支撐板19與真 空處理室12H支柱17。另外，τ側赦管⑽設置成包 圍連接支撐板21與真空處理室12之第2支柱18。 此外，藉驅動系統16的動作可施加負載於下側波紋管 22 °為了充分吸收該負載，需要比較長的下侧波紋管22。 較長的下側波紋管22，增大驅動系統16與真空處理室12之 間隔’在謀求貼合基板製造裝置11的小型化上形成障礙。 另外’因為下側波紋管22的内側空間增加真空處理室12的 容積’故真空泵23使真空處理室12減壓的時間變長。波紋 官20、22 ’配合耐用期間雖有必要定期地交換，不過相對 於在上側波紋管20藉加壓系統15施加加壓時的負載，在波 紋管22則是藉加壓系統15施加在加壓時的負載，與藉驅動 系統16施加對位時之負載。因此，下側波紋管22的耐用期 間比較短。交換下側波紋管22時，與交換上側波紋管2〇比 較，需要基板製造裝置11的大幅解體作業。因此，下側波 紋管22的交換作業繁雜，必須使基板製造裝置丨丨長時間地 停止，使貼合基板的生產性降低。 相對於此，專利文獻2提出在真空處理室（腔室）内黏合 保持平板，藉驅動系統隨著真空處理室（腔室）使保持平板移 動，進行基板的對準（對位)之製造裝置。在該構造中，由於 第10圖之下側波紋管22及第2支柱18可以免除，所以可以減 零件點數’且提昇維修性。 然而，專利文獻2的製造裝置，一旦在基板貼合時使真 空處理室内減壓，則由於該真空處理室的内部壓力和外部 的大氣壓之差，真空處理室會產生若干變形。保持平板直 接受真空處理室變形的影響，存在有產生保持平板表面的 彎曲與2個保持平板的位置偏移之問題。在貼合相互對向之 2片基板所製造之液晶顯示板中，封入液晶後之基板間隔 (槽間隙）為例如5μηι且極為狹小。為了以預定之槽間隙貼合 2片基板，有必要將2片基板維持於高度之平行度。保持平 板表面的彎曲使2片基板的平行度降低，很難達成預定的槽 間隙。因此，有必要抑制保持平板表面的彎曲，也就是保 持平面的平面度的變化。 專利文獻1 特開2002-040398號公報 專利文獻2 特開2002-229044號公報（詳細說明書的段落[〇233] [0236] ' 第 31 圖） 【明内^^ 3 發明概要 本發明之目的，係提供一種便宜、維修性優良，且以 高精度貼合2片基板之貼合基板製造裝置。 本發明之第1形態係提供一種貼合基板製造裝置，在可 以減壓之處理室内，藉相互對向配置之第1及第2保持平 板，保持2片基板，並且貼合前述2片基板。加壓系統係設 置於前述處理室的外部，使貼合用之加壓力作用於2片基 板。藉第1支撐構件，連接前述加壓系統與前述第丨保持平 板，使第1保持平板，在貼合2片基板時，與處理室的内面 分開配置。第2保持板係藉第2支撐構件，被支撐於與前述 處理室的内面分開之位置。驅動系統係使處理室及第2保持 平板作水平移動及水平旋轉，以對位2片基板。驅動系統係 設置於處理室的外部，且與處理室連接。 本發明之第2形態係提供一種貼合基板製造裝置，在可 以減壓之處理室内，藉相互對向配置之第丨及第2保持平 板，保持2片基板，並且貼合前述2片基板。設置於處理室 的外部之加壓系統，係使貼合用之加壓力作用於2片基板。 第1支撐構件連接加壓系統與前述第丨保持平板，使第丨保持 平板，在貼合2片基板時，與前述處理室的内面分開配置。 驅動系統係設置於處理室的内部，使第2保持平板作水平移 動及水平㈣，崎位2#絲。购系統支撐第2保持板， 使第2保持平板，在對位2片基板時，與處理室的内面分開 配置。 1222671 圖式簡單說明 第1圖為本發明之第1實施形態之貼合基板製造裝置的 模式圖。 第2圖為貼合基板製造裝置之控制機構之區塊圖。 5 第3圖為本發明之第2實施形態之貼合基板製造裝置的 模式圖。 第4圖為本發明之第3實施形態之貼合基板製造裝置的 模式圖。 第5圖為本發明之其他形態之貼合基板製造裝置的模 10 式圖。 第6圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第7圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 15 第8圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第9圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第10圖為習知之貼合基板製造裝置的模式圖。 20 【實施方式】 較佳實施例之詳細說明 以下，依照圖式說明本發明之第1實施形態之貼合基板 製造裝置。 第1圖為表示第1實,施型態的貼合基板製造裝置。貼合 9 基板製造製造裝置31，包含有底板33，與固定於其底板32 之門狀之支撐框33。底板32及支撐框33係由具有相當高剛 性之之材質所形成。在支撐框33内側之略中央，設置進行 基板W1、W2的貼合處理之真空處理室（腔室）。在真空處理 室34的上方，設置有使貼合用之加壓力作用於基板W1、 W2之加壓系統35。在真空處理室34的下方，設置有進行基 板Wl、W2的對位之驅動系統36。 首先，針對加壓系統35加以說明。加壓系統35包含導 執38a、38b，線性導執39a、39b，第1〜第3支撐板41〜43， 及馬達44。導執38a、38b，係安裝於支撐框33的支柱部内 側面的兩側，線性導執39a、39b係藉該導軌38a、38b支撐 成可以上下移動。在兩側之線性導執39a、3%之間，架設 有第1及第2支撐板41、42。第1支撐板41係藉由利用安裝於 支撐框33的上部之馬達44上下運動之第3支撐板43來懸 吊。第3支撐板43係由上板、下板及連接板所形成。該上板 設置_帽46，該下板則安裝有多數(本實施形態中為*個） 測力器48。忒連接板連接上板與下板。滾珠螺桿衫係整體 可以旋轉地連結於馬達44的輸出軸，第3支撐板Μ的螺帽如 螺合滾珠螺桿45。因此，馬達44可藉正驅動滾珠螺 桿45，使第3支撐板43上下移動。 處理室34係由上下可以分割之上側容器*與下 測谷⑴4b所形成，用以減壓真空處理室34之真空泵观藉 真工配官49與真空處理室34連接。在真空處理室％内，相 互對向地設置有具有用以分職著㈣基板Wi、W2之吸 1222671 盤機構之第1及第2保持平板51、52。又，藉吸盤機構，基 板Wl、W2的吸著保持係使用真空吸盤（吸引吸著）及靜電吸 盤(靜電吸著）中之至少一者來進行。 第1保持平板51係設置於上側容器34a内。第1保持平板 5 51係透過4根第1支柱，藉第2支撐板42懸掛支撐。在基板貼 合時，設定第1支柱53的長度，使第1保持平板51與真空處 理室34的上内面分開配置，也就是使第1保持平板51不與真 空處理室34的上内面接觸。另外，在第2支撐板42與上側容 器34a之間，設置著彈性體（波紋管）54以包圍各支柱53。上 10 側容器34a係藉波紋管54，懸掛支撐於第2支撐板42。在波 紋管54的兩端，形成有具有〇環(省略圖示）之凸緣部。藉〇 環密封第2支撐板42與上侧容器34a之間，並保持真空處理 室34内之氣密。 第2保持平板52係設置於下側容器34b内。第2保持平板 15 52係藉4根第2支柱56與支撐板57連接，而下側容器34b則藉 4根第3支柱58與支撐板57連接。支撐板57係藉多數驅動機 構59支撐，且驅動機構59固定於底板32。在支撐於驅動機 構59之支撐板57上之預定位置上，立設有第2支柱56與第3 支柱58。而且’藉第2支柱56支撑第2保持平板52，藉第3支 20柱58支撐著下側容器34b。第2支柱56比第3支柱58長，第2 支柱56的長度係設定成使第2保持平板，與真空處理室％的 下内面分開配置，也就是，使第2保持平板52不與真空處理 室34的下内面接觸。 驅動機構59使用驅動用馬達64(第2圖），使支撐板57於 11 1222671 /方向及γ方向水平移動，且使其水平旋轉（a方向）。驅動 系先36包含·動機構59與支撐板57與驅動用馬達。 收容各第2支柱％之貫通孔係形成於下側容 器34tp而0 環60嵌入各貫通孔。0環60堵塞第2支柱56與下側容器34b 5之間之間隙’且保持真空處理室洲氣密。 其次，使用第2圖說明貼合基板製造裝置31的控制機 構。又，在第2圖中，對於與在第丨圖說明之構造相同之構 造部分，則賦予相同符號。 貼合基板製造裝置31包含有真空處理室34的壓力（真 10空泵5〇)，貼合用之加壓力（加壓用馬達44)，及用以控制基 板的對位（驅動系統36)之控制裝置61。控制裝置61為，例 如，一般之PLC(Pr〇grammable Logic Controllers)。在控制 裝置61連接測力器48，影像處理裝置62，壓力傳感器63， 加壓用馬達44,驅動系統36的驅動用馬達64,及真空泵5〇。 15 控制裝置61算出由各測力器48的輸出信號賦予基板发明 Description of the invention: [Technical field to which the invention belongs 3 Field of the invention The present invention relates to a manufacturing apparatus for bonding substrates (boards). Specifically, it relates to a method for bonding two substrates at predetermined intervals to manufacture a liquid crystal display. Device (Liquid Crystal Display; LCD) and other devices for laminating substrates (boards). [Prior Art 3 Background of the Invention In recent years, LCD flat panel display panels have gradually increased in size and volume, and the demand for reducing manufacturing costs has increased. Therefore, even in a bonded substrate manufacturing apparatus for bonding two substrates to manufacture a flat display panel, although it is increased in size in accordance with the size of the panel, a manufacturing apparatus that is inexpensive and has improved productivity is still required. The liquid crystal display panel system, for example, makes most thin film transistors (TFTs) form a rectangular array substrate and open color film (red, green, blue) or light-shielding film substrates such as light-shielding films with extremely narrow _ (number " m) are opposed to each other, and are manufactured by sealing between the two substrates. After the liquid crystal is immersed in the injection port, the vacuum chamber is used to inject liquid crystal between the plates and seal the injection port by a vacuum injection method. ^ Re: using, for example, a dripping gauge (amount of liquid crystal) in the frame of a sapphire sealing material that forms a sealing material along the peripheral edge of the array substrate. Patent Document 〇 Brother 1 〇 The figure shows a conventional sharp-plate manufacturing apparatus 11 for bonding substrates by a drop injection method. The vacuum processing chamber (chamber) 12 of the bonded substrate manufacturing apparatus U is disposed to face each other. And the second flat plates 13, 14 hold the substrates W1, W2 on each of the flat plates 13, 14, respectively. The vacuum processing chamber 12 is formed by being divided into upper and lower upper containers 12a and lower containers ⑶. In a vacuum A processing system 12 is provided above the processing system 12 and a driving system 16 is provided below the vacuum processing chamber 12. The first slab 丨 3 complements the first button 17 is connected to the GM system 15 and the second holding plate 14 is 2. The drive system 16 is connected to the drive system 16 through the second pillar 18, and the pressurization system 15 is used to apply the pressing force to the board WhW2 when the substrates W1 and W2 are bonded. The bellows 20 is provided to surround and connect the support plate 19 and the vacuum processing chamber 12H. Column 17. In addition, the τ-side pardon tube ⑽ is provided so as to surround the second pillar 18 connecting the support plate 21 and the vacuum processing chamber 12. In addition, a load can be applied to the lower corrugated tube 22 ° by the action of the drive system 16 in order to fully absorb the The load requires a relatively long lower corrugated tube 22. The longer lower corrugated tube 22 increases the distance between the drive system 16 and the vacuum processing chamber 12, which is an obstacle to miniaturization of the bonded substrate manufacturing apparatus 11. In addition, 'Because the inner space of the lower bellows 22 increases the volume of the vacuum processing chamber 12', the vacuum pump 23 decompresses the vacuum processing chamber 12 for a longer time. The bellows 20, 22 'Although it is necessary to exchange regularly during the durability period, but With respect to the load when the upper bellows 20 is pressurized by the pressure system 15, the bellows 22 is the load when the pressure is applied by the pressure system 15 and the load when it is aligned with the drive system 16. Therefore, the durability period of the lower corrugated tube 22 is relatively short. When the lower corrugated tube 22 is exchanged, a large disassembling operation of the substrate manufacturing apparatus 11 is required compared with the exchange of the upper corrugated tube 20. Therefore, the lower corrugated tube 22 is replaced. The replacement operation is complicated, and the substrate manufacturing apparatus must be stopped for a long time to reduce the productivity of the bonded substrate. In contrast, Patent Document 2 proposes that a flat plate is adhered and held in a vacuum processing chamber (chamber), and a driving system is used. As the vacuum processing chamber (chamber) moves the holding plate, the manufacturing device for aligning (aligning) the substrates. In this structure, since the lower side bellows 22 and the second pillar 18 in FIG. 10 can be eliminated, Therefore, it is possible to reduce the number of component points and improve maintainability. However, in the manufacturing apparatus of Patent Document 2, once the vacuum processing chamber is depressurized when the substrates are bonded, due to the difference between the internal pressure of the vacuum processing chamber and the external atmospheric pressure, There are several deformations in the vacuum processing chamber. The holding plate is straight. Under the influence of the deformation of the vacuum processing chamber, there is a problem that the surface of the holding plate is bent and the position of the two holding plates is shifted. In a liquid crystal display panel manufactured by bonding two substrates facing each other, the substrate interval (slot gap) after sealing the liquid crystal is, for example, 5 μm and is extremely narrow. In order to bond two substrates with a predetermined slot gap, it is necessary to maintain the parallelism of the two substrates at a height. Maintaining the curvature of the flat plate surface reduces the parallelism of the two substrates, making it difficult to achieve a predetermined slot gap. Therefore, it is necessary to suppress the variation of the flatness of the surface of the holding plate, that is, the flatness of the holding plane. Patent Document 1 JP-A-2002-040398 Patent Document 2 JP-A-2002-229044 (paragraph of the detailed description [0233] [0236] 'Figure 31) [Akimoto ^^ 3 Summary of the invention The object of the present invention, Provides a bonded substrate manufacturing device that is inexpensive, has excellent maintainability, and bonds two substrates with high accuracy. A first aspect of the present invention is to provide a bonded substrate manufacturing apparatus, which holds two substrates by first and second holding flat plates arranged facing each other in a processing chamber capable of reducing pressure, and bonds the two substrates. The pressurizing system is placed outside the aforementioned processing chamber, and the pressing force for bonding is applied to two substrates. The first support member is connected to the pressurizing system and the first holding plate, so that the first holding plate is arranged separately from the inner surface of the processing chamber when the two substrates are bonded. The second holding plate is supported by a second supporting member at a position separated from the inner surface of the processing chamber. The driving system moves the processing chamber and the second holding plate horizontally and rotates horizontally to align the two substrates. The drive system is provided outside the processing chamber and is connected to the processing chamber. A second aspect of the present invention is to provide a bonded substrate manufacturing apparatus, which holds two substrates by adhering the first and second holding flat plates facing each other in a pressure-reducing processing chamber, and bonds the two substrates. A pressurizing system installed outside the processing chamber causes the pressing force for bonding to be applied to two substrates. The first supporting member is connected to the pressurizing system and the first holding plate, so that the second holding plate is disposed separately from the inner surface of the processing chamber when the two substrates are bonded. The driving system is installed inside the processing chamber to make the second holding plate move horizontally and horizontally. The purchase system supports the second holding plate so that the second holding plate is arranged separately from the inner surface of the processing chamber when the two substrates are aligned. 1222671 Brief Description of Drawings Fig. 1 is a schematic diagram of a bonded substrate manufacturing apparatus according to a first embodiment of the present invention. Fig. 2 is a block diagram of a control mechanism of a bonded substrate manufacturing apparatus. 5 Fig. 3 is a schematic view of a bonded substrate manufacturing apparatus according to a second embodiment of the present invention. Fig. 4 is a schematic view of a bonded substrate manufacturing apparatus according to a third embodiment of the present invention. Fig. 5 is a pattern diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. Fig. 6 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. Fig. 7 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. 15 FIG. 8 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. Fig. 9 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. FIG. 10 is a schematic diagram of a conventional bonded substrate manufacturing apparatus. [Embodiment] Detailed description of a preferred embodiment Hereinafter, a bonded substrate manufacturing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a device for manufacturing a bonded substrate showing the first embodiment and application mode. The bonding 9 substrate manufacturing manufacturing device 31 includes a bottom plate 33 and a gate-shaped support frame 33 fixed to the bottom plate 32. The bottom plate 32 and the support frame 33 are formed of a material having a relatively high rigidity. A vacuum processing chamber (chamber) for attaching the substrates W1 and W2 is provided at a slightly center of the inside of the support frame 33. Above the vacuum processing chamber 34, a pressurizing system 35 is provided which applies a pressing force for bonding to the substrates W1 and W2. Below the vacuum processing chamber 34, a drive system 36 for positioning the substrates W1 and W2 is provided. First, the pressurizing system 35 will be described. The pressurizing system 35 includes guides 38a, 38b, linear guides 39a, 39b, first to third support plates 41 to 43, and a motor 44. The guides 38a and 38b are mounted on both sides of the inner side of the support portion of the support frame 33, and the linear guides 39a and 39b are supported by the guide rails 38a and 38b so as to be movable up and down. Between the linear guides 39a and 3% on both sides, first and second support plates 41 and 42 are erected. The first support plate 41 is suspended by a third support plate 43 which is moved up and down by a motor 44 mounted on an upper portion of the support frame 33. The third support plate 43 is formed of an upper plate, a lower plate, and a connection plate. The upper plate is provided with a cap 46, and the lower plate is provided with a plurality of (* number of dynamometers) 48 in this embodiment.忒 The connection plate connects the upper plate with the lower plate. The ball screw shirt is integrally rotatably connected to the output shaft of the motor 44, and the nut of the third support plate M, such as a ball screw 45, is screwed. Therefore, the motor 44 can move the third support plate 43 up and down by driving the ball screw 45 forward. The processing chamber 34 is formed by an upper container * and a lower measuring valley 4b which can be divided up and down, and is connected to the vacuum processing chamber 34 by a vacuum pump 49 for decompressing the vacuum processing chamber 34. Within the vacuum processing chamber%, first and second holding plates 51, 52 having suction 1222671 disk mechanisms for separating the substrates Wi, W2 from each other are provided opposite to each other. In addition, by means of a chuck mechanism, the holding and holding of the substrates W1 and W2 is performed using at least one of a vacuum chuck (suction chuck) and an electrostatic chuck (electrostatic chuck). The first holding plate 51 is provided in the upper container 34a. The first holding plate 5 51 is suspended and supported by the second support plate 42 through four first pillars. When the substrates are bonded, the length of the first pillar 53 is set so that the first holding plate 51 and the upper inner surface of the vacuum processing chamber 34 are arranged separately, that is, the first holding plate 51 does not contact the upper inner surface of the vacuum processing chamber 34. An elastic body (corrugated tube) 54 is provided between the second support plate 42 and the upper container 34a so as to surround each of the pillars 53. The upper-side container 34 a is supported by the second support plate 42 by a bellows 54. Flange portions having o-rings (not shown) are formed at both ends of the corrugated tube 54. A ring is used to seal the space between the second support plate 42 and the upper container 34a, and the airtightness in the vacuum processing chamber 34 is maintained. The second holding plate 52 is installed in the lower container 34b. The second holding plate 15 52 is connected to the support plate 57 by four second pillars 56, and the lower container 34 b is connected to the support plate 57 by four third pillars 58. The support plate 57 is supported by a plurality of driving mechanisms 59, and the driving mechanism 59 is fixed to the bottom plate 32. At a predetermined position supported on the support plate 57 of the driving mechanism 59, a second pillar 56 and a third pillar 58 are erected. Further, the second holding plate 52 is supported by the second support 56 and the lower container 34b is supported by the third support 20. The second pillar 56 is longer than the third pillar 58, and the length of the second pillar 56 is set so that the second holding plate is disposed separately from the lower inner surface of the vacuum processing chamber%, that is, the second holding plate 52 is not subjected to vacuum processing. The lower inner surface of the chamber 34 is in contact. The driving mechanism 59 uses a driving motor 64 (FIG. 2) to horizontally move the support plate 57 in the direction 11 1222671 / and the γ direction, and to rotate it horizontally (direction a). The drive train 36 includes a moving mechanism 59, a support plate 57 and a drive motor. A through hole accommodating each of the second pillars is formed in the lower container 34tp, and the 0 ring 60 is fitted into each of the through holes. The 0 ring 60 closes the gap 'between the second pillar 56 and the lower container 34b 5 and keeps the vacuum processing chamber airtight. Next, the control mechanism of the bonded substrate manufacturing apparatus 31 will be described using FIG. 2. In Fig. 2, the same reference numerals are given to the same structural portions as those described in Fig. 1A. The bonded substrate manufacturing apparatus 31 includes the pressure of the vacuum processing chamber 34 (true 10 empty pump 50), the pressure for bonding (pressurizing motor 44), and the positioning of the substrate (drive system 36).之 控制 装置 61。 The control device 61. The control device 61 is, for example, a general PLC (Promagramable Logic Controllers). The control device 61 is connected to a load cell 48, an image processing device 62, a pressure sensor 63, a pressure motor 44, a drive motor 64 of the drive system 36, and a vacuum pump 50. 15 The control device 61 calculates the output signal from each load cell 48 to the substrate
Wl、W2之負載，並因應所异出之負載產生馬達驅動信號， 將其馬達驅動#號供給至加壓用馬達44。加壓用馬達44則 依照馬達驅動# 5虎驅動’使弟1保持平板51上升或下降。 另外，控制裝置61依據由影像處理裝置62之輸出信 20 號’將所產生之馬達驅動彳自號供給至驅動馬達64，詳而古 之’貼合基板製造裝置31包含有在基板貼合時攝影用以作 兩基板Wl、W2的對位之對準符號之CCD攝影機（省略圖 示）。該CCD攝影機’係在貼合時攝影形成於基板wi、W2 之對準符號，將其影像資料供給至影像處理裝置62。控制 12 1222671 裝置61因應其影像處理叙置62的演算結果（位置偏移量的 算出資料），產生馬達驅動信號，並將其馬達驅動信號供給 至驅動用馬達64。驅動用馬達64依照馬達驅動信號旋轉， 且作動驅動機構59。藉驅動機構59的作動，移動支撐板57、 5第2保持平板52及下側容器34b，進行兩基板W1、W2之對 位。 堡力傳感裔63係配置於真空處理室34内之第1及第3伴 持平板51、52之附近，輸出因應該真空處理室34内之壓力 之檢出信號。在減壓下，為了貼合基板貨1、W2，控制裝 10置61，係依據壓力傳感器63之檢出信號，調節真空栗5〇的 驅動與設置於真空配管49之閥（省略圖示）的開關。藉真空系 50及閥的控制，將真空處理室34調節成所希望的減壓狀態。 其次，針對貼合基板製造裝置31的動作加以說明。 在貼合基板製造裝置31中，若第3支撐板43，藉加壓用 15馬達44之驅動作上下移動，則線性導軌39a、39b藉測力器 48及第1支撐板41，沿著導軌38a、38b作上下移動，上側容 器34a ’則藉第2支撐板42及波紋管54作上下移動。上側容 器34a，藉下降至與下側容器3413抵接為止，閉塞真空處理 室34 〇 20 其後，若驅動真空泵50，則真空處理室34被減壓。在 該狀態，進一步，若旋轉加壓用馬達44，使線性導執39a、 39b下降，則上侧谷态34a不會下降，且第2支撐板42、第1 支柱53及第1保持平板51下降，並壓縮波紋管54。 第2保持平板52係藉第2支柱56支撐於支撐板57，下倒 13 容器34b(被閉塞之真空處理室34)，係藉第3支柱咒支撐於支 撐板57。在該狀態下，若驅動系統36動作，則第2保持平板 52與真空處理室34形成一體，於X方向及丫方向水平移動， 並且水平旋轉（0方向），進行基板W卜W2的對位。在該對 位時，伴隨X方向及Y方向的移動與水平旋轉之負載係藉由 波紋管54吸收。另外，由於剛體性地連接於驅動系統36之 支撐板57以使第2保持平板52與真空處理室34一體地移 動，在基板Wl、W2之對位時，不會施加負載於設置在下 側容器34b與第2支柱56之間之〇環60。 而且，貼合基板製造裝置31在進行保持於第丨保持平板 及第2保持平板52之基板Wl、W2之對位後，藉加壓系統 35 ’施加加壓力於各基板W1、〜2間，以進行貼合。 其次，將本發明之第1實施形態之貼合基板製造裝置31 之特徵記載於如下。 (1) 在基板Wl、W2的對位時，一體地移動真空處理室 34與第2保持平板52，在第2支柱56與真空處理室34的接觸 部分(0環），幾乎不施加負載，因此，可以使用便宜之〇環， 替代第10圖所示之下側波紋管22，作為氣密保持構件，可 以削減製造裝置31的製造成本。另外，如第1〇圖所示，由 於/又有必要設置下側波紋管22，所以可以縮短減壓真空處 理至34時之排氣時間。進一步，可縮短連接第2保持平板μ 與驅動系統36之第2支柱56，製造裝置31可以小型化。 (2) 第1保持平板51，係作為與真空處理室34分開之第1 支撐構件之支撐於第丨支柱53，第2保持平板52，係作為與 1222671 真空處理室34分開之第2支撐構件之支撐於第2支柱％。藉 該構造，在基板貼合時之減壓下，即使在真空處理室34產 生變形時，由於可以防止其力作用於第丨及第2保持平板 51、52，所以即使在該減壓下，亦不會對基板W1、冒2的 5相對位置與平行度產生影響。藉此，可以正確地進行基板 Wl、W2的對位，並可以進行精度佳的基板W1、冒2的貼合。 以下’針對本發明之第2實施形態加以說明。 第2實施形態中，針對與第丨實施型態的構造相同者， 賦予相同的符號，並且簡略化其說明。以下以與第丨實施形 10 態之不同點為中心加以說明。 如第3圖所示，在第2實施形態之貼合基板製造裝置3la 中’驅動糸統36之驅動機構59設置於真空處理室34内部， 且第2保持平板52直接連接於該驅動機構59。 洋而δ之’多數驅動機構59固定於底板32上，並藉各 15驅動機構59支撐著第2保持平板52。該驅動機構59與第1實 施形態同樣地動作，使第2保持平板52水平移動(X方向及γ 方向），並且水平旋轉（0方向）。 在下側容器34b的下面，設置有包圍驅動機構59之剛體 筒71，且下側容器34b藉其剛體筒71支撐於底板32上。另 20外，該剛體筒71作為用以保持真空處理室34的氣密之氣密 保持構件之功能之構件，且在兩端之凸緣部具有〇環(省略 圖示）。藉其〇環密封下側容器34b與底板32之間，剛體筒71 的内側之空間與處理室34的内部空間連通。因此，剛體筒 71分劃處理室34的一部份。 15 1222671 在剛體筒71的側面，設置有面向驅動機構59之排氣口 71a，而排氣口 71a係藉配管72與真空泵73連接。該真空泵 73另外設置有用以在真空狀態下使真空處理室34減壓之前 述真空泵50。 5 本實施形態之貼合基板製造裝置31a之控制機構，如第 2圖之虛線所示，追加有真空泵73與壓力傳感器74。在該貼 合基板製造裝置31a中，於真空處理室34内，第1壓力傳感 器63係配置於保持平板51、52的附近，第2壓力傳感器74係 配置於驅動機構59的附近。也就是，第1壓力傳感器63檢出 10基板Wl、W2的附近之壓力，且第2壓力傳感器74檢出驅動 機構59的附近之壓力。 控制裝置61，係依據各壓力傳感器63、74之檢出信號， 控制各真空泵50、73。具體而言，控制裝置61，首先驅動 第2真空泵73，在減壓至驅動機構59的附近之大氣被排氣到 15預定壓力之階段，驅動第1真空泵50。 貼合基板製造裝置31a係與第1實施形態之貼合基板製 造裝置31相同，藉驅動加壓系統35之馬達44，使上側容器 34a下降，密封該上側容器34a與下側容器34b，並閉塞真空 處理室34。而且，在該狀態下進一步若使馬達44向下降方 20向旋轉，則推壓波紋管54，藉第2支撐版42、第1支柱53， 僅使第1保持平板51下降。 此時，驅動系統36之驅動機構59動作，進行基板W1、 W2的對位。具體而言，藉驅動機構59的動作，該驅動機構 59上之弟2保持平板52，於X方向及Y方向水平移動，並且 16 1222671 水平旋轉（0方向），適當地進行基版冒丨、W2的對位。 在該對位時，因隨著驅動機構59的動作之摩耗，會有 由該驅動機構59發生粒子的情形。在本實施形態中係㈣ 了驅動機構59的附近之氣體，藉排氣口 71a及配管72由真空 5泵73排氣之構造作為對策。因此，即使由驅動機構59發生 粒子，亦可以防止粒子向基板Wl、W2飛揚。特別是，藉 第1真空泵50先行真空處理室34的排氣，再藉第2真空泵73 進行排氣，可以確實地防止粒子的飛揚，可以提高真空處 理室34的清潔度。 10 其次’將本發明之第2實施形態之貼合基板製造裝置 31a的特徵記載如下。 (1) 在貼合基板製造裝置31a中，將驅動機構59設置於真 空處理室34内，在基板Wl、W2的對位時，由於為僅使第2 保持平板52移動之構造，所以在包圍第1支柱53之波紋管54 15 上’不會施加隨著驅動機構59移動之負載。因此，波紋管 54的使用期限可以延長。 (2) 由於驅動機構59直接的連接於第2保持平板52,所以 沒有必要如第1實施形態，設置支撐第2保持平板52之第2支 柱56，與支撐下側容器34b之第3支柱58。因此，可以謀求 20 製造裝置31a的製造成本的削減與製造裝置31a的小型化。 (3) 在剛體筒71的側面，設置著面向驅動機構59之排氣 口 71a，藉其排氣口 71a的排氣，可以去除在驅動機構59發 生之粒子。藉此，可以將真空處理室34内保持於清潔的狀 態0 17 (4) 用以由排氣口 71a去除粒子之第2真空泵73，係設置 在與用以將真空處理室34減壓至真空狀態之第i真空系5〇 不同之處。在該情形下，由於可以在為了去除粒子的最適 田時機進行排氣’所以可以提高真^處理室34内之清潔度。 (5) 將構成驅動系統36之驅動用馬達64，與驅動機構59 專之中之僅驅動機構59，配置於真空處理室34内。在該情 形下，可以抑制真空處理室Μ的容器的增加，實用上較佳。 以下，針對本發明之第3實施形態加以說明。 第4圖為表示第3實施形態之貼合基板製造裝置31b。但 疋，對於與上述之第1實施形態的構造相同者，則賦予相同 的符號，並且簡化其說明。另外，支撐框33與加壓系統35 的構造，係與第1實施形態相同，在第4圖省略其圖示。 詳而言之，在真空處理室34(下側容器34b)，固定有多 數(在本實施例為4個）之支撐台座75，在該支撐台座75的上 面，固定有第2保持平板52。支撐台座75，係分別設置於第 2保持平板52的下面之四角。如此，使支撐台座75介於第2 保持平板52與真空處理室34之間，且第2保持平板52係與真 空處理室34的内面分開配置。 另外，真空處理室34的下側容器34b係藉支撐處理室34 全體之支柱76，支撐於驅動系統36的支撐板57上。該支柱 76係形成於四角錐台狀之剛體，且支柱76的上面係抵接於 真空處理室34，而支柱76的下面則抵接於支撐板57。支检 76的上面之面積比下面的面積大，支柱76的上面之面積， 以與真空處理室34的下面之面積相等較佳。 在貼合基板製造裝置31b中，亦與第丨實施形態同樣 也—旦驅動系統36動作，則真空處理室34與第2保持平板 52形成一體，於X方向及Y方向水平移動，並且水平旋轉（0 方向），可以進行基板Wl、W2的對位。 其次，將本發明之第3實施形態之貼合基板製造裝置 3lb的特徵記載於如下。 (1) 貼合基板製造裝置31b，由於可以免除真空處理室34 "、驅動系統36之間之下側波紋管22(第1〇圖），所以可以削減 板製迨裴置31a的製造成本。另外，可以縮短減壓真空處 里至34時之排氣時間，進一步，可以謀求基板製造裝置31a 的小型化。 (2) 由於真空處理室34全體係藉支柱％所支撐，所以可 以防止隨著減壓真空處理室34的變形。進一步，在作為第2 支撐構件之支撐台座75上，固定第2保持平板52，藉分開設 15置第2保持平板52與真空處理室34,可以抑制因隨著減壓真 二處理至34的變形所造成之基板W1、W2之位置偏移。 (3) 藉以四角錐台狀之支柱％支撐真空處理室％全體， 可以確實地抑制減壓時之真空處理室34的變形。另外，支 柱76，右與使用四角柱狀之支柱的情形相比較，由於重量 2〇杈輕，所以可以得到輕量之貼合基板製造裝置31b。 各實施形態亦可作如以下之變更。 •貼合基板製造裝置31，雖為設置有4根第1〜第3支柱 53、56、58者，不過並不限制於此，亦可設置有4根以外數 目之支柱者。當然，第1〜第3支柱53、56、58亦可使其為分 19 ㈣構造。 更_—動_::連 =:圓所㈣ 位在構造中’術f，具有 二=:;=_板— 2保持平板52的下面與第= =:，且其抵接於其支撐台座7_面之外緣部配土 有〇裱60 〇也就是，兮n 直 10 μ衣60係設置成包圍第2支柱56之上 端(位於處理室蝴之料)料周，伽環 15 ㈣嫩纽刚㈣理室 在另外，在该構造令’考慮減磨時之真空處理室34的變 形，選定吸收其變形且可以充分保持真空處理室Μ的氣密 之〇_°在該構造中亦具有與第1實施形態相同的特徵。 20 在第6圖所示之構造中，在真空處理室34的内部，具有 =於5亥真空處理室34的底面與第2保持平板Μ之間之波紋 管79,藉該波紋管79保持真空處理室34的氣密。詳而言之， 波紋管79係在上下兩端之凸緣部具有〇環(省略圖示），且設 置成〇圍第2支柱56之上端（位於處理室34内之端部）的外 周。波紋管79上端之凸緣部連接於幻保持平板_下面， 而下側之凸緣部則連接於下側容器3扑的内側，藉各凸緣部 之〇環在封於第2保持平板52與真空處理室34之間可以 保持該真空處理室34的氣密。在該構造中，隨著在基板 Wi、W2的對位時之驅動系統％的移動之負載，由於不會 20 1222671 加於波紋管79，所以波紋管79只要是具有可保持氣密之密 封功能者即可，沒有必要如習知技術具有可吸收負載之彈 性功能。因此，可以使用長度較短之波紋管79，具有與第1 實施形態相同之特徵。 5 在第7圖所示之構造中，在驅動系統36的支撐板57上， 藉第2支柱56支撐第2保持平板52，藉剛體筒81支撐丁側容 器34b。剛體筒81係配置成包圍第2支柱56，具有作為可保 持真空處理室34的氣密之氣密保持構件之功能。也就是， 剛體筒81在兩端之凸緣部具有Ο環（省略圖示），藉該〇環密 1〇 封於下側容器34b與支撐板57之間，可以保持真空處理室34 的氣密。在該構造中，亦具有與第1實施形態相同之構造。 •在第3實施形態之貼合基板製造裝置31b中，亦可移 除支撐處理室34下面之全體支柱76。此時，如第8圖所示， 宜移除驅動系統36之支撑板57，且將用以支撐第2保持平板 15 52之支撐台座75配置於形成驅動機構59的正上方之位置。 在下侧容器34b與驅動機構59之連接部位，為了抑制減壓時 的變形，在其部位(驅動機構59)的正上方，藉配置支撐台座 75，可以防止因真空處理室34的變形而產生之基板W1、 W2的位置偏移。 2〇 •在各實施形態中，真空處理室34雖為分割成上下之 構造，不過並不限定於此，例如亦可為如第9圖所示之真空 處理室83的構造。另外，在第9圖之構造中，與第1實施形 悲不同之點係設置有用以包圍第1支柱53波紋管84及磁氣 密封85。 21 1222671 _之，真空處理室83係具有用以開關該處理室83 之閉，。在該真空處理室83内，對向設置第】及第2保持 平板Μ、52 ’且第1料平板㈣藉以支柱Μ騎支樓於 第2支撐板42上，而第2保持平板52係藉第2支柱^支樓於驅 5動系統36之支撑板57上。真空處理室83的上面係藉設置包 圍第i支柱53之波紋管84與磁氣密封85，可以氣密地與幻 支撐板42連接。該波紋管84與磁氣密封85係相互連接，具 2作為用以保持真空處理室83的氣密之氣密保持構件之功 月匕。另外’真空處理室83的下面係藉〇環6〇密封與第2支柱 1〇 56接觸之部分，可以保持氣密。此外，加壓系統35係與第i 實施形態者相同。 即使為使用具有如上述之構造之真空處理室们之第9 圖之貼合基板製造裝置’亦具有與第1實施形態相同之特 15徵另外，藉使用由波紋管討與磁氣密封85所形成之氣密 15保持構件，可以確實地吸收因驅動系統36的移動所產生二 負$。也就是，在對位基板W1、物寺，藉驅動系統叫吏 真空處理室34於X方向及Y方向直線移動時，波紋管84可吸 收其直線移動之負載，而當真空處理室34水平旋轉時（Θ方 向）’磁氣费封85可吸收其旋轉的負載。 2〇 【囷式簡單說明】 第1圖為本發明之第丨實施形態之貼合基板製造裝置 模式圖。 第2圖為貼合基板製造裝置之控制機構之區塊圖。 第3圖為本發明之第2實施形態之貼合基板製造裝置的 22 1222671 模式圖。 第4圖為本發明之第3實施形態之貼合基板製造裝置的 模式圖。 第5圖為本發明之其他形態之貼合基板製造裝置的模 5 式圖。 第6圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第7圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 10 第8圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第9圖為本發明之其他形態之貼合基板製造裝置的模 式圖。 第10圖為習知之貼合基板製造裝置的模式圖。 15 【圖式之主要元件代表符號表】 11、31…基板製造裝置 13、51…第1保持平板 15、35…加壓系統 17…第1支柱 19、21…支撐板 22…下側波紋管 33…支撐框 34a、12a…上側容器 38a、38b…導軌 41…第1支撐板 43…第3支撐板 45…滾珠螺桿 12…真空處理室 14、52…第2保持平板 16、36…驅動系統 18、56…第2支柱 20…上側波紋管 32…底板 23 1222671 34…真空處理室(腔室) 34b、12b…下側容器 39a、3%…線性導執 42…第2支撐板 44…馬達(加壓用） 46…螺帽 48…測力器 50…真空泵 53…支柱 54、79、84…波紋管 57…支撐板 58…第3支柱 59…驅動機構 60···Ο環 61…控制裝置 62…影像處理裝置 63、74…壓力傳感器 64…驅動用馬達 71、81···剛體筒 71a…排氣口 72…配管 73…真空泵 76…支柱 83…真空處理室 85…磁氣密封 86…閘閥 Wl、W2…基板Loads W1 and W2 generate motor drive signals in response to the different loads, and the motor drive # is supplied to the pressure motor 44. The pressurizing motor 44 causes the brother 1 to hold the flat plate 51 up or down in accordance with the motor drive # 5 虎 driving ’. In addition, the control device 61 supplies the generated motor drive signal to the drive motor 64 according to the output signal No. 20 of the image processing device 62. In detail, the ancient 'bonded substrate manufacturing device 31 includes the substrate bonding A CCD camera (not shown) used to align the alignment marks of the two substrates W1 and W2. This CCD camera 'images the alignment marks formed on the substrates wi and W2 at the time of bonding, and supplies the image data to the image processing device 62. Control 12 1222671 The device 61 generates a motor drive signal based on the calculation result (position offset calculation data) of its image processing device 62, and supplies the motor drive signal to the drive motor 64. The driving motor 64 rotates in accordance with a motor driving signal, and operates the driving mechanism 59. By the operation of the driving mechanism 59, the support plates 57, 5 are moved to the second holding plate 52 and the lower container 34b, and the two substrates W1, W2 are aligned. The Baoli sensor 63 is disposed near the first and third supporting plates 51 and 52 in the vacuum processing chamber 34, and outputs a detection signal corresponding to the pressure in the vacuum processing chamber 34. Under the reduced pressure, in order to adhere to the substrate goods 1 and W2, the control device 10 is set to 61. Based on the detection signal of the pressure sensor 63, the drive of the vacuum pump 50 and the valve installed in the vacuum pipe 49 are omitted (not shown). Switch. By controlling the vacuum system 50 and the valve, the vacuum processing chamber 34 is adjusted to a desired reduced pressure state. Next, the operation of the bonded substrate manufacturing apparatus 31 will be described. In the bonded substrate manufacturing apparatus 31, if the third support plate 43 is moved up and down by the driving of the 15 motor 44 for pressurization, the linear guides 39a and 39b use the load cell 48 and the first support plate 41 to follow the guide rail. 38a and 38b move up and down, and the upper container 34a 'moves up and down by the second support plate 42 and the bellows 54. The upper container 34a is lowered until it comes into contact with the lower container 3413 to close the vacuum processing chamber 34. After that, if the vacuum pump 50 is driven, the vacuum processing chamber 34 is decompressed. In this state, when the pressure motor 44 is rotated to lower the linear guides 39a and 39b, the upper valley state 34a is not lowered, and the second support plate 42, the first pillar 53, and the first holding plate 51 are not lowered. It descends and compresses the bellows 54. The second holding plate 52 is supported by the support plate 57 by the second support 56 and the container 34b (the closed vacuum processing chamber 34) is lowered and supported by the support plate 57 by the third support. In this state, if the drive system 36 operates, the second holding plate 52 and the vacuum processing chamber 34 are integrated, and move horizontally in the X direction and the Y direction, and rotate horizontally (0 direction) to align the substrates W2 and W2. . In this alignment, the load accompanying the movement in the X and Y directions and the horizontal rotation is absorbed by the bellows 54. In addition, since the support plate 57 of the drive system 36 is rigidly connected to move the second holding plate 52 and the vacuum processing chamber 34 integrally, no load is applied to the lower container when the substrates W1 and W2 are aligned. Ring 60 between 34b and second pillar 56. In addition, the bonded substrate manufacturing apparatus 31 aligns the substrates W1 and W2 held on the first and second holding plates 52 and 52, and then applies a pressure to each of the substrates W1 and W2 through the pressurizing system 35 '. For fitting. Next, features of the bonded substrate manufacturing apparatus 31 according to the first embodiment of the present invention will be described below. (1) When the substrates W1 and W2 are aligned, the vacuum processing chamber 34 and the second holding plate 52 are moved integrally, and the contact portion (0 ring) between the second support 56 and the vacuum processing chamber 34 is hardly applied with a load. Therefore, instead of the lower bellows 22 shown in FIG. 10, an inexpensive O-ring can be used as an airtight holding member, and the manufacturing cost of the manufacturing apparatus 31 can be reduced. In addition, as shown in Fig. 10, since it is necessary to provide the lower bellows 22, it is possible to shorten the exhaust time when the reduced-pressure vacuum treatment is performed to 34 hours. Furthermore, the second support 56 that connects the second holding plate μ and the drive system 36 can be shortened, and the manufacturing apparatus 31 can be miniaturized. (2) The first holding plate 51 serves as a support for the first support member separated from the vacuum processing chamber 34 on the first support 53 and the second holding plate 52 serves as the second support member separated from the 1222671 vacuum processing chamber 34 It is supported by the second pillar%. With this structure, even when the vacuum processing chamber 34 is deformed under reduced pressure at the time of substrate bonding, the force can be prevented from acting on the second and second holding plates 51 and 52. Therefore, even under this reduced pressure, It also does not affect the 5 relative positions and parallelism of the substrates W1 and 2. Thereby, the substrates W1 and W2 can be accurately aligned, and the substrates W1 and W2 can be bonded with high accuracy. Hereinafter, a second embodiment of the present invention will be described. In the second embodiment, the same symbols are assigned to the same structures as those in the first embodiment, and descriptions thereof are simplified. The following description focuses on the differences from the tenth embodiment. As shown in FIG. 3, in the bonded substrate manufacturing apparatus 31a of the second embodiment, the driving mechanism 59 of the driving system 36 is provided inside the vacuum processing chamber 34, and the second holding plate 52 is directly connected to the driving mechanism 59. . Most of the driving mechanisms 59 are fixed to the bottom plate 32, and the second holding plate 52 is supported by each of the driving mechanisms 59. This driving mechanism 59 operates in the same manner as the first embodiment, and moves the second holding plate 52 horizontally (X direction and γ direction) and rotates horizontally (0 direction). A rigid body cylinder 71 surrounding the driving mechanism 59 is provided below the lower container 34b, and the lower container 34b is supported on the bottom plate 32 by the rigid body cylinder 71. In addition, the rigid body tube 71 serves as a member for maintaining the airtight and airtight holding member of the vacuum processing chamber 34, and has o-rings (not shown) at the flange portions at both ends. The space between the lower container 34 b and the bottom plate 32 is sealed by the O-ring, and the space inside the rigid body tube 71 communicates with the internal space of the processing chamber 34. Therefore, the rigid body cylinder 71 delimits a part of the processing chamber 34. 15 1222671 An exhaust port 71a facing the driving mechanism 59 is provided on the side of the rigid body cylinder 71, and the exhaust port 71a is connected to the vacuum pump 73 through a pipe 72. The vacuum pump 73 is additionally provided with the vacuum pump 50 described previously to decompress the vacuum processing chamber 34 in a vacuum state. 5. The control mechanism of the bonded substrate manufacturing apparatus 31a of this embodiment is provided with a vacuum pump 73 and a pressure sensor 74 as shown by the dotted line in FIG. 2. In this bonded substrate manufacturing apparatus 31a, in the vacuum processing chamber 34, a first pressure sensor 63 is disposed near the holding plates 51 and 52, and a second pressure sensor 74 is disposed near the driving mechanism 59. That is, the first pressure sensor 63 detects the pressure in the vicinity of the substrates W1 and W2, and the second pressure sensor 74 detects the pressure in the vicinity of the driving mechanism 59. The control device 61 controls the vacuum pumps 50 and 73 based on the detection signals from the pressure sensors 63 and 74. Specifically, the control device 61 first drives the second vacuum pump 73, and drives the first vacuum pump 50 at a stage where the pressure in the vicinity of the driving mechanism 59 is exhausted to a predetermined pressure of 15 °. The bonded substrate manufacturing apparatus 31a is the same as the bonded substrate manufacturing apparatus 31 of the first embodiment. The upper container 34a is lowered by driving the motor 44 of the pressurizing system 35, and the upper container 34a and the lower container 34b are sealed and closed. Vacuum processing chamber 34. When the motor 44 is further rotated in the lowering direction 20 in this state, the bellows 54 is pushed, and only the first holding plate 51 is lowered by the second support plate 42 and the first support 53. At this time, the driving mechanism 59 of the driving system 36 is operated, and the substrates W1 and W2 are aligned. Specifically, by the action of the driving mechanism 59, the brother 2 on the driving mechanism 59 holds the flat plate 52, moves horizontally in the X direction and the Y direction, and 16 1222671 rotates horizontally (direction 0), and appropriately performs the base plate 丨, W2 alignment. During this alignment, particles may be generated by the driving mechanism 59 due to friction caused by the operation of the driving mechanism 59. In the present embodiment, the gas in the vicinity of the driving mechanism 59 is used, and the exhaust port 71a and the piping 72 are evacuated by the vacuum pump 73 as a countermeasure. Therefore, even if particles are generated by the driving mechanism 59, the particles can be prevented from flying toward the substrates W1 and W2. In particular, the first vacuum pump 50 exhausts the vacuum processing chamber 34 in advance, and then the second vacuum pump 73 exhausts the air. This can reliably prevent particles from flying and improve the cleanliness of the vacuum processing chamber 34. 10 Next, the features of the bonded substrate manufacturing apparatus 31a according to the second embodiment of the present invention will be described below. (1) In the bonded substrate manufacturing apparatus 31a, the driving mechanism 59 is provided in the vacuum processing chamber 34, and when the substrates W1 and W2 are aligned, the structure is such that only the second holding plate 52 is moved. No load is applied to the bellows 54 15 of the first pillar 53 to move with the driving mechanism 59. Therefore, the life of the bellows 54 can be extended. (2) Since the driving mechanism 59 is directly connected to the second holding plate 52, it is not necessary to provide the second support 56 supporting the second holding plate 52 and the third support 58 supporting the lower container 34b as in the first embodiment. . Therefore, it is possible to reduce the manufacturing cost of the manufacturing apparatus 31a and miniaturize the manufacturing apparatus 31a. (3) An exhaust port 71a facing the driving mechanism 59 is provided on the side of the rigid body cylinder 71, and particles generated in the driving mechanism 59 can be removed by exhausting the exhaust port 71a. Thereby, the inside of the vacuum processing chamber 34 can be kept in a clean state. 0 17 (4) The second vacuum pump 73 for removing particles from the exhaust port 71a is provided in the vacuum processing chamber 34 to reduce the pressure to the vacuum. The i-th vacuum of the state is 50% different. In this case, since the exhaust can be performed at an optimum timing for removing particles, the cleanliness in the true processing chamber 34 can be improved. (5) The driving motor 64 constituting the driving system 36 and only the driving mechanism 59 among the driving mechanisms 59 are disposed in the vacuum processing chamber 34. In this case, it is possible to suppress an increase in the number of containers in the vacuum processing chamber M, which is practically preferable. Hereinafter, a third embodiment of the present invention will be described. Fig. 4 shows a bonded substrate manufacturing apparatus 31b according to a third embodiment. However, those having the same structure as that of the first embodiment described above are given the same reference numerals, and the description thereof will be simplified. The structures of the support frame 33 and the pressurizing system 35 are the same as those of the first embodiment, and their illustration is omitted in FIG. 4. Specifically, a plurality of (four in this embodiment) support bases 75 are fixed to the vacuum processing chamber 34 (the lower container 34b), and a second holding plate 52 is fixed on the support base 75. The support pedestals 75 are provided at the four corners of the lower surface of the second holding plate 52, respectively. In this way, the support base 75 is interposed between the second holding plate 52 and the vacuum processing chamber 34, and the second holding plate 52 is disposed separately from the inner surface of the vacuum processing chamber 34. In addition, the lower container 34 b of the vacuum processing chamber 34 is supported by a support plate 57 of the drive system 36 via a pillar 76 that supports the entire processing chamber 34. The pillar 76 is formed in a quadrangular pyramid-shaped rigid body. The upper surface of the pillar 76 is in contact with the vacuum processing chamber 34, and the lower surface of the pillar 76 is in contact with the support plate 57. The area of the upper surface of the inspection 76 is larger than the area of the lower surface. The area of the upper surface of the pillar 76 is preferably equal to the area of the lower surface of the vacuum processing chamber 34. The bonded substrate manufacturing apparatus 31b is also the same as the first embodiment. Once the driving system 36 operates, the vacuum processing chamber 34 and the second holding plate 52 are integrated, and move horizontally in the X and Y directions and rotate horizontally. (0 direction), the substrates W1 and W2 can be aligned. Next, the characteristics of the bonded substrate manufacturing apparatus 3lb according to the third embodiment of the present invention will be described below. (1) The bonded substrate manufacturing apparatus 31b can eliminate the lower bellows 22 (Figure 10) between the vacuum processing chamber 34 " and the drive system 36, so the manufacturing cost of the plate system 31b can be reduced. . In addition, the evacuation time from the reduced-pressure vacuum to 34 o'clock can be shortened, and the size of the substrate manufacturing apparatus 31a can be reduced. (2) Since the entire system of the vacuum processing chamber 34 is supported by the pillar%, it is possible to prevent the deformation of the vacuum processing chamber 34 due to the decompression. Furthermore, the second holding plate 52 is fixed to the supporting base 75 as the second supporting member, and 15 second holding plates 52 and the vacuum processing chamber 34 are opened by dividing, so that the pressure caused by the vacuum treatment to 34 can be suppressed. The positions of the substrates W1 and W2 caused by the deformation are shifted. (3) The support of the entire vacuum processing chamber% is supported by a square pyramid-shaped pillar%, so that deformation of the vacuum processing chamber 34 can be reliably suppressed during decompression. In addition, compared with the case where the right pillar 76 is a rectangular pillar, the weight of the pillar 76 is light, so that a light-weight bonded substrate manufacturing apparatus 31b can be obtained. Each embodiment can be modified as follows. • Although the bonded substrate manufacturing apparatus 31 is provided with four first to third pillars 53, 56, and 58, the present invention is not limited to this, and a number of pillars other than four may be provided. Of course, the first to third pillars 53, 56, and 58 may also have a divided structure. __Moving_ :: 连 =: The circle is located in the structure 'operation f, which has two =:; = _ 板 — 2 keeps the bottom of the flat plate 52 and the == :, and it abuts on its support base 7_ The outer edge of the surface is equipped with 〇60, that is, 兮 n straight 10 μ clothing 60 is set to surround the upper end of the second pillar 56 (located in the processing chamber), the material ring, 15 ring tender In addition, in this structure, the deformation of the vacuum processing chamber 34 during the reduction of friction is considered in this structure, and it is selected to absorb the deformation and maintain the airtightness of the vacuum processing chamber M. 0 ° in this structure also has Features similar to those of the first embodiment. 20 In the structure shown in FIG. 6, inside the vacuum processing chamber 34, a bellows 79 is provided between the bottom surface of the vacuum processing chamber 34 and the second holding plate M, and the vacuum is maintained by the bellows 79. The processing chamber 34 is airtight. Specifically, the bellows 79 is provided with o-rings (not shown) at the flange portions at the upper and lower ends, and is provided so as to surround the outer periphery of the upper end of the second pillar 56 (the end located in the processing chamber 34). The flange portion at the upper end of the bellows 79 is connected to the lower holding plate, and the lower flange portion is connected to the inside of the lower container 3 flap. The ring of each flange portion is sealed to the second holding plate 52. The vacuum processing chamber 34 can be kept airtight from the vacuum processing chamber 34. In this structure, as the load of the driving system moves during the alignment of the substrates Wi and W2, since 20 1222671 is not added to the bellows 79, as long as the bellows 79 has a sealing function capable of maintaining airtightness It is only necessary that there is no need to have the elastic function of absorbing load as in the conventional technology. Therefore, the corrugated tube 79 having a short length can be used, and has the same characteristics as those of the first embodiment. 5 In the structure shown in FIG. 7, on the support plate 57 of the drive system 36, the second holding plate 52 is supported by the second support 56 and the side container 34b is supported by the rigid body 81. The rigid body cylinder 81 is arranged so as to surround the second pillar 56 and functions as an airtight holding member capable of holding the airtightness of the vacuum processing chamber 34. That is, the rigid body cylinder 81 has O-rings (not shown) at the flange portions at both ends, and the 0-rings are tightly sealed between the lower container 34b and the support plate 57 to maintain the gas in the vacuum processing chamber 34. dense. This structure also has the same structure as that of the first embodiment. In the bonded substrate manufacturing apparatus 31b of the third embodiment, it is also possible to remove all the pillars 76 supporting the processing chamber 34 below. At this time, as shown in FIG. 8, the supporting plate 57 of the driving system 36 should be removed, and a supporting base 75 for supporting the second holding plate 15 52 should be arranged directly above the driving mechanism 59. In order to suppress the deformation during decompression at the connection portion between the lower container 34b and the driving mechanism 59, a support base 75 is arranged directly above the portion (the driving mechanism 59) to prevent the deformation caused by the vacuum processing chamber 34. The positions of the substrates W1 and W2 are shifted. 20 • In each embodiment, the vacuum processing chamber 34 is divided into a vertical structure, but it is not limited to this. For example, the vacuum processing chamber 83 may have a structure as shown in FIG. 9. In addition, in the structure shown in Fig. 9, a point different from the first embodiment is provided to surround the first pillar 53 with a bellows 84 and a magnetic seal 85. 21 1222671 _ In addition, the vacuum processing chamber 83 has a closure for opening and closing the processing chamber 83. In the vacuum processing chamber 83, the first and second holding plates M, 52 'are oppositely installed, and the first material plate 骑 rides the branch on the second support plate 42 by the pillar M, and the second holding plate 52 is borrowed. The second pillar ^ support building is on the support plate 57 of the drive system 36. The upper surface of the vacuum processing chamber 83 is provided with a bellows 84 and a magnetic seal 85 surrounding the i-th pillar 53 so as to be hermetically connected to the magic support plate 42. The bellows 84 and the magnetic seal 85 are connected to each other and have a function as an airtight holding member for holding the airtightness of the vacuum processing chamber 83. In addition, the bottom surface of the 'vacuum processing chamber 83 is sealed by a 〇ring 60, which is in contact with the second pillar 105, and can be kept airtight. The pressurizing system 35 is the same as that of the i-th embodiment. Even if the bonded substrate manufacturing apparatus of the ninth figure using the vacuum processing chamber having the structure as described above has the same characteristics as the first embodiment, it also uses a corrugated tube and a magnetic seal 85. The formed airtight 15 holding member can reliably absorb two negative $ generated by the movement of the driving system 36. That is, when the alignment substrate W1 and Wusi are called by the driving system to move the vacuum processing chamber 34 linearly in the X and Y directions, the bellows 84 can absorb the load of the linear movement, and when the vacuum processing chamber 34 rotates horizontally Hour (Θ direction) 'magnetic gas seal 85 can absorb its rotating load. 20 [Brief description of the formula] FIG. 1 is a schematic diagram of a bonded substrate manufacturing apparatus according to a first embodiment of the present invention. Fig. 2 is a block diagram of a control mechanism of a bonded substrate manufacturing apparatus. Fig. 3 is a schematic diagram of a bonded substrate manufacturing apparatus according to a second embodiment of the present invention. Fig. 4 is a schematic view of a bonded substrate manufacturing apparatus according to a third embodiment of the present invention. Fig. 5 is a pattern diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. Fig. 6 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. Fig. 7 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. 10 FIG. 8 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. Fig. 9 is a schematic diagram of a bonded substrate manufacturing apparatus according to another aspect of the present invention. FIG. 10 is a schematic diagram of a conventional bonded substrate manufacturing apparatus. 15 [Representative symbols for main components of the drawings] 11, 31 ... Substrate manufacturing equipment 13, 51 ... First holding plate 15, 35 ... Pressing system 17 ... First pillar 19, 21 ... Support plate 22 ... Lower bellows 33 ... support frames 34a, 12a ... upper containers 38a, 38b ... rail 41 ... first support plate 43 ... third support plate 45 ... ball screw 12 ... vacuum processing chamber 14,52 ... second holding plate 16,36 ... drive system 18, 56 ... Second pillar 20 ... Upper bellows 32 ... Base plate 23 1222671 34 ... Vacuum processing chamber (chamber) 34b, 12b ... Lower container 39a, 3% ... Linear guide 42 ... Second support plate 44 ... Motor (For pressurization) 46 ... nut 48 ... force measuring device 50 ... vacuum pump 53 ... pillars 54,79,84 ... corrugated tube 57 ... support plate 58 ... third pillar 59 ... driving mechanism 60 ... 50 ring 61 ... control Device 62 ... image processing device 63, 74 ... pressure sensor 64 ... driving motor 71, 81 ... rigid body 71a ... exhaust port 72 ... pipe 73 ... vacuum pump 76 ... pillar 83 ... vacuum processing chamber 85 ... magnetic seal 86 ... gate valves W1, W2 ... base plate
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