WO2014021192A1 - Substrate bonding apparatus and substrate bonding method - Google Patents

Substrate bonding apparatus and substrate bonding method Download PDF

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Publication number
WO2014021192A1
WO2014021192A1 PCT/JP2013/070205 JP2013070205W WO2014021192A1 WO 2014021192 A1 WO2014021192 A1 WO 2014021192A1 JP 2013070205 W JP2013070205 W JP 2013070205W WO 2014021192 A1 WO2014021192 A1 WO 2014021192A1
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WO
WIPO (PCT)
Prior art keywords
substrate
concave
thin substrate
thin
pressing
Prior art date
Application number
PCT/JP2013/070205
Other languages
French (fr)
Japanese (ja)
Inventor
水野　賢一
Original Assignee
芝浦メカトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦メカトロニクス株式会社 filed Critical 芝浦メカトロニクス株式会社
Priority to JP2014528106A priority Critical patent/JP5852244B2/en
Priority to CN201380031324.5A priority patent/CN104471630B/en
Priority to KR1020157005117A priority patent/KR101623325B1/en
Publication of WO2014021192A1 publication Critical patent/WO2014021192A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Definitions

  • This invention relates to the board
  • Electronic devices such as smartphones and PDAs (personal digital assistants) are often provided with a touch panel that allows a user to perform a gesture operation by touching a display with a finger or a pen.
  • Such an electronic device is configured by covering a display arranged on the surface of a casing with a laminated substrate body in which a touch panel sheet and a cover panel are laminated.
  • the method of manufacturing the laminated substrate body is performed by applying an adhesive to the surface of the touch panel sheet placed on the placement surface of the substrate laminating apparatus, and pressing and joining the cover panel held above.
  • buttons for device operation have been provided on the side of the casing of electronic devices, but in recent years, a highly flexible organic EL display has been used not only on the surface of the casing but also on the side of the casing. In addition, it has been proposed that a display is extended to enable gesture operation using a touch panel even on a side surface portion.
  • the laminated substrate body also needs to be configured to be bent and bent at both ends to form a concave shape so as to cover the display from the surface to the side surface.
  • both ends of a glass or resin substrate serving as a cover panel are bent or bent to form a concave shape.
  • the mounting surface of the substrate bonding apparatus is a convex surface that fits into the concave surface of the cover panel, and the touch panel sheet coated with the adhesive is bent and held along the convex surface. And it pushes into the concave surface of a cover panel, and joins both.
  • the adhesive may be scraped off by this surface contact, and the cover panel and the touch panel sheet may not be properly joined, or a part of the adhesive may protrude to the outside and cause a product defect.
  • substrate bonding apparatus to the concave surface of a cover panel may not correspond, and it may be difficult to stick both.
  • an object of this invention is to provide the board
  • the present invention is a substrate bonding apparatus for bonding a concave substrate having a concave surface and a flexible thin substrate via an adhesive, and the thin substrate is attached to the concave surface of the concave substrate.
  • a pressing unit that presses the pressing unit, the pressing unit pressing the thin substrate against the concave surface of the concave substrate; and the thin substrate that is positioned on the side of the pressing unit with respect to the concave substrate by the pressing unit.
  • a displacement portion that fits within the concave surface of the concave substrate and displaces the thin substrate so as to follow the concave surface.
  • the pressing portion is a center block
  • the displacement portion is a separation block that can approach and separate from the center block
  • the pressing means until the center block and the separation block contract smaller than the concave surface
  • the separation block is brought close to the central block and enters the concave space together with the thin substrate, and the separation block is moved in the concave space toward the side of the concave substrate, thereby reducing the thin shape.
  • the substrate may be expanded along the concave surface.
  • the separation block may have a pressing curved surface having substantially the same shape as the concave surface portion of the side portion of the concave substrate on the side portion side.
  • At least a part of the displacement part may be constituted by an elastic member.
  • the pressing means further includes guide means for pre-bending the thin substrate following the overall shape when the separation block is moved to the central block, and the separation block is formed into the concave substrate after the bending. You may make it move to the said side part direction.
  • the guide means may include a claw portion that preliminarily bends the thin substrate by being hooked on the side edge of the thin substrate and applying an external force.
  • the separation block is located near the central block from a position outside the position where the side block of the concave substrate contacts with the side plate during the bending by the claw portion via the thin substrate. You may make it move to.
  • the claw portion may move along the outer shape of the separation block through the side edge surface of the thin substrate not receiving an external force.
  • the claw portion includes a side edge of the thin substrate that is not subjected to an external force, and a side edge of the thin substrate after being bent along the outer shape of the separation block close to the center block. You may make it move on the straight line which passes.
  • a suction means for adsorbing the thin substrate bent and shaped in accordance with the overall shape of the center block and the separation block to the separation block may be further provided.
  • a curing unit that temporarily cures the adhesive applied to at least one of the concave substrate and the thin substrate before and after the thin substrate is bonded to the concave substrate; You may make it prepare.
  • a curing treatment unit that temporarily cures the adhesive applied to at least one of the concave substrate and the thin substrate, at least before bonding the side edges and after bonding the side edges; You may make it prepare.
  • the pressing means includes a support portion that supports the displacement portion, and the displacement portion is displaced toward the side portion of the concave substrate while bringing the other end into contact with the thin substrate,
  • the thin substrate may be pressure-bonded following the concave surface, and the support portion may support the other end of the displacement portion as a displacement fulcrum.
  • the distance between the one end of the displacement part and the fulcrum may be variably provided so as to maintain the pressure bonding of the thin substrate to the concave substrate.
  • the thin substrate and the side portion of the concave substrate do not rub due to surface contact. Therefore, erroneous locations are bonded to each other, and generation of wrinkles of the thin substrate and generation of non-contacted portions between the thin substrate and the concave substrate can be suppressed.
  • the thin substrate is not pushed in while grinding the side part of the concave substrate with the surface, the outflow of the adhesive is prevented, the adhesive force is decreased, the design property is decreased, and the adhesive is interposed. A short circuit or the like can be prevented.
  • FIG. 1 is a schematic view showing cross sections of various substrates after bonding.
  • substrate bonding apparatus 1 of this invention bonds the thin board
  • FIG. 1 is a schematic view showing cross sections of various substrates after bonding.
  • substrate bonding apparatus 1 of this invention bonds the thin board
  • the thin substrate 21 is a touch panel, a decorative film, or various films such as an organic EL display and a liquid crystal display.
  • the concave substrate 20 is a protective panel made of glass or acrylic for protecting the thin substrate 21.
  • the entire surface of the thin substrate 21 is adhered to the concave substrate 20 with the adhesive R so that the entire surface of the thin substrate 21 is covered with the concave substrate 20.
  • the thin substrate 21 is a flexible thin substrate. In order for the thin substrate 21 to be affixed to the concave surface 20a of the concave substrate 20, it is sufficient if the thin substrate 21 is flexible enough to bend and deform along the concave surface 20a.
  • the concave substrate 20 is a substrate having a concave surface 20a.
  • the concave surface 20a is formed such that at least the side portion 20b of the concave substrate 20 rises from the curved portion or the bent portion. That is, the concave substrate 20 has a concave surface 20a formed on the substrate surface by bending or bending.
  • the central region other than the side part 20b of the concave substrate 20 may be flat or may be continuously curved with the side part 20b.
  • the concave substrate 20 may be warped as a whole, or the back surface opposite to the concave surface 20a may have a shape unrelated to the concave surface 20a, for example, a flat surface.
  • a pair of opposing side portions 20b may rise, any one of the side portions 20b may rise, or three side portions 20b may rise.
  • Two sets of side portions 20b facing each other so as to surround the center from four sides may rise.
  • the concave substrate 20 has a substantially tile shape or a substantially arc-shaped cross section, and as shown in FIG. 1B, the side portion 20b is bent at a right angle.
  • the side portion 20b includes a substantially U shape in which the side portion 20b rises from the curved portion.
  • the side part 20b stands up to form the concave surface 20a.
  • a space surrounded by the flat surface including both ends of the side portion 20b and the concave surface 20a is referred to as a concave space 20c defined by the concave surface 20a.
  • the adhesive R is not particularly limited as long as it accepts and cures external energy.
  • a thermosetting resin for example, a thermosetting resin, a photocurable resin, a radiation curable resin, and other various resins that are cured by receiving electromagnetic waves. Or a resin that hardens upon drying.
  • FIG. 2 is a configuration diagram of the substrate bonding apparatus 1 according to the first embodiment.
  • Drawing 3 is a lineblock diagram of press mechanism 4 (pressing means) with which substrate pasting device 1 concerning a 1st embodiment is provided.
  • substrate bonding apparatus 1 makes the holding
  • the holding part 3 and the pressing mechanism 4 can be relatively approached.
  • both or one of the holding unit 3 and the pressing mechanism 4 has an actuator that moves so as to approach or separate from the other party.
  • the holding unit 3 holds the concave substrate 20 by an electrostatic chuck, a mechanical chuck, a vacuum chuck, an adhesive chuck, or other various chuck mechanisms.
  • the pressing mechanism 4 pushes the thin substrate 21 into the concave space 20c while holding the thin substrate 21 by any of the same various chuck mechanisms, and the thin substrate 21 follows the concave surface 20a of the concave substrate 20. It is expanded to the concave surface 20a while being bent and deformed.
  • the pressing mechanism 4 can be continuously deformed into two types.
  • the first form of the pressing mechanism 4 is a reduced body that is shrunk smaller than the concave space 20c defined by the concave surface 20a.
  • the 2nd form of the press mechanism 4 is the expansion body expanded according to the concave surface 20a, as shown to (c) of FIG.
  • the pressing mechanism 4 takes the form of a contracting body, the pressing mechanism 4 does not come into contact with the concave surface 20a, so that the thin substrate 21 is rolled into the concave surface space 20c, and in the process of shifting to the expanding body, The substrate 21 is expanded while being bent and deformed so as to follow the concave surface 20a from the center of the substrate, and the entire surface of the thin substrate 21 is brought into close contact with the concave substrate 20 via the adhesive R.
  • the pressing mechanism 4 includes a center block 41 and a separation block 42.
  • the separation block 42 is arranged beside the central block 41 so as to face the side portion 20b of the concave substrate 20.
  • a single separation block 42 is disposed so as to face the side part 20b, and two opposing sides of the four sides are arranged.
  • the separation blocks 42 are arranged on both sides of the central block 41 so as to face the side part 20b, and the side part 20b where all four sides have risen.
  • a total of four separation blocks 42 are arranged on four sides of the central block 41.
  • the central block 41 presses the central region of the thin substrate 21 against the central region of the concave substrate 20. That is, the central block 41 is a substantially rectangular parallelepiped having an upper surface that follows the surface shape of the central region of the concave surface 20a. If the center area
  • the separation block 42 spreads the thin substrate 21 along the concave surface 20 a of the concave substrate 20. Further, the separation block 42 extends to the side portion 20b of the concave substrate 20 and closely contacts the thin substrate 21 without a gap. Therefore, the separation block 42 is generally a rectangular parallelepiped as a whole, but the pressing curved surface 42a facing the side portion 20b of the concave substrate 20 is substantially the same corresponding to the curved or bent surface shape of the side portion 20b. It has become. For example, when the side portion 20b is raised by the curved portion, the pressing curved surface 42a has a rounded curvature considering the curvature of the curved portion, the thickness of the thin substrate 21, and the thickness of the applied adhesive R. .
  • the central block 41 is immovable with respect to the direction of the side portion 20b of the concave substrate 20, and is movable only in the direction toward the concave substrate 20.
  • the separation block 42 is movable not only in the direction toward the concave substrate 20 but also away from the central block 41. Specifically, as shown in FIGS. 3A and 3B, the first position A approaching the central block 41 and the side of the concave substrate 20 as shown in FIG. It moves horizontally between the second position B that abuts the part 20b via the thin substrate 21.
  • the entire facing region of the center block 41 and the separation block 42 is contracted to be smaller than the concave space 20c of the concave substrate 20 and forms a reduced body.
  • the overall facing region is a region where the region facing the concave surface 20a of the central block 41 and the region facing the concave surface 20a of the separation block 42 are inscribed. That is, the sum of the widths of the separation blocks 42 on both sides and the width of the center block 41 is smaller than the concave surface width of the concave substrate 20.
  • the separation block 42 when the separation block 42 is present at the second position B, the entire opposing region formed by the center block 41 and the separation block 42 is expanded along the concave surface 20a of the concave substrate 20, become. That is, the separation block 42 moves from the first position A to the second position B by the amount obtained by subtracting the sum of the width of the separation block 42 on both sides and the width of the center block 41 from the concave surface width of the concave substrate 20. To do.
  • the substrate bonding apparatus 1 first moves the separation block 42 to the central block 41 by moving it to the first position A as shown in FIG. That is, in the first step, the separation block 42 and the central block 41 are deformed into a reduced body shape.
  • the concave substrate 20 is installed in the holding unit 3, and the thin substrate 21 is placed on the upper surfaces of the center block 41 and the separation blocks 42 on both sides. At this time, the concave substrate 20 and the thin substrate 21 face each other in the vacuum chamber 9.
  • the concave substrate 20 is installed so that the concave surface 20 a faces the thin substrate 21.
  • the adhesive R is applied to the opposing surfaces of the concave substrate 20, the thin substrate 21, or both.
  • the holding unit 3 and the contracted body are relatively moved closer to each other.
  • the reduced body enters the concave space 20c
  • the thin substrate 21 is also pushed into the concave space 20c.
  • the reduced body is smaller than the concave space 20c. Accordingly, the thin substrate 21 and the side portion 20b of the concave substrate 20 do not make surface contact, although the possibility of point contact remains. Since there is no surface contact, the thin substrate 21 is not pushed in while rubbing the side portion 20b of the concave substrate 20 with the surface.
  • the relative approach of the holding unit 3 and the contraction body is continued until the central region of the thin substrate 21 is pressed against the central region of the concave substrate 20.
  • the pressing can be detected by installing a torque sensor or the like on the actuator.
  • the separation block 42 is moved to the second position B so as to be separated from the central block 41 as shown in FIG. If it does so, the whole opposing area
  • the separation block 42 As the separation block 42 is horizontally moved, the thin substrate 21 is pushed and expanded along the concave surface 20a of the concave substrate 20 from the central region toward the end.
  • the separation block 42 has an outer shape in which the pressing curved surface 42a matches the surface shape of the side portion 20b. Therefore, the thin substrate 21 and the concave substrate 20 are in close contact with each other. In addition, since the contact is made in order from the center toward the end, no space is generated between the concave substrate 20 and the thin substrate 21.
  • the pressing mechanism 4 included in the substrate bonding apparatus 1 includes the center block 41 and the separation block 42.
  • the separation block 42 is located beside the central block 41 and can approach and separate from the central block 41. Then, until the shape of the central block 41 and the separation block 42 is smaller than the concave space 20 c of the concave substrate 20, the separation block 42 is brought close to the central block 41 and enters the concave space 20 c together with the thin substrate 21. Next, the separation block 42 is moved in the concave space 20c in the direction of the side portion 20b where the concave substrate 20 rises, so that the thin substrate 21 is expanded following the concave surface 20a.
  • this pressing mechanism 4 when the thin substrate 21 is pushed into the concave space 20c of the concave substrate 20, the thin substrate 21 and the side portion 20b of the concave substrate 20 are not in contact with each other and rubbed. For this reason, erroneous portions are bonded to each other, and generation of wrinkles of the thin substrate 21 and generation of a non-contact portion between the thin substrate 21 and the concave substrate 20 can be suppressed.
  • the thin substrate 21 is not pushed in while rubbing the side 20b of the concave substrate 20 with the surface, the outflow of the adhesive R is prevented, the adhesive strength is decreased, the design property is decreased, and the adhesive is bonded. A short circuit or the like via the agent R can be prevented.
  • the thin substrate 21 is pressed against the concave surface 20a of the concave substrate 20 from the central region toward the end as the separation block 42 moves horizontally. Therefore, it is possible to further suppress the occurrence of wrinkles on the thin substrate 21 and the occurrence of a non-contact portion between the thin substrate 21 and the concave substrate 20.
  • the separation block 42 has a pressing curved surface 42a having substantially the same shape as that of the concave surface 20a of the side portion 20b on which the concave substrate 20 rises, on the side portion 20b side. Therefore, the thin substrate 21 can be adhered to the concave substrate 20 in the entire region. Therefore, even when the thin substrate 21 is bonded to the concave substrate 20, a high-quality bonded product can be manufactured.
  • FIG. 4 is an enlarged view showing the side part 20 b of the concave substrate 20.
  • manufacturing errors may occur in the side portion 20b of the concave substrate 20 in the degree of bending or the degree of bending.
  • the shape of the pressing curved surface 42 a of the separation block 42 and the side part 20 b of the concave substrate 20 may not match, and the thin substrate 21 may be difficult to adhere to the concave surface 20 a of the concave substrate 20.
  • the substrate bonding apparatus 1 includes a separation block 42 made of an elastic member, as shown in FIG.
  • the portion made of the elastic member may be only the pressing curved surface 42a that is in close contact with the side portion 20b of the concave substrate 20, or all may be an elastic member for easy manufacture of the separation block 42.
  • the elastic member is a member that is elastically deformed when pressed and has substantially the same shape as the side portion 20b, and returns to its original shape when the pressure is released, and is a natural rubber sheet or block having elasticity, polybutadiene, nitrile And a synthetic rubber sheet or block such as chloroprene, a sheet or block made of fiber such as polyurethane, and a brush bundled with fibers. The same applies to the elastic member described later.
  • FIG. 5 is a diagram illustrating a pressing mode of the separation block 42 when at least the pressing curved surface 42a is formed of an elastic member.
  • the pressing curved surface 42a of the side portion 20b absorbs the error. Deforms following the shape. Therefore, the entire area of the thin substrate 21 can be pressed against the concave substrate 20, and the thin substrate 21 is bent and deformed following the concave surface 20 a with high accuracy, so that the thin substrate 21 and the concave substrate 20 are closely attached.
  • FIG. 6 is a perspective view of the pressing mechanism 4 in the substrate bonding apparatus 1 according to the third embodiment.
  • symbol is attached
  • substrate bonding apparatus 1 which concerns on 3rd Embodiment is bending the thin board
  • separation block 42 are extended and extended in the same direction on the same stage 44, as shown in FIG. The center block 41 is fixed to the stage 44.
  • a rail 45 is laid on the stage 44.
  • the separation block 42 is fixed to a slide base 46 that slides on the rail 45.
  • the rail 45 extends in a direction crossing the long side of the separation block 42. That is, by sliding on the rail 45, the center block 41 is brought into contact with and separated from the center block 41, and the center block 41 and the separation block 42 are in the form of a reduced body and an expanded body.
  • the driving means for moving the separation block 42 is a rotating machine 47a such as a servo motor or a stepping motor, and a ball screw 47b connected to the rotating machine 47a.
  • the ball screw 47b extends in parallel with the rail 45, and each slide base 46 on which each separation block 42 is mounted is fitted to the ball screw 47b. Screw grooves corresponding to the slide bases 46 are formed in opposite directions.
  • the detailed configuration of the pressing mechanism 4 so far is the same as that of the substrate bonding apparatus 1 according to the first embodiment.
  • a claw portion 5 is further provided outside each separation block 42.
  • the tab 5 is guide means for bending the thin substrate 21 in advance in accordance with the shapes of the central block 41 and the separation block 42 when the separation block 42 is at the first position A.
  • the claw portion 5 has a plate shape having approximately the same length as the separation block 42 and is attached along the separation block 42.
  • the claw portion 5 has flanges 5 a bent toward the center of both ends of the separation block 42 at both ends, and is pivotally supported by the flange 5 a on a rotation shaft 48 penetrating the shaft of the separation block 42.
  • the rotating shaft 48 is connected to a rotating machine 49 such as a servo motor or a stepping motor.
  • Each rotating shaft 48 and each rotating machine 49 are fixed to each slide base 46, and this claw portion 5 is movable along the pressing curved surface 42 a of the separation block 42.
  • FIG. 7 is a state transition diagram illustrating the movement in the vicinity of the pressing curved surface 42a in the substrate bonding apparatus 1 according to the third embodiment.
  • the separation block 42 is moved to the third position C as shown in FIG.
  • the third position C is further outward than the second position B, and when the flat thin substrate 21 not receiving external force is placed on the upper surface of the pressing mechanism 4, The position is such that it is slightly applied to the pressing curved surface 42a.
  • the separation block 42 moved to the third position C the thin substrate 21 that has not been subjected to external force is placed on the upper surface of the pressing mechanism 4, and as shown in FIG.
  • the part 5 is moved above the separation block 42 and hooked on the side end face of the thin substrate 21. That is, the extent that the end of the thin substrate 21 protrudes slightly to the pressing curved surface 42a is such that the claw portion 5 can be caught by the side end surface of the thin substrate 21 and exert an external force.
  • the adhesive R is applied to the inside slightly from the outer edge of the thin substrate 21 and the claw portion 5 is not in contact.
  • the claw portion 5 When the claw portion 5 is hooked, the claw portion 5 is rotated downward along the pressing curved surface 42a while pulling back (retracting) the separation block 42 to the first position A as shown in FIG. 7C. I will let you. Since the nail
  • the thin substrate 21 follows the upper surface of the reduction body as shown in FIG. It is wrapped around. In a state where the thin substrate 21 is wound around the upper surface of the reduced body, the shape and size of the thin substrate 21 are smaller than the concave surface 20a of the concave substrate 20.
  • the separation block 42 is moved to the second position B while the claw portion 5 is maintained at the rotation end position, as shown in FIG. Then, as shown in FIG. 7G, the entire thin substrate 21 is brought into close contact with the concave substrate 20. Thus, the thin substrate 21 and the side portion 20b of the concave substrate 20 come into contact for the first time when the separation block 42 moves to the second position B.
  • the claw portion 5 is engaged with the thin substrate 21 until the thin substrate 21 and the side portion 20b of the concave substrate 20 are in close contact with each other, or as shown in FIG. It is desirable to continue.
  • the pressing mechanism 4 further includes guide means for bending the thin substrate 21 in advance according to the shape of the center block 41 and the separation block 42 when the separation block 42 is at the first position A. Then, the driving means moves the separation block 42 to the second position B after the bending.
  • the thin substrate 21 is smaller than the concave space 20c of the concave substrate 20, when the thin substrate 21 is pushed into the concave space 20c of the concave substrate 20, the thin substrate 21 and the concave substrate 20 side The side part 20b does not come into contact. Therefore, even if compared with the first embodiment, wrinkle generation of the thin substrate 21 due to sticking of the wrong place with the adhesive R, non-adherence between the thin substrate 21 and the concave substrate 20 The occurrence of the location can be further suppressed.
  • the thin substrate 21 is not pushed in while rubbing the side 20b of the concave substrate 20 with the surface, it further prevents the adhesive R from flowing out to the outside, lowering the adhesive force, lowering the design, A short circuit or the like via the adhesive R can be further prevented.
  • this guide means is a claw portion 5 for bending the thin substrate 21 in advance by being hooked on the side edge surface of the thin substrate 21 and applying an external force. Therefore, even when the adhesive R is applied to the thin substrate 21, contact with the application surface of the adhesive R for bending can be minimized, and the adhesive force before bonding And the occurrence of unevenness of the adhesive R can be suppressed.
  • the driving means moves the separation block 42 from the third position C outside the second position B to the first position A through the second position B during the bending by the claw portion 5. I moved it.
  • the thin substrate 21 is wound around the pressing curved surface 42a of the separation block 42 so as to correct the bending by the claw portion 5 each time it is gently bent.
  • the thin substrate 21 is greatly bent in the wrong direction during bending or loosely wound around the separation block 42. Can be easily bent and formed. Therefore, the thin substrate 21 can be accurately made smaller than the concave space 20c, and the thin substrate 21 can be brought into close contact with the concave surface 20a of the concave substrate 20 at the time of expansion by the separation block 42, Product quality is improved.
  • FIG. 8 is a state transition diagram illustrating the operation of the claw portion 5 in the substrate bonding apparatus 1 according to the fourth embodiment. As shown in FIG. 8, the claw portion 5 may be moved along the outer shape of the separation block 42, or may be moved linearly while hooking the side edge surface of the thin substrate 21.
  • the claw portion 5 according to the fourth embodiment is separated from the side edge of the thin substrate 21 that is not subjected to external force and at the first position A. It moves on a straight line passing through the side edge of the thin substrate 21 after being bent along the outer shape of the block 42.
  • FIG. 9 is an enlarged view of the separation block 42 of the substrate bonding apparatus 1 according to the fifth embodiment.
  • the separation block 42 includes a curing processing unit 42b that radiates energy for curing the adhesive R.
  • the curing processing unit 42b prevents dripping of the adhesive R, prevents unevenness of the adhesive R caused by contact between the thin substrate 21 and the concave substrate 20, or maintains the shape of the thin substrate 21 bonded in a bent shape.
  • the adhesive R applied to the thin substrate 21 is temporarily cured. Temporary curing is a state in which a completely cured state is not reached.
  • the curing processing unit 42b is housed inside the separation block 42 and radiates energy toward the pressing curved surface 42a in order to maintain the shape of the bent thin substrate 21.
  • the curing processing unit 42b is an infrared lamp if the adhesive R is a thermosetting resin, and a UV lamp if the adhesive R is an ultraviolet curable resin.
  • the adhesive R In order to put the adhesive R in a temporarily cured state, it is sufficient to radiate an amount of energy that does not reach the adhesive R completely. Moreover, if it is an ultraviolet curable resin, it can be made into a temporary hardening state by the oxygen inhibitory effect
  • the adhesive R is applied to the thin substrate 21 in advance, and the thin substrate 21 is bent so as to be wound around the center block 41 and the separation block 42. Thereafter, before the thin substrate 21 is pressed against the concave substrate 20, the adhesive R is temporarily cured by the curing processing unit 42b.
  • the adhesive R applied to the area facing the pressing curved surface 42a that is, the adhesive having a large curved surface, where the applied adhesive R tends to flow and collect on the edge of the thin substrate 21. R is temporarily cured.
  • the thin substrate 21 is pushed into the concave space 20c of the concave substrate 20 while maintaining the state of being bent and shaped following the shapes of the center block 41 and the separation block 42 by temporary curing, and the separation block 42 is moved to the second block. By moving to the position B, the thin substrate 21 is gradually stretched along the concave surface 20a.
  • the center block 41 is further provided with the curing processing unit 42 b that temporarily cures the adhesive R applied to the side portion of the thin substrate 21.
  • the thin substrate 21 formed by bending following the shape of the separation block 42 is temporarily cured.
  • the flow of the adhesive R can be suppressed before the entire area of the thin substrate 21 is brought into close contact with the concave substrate 20 using the separation block 42. For this reason, erroneous portions are bonded to each other, and generation of wrinkles of the thin substrate 21 and generation of a non-contact portion between the thin substrate 21 and the concave substrate 20 can be suppressed.
  • the adhesive R does not move to the edge of the thin substrate 21 before being adhered, the protrusion after adhesion, unevenness of the adhesion thickness, lowering of the adhesive force, lowering of the design, It is possible to prevent a short circuit or the like. Furthermore, after laminating with the substrate laminating apparatus 1, the thin substrate bonded in a bent shape until the next process of curing the final adhesive R is carried out from the substrate laminating apparatus 1 The shape of 21 can be maintained so that it does not peel off.
  • FIG. 10 is an enlarged view of the separation block 42 of the substrate bonding apparatus 1 according to the sixth embodiment.
  • the suction portion 42c is provided to maintain the shape until the bent thin substrate 21 is bonded.
  • the suction part 42 c is a suction pipe connected to the negative pressure generator, and opens to the pressing curved surface 42 a of the separation block 42.
  • a curing processing unit 50 is provided.
  • the curing processing unit 50 radiates energy for curing the adhesive R, and is basically the same as the curing processing unit 42b. However, the curing processing unit 50 is disposed on the side (outside) of the concave substrate 20 that is extended by the bending of the side part 20b.
  • the suction unit 42c sucks the thin substrate 21 wound around the separation block 42 and keeps the thin substrate 21 in close contact with the separation block 42. Suction may be performed so that the entire area of the thin substrate 21 is in close contact with the separation block 42 and the center block 41, but at least a region facing the pressing curved surface 42a, that is, a large curved surface, is likely to generate a reaction force against bending stress. It is effective to suck the points. Then, by moving the separation block 42 to the second position B while maintaining the suction by the suction part 42c, the thin substrate 21 is gradually stretched along the concave surface 20a from the bent state. To go.
  • the curing processing unit 50 applies the adhesive R before or after bending (before bonding to the side part 20b) and after bending (after bonding to the side part 20b). Radiates energy for pre-curing.
  • suck the thin board
  • the adhesive agent R is temporarily hardened by the hardening process part 50 before bending shaping
  • the adhesive R is temporarily cured by the curing processing unit 50 after bending, the shape of the bonded thin substrate 21 can be maintained and prevented from peeling off. Therefore, the same effect as that of the fifth embodiment can be obtained by this configuration.
  • FIG.11 and FIG.12. 11 and 12 are diagrams showing the configuration and operation of the pressing mechanism of the present embodiment.
  • the pressing mechanism 4 of this embodiment includes a pressing portion 141, a displacement portion 142, and a support portion 143. Moreover, this embodiment has the hardening process part 50 similarly to FIG.
  • the pressing portion 141 is a member that moves the thin substrate 21 in a direction in which the thin substrate 21 is in contact with or separated from the concave substrate 20. The pressing portion 141 approaches the concave substrate 20 and presses the thin substrate 21 against the central region of the concave substrate 20.
  • the pressing portion 141 is a substantially rectangular parallelepiped block, and the upper surface thereof has a shape that follows the surface shape of the central region of the concave surface 20a. That is, when the central region of the concave surface 20a is a curved surface, the upper surface of the pressing portion 141 has a shape that follows the curved surface. When the central region of the concave surface 20a is flat, the upper surface of the pressing portion 141 is flat.
  • the upper surface is provided with the above-described chuck mechanism so that the thin substrate 21 can be held.
  • the displacement portion 142 is a pair of members provided on both sides of the pressing portion 141 corresponding to the both side portions 20b of the concave substrate 20.
  • the displacement portion 142 is provided at a position that fits together with the pressing portion 141 in the space inside the side portion 20 b of the concave substrate 20 when the pressing portion 141 presses the thin substrate 21.
  • the displacement portion 142 approaches the concave substrate 20 together with the pressing portion 141 and is displaced toward the outer edge of the thin substrate 21 while one end is in contact with the thin substrate 21. Due to this displacement, the displacement part 142 presses the thin substrate 21 along the concave surface 20 a of the concave substrate 20.
  • the displacement portion 142 may be provided on one, three or four sides of the pressing portion 141 correspondingly.
  • the displacement portion 142 of the present embodiment has a plate shape having at least the entire length of the side portion 20b in parallel with the side portions 20b of the concave substrate 20.
  • One end of the displacement portion 142 that contacts and separates from the thin substrate 21 is a plate-shaped edge portion 142x.
  • the displacement part 142 is configured by an elastic member that is bent when the edge part 142x comes into contact with the thin substrate 21 and is pressed against the concave substrate 20.
  • various materials can be applied as the material of the elastic member.
  • the displacement part 142 can be made of rubber or other resin.
  • the whole does not necessarily need to be a flat surface and may have a fixed angle and curvature.
  • the displacement portion 142 does not damage the concave substrate 20 and the thin substrate 21.
  • it may be made of rubber or other resin or coated with resin. Further, by making the edge 142x have a round shape, damage can be prevented.
  • the support portion 143 is a member that supports the other end that is a part of the displacement portion 142.
  • the support portion 143 has a shaft portion 143 a that serves as a fulcrum of displacement of the displacement portion 142.
  • the shaft portion 143a is provided in parallel to the side portion 20b of the concave substrate 20, and is rotated by a driving source (not shown). Thereby, the support part 143 rotates centering
  • the radius of rotation from the center of rotation of the shaft portion 143a of the support portion 143 to one end of the displacement portion 142 is such that one end of the displacement portion 142 does not leave the thin substrate 21 during the rotation and is moved to the concave substrate 20.
  • the length is set to maintain the crimping.
  • the distance from the rotation center of the shaft portion 143a to the inner surface of the curved portion may not be constant depending on the position and shape of the inner surface.
  • the difference between the position where the distance is the longest and the position where the distance is the shortest is absorbed by the elastic deformation of the displacement portion 142, and the pressure bonding of the thin substrate 21 to the concave substrate 20 by one end of the displacement portion 142 is maintained.
  • Turning radius is set.
  • the pressing portion 141 is set so as to press the thin substrate 21 to the concave substrate 20 simultaneously with the displacement portion 142 or before the displacement portion 142. In the case of simultaneously pressing, the pressing surface of the pressing portion 141 and the height of one end of the displacement portion 142 are made equal.
  • an elastic member that urges the pressing portion 141 in a direction in which the thin substrate 21 is pressed against the concave substrate 20 is provided.
  • the pressing portion 141 presses the thin substrate 21 to the concave substrate 20 the pressing portion 141 moves backward relative to the displacement portion 142 against the urging force of the elastic member, and then the displacement One end of the portion 142 presses the thin substrate 21 to the concave substrate 20.
  • the pressing portion 141 itself or its pressing surface can be an elastic body.
  • the pressing surface of the pressing portion 141 is elastically deformed and retreats relative to one end of the displacement portion 142, and then is displaced.
  • One end of the portion 142 presses the thin substrate 21 to the concave substrate 20.
  • the vacuum chamber 9 is evacuated by a vacuum source. Then, before the thin substrate 21 is attached close to the concave substrate 20, energy for temporarily curing the adhesive R is emitted from the curing processing unit 50. Thereby, when the pressing part 141 and the displacement part 142 enter the space between the side parts 20b which the concave substrate 20 opposes, it can suppress that the adhesive agent R apply
  • the pressing unit 141 and the displacement unit 142 enter the space between the opposing side portions 20 b of the concave substrate 20, so that the thin substrate 21 is also in this space. Get inside.
  • the displacement portion 142 is in a space inside the side portion 20 b of the concave substrate 20.
  • the approach between the holding unit 3 and the pressing mechanism 4 continues until the pressing unit 141 presses the central region of the thin substrate 21 against the central region of the concave substrate 20 as shown in FIGS. .
  • the pressing can be detected by connecting a torque sensor or the like to the drive source of the drive mechanism.
  • the pressing portion 141 presses the thin substrate 21 against the concave substrate 20
  • one end of the displacement portion 142 also presses the thin substrate 21 against the concave substrate 20.
  • the pressing timing of the pressing portion 141 and the pressing timing of the displacement portion 142 are as described above.
  • the displacement portion 142 is elastically deformed, and one end of the displacement portion 142 is inserted at a position continuous with the pressing end of the pressing portion 141.
  • the drive source is activated and the support portion 143 is rotated. Then, one end of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20 b of the concave substrate 20. Due to the elastic deformation of the displacement portion 142, one end thereof maintains contact with the concave substrate 20 via the thin substrate 21. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20. In addition, you may radiate
  • the thin substrate 21 follows the rotation of the displacement portion 142 toward the side portion 20 b of the concave substrate 20. 21 is pressed against the concave substrate 20. For this reason, the thin substrate 21 can be uniformly adhered over the entire surface of the concave substrate 20 without the occurrence of biting of vacuum bubbles or the like. Therefore, the quality of the product after bonding is improved. Moreover, since the adhesive agent R is temporarily hardened by the hardening process part 50 before bonding, the flow of the adhesive agent R is suppressed.
  • the adhesive R is temporarily cured by the curing processing unit 50 after bonding, the shape of the bonded thin substrate 21 can be maintained and can be prevented from peeling off. Therefore, the same effects as those of the fifth and sixth embodiments can be obtained by this configuration. In addition, you may perform any one or both of temporary hardening before bonding and temporary hardening after bonding.
  • FIG.13 and FIG.14 are diagrams showing the configuration and operation of the pressing mechanism 4 in the present embodiment.
  • the displacement part 142 of this embodiment has the roller 142a and the axial support part 142b.
  • the roller 142a is a rotating member having at least the entire length of the side portion 20b in parallel with the side portion 20b of the concave substrate 20.
  • the outer peripheral surface of the roller 142 a becomes one end of a displacement portion 142 that contacts and separates from the thin substrate 21.
  • the shaft support 142b is a member that rotatably supports the roller 142a at one end thereof.
  • the shaft support 142b has a length at least equal to the entire length of the roller 142a.
  • the shaft support 142b supports both ends of the shaft of the roller 142a by arm portions at both ends.
  • the arm portion is provided so as to be displaceable (extendable / contractible) by, for example, an elastic body, an air cylinder, an electromagnet floating device, and the like, and is configured to maintain the pressure bonding by the roller 142a according to the shape of the bending portion.
  • the elastic body it is possible to use rubber or other resin, a spring, or a material in which the support is elastically supported by these.
  • an electromagnet it becomes easy to adjust the crimping force, the amount of expansion and contraction, etc., by the control device controlling energization.
  • the support part 143 is a member that supports the other end of the shaft support part 142b.
  • the support portion 143 has a displacement fulcrum of the displacement portion 142, that is, a shaft portion 143a serving as a rotation axis of the shaft support portion 142b.
  • the configuration of the shaft portion 143a is the same as that in the first embodiment.
  • the pressing portion 141 is set to press the thin substrate 21 to the concave substrate 20 simultaneously with the roller 142a of the displacement portion 142 or before the roller 142a, as in the first embodiment. Yes.
  • the outer peripheral surface of the roller 142a which is one end of the displacement portion 142, is in a space inside the side portion 20b of the concave substrate 20.
  • the drive source is activated and the shaft portion 143a rotates.
  • the roller 142a of the displacement portion 142 rotates along the curved portion of the side portion 20b of the concave substrate 20 toward the outer edge of the thin substrate 21. Moving. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20.
  • the arm portion expands and contracts according to the shape of the curved portion, so that the pressure bonding of the thin substrate 21 to the concave substrate 20 by the roller 142a is maintained.
  • the same effects as those of the seventh embodiment can be obtained, and the following effects can be obtained. That is, the member that is in direct contact with the thin substrate 21 is the rotating roller 142a. For this reason, scratches and the like due to rubbing the surface of the thin substrate 21 are less likely to occur. Further, since the thin substrate 21 is not easily damaged even if it is moved at a high speed, the bonding process can be speeded up. Furthermore, even when the shape of the curved portion of the concave substrate 20 and the flexibility of the thin substrate 21 vary due to the expansion and contraction of the arm portion, it is possible to maintain the pressure bonding following the curved surface.
  • FIG.15 and FIG.16 is a figure which shows the structure and operation
  • This embodiment is basically the same configuration as the seventh embodiment.
  • the displacement part 142 of this embodiment has the brush 142c, as shown in FIG.
  • the support part 143 has the base
  • the brush 142c is, for example, an assembly of a plurality of resins, natural or synthetic fibers, or hairs, and one end of the brush 142c faces the curved portion of the side portion 20b of the concave substrate 20. The other end, which is a part of the brush 142c, is implanted in the base portion 143b.
  • the base portion 143b is a member having at least the entire length of the side portion 20b in parallel with the side portion 20b of the concave substrate 20, and has a curved surface toward the curved portion of the side portion 20b.
  • the brush 142c is planted over the entire surface of the curved surface.
  • the tip of the brush 142c is one end that contacts the thin substrate 21 and presses against the concave substrate 20.
  • the portion of the brush 142c that is implanted into the base portion 143b is one of the fulcrums for displacement of the brush 142c. Further, since the brush 142c has flexibility, it is bent when the thin substrate 21 is pressed against the concave substrate 20.
  • the base portion 143 b of the displacement portion 142 is further recessed, and the tip of the brush 142 c is concave to the thin substrate 21. It has a drive mechanism that moves in the direction of pressing against the substrate 20.
  • the pressing portion 141 is set to press the thin substrate 21 against the concave substrate 20 simultaneously with the brush 142c of the displacement portion 142 or before the brush 142c. Yes.
  • the tip of the brush 142c which is one end of the displacement portion 142, fits in a space inside the side portion 20b of the concave substrate 20, and the thin substrate 21 is sequentially pressed against the concave substrate 20 from the inside to the outside. Is set.
  • the tip of the brush 142c which is one end of the displacement portion 142, is in a space inside the side portion 20b of the concave substrate 20.
  • the drive mechanism operates to move the base portion 143b toward the concave substrate 20. Then, as shown in FIGS. 16C and 16D, the brush 142c is bent while pressing the thin substrate 21 against the concave substrate 20 sequentially from the inner brush 142c to the outer brush 142c. Thereby, the brush 142c press-bonds the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20.
  • the member that is in direct contact with the thin substrate 21 is a flexible brush 142c. For this reason, even if there is a greater difference or variation in the curved shape, it is possible to absorb this and perform bonding with high accuracy. Further, scratches caused by rubbing the surface of the thin substrate 21 are less likely to occur.
  • the thin substrate 21 is hardly damaged even if it is moved at a high speed, the bonding process can be speeded up. Furthermore, since the structure of the displacement part 142 is the brush 142c planted in the base
  • FIG. 17 is a diagram illustrating the configuration and operation of the pressing mechanism 4 in the present embodiment.
  • This embodiment is basically the same configuration as the ninth embodiment.
  • the pressing portion 141 and the base portion 143b (support portion 143) are integrally formed, and not only the base portion 143b but also the upper surface of the pressing portion 141.
  • the brush 142c (displacement part 142) is planted.
  • the tip of the brush 142c is centered so that the thin substrate 21 is crimped first from the central portion of the concave substrate 20, and the other brushes 142c are also sequentially crimped toward the side portion 20b of the concave substrate 20.
  • the department is set high.
  • the tip of the brush 142c which is one end of the displacement portion 142, is located inside the side portion 20b of the concave substrate 20.
  • the brush 142 c of the pressing unit 141 presses the thin substrate 21 against the concave substrate 20.
  • the tip of the brush 142c sequentially press-bonds the thin substrate 21 from the central portion of the concave substrate 20 toward the side portion 20b.
  • the thin substrate 21 is sequentially moved from the inner brush 142c to the outer brush 142c also in the curved portion of the side portion 20b of the concave substrate 20.
  • the brush 142c is bent while being pressed against the concave substrate 20. Thereby, the brush 142c press-bonds the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20.
  • FIG. 18 is a diagram illustrating the configuration and operation of the pressing mechanism 4 in the present embodiment.
  • This embodiment is basically the same configuration as the seventh embodiment. However, this embodiment has a guide mechanism 15 as shown in FIG.
  • the guide mechanism 15 is a mechanism that guides the surface in the vicinity of the side portion 21 b of the thin substrate 21 pressed by the pressing mechanism 4 so as to enter the inside of the side portions 20 b of the concave substrate 20.
  • the guide mechanism 15 has a pair of guide members 15 a that come in contact with and separate from both side portions 21 b of the thin substrate 21 placed on the pressing mechanism 4.
  • the guide member 15a has a plate shape having a length equivalent to at least the entire length of the side portion 21b of the thin substrate 21.
  • the pair of guide members 15a is moved between a guide position in contact with the side portion 21b of the thin substrate 21 and a retraction position that is retracted away from the side portion 21b of the thin substrate 21 by a moving mechanism (not shown). It is provided to be movable. In addition, this moving mechanism is provided with a pair of frames each having a guide member 15a so as to be rotatable around an axis connected to a drive source, and by rotating in opposite directions to each other, It is good also as a structure which the guide member 15a moves to the direction which mutually contacts.
  • the pair of guide members 15 a are provided so as to be lifted and lowered together with the pressing mechanism 4 by a lifting mechanism (not shown) while being in contact with the side portion 21 b of the thin substrate 21.
  • this lifting mechanism may also be used as the driving mechanism of the pressing mechanism 4.
  • the up-and-down movement of the guide member 15 a may be relative to the concave substrate 20 held by the holding unit 3.
  • the pair of guide members 15 a are configured so that the thin substrate 21 is held at a position separated from the concave substrate 20 except for a portion pressed by the pressing portion 141 and pressed by the displacement portion 142. An interval and a follow-up distance to the pressing mechanism 4 are set.
  • the both side portions 21b of the thin substrate 21 come to a position entering the space inside the both side portions 20b of the concave substrate 20.
  • the pressing mechanism 4 approaches the concave substrate 20 in a state where the positions of the both side portions 21b of the thin substrate 21 are regulated, and the guide member 15a also approaches the concave substrate 20 following this. .
  • both side portions 21b of the thin substrate 21 are located inside the side portions 20b of the concave substrate 20 by the guide member 15a.
  • the pressing unit 141 presses the thin substrate 21 against the concave substrate 20, and the displacement unit 142 follows the curved portion of the side portion 20 b of the concave substrate 20.
  • the thin substrate 21 is crimped. The details are the same as in the first embodiment.
  • the thin substrate 21 is held in contact with the guide member 15a until the entire surface of the thin substrate 21 is bonded to the concave substrate 20, and thereafter, FIG. E), the guide member 15a is separated from the thin substrate 21. For this reason, shaking of the plate surface of the thin substrate 21 being bonded is prevented.
  • the displacement portion 142 of the present embodiment has, for example, a plurality of one ends that are substantially elliptical in cross section and contacted and separated from the thin substrate 21.
  • the displacement part 142 is a rotation member which has the length of the full length of the side part 20b at least parallel to the side part 20b of the concave board
  • a relatively hard member or an elastic member may be used.
  • the support portion 143 is a shaft that supports a part of the displacement portion 142 and serves as a pivot point of rotation of the displacement portion 142.
  • the configuration of this shaft is the same as that of the shaft portion 143a of the first embodiment.
  • the support portion 143 is provided at an eccentric position of the displacement portion 142, and the edge portion 142y that is one outer peripheral surface of the displacement portion 142 and the edge portion 142z that is the other outer peripheral surface that opposes the support portion 143, that is, The distance from the rotation center of the shaft is different.
  • the edge 142y has a longer distance from the center of rotation than the edge 142z.
  • the edge portions 142y and 142z serve as one end of the displacement portion 142 that contacts and separates from the thin substrate 21. Note that three or more ends having different rotation radii can be provided so as to be able to handle more curved surfaces.
  • a hole, a recess, or a cavity that allows the displacement portion 142 to rotate is provided in the vicinity of the displacement portion 142 in the pressing portion 141. Further, the pressing portion 141 is set so as to press the thin substrate 21 to the concave substrate 20 simultaneously with the displacement portion 142 or before the displacement portion 142 as in the first embodiment.
  • the support portion 143 may be provided so as to be displaceable by an elastic member, and the pressure bonding by the displacement portion 142 may be maintained according to the shape of the bending portion.
  • FIG. 19A shows a case of a curved shape with a large radius of curvature.
  • the edge 142y faces the thin substrate 21.
  • the pressing mechanism 4 is brought close to the holding unit 3 that holds the concave substrate 20, and the thin substrate 21 enters the space between the opposing side portions 20 b of the concave substrate 20.
  • the edge portion 142 y of the displacement portion 142 together with the pressing portion 141, presses the thin substrate 21 against the concave substrate 20.
  • the drive source operates and the support portion 143 rotates. Then, as shown in FIG. 19B, the edge 142 y of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20 b of the concave substrate 20. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20.
  • the edge 142z faces the thin substrate 21 as shown in FIG. And the support part 143 rotates in the state which the edge part 142z pressed the thin board
  • the support portion 143 so as to be displaceable by an elastic member, even if the shape of the curved portion of the concave substrate 20 and the flexibility of the thin substrate 21 vary, it is possible to maintain the pressure bonding following the curved surface. it can.
  • the positional relationship between a pair of substrates to be bonded is not limited to that exemplified in the above embodiment.
  • FIG. 21A it is possible to configure a mode in which the concave substrate 20 is supported downward and the thin substrate 21 is held upward by the pressing portion 141.
  • FIGS. 21B to 21D the pressing portion 141 and the displacement portion 142 holding the thin substrate 21 are lowered, and the pressing portion 141 moves the central region of the thin substrate 21 into the concave substrate. 20, the displacement portion 142 presses the thin substrate 21 against the side portion 20 b of the concave substrate 20. Bonding can also be performed by placing the thin substrate 21 above the concave substrate 20 and pressing it from above with the pressing portion 141 and the displacement portion 142.
  • the adhesive by pre-curing the adhesive before bonding and the adhesive after bonding by irradiation of energy by the curing processing unit, The flow may be suppressed.
  • This temporary curing can be realized, for example, by weakening the energy applied to the adhesive.
  • the adhesive when the adhesive is an ultraviolet curable resin, the adhesive can be temporarily cured by irradiating UV light in the atmosphere. In the case of irradiation in the atmosphere, curing is hindered by oxygen in the atmosphere, and it is easy to maintain a state in which the viscosity of the surface is maintained.
  • the curing processing units 42b and 50 are provided outside the holding unit 3. However, the curing processing units 42b and 50 are also provided inside the holding unit 3 to cure the entire adhesive R from the entire holding unit 3. May be radiated. And the following hardening processes are realizable by using these hardening process parts properly.
  • the adhesive R applied to the concave substrate 20 or the thin substrate 21 is temporarily cured before bonding.
  • the adhesive is temporarily cured by radiating energy from the curing unit before and after the bonding.
  • the curing processing unit is directed toward the portion where the concave substrate and the thin substrate are pressure bonded in accordance with the movement of one end of the displacement portion. May emit energy.
  • the light of the UV lamp is guided by an optical fiber, and the end face of the optical fiber is arranged in a straight line or a dotted shape over the entire length of the concave substrate, and the concave substrate and the thin substrate are crimped in accordance with the movement of one end of the displacement portion.
  • the UV is irradiated toward the target site.
  • the adhesive is temporarily cured.
  • the time for temporary curing can be shortened, and the displacement of the thin substrate with respect to the concave substrate can be suppressed.
  • the substrates may be bonded in a vacuum or in the air. Even when the process is performed in the air, it is possible to prevent entrapment of bubbles and the like by pressing the thin substrate from the central region of the concave substrate toward the side portion.
  • the flat surface is not crimped in a relatively wide range, but can be sequentially crimped from the center of the concave substrate toward the outside. , Effective in preventing air bubbles.
  • the substrate to be bonded is typically a cover panel, a touch panel and a liquid crystal module, or a display panel and a backlight constituting the liquid crystal module.
  • the size, shape, material, etc. are not limited as long as they can be a pair of objects to be attached.
  • the present invention can also be applied to various members constituting the display device. It is free to attach the adhesive to which substrate, and it is applicable not only when the adhesive is attached to one of the substrates but also when the adhesive is attached to both. The present invention is also applicable to the case where one substrate is pressure-bonded to the other substrate without using an adhesive.
  • any of the above embodiments may be combined.
  • the eleventh embodiment can be combined with all the above embodiments.
  • the above embodiments are not intended to limit the scope of the invention.
  • These embodiments can be variously omitted, replaced, changed, and combined within the scope of the gist of the invention, and are included in the invention described in the scope of claims and the equivalents thereof.
  • Displacement part 142a ... Roller 142b ... Shaft support part 142c ... Brush 142x, 142y, 142z ... Edge part 143 ... Supporting part 143a ... Shaft part 143b ... Base part R ... Adhesive A ... 1st position B ... 2nd position C ... 3rd position

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

Provided is a substrate bonding apparatus with which high-precision bonding, using adhesive, between a concave substrate having a concave face and a flexible, thin substrate can be achieved. Said apparatus is provided with a central block (41) and separated blocks (42), both sides of which are separated by the central block (41), and the separated blocks (42) have, on the side edge part (20b) of a concave substrate (20) side, a pressing-bending face (42a) which has essentially the same shape as a concave face (20a) portion of said side edge part (20b). The separated blocks (42) move between a first position (A) close to the central block (41) and a second position (B) in contact, by way of the thin substrate (21), with the side edge part (20b) of the concave substrate (20). When the separated blocks (42) move into the first position (A), the central block (41) and the separated blocks (42) are contracted so as to be smaller than the concave face space (20c) of the concave substrate (20), and when the separated blocks (42) move into the second position (B), the separated blocks (42) the central block (41) and the separated blocks (42) expand to lie along the concave face (20a) of the concave substrate (20).

Description

[規則37.2に基づきISAが決定した発明の名称]　基板貼合装置及び基板貼合方法[Name of invention determined by ISA based on Rule 37.2] Board pasting device and board pasting method
　本発明は、一対の基板を貼り合わせる基板貼合装置に関する。 This invention relates to the board | substrate bonding apparatus which bonds a pair of board | substrate.
　スマートフォンやＰＤＡ（パーソナルデジタルアシスタント）などの電子機器において、ディスプレイにユーザが指やペン等で触れてジェスチャ操作を行うことを可能とするタッチパネルを備えたものが多く用いられている。 2. Description of the Related Art Electronic devices such as smartphones and PDAs (personal digital assistants) are often provided with a touch panel that allows a user to perform a gesture operation by touching a display with a finger or a pen.
　このような電子機器は、筐体表面に配置されたディスプレイに、タッチパネルシートとカバーパネルとを積層した積層基板体を被覆して構成される。 Such an electronic device is configured by covering a display arranged on the surface of a casing with a laminated substrate body in which a touch panel sheet and a cover panel are laminated.
　積層基板体の製造方法は、一例として、基板貼合装置の載置面に載置したタッチパネルシート表面に接着剤を塗布して、上方に保持したカバーパネルに対して押し付けて接合する。 As an example, the method of manufacturing the laminated substrate body is performed by applying an adhesive to the surface of the touch panel sheet placed on the placement surface of the substrate laminating apparatus, and pressing and joining the cover panel held above.
特開２０１１－１５０３３１号公報JP 2011-150331 A
　電子機器の筐体側面部分には機器操作用の物理ボタンが設けられていることが多かったが、近年、柔軟性の高い有機ＥＬディスプレイを用いて、筐体表面だけでなく筐体の側面にもディスプレイを延設し、側面部分においてもタッチパネルによるジェスチャ操作を可能とすることが提案されている。 In many cases, physical buttons for device operation have been provided on the side of the casing of electronic devices, but in recent years, a highly flexible organic EL display has been used not only on the surface of the casing but also on the side of the casing. In addition, it has been proposed that a display is extended to enable gesture operation using a touch panel even on a side surface portion.
　そのため、積層基板体も、両端を湾曲又は屈曲して立ち上げて凹形状とし、ディスプレイを表面から側面にかけて覆うように構成する必要がある。 Therefore, the laminated substrate body also needs to be configured to be bent and bent at both ends to form a concave shape so as to cover the display from the surface to the side surface.
　凹形状の積層基板体を製造するためには、まず、カバーパネルとなるガラス又は樹脂製の基板の両端を湾曲又は屈曲して凹状に成形する。次に可撓性を有するタッチパネル用シートを、このカバーパネルの凹面に沿って密着するように積層処理を行う必要がある。 In order to manufacture a concave laminated substrate body, first, both ends of a glass or resin substrate serving as a cover panel are bent or bent to form a concave shape. Next, it is necessary to perform a lamination process so that the flexible touch panel sheet adheres along the concave surface of the cover panel.
　積層処理の方法としては、例えば、基板貼合装置の載置面をカバーパネルの凹面に嵌合する凸面とし、接着剤を塗布したタッチパネルシートを撓ませてこの凸面上に沿わせて保持する。そしてカバーパネルの凹面に押し込んで両者を接合する。 As a method of the lamination process, for example, the mounting surface of the substrate bonding apparatus is a convex surface that fits into the concave surface of the cover panel, and the touch panel sheet coated with the adhesive is bent and held along the convex surface. And it pushes into the concave surface of a cover panel, and joins both.
　しかしながら、このような製造方法の場合、カバーパネルの凹面にタッチパネルシートを押し込んだ際に、カバーパネルの両端の湾曲又は屈曲した立ち上がり部に接着剤が塗布されたタッチパネルシートが面接触で擦りながら押し込まれることになる。 However, in the case of such a manufacturing method, when the touch panel sheet is pushed into the concave surface of the cover panel, the touch panel sheet coated with an adhesive is pushed into the curved or bent rising portions at both ends of the cover panel while being rubbed in surface contact. Will be.
　この面接触によって接着剤が削り取られてしまい、カバーパネルとタッチパネルシートが適切に接合されなかったり、接着剤の一部が外にはみ出して製品不良を招く可能性があった。 The adhesive may be scraped off by this surface contact, and the cover panel and the touch panel sheet may not be properly joined, or a part of the adhesive may protrude to the outside and cause a product defect.
　また、カバーパネルの両端の湾曲又は屈曲した立ち上がり部の湾曲度合いや屈曲度合いに製造誤差が生じる場合がある。この場合、基板貼合装置の載置面をカバーパネルの凹面に嵌合する凸面の形状が一致せず、両者が密着させづらいことがある。 In addition, there may be a manufacturing error in the degree of bending or the degree of bending of the bent or bent rising portion of the cover panel. In this case, the shape of the convex surface which fits the mounting surface of the board | substrate bonding apparatus to the concave surface of a cover panel may not correspond, and it may be difficult to stick both.
　本発明は、上述のような問題点を解決するために提案されたものである。すなわち、本発明は、凹面を有する凹状基板と可撓性を有する薄状基板とを接着剤を介して精度よく貼り合わせることのできる基板貼合装置を提供することを目的とする。 The present invention has been proposed to solve the above-described problems. That is, an object of this invention is to provide the board | substrate bonding apparatus which can bond the concave board | substrate which has a concave surface, and the thin board | substrate which has flexibility with an adhesive agent accurately.
　本発明は、凹面を有する凹状基板と可撓性を有する薄状基板とを、接着剤を介して貼り合わせる基板貼合装置であって、前記凹状基板の凹面に対して、前記薄状基板を押圧する押圧手段を有し、前記押圧手段は、前記凹状基板の凹面に前記薄状基板を押し付ける押付部と、前記押付部の脇に位置し、前記押付部による前記凹状基板に対する前記薄状基板の押し付けとともに、前記凹状基板の凹面内に収まり、前記薄状基板を前記凹面に倣って圧着させるように変位する変位部と、を有することを特徴とする。 The present invention is a substrate bonding apparatus for bonding a concave substrate having a concave surface and a flexible thin substrate via an adhesive, and the thin substrate is attached to the concave surface of the concave substrate. A pressing unit that presses the pressing unit, the pressing unit pressing the thin substrate against the concave surface of the concave substrate; and the thin substrate that is positioned on the side of the pressing unit with respect to the concave substrate by the pressing unit. And a displacement portion that fits within the concave surface of the concave substrate and displaces the thin substrate so as to follow the concave surface.
　前記押付部は、中心ブロックであり、前記変位部は、前記中心ブロックと接近及び離反可能な分離ブロックであり、前記押圧手段は、前記中心ブロックと前記分離ブロックが前記凹面よりも小さく縮まるまで、前記分離ブロックを前記中心ブロックに寄せて、前記薄状基板とともに当該凹面空間内に入り込ませ、前記分離ブロックを前記凹面空間内で前記凹状基板の側辺部方向へ移動させることで、前記薄状基板を前記凹面に倣って押し拡げるようにしてもよい。 The pressing portion is a center block, the displacement portion is a separation block that can approach and separate from the center block, and the pressing means until the center block and the separation block contract smaller than the concave surface, The separation block is brought close to the central block and enters the concave space together with the thin substrate, and the separation block is moved in the concave space toward the side of the concave substrate, thereby reducing the thin shape. The substrate may be expanded along the concave surface.
　前記分離ブロックは、前記凹状基板の前記側辺部が有する前記凹面の部分と概略同一形状の押圧曲面を該側辺部側に有するようにしてもよい。 The separation block may have a pressing curved surface having substantially the same shape as the concave surface portion of the side portion of the concave substrate on the side portion side.
　　前記変位部の少なくとも一部が、弾性部材により構成されていてもよい。 At least a part of the displacement part may be constituted by an elastic member.
　前記押圧手段は、前記分離ブロックを前記中心ブロックに寄せたときの全体形状に倣って前記薄状基板を予め曲げ成形するガイド手段を更に備え、前記分離ブロックは、前記曲げ成形後、前記凹状基板の前記側辺部方向へ移動するようにしてもよい。 The pressing means further includes guide means for pre-bending the thin substrate following the overall shape when the separation block is moved to the central block, and the separation block is formed into the concave substrate after the bending. You may make it move to the said side part direction.
　前記ガイド手段は、前記薄状基板の側辺端面に引っ掛かって外力を与えることで、当該薄状基板を予め前記曲げ成形するツメ部を含むようにしてもよい。 The guide means may include a claw portion that preliminarily bends the thin substrate by being hooked on the side edge of the thin substrate and applying an external force.
　前記分離ブロックは、前記ツメ部による前記曲げ成形の最中、前記凹状基板の前記側辺部と前記薄状基板を介して当接する位置よりも外側方の位置から、前記中心ブロックに寄った位置まで移動するようにしてもよい。 The separation block is located near the central block from a position outside the position where the side block of the concave substrate contacts with the side plate during the bending by the claw portion via the thin substrate. You may make it move to.
　前記ツメ部は、外力を受けていない前記薄状基板の側辺端面を通り、前記分離ブロックの外形に沿って移動するようにしてもよい。 The claw portion may move along the outer shape of the separation block through the side edge surface of the thin substrate not receiving an external force.
　前記ツメ部は、外力を受けていない前記薄状基板の側辺端と、前記中心ブロックに寄った前記分離ブロックの外形に沿って曲げ成形された後の前記薄状基板の側辺端とを通る直線上を移動するようにしてもよい。 The claw portion includes a side edge of the thin substrate that is not subjected to an external force, and a side edge of the thin substrate after being bent along the outer shape of the separation block close to the center block. You may make it move on the straight line which passes.
　前記中心ブロックと前記分離ブロックとの全体形状に倣って曲げ成形された前記薄状基板を前記分離ブロックに吸着させる吸引手段を更に備えるようにしてもよい。 A suction means for adsorbing the thin substrate bent and shaped in accordance with the overall shape of the center block and the separation block to the separation block may be further provided.
　前記凹状基板及び前記薄状基板の少なくとも一方に塗布されている前記接着剤を、前記薄状基板を前記凹状基板に貼り合わせる前及び貼り合わせた後の少なくとも一方において、仮硬化させる硬化処理部を備えるようにしてもよい。 A curing unit that temporarily cures the adhesive applied to at least one of the concave substrate and the thin substrate before and after the thin substrate is bonded to the concave substrate; You may make it prepare.
　前記凹状基板及び前記薄状基板の少なくとも一方に塗布されている前記接着剤を、前記側辺部の貼り合わせ前及び前記側辺部の貼り合わせ後の少なくとも一方において、仮硬化させる硬化処理部を備えるようにしてもよい。 A curing treatment unit that temporarily cures the adhesive applied to at least one of the concave substrate and the thin substrate, at least before bonding the side edges and after bonding the side edges; You may make it prepare.
　前記押圧手段は、前記変位部を支持する支持部を有し、前記変位部は、他端を前記薄状基板に接触させながら、前記凹状基板の側辺部に向かって変位することにより、前記薄状基板を前記凹面に倣って圧着させ、前記支持部は、前記変位部の他端を変位の支点として支持するようにしてもよい。 The pressing means includes a support portion that supports the displacement portion, and the displacement portion is displaced toward the side portion of the concave substrate while bringing the other end into contact with the thin substrate, The thin substrate may be pressure-bonded following the concave surface, and the support portion may support the other end of the displacement portion as a displacement fulcrum.
　前記変位部の一端は、前記凹状基板への前記薄状基板の圧着を維持するように、前記支点との間の距離が可変に設けられていてもよい。 The distance between the one end of the displacement part and the fulcrum may be variably provided so as to maintain the pressure bonding of the thin substrate to the concave substrate.
　なお、上記のような態様を、方法として捉えたものも、本発明の一態様である。 In addition, what caught the above aspects as a method is also 1 aspect of this invention.
　本発明によれば、凹状基板の凹面空間内に薄状基板を押し込む際、薄状基板と凹状基板の側辺部とが面接触して擦れることはない。そのため、誤った箇所同士が接着してしまい、薄状基板のシワ発生、薄状基板と凹状基板との間の非密着箇所発生を抑制することができる。また、薄状基板が凹状基板の側辺部を面で摩りながら押し込まれることがなくなるため、接着剤の外側への流出を防止し、接着力の低下、意匠性の低下、接着剤を介した短絡等を防止することができる。 According to the present invention, when the thin substrate is pushed into the concave space of the concave substrate, the thin substrate and the side portion of the concave substrate do not rub due to surface contact. Therefore, erroneous locations are bonded to each other, and generation of wrinkles of the thin substrate and generation of non-contacted portions between the thin substrate and the concave substrate can be suppressed. In addition, since the thin substrate is not pushed in while grinding the side part of the concave substrate with the surface, the outflow of the adhesive is prevented, the adhesive force is decreased, the design property is decreased, and the adhesive is interposed. A short circuit or the like can be prevented.
貼り合わせ後の各種基板を示す模式図である。It is a schematic diagram which shows the various board | substrates after bonding. 第１の実施形態に係る基板貼合装置の構成図である。It is a block diagram of the board | substrate bonding apparatus which concerns on 1st Embodiment. 第１の実施形態に係る基板貼合装置が備える押圧機構の構成図である。It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 1st Embodiment is provided. 第２の実施形態に係り、凹状基板の側辺部を示す拡大図である。It is an enlarged view which shows the side part of a concave board | substrate concerning 2nd Embodiment. 第２の実施形態に係る基板貼合装置の分離ブロックの押圧態様を示す図である。It is a figure which shows the press aspect of the separation block of the board | substrate bonding apparatus which concerns on 2nd Embodiment. 第３の実施形態に係る押圧機構の斜視図である。It is a perspective view of the press mechanism which concerns on 3rd Embodiment. 第３の実施形態に係る押圧曲面付近の動きを示す状態遷移図である。It is a state transition diagram which shows the motion of the press curved surface vicinity which concerns on 3rd Embodiment. 第４の実施形態に係るツメ部の動作を示す状態遷移図である。It is a state transition diagram showing operation of a claw part concerning a 4th embodiment. 第５の実施形態に係る基板貼合装置の分離ブロックの拡大図である。It is an enlarged view of the isolation | separation block of the board | substrate bonding apparatus which concerns on 5th Embodiment. 第６の実施形態に係る基板貼合装置の分離ブロックの拡大図である。It is an enlarged view of the isolation | separation block of the board | substrate bonding apparatus which concerns on 6th Embodiment. 第７の実施形態に係る基板貼合装置が備える押圧機構の構成図である。It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 7th Embodiment is provided. 第７の実施形態に係る基板貼合装置の貼り合わせ工程を示す図である。It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on 7th Embodiment. 第８の実施形態に係る基板貼合装置が備える押圧機構の構成図である。It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 8th Embodiment is provided. 第８の実施形態に係る基板貼合装置の貼り合わせ工程を示す図である。It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on 8th Embodiment. 第９の実施形態に係る基板貼合装置が備える押圧機構の構成図である。It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 9th Embodiment is provided. 第９の実施形態に係る基板貼合装置の貼り合わせ工程を示す図である。It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on 9th Embodiment. 第１０の実施形態に係る基板貼合装置の貼り合わせ工程を示す図である。It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on 10th Embodiment. 第１１の実施形態に係る基板貼合装置の貼り合わせ工程を示す図である。It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on 11th Embodiment. 第１２の実施形態に係る基板貼合装置が備える押圧機構の構成図である。It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 12th Embodiment is provided. 第１２の実施形態に係る基板貼合装置が備える押圧機構の構成図である。It is a block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 12th Embodiment is provided. 他の実施形態に係る基板貼合装置の貼り合わせ工程を示す図である。It is a figure which shows the bonding process of the board | substrate bonding apparatus which concerns on other embodiment.
　以下、本発明に係る基板貼合装置の実施形態について図面を参照しつつ詳細に説明する。 Hereinafter, embodiments of a substrate bonding apparatus according to the present invention will be described in detail with reference to the drawings.
　（基板）
　予め、本発明の基板貼合装置によって貼り合わされる基板について説明する。図１は、貼り合わせ後の各種基板の断面を示す模式図である。本発明の基板貼合装置１は、接着剤Ｒを使って凹状基板２０の凹面２０ａに沿って、薄状基板２１を貼り合わせる。 (substrate)
The board | substrate bonded together by the board | substrate bonding apparatus of this invention is demonstrated previously. FIG. 1 is a schematic view showing cross sections of various substrates after bonding. The board | substrate bonding apparatus 1 of this invention bonds the thin board | substrate 21 along the concave surface 20a of the concave board | substrate 20 using the adhesive agent R. FIG.
　薄状基板２１は、タッチパネル、装飾フィルム、又は有機ＥＬディスプレイや液晶ディスプレイ等の各種のフィルムである。一方、凹状基板２０は、薄状基板２１を保護するためのガラスやアクリル等の保護パネルである。例えば、薄状基板２１を保護する目的で、薄状基板２１の全面が凹状基板２０に覆われるように、薄状基板２１の全面を凹状基板２０に接着剤Ｒで密着させる。 The thin substrate 21 is a touch panel, a decorative film, or various films such as an organic EL display and a liquid crystal display. On the other hand, the concave substrate 20 is a protective panel made of glass or acrylic for protecting the thin substrate 21. For example, for the purpose of protecting the thin substrate 21, the entire surface of the thin substrate 21 is adhered to the concave substrate 20 with the adhesive R so that the entire surface of the thin substrate 21 is covered with the concave substrate 20.
　この薄状基板２１は、可撓性を有する薄い基板である。薄状基板２１は、凹状基板２０の凹面２０ａに貼り付けるために、当該凹面２０ａに倣った曲げ変形が可能な程度の可撓性があれば十分である。 The thin substrate 21 is a flexible thin substrate. In order for the thin substrate 21 to be affixed to the concave surface 20a of the concave substrate 20, it is sufficient if the thin substrate 21 is flexible enough to bend and deform along the concave surface 20a.
　凹状基板２０は、凹面２０ａを有した基板である。凹面２０ａは、凹状基板２０の少なくとも側辺部２０ｂが湾曲部又は屈曲部より立ち上がって形成されている。すなわち、湾曲や屈曲により基板表面に凹面２０ａが形成されているものが凹状基板２０である。 The concave substrate 20 is a substrate having a concave surface 20a. The concave surface 20a is formed such that at least the side portion 20b of the concave substrate 20 rises from the curved portion or the bent portion. That is, the concave substrate 20 has a concave surface 20a formed on the substrate surface by bending or bending.
　凹状基板２０の側辺部２０ｂ以外の中心領域は、平坦であっても、側辺部２０ｂと連続して湾曲していてもよい。また、凹状基板２０は、全体的に反り返るようにしてもよいし、凹面２０ａと反対側となる背面は凹面２０ａと関係のない形状、例えば平坦面であってもよい。また、対向する一対の側辺部２０ｂが立ち上がっていてもよいし、いずれか一つの側辺部２０ｂが立ち上がっていてもよいし、三方の側辺部２０ｂが立ち上がっていてもよい。中心を四方から囲むように対向する２組の側辺部２０ｂがそれぞれ立ち上がっていてもよい。 The central region other than the side part 20b of the concave substrate 20 may be flat or may be continuously curved with the side part 20b. The concave substrate 20 may be warped as a whole, or the back surface opposite to the concave surface 20a may have a shape unrelated to the concave surface 20a, for example, a flat surface. In addition, a pair of opposing side portions 20b may rise, any one of the side portions 20b may rise, or three side portions 20b may rise. Two sets of side portions 20b facing each other so as to surround the center from four sides may rise.
　具体的には、凹状基板２０は、図１の（ａ）に示すように、略瓦型又は断面略円弧型であり、（ｂ）に示すように、側辺部２０ｂが直角に立ち上がった屈曲部を有する略コの字型であり、また（ｃ）に示すように、側辺部２０ｂが湾曲部によって立ち上がった略Ｕ字型を含む。 Specifically, as shown in FIG. 1A, the concave substrate 20 has a substantially tile shape or a substantially arc-shaped cross section, and as shown in FIG. 1B, the side portion 20b is bent at a right angle. In addition, as shown in (c), the side portion 20b includes a substantially U shape in which the side portion 20b rises from the curved portion.
　以下、単に側辺部２０ｂと呼ぶ場合には、凹面２０ａを形成すべく立ち上がっている側辺部２０ｂを指す。また、当該側辺部２０ｂの両端を含んだ平面と凹面２０ａとで囲まれた空間を、凹面２０ａが画成する凹面空間２０ｃと呼ぶ。 Hereinafter, when the side part 20b is simply referred to, the side part 20b stands up to form the concave surface 20a. A space surrounded by the flat surface including both ends of the side portion 20b and the concave surface 20a is referred to as a concave space 20c defined by the concave surface 20a.
　接着剤Ｒは、外部のエネルギーを受容して硬化するものであれば、特に限定はなく、例えば、熱硬化性樹脂、光硬化性樹脂、放射線硬化性樹脂、その他電磁波を受けて硬化する各種樹脂、又は乾燥により硬化する樹脂である。 The adhesive R is not particularly limited as long as it accepts and cures external energy. For example, a thermosetting resin, a photocurable resin, a radiation curable resin, and other various resins that are cured by receiving electromagnetic waves. Or a resin that hardens upon drying.
　（第１の実施形態）
　第１の実施形態に係る基板貼合装置１について図面を参照して説明する。図２は、第１の実施形態に係る基板貼合装置１の構成図である。図３は、第１の実施形態に係る基板貼合装置１が備える押圧機構４（押圧手段）の構成図である。 (First embodiment)
The board | substrate bonding apparatus 1 which concerns on 1st Embodiment is demonstrated with reference to drawings. FIG. 2 is a configuration diagram of the substrate bonding apparatus 1 according to the first embodiment. Drawing 3 is a lineblock diagram of press mechanism 4 (pressing means) with which substrate pasting device 1 concerning a 1st embodiment is provided.
　（構成）
　図２に示すように、この基板貼合装置１は、図示しない真空源に接続された真空チャンバ９内に、保持部３と押圧機構４（押圧手段）とを対向させている。保持部３と押圧機構４とは、相対的に接近が可能となっている。例えば、保持部３と押圧機構４の両方又は一方には、相手方に向けて接近又は離反するように移動させるアクチュエータを有する。 (Constitution)
As shown in FIG. 2, this board | substrate bonding apparatus 1 makes the holding | maintenance part 3 and the press mechanism 4 (pressing means) oppose in the vacuum chamber 9 connected to the vacuum source which is not shown in figure. The holding part 3 and the pressing mechanism 4 can be relatively approached. For example, both or one of the holding unit 3 and the pressing mechanism 4 has an actuator that moves so as to approach or separate from the other party.
　保持部３は、静電チャック、メカチャック、真空チャック、粘着チャック、又はその他各種のチャック機構によって凹状基板２０を保持する。押圧機構４は、同様の各種のチャック機構の何れかによって薄状基板２１を保持しながら、薄状基板２１を凹面空間２０ｃ内に押し込み、薄状基板２１を凹状基板２０の凹面２０ａに倣って曲げ変形させながら凹面２０ａに押し拡げる。 The holding unit 3 holds the concave substrate 20 by an electrostatic chuck, a mechanical chuck, a vacuum chuck, an adhesive chuck, or other various chuck mechanisms. The pressing mechanism 4 pushes the thin substrate 21 into the concave space 20c while holding the thin substrate 21 by any of the same various chuck mechanisms, and the thin substrate 21 follows the concave surface 20a of the concave substrate 20. It is expanded to the concave surface 20a while being bent and deformed.
　図３に示すように、押圧機構４は、２種類の形態に連続的に変形可能となっている。押圧機構４の第１の形態は、図３の（ａ）に示すように、凹面２０ａが画成する凹面空間２０ｃよりも小さく縮こまった縮小体である。押圧機構４の第２の形態は、図３の（ｃ）に示すように、凹面２０ａに倣って拡大した膨張体である。 As shown in FIG. 3, the pressing mechanism 4 can be continuously deformed into two types. As shown in FIG. 3A, the first form of the pressing mechanism 4 is a reduced body that is shrunk smaller than the concave space 20c defined by the concave surface 20a. The 2nd form of the press mechanism 4 is the expansion body expanded according to the concave surface 20a, as shown to (c) of FIG.
　押圧機構４が縮小体の態様を採ることで、押圧機構４は凹面２０ａと接触することなく、薄状基板２１を巻き込んで凹面空間２０ｃに入り込み、膨張体の態様に移行する過程で、薄状基板２１を基板中心から外側に向かって凹面２０ａに倣うように曲げ変形させながら押し拡げ、薄状基板２１の全面を凹状基板２０に接着剤Ｒを介して密着させる。 Since the pressing mechanism 4 takes the form of a contracting body, the pressing mechanism 4 does not come into contact with the concave surface 20a, so that the thin substrate 21 is rolled into the concave surface space 20c, and in the process of shifting to the expanding body, The substrate 21 is expanded while being bent and deformed so as to follow the concave surface 20a from the center of the substrate, and the entire surface of the thin substrate 21 is brought into close contact with the concave substrate 20 via the adhesive R.
　この押圧機構４は、中心ブロック４１と分離ブロック４２とを備えている。分離ブロック４２は、凹状基板２０の側辺部２０ｂと向かい合うように中心ブロック４１の脇に並んでいる。凹状基板２０の四方のうちの一辺のみが立ち上がった側辺部２０ｂである場合には、その側辺部２０ｂと対向するように一機の分離ブロック４２が配置され、四方のうちの対向する二辺が立ち上がった側辺部２０ｂである場合には、それら側辺部２０ｂと対向するように、中心ブロック４１の両脇に分離ブロック４２が配置され、四辺の全てが立ち上がった側辺部２０ｂである場合には、中心ブロック４１の四方に計４機の分離ブロック４２が配置される。 The pressing mechanism 4 includes a center block 41 and a separation block 42. The separation block 42 is arranged beside the central block 41 so as to face the side portion 20b of the concave substrate 20. In the case where only one side of the four sides of the concave substrate 20 is the rising side part 20b, a single separation block 42 is disposed so as to face the side part 20b, and two opposing sides of the four sides are arranged. In the case of the side part 20b where the side has risen, the separation blocks 42 are arranged on both sides of the central block 41 so as to face the side part 20b, and the side part 20b where all four sides have risen. In some cases, a total of four separation blocks 42 are arranged on four sides of the central block 41.
　中心ブロック４１は、薄状基板２１の中心領域を凹状基板２０の中心領域に押し付ける。すなわち、この中心ブロック４１は、凹面２０ａの中心領域の面形状に倣った上面を有する概略直方体である。概略直方体とは、凹面２０ａの中心領域が湾曲していれば、それに倣って上面が隆起しており、凹面２０ａの中心領域が平坦であれば、それに倣って上面が平坦である。 The central block 41 presses the central region of the thin substrate 21 against the central region of the concave substrate 20. That is, the central block 41 is a substantially rectangular parallelepiped having an upper surface that follows the surface shape of the central region of the concave surface 20a. If the center area | region of the concave surface 20a is curving, a substantially rectangular parallelepiped has the upper surface raised according to it, and if the center area | region of the concave surface 20a is flat, the upper surface will be flat according to it.
　分離ブロック４２は、薄状基板２１を凹状基板２０の凹面２０ａに倣って押し拡げる。また、この分離ブロック４２は、凹状基板２０の側辺部２０ｂまで及んで薄状基板２１を隙間無く密着させる。そのため、分離ブロック４２は、全体的には概略直方体であるが、凹状基板２０の側辺部２０ｂと対向する押圧曲面４２ａが当該側辺部２０ｂの湾曲又は屈曲した面形状に対応した概略同一となっている。例えば、側辺部２０ｂが湾曲部によって立ち上がっている場合、押圧曲面４２ａは、湾曲部の曲率と薄状基板２１の厚み、塗布された接着剤Ｒの厚みを考慮した曲率の丸みを帯びている。 The separation block 42 spreads the thin substrate 21 along the concave surface 20 a of the concave substrate 20. Further, the separation block 42 extends to the side portion 20b of the concave substrate 20 and closely contacts the thin substrate 21 without a gap. Therefore, the separation block 42 is generally a rectangular parallelepiped as a whole, but the pressing curved surface 42a facing the side portion 20b of the concave substrate 20 is substantially the same corresponding to the curved or bent surface shape of the side portion 20b. It has become. For example, when the side portion 20b is raised by the curved portion, the pressing curved surface 42a has a rounded curvature considering the curvature of the curved portion, the thickness of the thin substrate 21, and the thickness of the applied adhesive R. .
　更に、中心ブロック４１は、凹状基板２０の側辺部２０ｂ方向に対しては不動であり、凹状基板２０に向かう方向のみ移動可能となっている。一方、分離ブロック４２は、凹状基板２０に向かう方向のみならず、中心ブロック４１から離れるように外方へ移動可能となっている。具体的には、図３の（ａ）及び（ｂ）に示すように、中心ブロック４１に寄った第１の位置Ａと、図３の（ｃ）に示すように、凹状基板２０の側辺部２０ｂに薄状基板２１を介して当接する第２の位置Ｂとの間を水平移動する。 Furthermore, the central block 41 is immovable with respect to the direction of the side portion 20b of the concave substrate 20, and is movable only in the direction toward the concave substrate 20. On the other hand, the separation block 42 is movable not only in the direction toward the concave substrate 20 but also away from the central block 41. Specifically, as shown in FIGS. 3A and 3B, the first position A approaching the central block 41 and the side of the concave substrate 20 as shown in FIG. It moves horizontally between the second position B that abuts the part 20b via the thin substrate 21.
　分離ブロック４２が第１の位置Ａに存在するとき、中心ブロック４１と分離ブロック４２との全体的な対向領域は凹状基板２０の凹面空間２０ｃよりも小さく縮まり、縮小体の形態となる。全体的な対向領域とは、中心ブロック４１の凹面２０ａと対向する領域と分離ブロック４２の凹面２０ａと対向する領域とが内接する領域である。すなわち、両脇の分離ブロック４２の幅と中心ブロック４１の幅の合計は、凹状基板２０の凹面幅よりも小さい。 When the separation block 42 is present at the first position A, the entire facing region of the center block 41 and the separation block 42 is contracted to be smaller than the concave space 20c of the concave substrate 20 and forms a reduced body. The overall facing region is a region where the region facing the concave surface 20a of the central block 41 and the region facing the concave surface 20a of the separation block 42 are inscribed. That is, the sum of the widths of the separation blocks 42 on both sides and the width of the center block 41 is smaller than the concave surface width of the concave substrate 20.
　また、分離ブロック４２が第２の位置Ｂに存在するとき、中心ブロック４１と分離ブロック４２とが形成する全体的な対向領域が凹状基板２０の凹面２０ａに沿うまで拡大し、膨張体の形態となる。すなわち、分離ブロック４２は、凹状基板２０の凹面幅から、両脇の分離ブロック４２の幅と中心ブロック４１の幅の合計を差し引いた分だけ、第１の位置Ａから第２の位置Ｂへ移動する。 Further, when the separation block 42 is present at the second position B, the entire opposing region formed by the center block 41 and the separation block 42 is expanded along the concave surface 20a of the concave substrate 20, Become. That is, the separation block 42 moves from the first position A to the second position B by the amount obtained by subtracting the sum of the width of the separation block 42 on both sides and the width of the center block 41 from the concave surface width of the concave substrate 20. To do.
　（作用）
　この基板貼合装置１は、まず、第１のステップとして、図３の（ａ）に示すように、分離ブロック４２は第１の位置Ａに移動させることで中心ブロック４１に寄せておく。すなわち、第１のステップでは、分離ブロック４２と中心ブロック４１とを縮小体の形状に変形させておく。 (Function)
As shown in FIG. 3A, the substrate bonding apparatus 1 first moves the separation block 42 to the central block 41 by moving it to the first position A as shown in FIG. That is, in the first step, the separation block 42 and the central block 41 are deformed into a reduced body shape.
　そして、保持部３に凹状基板２０を設置し、中心ブロック４１及び両脇の分離ブロック４２の上面に薄状基板２１を載せる。このとき、凹状基板２０と薄状基板２１とは、真空チャンバ９内において対向する。凹状基板２０は、薄状基板２１に凹面２０ａを向けるように設置しておく。接着剤Ｒは、凹状基板２０、薄状基板２１、又はその両方の対向面に塗布しておく。 Then, the concave substrate 20 is installed in the holding unit 3, and the thin substrate 21 is placed on the upper surfaces of the center block 41 and the separation blocks 42 on both sides. At this time, the concave substrate 20 and the thin substrate 21 face each other in the vacuum chamber 9. The concave substrate 20 is installed so that the concave surface 20 a faces the thin substrate 21. The adhesive R is applied to the opposing surfaces of the concave substrate 20, the thin substrate 21, or both.
　次に、第２のステップとして、図３の（ｂ）に示すように、保持部３と縮小体とを相対的に接近させる。縮小体が凹面空間２０ｃ内に入り込むとき、薄状基板２１も凹面空間２０ｃ内に押し込まれる。このとき、縮小体は凹面空間２０ｃより小さい。従って、薄状基板２１と凹状基板２０の側辺部２０ｂとは、点接触の可能性は残るものの、面接触しない。面接触しないため、薄状基板２１が凹状基板２０の側辺部２０ｂを面で擦りながら押し込まれることはない。 Next, as a second step, as shown in FIG. 3B, the holding unit 3 and the contracted body are relatively moved closer to each other. When the reduced body enters the concave space 20c, the thin substrate 21 is also pushed into the concave space 20c. At this time, the reduced body is smaller than the concave space 20c. Accordingly, the thin substrate 21 and the side portion 20b of the concave substrate 20 do not make surface contact, although the possibility of point contact remains. Since there is no surface contact, the thin substrate 21 is not pushed in while rubbing the side portion 20b of the concave substrate 20 with the surface.
　保持部３と縮小体の相対的な接近は、薄状基板２１の中心領域が凹状基板２０の中心領域に押し付けられるまで続行される。例えば、アクチュエータにトルクセンサ等を設置しておくことで、当該押し付けを感知可能である。 The relative approach of the holding unit 3 and the contraction body is continued until the central region of the thin substrate 21 is pressed against the central region of the concave substrate 20. For example, the pressing can be detected by installing a torque sensor or the like on the actuator.
　第３のステップとして、図３の（ｃ）に示すように、分離ブロック４２を中心ブロック４１から離反するように第２の位置Ｂへ移動させる。そうすると、中心ブロック４１と分離ブロック４２とが形成する全体的な対向領域が凹状基板２０の凹面２０ａに沿うまで拡大し、凹状基板２０の凹面形状及び大きさに一致する。尚、実際は薄状基板２１と接着剤Ｒが介在する分、大きさは若干小さい。 As a third step, the separation block 42 is moved to the second position B so as to be separated from the central block 41 as shown in FIG. If it does so, the whole opposing area | region which the center block 41 and the isolation | separation block 42 form will expand until it follows the concave surface 20a of the concave substrate 20, and will correspond to the concave surface shape and magnitude | size of the concave substrate 20. FIG. Actually, the size is slightly smaller because the thin substrate 21 and the adhesive R are interposed.
　このとき、薄状基板２１は、分離ブロック４２の水平移動に伴って、中心領域から端へ向かって凹状基板２０の凹面２０ａに倣って押し拡げられていく。分離ブロック４２は、押圧曲面４２ａが当該側辺部２０ｂの面形状と一致する外形状を有している。そのため、薄状基板２１と凹状基板２０とが全域において密着する。しかも、中心から端に向かって順に密着していくため、凹状基板２０と薄状基板２１との間に空間は生じない。 At this time, as the separation block 42 is horizontally moved, the thin substrate 21 is pushed and expanded along the concave surface 20a of the concave substrate 20 from the central region toward the end. The separation block 42 has an outer shape in which the pressing curved surface 42a matches the surface shape of the side portion 20b. Therefore, the thin substrate 21 and the concave substrate 20 are in close contact with each other. In addition, since the contact is made in order from the center toward the end, no space is generated between the concave substrate 20 and the thin substrate 21.
　（効果）
　以上のように、本実施形態の基板貼合装置１が備える押圧機構４は、中心ブロック４１と分離ブロック４２とを備える。分離ブロック４２は、中心ブロック４１の脇に位置し、中心ブロック４１と接近及び離反可能となっている。そして、中心ブロック４１と分離ブロック４２と形状が凹状基板２０の凹面空間２０ｃよりも小さく縮まるまで、分離ブロック４２を中心ブロック４１に寄せて、薄状基板２１とともに凹面空間２０ｃ内に入り込ませる。次に、分離ブロック４２を凹面空間２０ｃ内で凹状基板２０の立ち上がった側辺部２０ｂ方向へ移動させることで、薄状基板２１を凹面２０ａに倣って押し拡げる。 (effect)
As described above, the pressing mechanism 4 included in the substrate bonding apparatus 1 according to the present embodiment includes the center block 41 and the separation block 42. The separation block 42 is located beside the central block 41 and can approach and separate from the central block 41. Then, until the shape of the central block 41 and the separation block 42 is smaller than the concave space 20 c of the concave substrate 20, the separation block 42 is brought close to the central block 41 and enters the concave space 20 c together with the thin substrate 21. Next, the separation block 42 is moved in the concave space 20c in the direction of the side portion 20b where the concave substrate 20 rises, so that the thin substrate 21 is expanded following the concave surface 20a.
　この押圧機構４によると、凹状基板２０の凹面空間２０ｃ内に薄状基板２１を押し込む際、薄状基板２１と凹状基板２０の側辺部２０ｂとが面接触して擦れることはない。そのため、誤った箇所同士が接着してしまい、薄状基板２１のシワ発生、薄状基板２１と凹状基板２０との間の非密着箇所発生を抑制することができる。また、薄状基板２１が凹状基板２０の側辺部２０ｂを面で擦りながら押し込まれることがなくなるため、接着剤Ｒの外側への流出を防止し、接着力の低下、意匠性の低下、接着剤Ｒを介した短絡等を防止することができる。 According to this pressing mechanism 4, when the thin substrate 21 is pushed into the concave space 20c of the concave substrate 20, the thin substrate 21 and the side portion 20b of the concave substrate 20 are not in contact with each other and rubbed. For this reason, erroneous portions are bonded to each other, and generation of wrinkles of the thin substrate 21 and generation of a non-contact portion between the thin substrate 21 and the concave substrate 20 can be suppressed. In addition, since the thin substrate 21 is not pushed in while rubbing the side 20b of the concave substrate 20 with the surface, the outflow of the adhesive R is prevented, the adhesive strength is decreased, the design property is decreased, and the adhesive is bonded. A short circuit or the like via the agent R can be prevented.
　また、薄状基板２１は、分離ブロック４２の水平移動に伴って、中心領域から端へ向かって凹状基板２０の凹面２０ａに押し付けられていく。そのため、薄状基板２１のシワ発生、薄状基板２１と凹状基板２０との間の非密着箇所発生を更に抑制することができる。 Further, the thin substrate 21 is pressed against the concave surface 20a of the concave substrate 20 from the central region toward the end as the separation block 42 moves horizontally. Therefore, it is possible to further suppress the occurrence of wrinkles on the thin substrate 21 and the occurrence of a non-contact portion between the thin substrate 21 and the concave substrate 20.
　また、分離ブロック４２は、凹状基板２０の立ち上がった側辺部２０ｂが有する凹面２０ａの部分と概略同一形状の押圧曲面４２ａを該側辺部２０ｂ側に有する。そのため、凹状基板２０に対しても薄状基板２１を全域において密着させることができる。従って、凹状基板２０に対して薄状基板２１を貼り合わせる場合であっても、品質の高い貼合物を製造することができる。 Further, the separation block 42 has a pressing curved surface 42a having substantially the same shape as that of the concave surface 20a of the side portion 20b on which the concave substrate 20 rises, on the side portion 20b side. Therefore, the thin substrate 21 can be adhered to the concave substrate 20 in the entire region. Therefore, even when the thin substrate 21 is bonded to the concave substrate 20, a high-quality bonded product can be manufactured.
　（第２の実施形態）
　（構成）
　図４は、凹状基板２０の側辺部２０ｂを示す拡大図である。図４に示すように、凹状基板２０の側辺部２０ｂは、湾曲度合いや屈曲度合いに製造誤差が生じる場合がある。この場合、分離ブロック４２の押圧曲面４２ａと凹状基板２０の側辺部２０ｂの形状が一致せず、薄状基板２１を凹状基板２０の凹面２０ａに密着させづらいことがある。 (Second Embodiment)
(Constitution)
FIG. 4 is an enlarged view showing the side part 20 b of the concave substrate 20. As shown in FIG. 4, manufacturing errors may occur in the side portion 20b of the concave substrate 20 in the degree of bending or the degree of bending. In this case, the shape of the pressing curved surface 42 a of the separation block 42 and the side part 20 b of the concave substrate 20 may not match, and the thin substrate 21 may be difficult to adhere to the concave surface 20 a of the concave substrate 20.
　そこで、第２の実施形態に係る基板貼合装置１は、図５に示すように、弾力部材よりなる分離ブロック４２を備えている。弾力部材を素材とする部分は、凹状基板２０の側辺部２０ｂと密着する押圧曲面４２ａのみであってもよいし、分離ブロック４２の簡便な製造のため、全てを弾性部材としてもよい。 Therefore, the substrate bonding apparatus 1 according to the second embodiment includes a separation block 42 made of an elastic member, as shown in FIG. The portion made of the elastic member may be only the pressing curved surface 42a that is in close contact with the side portion 20b of the concave substrate 20, or all may be an elastic member for easy manufacture of the separation block 42.
　弾性部材は、押し付けたときに弾性変形して側辺部２０ｂと概略同一形状になり、押し付け解除によって元の形状に戻る部材であり、弾性力を有する天然ゴムのシート又はブロック、ポリブタジエン系、ニトリル系、クロロプレン系等の合成ゴムのシート又はブロック、ポリウレタン等の繊維よりなるシート又はブロック、繊維を束ねたブラシ等が挙げられる。後述する弾性部材も同様である。 The elastic member is a member that is elastically deformed when pressed and has substantially the same shape as the side portion 20b, and returns to its original shape when the pressure is released, and is a natural rubber sheet or block having elasticity, polybutadiene, nitrile And a synthetic rubber sheet or block such as chloroprene, a sheet or block made of fiber such as polyurethane, and a brush bundled with fibers. The same applies to the elastic member described later.
　（作用効果）
　図５は、少なくとも押圧曲面４２ａを弾性部材で構成した場合の分離ブロック４２の押圧態様を示す図である。図５の（ａ）及び（ｂ）に示すように、凹状基板２０の側辺部２０ｂの形状に誤差が生じていたとしても、その誤差を吸収するように押圧曲面４２ａが側辺部２０ｂの形状に倣って変形する。そのため、薄状基板２１の全域を凹状基板２０に押し付けることができ、薄状基板２１は凹面２０ａに精度よく倣って曲げ変形し、薄状基板２１と凹状基板２０との密着が実現される。 (Function and effect)
FIG. 5 is a diagram illustrating a pressing mode of the separation block 42 when at least the pressing curved surface 42a is formed of an elastic member. As shown in FIGS. 5A and 5B, even if an error occurs in the shape of the side portion 20b of the concave substrate 20, the pressing curved surface 42a of the side portion 20b absorbs the error. Deforms following the shape. Therefore, the entire area of the thin substrate 21 can be pressed against the concave substrate 20, and the thin substrate 21 is bent and deformed following the concave surface 20 a with high accuracy, so that the thin substrate 21 and the concave substrate 20 are closely attached.
　従って、凹状基板２０に製造誤差が存在していても、品質の高い貼合物を製造することができる。 Therefore, even if a manufacturing error exists in the concave substrate 20, a high-quality bonded product can be manufactured.
　（第３の実施形態）
　図６は、第３の実施形態に係る基板貼合装置１のうち、押圧機構４の斜視図である。尚、第１の実施形態と同一構成、同一機能については同一符号を付し、詳細な説明を省略する。 (Third embodiment)
FIG. 6 is a perspective view of the pressing mechanism 4 in the substrate bonding apparatus 1 according to the third embodiment. In addition, the same code | symbol is attached | subjected about the same structure and 1st Embodiment as 1st Embodiment, and detailed description is abbreviate | omitted.
　（構成）
　第３の実施形態に係る基板貼合装置１は、薄状基板２１を凹状基板２０の凹面空間２０ｃに押し込む前に、薄状基板２１を曲げ成形することで、分離ブロック４２を中心ブロック４１に寄せてなる縮小体に巻き付けておく。この基板貼合装置１において、中心ブロック４１及び分離ブロック４２は、図６に示すように、同一ステージ４４上に長辺を同一方向に延ばして設置されている。中心ブロック４１は、当該ステージ４４に固定されている。 (Constitution)
The board | substrate bonding apparatus 1 which concerns on 3rd Embodiment is bending the thin board | substrate 21 before pushing the thin board | substrate 21 into the concave surface space 20c of the concave board | substrate 20, and makes the isolation | separation block 42 into the center block 41. Wrap it around the contracted body. In this board | substrate bonding apparatus 1, the center block 41 and the isolation | separation block 42 are extended and extended in the same direction on the same stage 44, as shown in FIG. The center block 41 is fixed to the stage 44.
　また、ステージ４４には、レール４５が敷設されている。分離ブロック４２は、このレール４５上を摺動するスライド台４６に固定されている。レール４５は、分離ブロック４２の長辺を横断する方向に延びている。すなわち、レール４５上を滑ることで中心ブロック４１に対して接離し、中心ブロック４１と分離ブロック４２とは縮小体及び膨張体の形態をとる。 Also, a rail 45 is laid on the stage 44. The separation block 42 is fixed to a slide base 46 that slides on the rail 45. The rail 45 extends in a direction crossing the long side of the separation block 42. That is, by sliding on the rail 45, the center block 41 is brought into contact with and separated from the center block 41, and the center block 41 and the separation block 42 are in the form of a reduced body and an expanded body.
　分離ブロック４２を移動させる駆動手段は、サーボモータやステッピングモータ等の回転機４７ａと、回転機４７ａに接続されたボールネジ４７ｂである。ボールネジ４７ｂは、レール４５と平行に延設され、各分離ブロック４２を載せた各スライド台４６は、当該ボールネジ４７ｂに嵌合している。各スライド台４６に対応するネジ溝は、互いに反対方向に穿設されている。 The driving means for moving the separation block 42 is a rotating machine 47a such as a servo motor or a stepping motor, and a ball screw 47b connected to the rotating machine 47a. The ball screw 47b extends in parallel with the rail 45, and each slide base 46 on which each separation block 42 is mounted is fitted to the ball screw 47b. Screw grooves corresponding to the slide bases 46 are formed in opposite directions.
　このボールネジ４７ｂによると、ネジ軸が一方向に回転させられると、各スライド台４６は互いに反対方向に移動する。すなわち、両脇の分離ブロック４２は、それぞれ、中心ブロック４１と接近又は離反する方向に移動する。 According to this ball screw 47b, when the screw shaft is rotated in one direction, the slide bases 46 move in opposite directions. That is, the separation blocks 42 on both sides move in a direction approaching or separating from the center block 41, respectively.
　ここまでの押圧機構４の詳細構成は、第１の実施形態に係る基板貼合装置１も同一である。第３の実施形態では、更に、各分離ブロック４２の外側にツメ部５を備えている。ツメ部５は、分離ブロック４２が第１の位置Ａにあるときの、中心ブロック４１と分離ブロック４２の形状に倣って、薄状基板２１を予め曲げ成形するガイド手段である。 The detailed configuration of the pressing mechanism 4 so far is the same as that of the substrate bonding apparatus 1 according to the first embodiment. In the third embodiment, a claw portion 5 is further provided outside each separation block 42. The tab 5 is guide means for bending the thin substrate 21 in advance in accordance with the shapes of the central block 41 and the separation block 42 when the separation block 42 is at the first position A.
　このツメ部５は、分離ブロック４２と概略同一の長さの板形状を有し、分離ブロック４２に沿って取り付けられている。ツメ部５は、分離ブロック４２の両端中心に向かって屈曲したフランジ５ａを両端に有し、分離ブロック４２の軸を貫く回転軸４８に当該フランジ５ａで軸支されている。この回転軸４８は、サーボモータやステッピングモータ等の回転機４９に接続されている。各回転軸４８と各回転機４９は、各スライド台４６に固定されており、このツメ部５は、分離ブロック４２の押圧曲面４２ａに沿って移動可能となっている。 The claw portion 5 has a plate shape having approximately the same length as the separation block 42 and is attached along the separation block 42. The claw portion 5 has flanges 5 a bent toward the center of both ends of the separation block 42 at both ends, and is pivotally supported by the flange 5 a on a rotation shaft 48 penetrating the shaft of the separation block 42. The rotating shaft 48 is connected to a rotating machine 49 such as a servo motor or a stepping motor. Each rotating shaft 48 and each rotating machine 49 are fixed to each slide base 46, and this claw portion 5 is movable along the pressing curved surface 42 a of the separation block 42.
　（作用）
　この基板貼合装置１の動作を図７を参照しつつ説明する。図７は、第３の実施形態に係る基板貼合装置１のうち、押圧曲面４２ａ付近の動きを示す状態遷移図である。 (Function)
The operation of the substrate bonding apparatus 1 will be described with reference to FIG. FIG. 7 is a state transition diagram illustrating the movement in the vicinity of the pressing curved surface 42a in the substrate bonding apparatus 1 according to the third embodiment.
　まず、図７の（ａ）に示すように、分離ブロック４２を第３の位置Ｃに移動させておく。第３の位置Ｃとは、第２の位置Ｂよりも更に外方であり、外力を受けていない平坦な薄状基板２１が押圧機構４の上面に載置されたときに、分離ブロック４２の押圧曲面４２ａに少し掛かる程度の位置である。 First, the separation block 42 is moved to the third position C as shown in FIG. The third position C is further outward than the second position B, and when the flat thin substrate 21 not receiving external force is placed on the upper surface of the pressing mechanism 4, The position is such that it is slightly applied to the pressing curved surface 42a.
　そして、分離ブロック４２を第３の位置Ｃに移動させた状態で、外力を受けていない薄状基板２１を押圧機構４の上面に載置し、図７の（ｂ）に示すように、ツメ部５を分離ブロック４２の上方に移動させて、薄状基板２１の側辺端面に引っ掛ける。すなわち、薄状基板２１の端が押圧曲面４２ａに少し飛び出る程度とは、ツメ部５が薄状基板２１の側辺端面に引っ掛かって外力を及ぼし得る程度である。この時、接着剤Ｒは薄状基板２１の外縁よりわずかに内側まで塗布されていて、ツメ部５が接触しない状態となっている事が好ましい。 Then, with the separation block 42 moved to the third position C, the thin substrate 21 that has not been subjected to external force is placed on the upper surface of the pressing mechanism 4, and as shown in FIG. The part 5 is moved above the separation block 42 and hooked on the side end face of the thin substrate 21. That is, the extent that the end of the thin substrate 21 protrudes slightly to the pressing curved surface 42a is such that the claw portion 5 can be caught by the side end surface of the thin substrate 21 and exert an external force. At this time, it is preferable that the adhesive R is applied to the inside slightly from the outer edge of the thin substrate 21 and the claw portion 5 is not in contact.
　ツメ部５を引っ掛けると、図７の（ｃ）に示すように、分離ブロック４２を第１の位置Ａに引き戻し（後退）ながら、同時に、ツメ部５を押圧曲面４２ａに沿って下方向に回転させていく。ツメ部５と分離ブロック４２は同一スライド台４６と固定関係を有するため、ツメ部５と押圧曲面４２ａとの距離は変わらない。このとき、分離ブロック４２の後退の度に薄状基板２１には緩い撓みが生じる。そして、ツメ部５の回転の度に其の緩みを矯正するように、薄状基板２１は分離ブロック４２の押圧曲面４２ａに巻締められていく。 When the claw portion 5 is hooked, the claw portion 5 is rotated downward along the pressing curved surface 42a while pulling back (retracting) the separation block 42 to the first position A as shown in FIG. 7C. I will let you. Since the nail | claw part 5 and the isolation | separation block 42 have the fixed relationship with the same slide stand 46, the distance of the nail | claw part 5 and the press curved surface 42a does not change. At this time, each time the separation block 42 is retracted, the thin substrate 21 is loosely bent. And the thin board | substrate 21 is wound around the press curved surface 42a of the separation block 42 so that the looseness may be corrected whenever the nail | claw part 5 rotates.
　分離ブロック４２の後退とツメ部５の回転を続け、分離ブロック４２が第１の位置Ａに到達すると、図７の（ｄ）に示すように、薄状基板２１は、縮小体の上面に倣って巻き付いている。薄状基板２１が縮小体の上面に巻き付いた状態では、薄状基板２１の形状及び大きさは、凹状基板２０の凹面２０ａよりも小さくなっている。 When the separation block 42 continues to move backward and the claw 5 rotates, and the separation block 42 reaches the first position A, the thin substrate 21 follows the upper surface of the reduction body as shown in FIG. It is wrapped around. In a state where the thin substrate 21 is wound around the upper surface of the reduced body, the shape and size of the thin substrate 21 are smaller than the concave surface 20a of the concave substrate 20.
　そのため、図７の（ｅ）に示すように、凹面空間２０ｃに薄状基板２１を押し込んでも、凹状基板２０の側辺部２０ｂと薄状基板２１とが接触することはない。薄状基板２１の凹面空間２０ｃへの押し込みは、薄状基板２１の中心領域が凹状基板２０の中心領域に押し付けられるまで継続される。 Therefore, as shown in FIG. 7E, even if the thin substrate 21 is pushed into the concave space 20c, the side portion 20b of the concave substrate 20 and the thin substrate 21 do not come into contact with each other. The pushing of the thin substrate 21 into the concave space 20 c is continued until the central region of the thin substrate 21 is pressed against the central region of the concave substrate 20.
　薄状基板２１の凹面空間２０ｃへの押し込みが完了すると、図７の（ｆ）に示すように、ツメ部５を回転終了位置に維持させたまま、分離ブロック４２を第２の位置Ｂへ移動させていき、図７の（ｇ）に示すように、薄状基板２１の全体を凹状基板２０に密着させる。このように、薄状基板２１と凹状基板２０の側辺部２０ｂとは、分離ブロック４２が第２の位置Ｂに移動したときに初めて接触することとなる。 When the pushing of the thin substrate 21 into the concave space 20c is completed, the separation block 42 is moved to the second position B while the claw portion 5 is maintained at the rotation end position, as shown in FIG. Then, as shown in FIG. 7G, the entire thin substrate 21 is brought into close contact with the concave substrate 20. Thus, the thin substrate 21 and the side portion 20b of the concave substrate 20 come into contact for the first time when the separation block 42 moves to the second position B.
　尚、ツメ部５は、薄状基板２１と凹状基板２０の側辺部２０ｂとが密着するまで、又は図７の（ｈ）に示すように、その密着の直前まで薄状基板２１との係合を継続しておくことが望ましい。 The claw portion 5 is engaged with the thin substrate 21 until the thin substrate 21 and the side portion 20b of the concave substrate 20 are in close contact with each other, or as shown in FIG. It is desirable to continue.
　（効果）
　以上のように、押圧機構４は、分離ブロック４２が第１の位置Ａにあるときの中心ブロック４１と分離ブロック４２の形状に倣って薄状基板２１を予め曲げ成形するガイド手段を更に備えるようにし、駆動手段は、この曲げ成形後に、分離ブロック４２を第２の位置Ｂへ移動させるようにした。 (effect)
As described above, the pressing mechanism 4 further includes guide means for bending the thin substrate 21 in advance according to the shape of the center block 41 and the separation block 42 when the separation block 42 is at the first position A. Then, the driving means moves the separation block 42 to the second position B after the bending.
　これにより、薄状基板２１は凹状基板２０の凹面空間２０ｃよりも小さくなっているため、凹状基板２０の凹面空間２０ｃ内に薄状基板２１を押し込む際、薄状基板２１と凹状基板２０の側辺部２０ｂとが接触することはない。そのため、第１の実施形態に比しても、誤った箇所が接着剤Ｒで粘着してしまうことによる、薄状基板２１のシワ発生、薄状基板２１と凹状基板２０との間の非密着箇所発生を更に抑制することができる。 Accordingly, since the thin substrate 21 is smaller than the concave space 20c of the concave substrate 20, when the thin substrate 21 is pushed into the concave space 20c of the concave substrate 20, the thin substrate 21 and the concave substrate 20 side The side part 20b does not come into contact. Therefore, even if compared with the first embodiment, wrinkle generation of the thin substrate 21 due to sticking of the wrong place with the adhesive R, non-adherence between the thin substrate 21 and the concave substrate 20 The occurrence of the location can be further suppressed.
　また、薄状基板２１が凹状基板２０の側辺部２０ｂを面で擦りながら押し込まれることがなくなるため、接着剤Ｒの外側への流出を更に防止し、接着力の低下、意匠性の低下、接着剤Ｒを介した短絡等を更に防止することができる。 Further, since the thin substrate 21 is not pushed in while rubbing the side 20b of the concave substrate 20 with the surface, it further prevents the adhesive R from flowing out to the outside, lowering the adhesive force, lowering the design, A short circuit or the like via the adhesive R can be further prevented.
　また、このガイド手段は、薄状基板２１の側辺端面に引っ掛かって外力を与えることで、当該薄状基板２１を予め曲げ成形するツメ部５である。そのため、薄状基板２１に接着剤Ｒを塗布している場合であっても、曲げ成形のための当該接着剤Ｒの塗布面に対する接触を最小限に止めることができ、貼り合わせ前の接着力の低下や接着剤Ｒのムラ発生を抑制することができる。 Further, this guide means is a claw portion 5 for bending the thin substrate 21 in advance by being hooked on the side edge surface of the thin substrate 21 and applying an external force. Therefore, even when the adhesive R is applied to the thin substrate 21, contact with the application surface of the adhesive R for bending can be minimized, and the adhesive force before bonding And the occurrence of unevenness of the adhesive R can be suppressed.
　更に、駆動手段は、ツメ部５による曲げ成形の最中、分離ブロック４２を第２の位置Ｂよりも外側方の第３の位置Ｃから第２の位置Ｂを通って第１の位置Ａまで移動させるようにした。これにより、薄状基板２１は、緩く撓みながらも其の度にツメ部５によって撓みを矯正するように分離ブロック４２の押圧曲面４２ａに巻締められていく。 Further, the driving means moves the separation block 42 from the third position C outside the second position B to the first position A through the second position B during the bending by the claw portion 5. I moved it. As a result, the thin substrate 21 is wound around the pressing curved surface 42a of the separation block 42 so as to correct the bending by the claw portion 5 each time it is gently bent.
　従って、ツメ部５で薄状基板２１の側辺端面のみを掴んでいる場合であっても、薄状基板２１が曲げ成形中に誤った方向に大きく撓んだり、分離ブロック４２に緩んで巻き付いたりすることなく、容易に曲げ成形することができる。そのため、薄状基板２１を精度よく凹面空間２０ｃよりも小さくすることができるとともに、分離ブロック４２による押し拡げの際に薄状基板２１を精度よく凹状基板２０の凹面２０ａに密着させることができ、製品の品質は向上する。 Therefore, even when only the side edge surface of the thin substrate 21 is gripped by the tab 5, the thin substrate 21 is greatly bent in the wrong direction during bending or loosely wound around the separation block 42. Can be easily bent and formed. Therefore, the thin substrate 21 can be accurately made smaller than the concave space 20c, and the thin substrate 21 can be brought into close contact with the concave surface 20a of the concave substrate 20 at the time of expansion by the separation block 42, Product quality is improved.
　（第４の実施形態）
　図８は、第４の実施形態に係る基板貼合装置１のうち、ツメ部５の動作を示す状態遷移図である。図８に示すように、ツメ部５は、分離ブロック４２の外形に沿った回転移動をする他、薄状基板２１の側辺端面を引っ掛けながら直線移動するようにしてもよい。 (Fourth embodiment)
FIG. 8 is a state transition diagram illustrating the operation of the claw portion 5 in the substrate bonding apparatus 1 according to the fourth embodiment. As shown in FIG. 8, the claw portion 5 may be moved along the outer shape of the separation block 42, or may be moved linearly while hooking the side edge surface of the thin substrate 21.
　すなわち、第４の実施形態に係るツメ部５は、図８（ａ）（ｂ）に示すように、外力を受けていない薄状基板２１の側辺端と、第１の位置Ａにある分離ブロック４２の外形に沿って曲げ成形された後の薄状基板２１の側辺端とを通る直線上を移動する。 That is, as shown in FIGS. 8A and 8B, the claw portion 5 according to the fourth embodiment is separated from the side edge of the thin substrate 21 that is not subjected to external force and at the first position A. It moves on a straight line passing through the side edge of the thin substrate 21 after being bent along the outer shape of the block 42.
　このようなツメ部５の移動態様によっても、薄状基板２１の側辺端面のみを掴むため、薄状基板２１に接着剤Ｒを塗布している場合であっても、曲げ成形のための当該接着剤塗布面に対する接触を最小限に止めることができ、貼り合わせ前の接着力の低下や接着剤Ｒのムラ発生を抑制することができる。 Even in the case where the adhesive R is applied to the thin substrate 21 in order to grasp only the side end surface of the thin substrate 21 by such a movement mode of the claw portion 5, Contact with the adhesive application surface can be minimized, and a decrease in adhesive strength before bonding and occurrence of unevenness in the adhesive R can be suppressed.
　（第５の実施形態）
　（構成）
　図９は、第５の実施形態に係る基板貼合装置１の分離ブロック４２の拡大図である。この分離ブロック４２は、接着剤Ｒを硬化させるためのエネルギーを放射する硬化処理部４２ｂを備えている。 (Fifth embodiment)
(Constitution)
FIG. 9 is an enlarged view of the separation block 42 of the substrate bonding apparatus 1 according to the fifth embodiment. The separation block 42 includes a curing processing unit 42b that radiates energy for curing the adhesive R.
　この硬化処理部４２ｂは、接着剤Ｒの垂れ防止、薄状基板２１と凹状基板２０との押し込み時における接触により生じる接着剤Ｒのムラ防止、又は曲げ形状で貼り合わされた薄状基板２１形状維持のために用いられ、薄状基板２１に塗布された接着剤Ｒを仮硬化させる。仮硬化とは、完全な硬化状態に到っていない状態のことである。 The curing processing unit 42b prevents dripping of the adhesive R, prevents unevenness of the adhesive R caused by contact between the thin substrate 21 and the concave substrate 20, or maintains the shape of the thin substrate 21 bonded in a bent shape. The adhesive R applied to the thin substrate 21 is temporarily cured. Temporary curing is a state in which a completely cured state is not reached.
　この硬化処理部４２ｂは、曲げ成形された薄状基板２１の形状維持のためには、分離ブロック４２の内部に収容され、押圧曲面４２ａに向かってエネルギーを放射する。硬化処理部４２ｂは、接着剤Ｒが熱硬化性樹脂であれば赤外線ランプであり、接着剤Ｒが紫外線硬化性樹脂であればＵＶランプである。 The curing processing unit 42b is housed inside the separation block 42 and radiates energy toward the pressing curved surface 42a in order to maintain the shape of the bent thin substrate 21. The curing processing unit 42b is an infrared lamp if the adhesive R is a thermosetting resin, and a UV lamp if the adhesive R is an ultraviolet curable resin.
　接着剤Ｒを仮硬化状態とする為には、接着剤Ｒに対して完全に硬化するには至らない量のエネルギーを放射すればよい。また、紫外線硬化樹脂であれば、大気などの酸素含有雰囲気における、厳密な放射エネルギー管理をしなくても、硬化の酸素阻害作用により仮硬化状態とすることができる。この場合、接着剤Ｒの内部のみが硬化となり、表面の粘性が保たれるので、接着剤Ｒの望まない流動を抑制しつつ、接着性を確保するようにできる。 In order to put the adhesive R in a temporarily cured state, it is sufficient to radiate an amount of energy that does not reach the adhesive R completely. Moreover, if it is an ultraviolet curable resin, it can be made into a temporary hardening state by the oxygen inhibitory effect | action of hardening, even if it does not carry out strict radiation energy management in oxygen-containing atmospheres, such as air | atmosphere. In this case, only the inside of the adhesive R is cured, and the viscosity of the surface is maintained, so that it is possible to ensure adhesiveness while suppressing unwanted flow of the adhesive R.
　（作用）
　図９に示すように、予め、薄状基板２１に接着剤Ｒを塗布しておき、中心ブロック４１と分離ブロック４２に巻き付けるように薄状基板２１を曲げ成形する。この後、凹状基板２０に薄状基板２１を押し付ける前に、硬化処理部４２ｂによって接着剤Ｒを仮硬化させておく。特に、押圧曲面４２ａに臨む領域に塗布された接着剤Ｒ、すなわち、大きな曲面を有し、塗布した接着剤Ｒが流動し薄状基板２１の縁に集まってしまう事が生じやすい箇所の接着剤Ｒを仮硬化させておく。 (Function)
As shown in FIG. 9, the adhesive R is applied to the thin substrate 21 in advance, and the thin substrate 21 is bent so as to be wound around the center block 41 and the separation block 42. Thereafter, before the thin substrate 21 is pressed against the concave substrate 20, the adhesive R is temporarily cured by the curing processing unit 42b. In particular, the adhesive R applied to the area facing the pressing curved surface 42a, that is, the adhesive having a large curved surface, where the applied adhesive R tends to flow and collect on the edge of the thin substrate 21. R is temporarily cured.
　そして、中心ブロック４１と分離ブロック４２の形状に倣って曲げ成形された状態を仮硬化によって維持させたまま、薄状基板２１を凹状基板２０の凹面空間２０ｃに押し込み、分離ブロック４２を第２の位置Ｂへ移動させることで、薄状基板２１を徐々に凹面２０ａに倣って引き延ばしていく。 The thin substrate 21 is pushed into the concave space 20c of the concave substrate 20 while maintaining the state of being bent and shaped following the shapes of the center block 41 and the separation block 42 by temporary curing, and the separation block 42 is moved to the second block. By moving to the position B, the thin substrate 21 is gradually stretched along the concave surface 20a.
　（効果）
　以上のように、第５の実施形態に係る基板貼合装置１では、薄状基板２１の側辺部に塗布されている接着剤Ｒを仮硬化させる硬化処理部４２ｂを更に備え、中心ブロック４１と分離ブロック４２の形状に倣って曲げ成形された薄状基板２１に対して仮硬化を行うようにした。 (effect)
As described above, in the substrate bonding apparatus 1 according to the fifth embodiment, the center block 41 is further provided with the curing processing unit 42 b that temporarily cures the adhesive R applied to the side portion of the thin substrate 21. In addition, the thin substrate 21 formed by bending following the shape of the separation block 42 is temporarily cured.
　これにより、分離ブロック４２を用いて薄状基板２１の全域を凹状基板２０に密着させる前に接着剤Ｒの流動を抑制できる。そのため、誤った箇所同士が接着してしまい、薄状基板２１のシワ発生、薄状基板２１と凹状基板２０との間の非密着箇所発生を抑制することができる。 Thus, the flow of the adhesive R can be suppressed before the entire area of the thin substrate 21 is brought into close contact with the concave substrate 20 using the separation block 42. For this reason, erroneous portions are bonded to each other, and generation of wrinkles of the thin substrate 21 and generation of a non-contact portion between the thin substrate 21 and the concave substrate 20 can be suppressed.
　また、密着させる前に接着剤Ｒが薄状基板２１の縁に移動することがないので、密着後のはみ出しや接着厚さの不均一、接着力の低下、意匠性の低下、接着剤Ｒを介した短絡等を防止することができる。さらに、基板貼合装置１で貼り合わせた後、基板貼合装置１より搬出して、最終的な接着剤Ｒを硬化させる次工程が完了するまでの間、曲げ形状で貼り合わされた薄状基板２１の形状を維持し、剥がれないようにすることができる。 In addition, since the adhesive R does not move to the edge of the thin substrate 21 before being adhered, the protrusion after adhesion, unevenness of the adhesion thickness, lowering of the adhesive force, lowering of the design, It is possible to prevent a short circuit or the like. Furthermore, after laminating with the substrate laminating apparatus 1, the thin substrate bonded in a bent shape until the next process of curing the final adhesive R is carried out from the substrate laminating apparatus 1 The shape of 21 can be maintained so that it does not peel off.
　（第６の実施形態）
　図１０は、第６の実施形態に係る基板貼合装置１の分離ブロック４２の拡大図である。第６の実施形態では、曲げ成形された薄状基板２１の貼り合わせまでの形状維持のために吸引部４２ｃを備えている。この吸引部４２ｃは、負圧発生装置に接続された吸引管であり、分離ブロック４２の押圧曲面４２ａに開口している。また、第６の実施形態では、硬化処理部５０を備えている。この硬化処理部５０は、接着剤Ｒを硬化させるためのエネルギーを放射するものであり、基本的には上記の硬化処理部４２ｂと同様である。但し、硬化処理部５０は、凹状基板２０における側辺部２０ｂの屈曲により伸張している側（外側）に配設されている。 (Sixth embodiment)
FIG. 10 is an enlarged view of the separation block 42 of the substrate bonding apparatus 1 according to the sixth embodiment. In the sixth embodiment, the suction portion 42c is provided to maintain the shape until the bent thin substrate 21 is bonded. The suction part 42 c is a suction pipe connected to the negative pressure generator, and opens to the pressing curved surface 42 a of the separation block 42. In the sixth embodiment, a curing processing unit 50 is provided. The curing processing unit 50 radiates energy for curing the adhesive R, and is basically the same as the curing processing unit 42b. However, the curing processing unit 50 is disposed on the side (outside) of the concave substrate 20 that is extended by the bending of the side part 20b.
　この吸引部４２ｃは、分離ブロック４２に巻き付けられた薄状基板２１を吸引し、薄状基板２１を分離ブロック４２に密着させておく。薄状基板２１の全域が分離ブロック４２や中心ブロック４１に密着するように吸引してもよいが、少なくとも、押圧曲面４２ａに臨む領域すなわち、大きな曲面を有し、曲げ応力に対する反力が生じやすい箇所を吸引することが効果的である。そして、この吸引部４２ｃによる吸引を維持したまま、分離ブロック４２を第２の位置Ｂへ移動させることで、薄状基板２１は曲げ成形された状態から徐々に凹面２０ａに倣って引き延ばされていく。硬化処理部５０は、このような曲げ成形前（側辺部２０ｂへの貼り合わせ前）及び曲げ成形後（側辺部２０ｂへの貼り合わせ後）のいずれか一方若しくは双方において、接着剤Ｒを仮硬化させるためのエネルギーを放射する。 The suction unit 42c sucks the thin substrate 21 wound around the separation block 42 and keeps the thin substrate 21 in close contact with the separation block 42. Suction may be performed so that the entire area of the thin substrate 21 is in close contact with the separation block 42 and the center block 41, but at least a region facing the pressing curved surface 42a, that is, a large curved surface, is likely to generate a reaction force against bending stress. It is effective to suck the points. Then, by moving the separation block 42 to the second position B while maintaining the suction by the suction part 42c, the thin substrate 21 is gradually stretched along the concave surface 20a from the bent state. To go. The curing processing unit 50 applies the adhesive R before or after bending (before bonding to the side part 20b) and after bending (after bonding to the side part 20b). Radiates energy for pre-curing.
　このように、第６の実施形態に係る基板貼合装置１では、中心ブロック４１と分離ブロック４２の形状に倣って曲げ成形された薄状基板２１を分離ブロック４２に吸着させる吸引部４２ｃを更に備えるようにした。また、曲げ成形前に硬化処理部５０により接着剤Ｒを仮硬化させた場合には、接着剤Ｒが流動することを抑制できる。さらに、曲げ成形後に硬化処理部５０により接着剤Ｒを仮硬化させた場合には、貼り合わされた薄状基板２１の形状を維持し、剥がれないようにすることができる。従って、当該構成によっても、第５の実施形態と同様の効果を奏することができる。 Thus, in the board | substrate bonding apparatus 1 which concerns on 6th Embodiment, the suction part 42c which makes the separation block 42 adsorb | suck the thin board | substrate 21 bent according to the shape of the center block 41 and the separation block 42 further. I prepared. Moreover, when the adhesive agent R is temporarily hardened by the hardening process part 50 before bending shaping | molding, it can suppress that the adhesive agent R flows. Furthermore, when the adhesive R is temporarily cured by the curing processing unit 50 after bending, the shape of the bonded thin substrate 21 can be maintained and prevented from peeling off. Therefore, the same effect as that of the fifth embodiment can be obtained by this configuration.
　（第７の実施形態）
　本実施形態に係る基板貼合装置について、図１１及び図１２を参照して説明する。図１１及び図１２は、本実施形態の押圧機構の構成と動作を示す図である。 (Seventh embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG.11 and FIG.12. 11 and 12 are diagrams showing the configuration and operation of the pressing mechanism of the present embodiment.
　（構成）
　本実施形態の押圧機構４は、図１１に示すように、押付部１４１、変位部１４２、支持部１４３を有する。また、本実施形態は、図１０と同様に、硬化処理部５０を有する。押付部１４１は、薄状基板２１を、凹状基板２０に接離する方向に移動させる部材である。この押付部１４１は、凹状基板２０に接近して、凹状基板２０の中央領域に対して、薄状基板２１を押し付ける。 (Constitution)
As shown in FIG. 11, the pressing mechanism 4 of this embodiment includes a pressing portion 141, a displacement portion 142, and a support portion 143. Moreover, this embodiment has the hardening process part 50 similarly to FIG. The pressing portion 141 is a member that moves the thin substrate 21 in a direction in which the thin substrate 21 is in contact with or separated from the concave substrate 20. The pressing portion 141 approaches the concave substrate 20 and presses the thin substrate 21 against the central region of the concave substrate 20.
　この押付部１４１は、略直方体形状のブロックであり、その上面は、凹面２０ａの中央領域の面形状に倣った形状を有する。つまり、凹面２０ａの中央領域が曲面である場合には、押付部１４１の上面は、その曲面に倣った形状である。凹面２０ａの中央領域が平坦である場合には、押付部１４１の上面は平坦である。なお、この上面には、上記のチャック機構が設けられ、薄状基板２１を保持可能に設けられている。 The pressing portion 141 is a substantially rectangular parallelepiped block, and the upper surface thereof has a shape that follows the surface shape of the central region of the concave surface 20a. That is, when the central region of the concave surface 20a is a curved surface, the upper surface of the pressing portion 141 has a shape that follows the curved surface. When the central region of the concave surface 20a is flat, the upper surface of the pressing portion 141 is flat. The upper surface is provided with the above-described chuck mechanism so that the thin substrate 21 can be held.
　変位部１４２は、凹状基板２０の両側辺部２０ｂに対応して、押付部１４１の両脇に設けられた一対の部材である。この変位部１４２は、押付部１４１が薄状基板２１を押し付ける際に、押付部１４１とともに凹状基板２０における側辺部２０ｂの内側の空間に収まる位置に設けられている。 The displacement portion 142 is a pair of members provided on both sides of the pressing portion 141 corresponding to the both side portions 20b of the concave substrate 20. The displacement portion 142 is provided at a position that fits together with the pressing portion 141 in the space inside the side portion 20 b of the concave substrate 20 when the pressing portion 141 presses the thin substrate 21.
　この変位部１４２は、押付部１４１とともに凹状基板２０に対して接近し、一端を薄状基板２１に接触させながら、薄状基板２１の外縁に向かって変位する。この変位により、変位部１４２は、薄状基板２１を凹状基板２０の凹面２０ａに倣って圧着させる。 The displacement portion 142 approaches the concave substrate 20 together with the pressing portion 141 and is displaced toward the outer edge of the thin substrate 21 while one end is in contact with the thin substrate 21. Due to this displacement, the displacement part 142 presses the thin substrate 21 along the concave surface 20 a of the concave substrate 20.
　変位部１４２は、凹状基板２０が側辺部２０ｂの一方、三方若しくは四方に湾曲部を有する場合には、これに対応して、押付部１４１の一方、三方若しくは四方の脇に設けてもよい。 When the concave substrate 20 has a curved portion on one, three or four sides of the side portion 20b, the displacement portion 142 may be provided on one, three or four sides of the pressing portion 141 correspondingly. .
　本実施形態の変位部１４２は、凹状基板２０の両側辺部２０ｂに平行に、少なくとも側辺部２０ｂの全長の長さを有する板形状である。変位部１４２の薄状基板２１に接離する一端は、板形状における縁部１４２ｘである。変位部１４２は、その縁部１４２ｘが薄状基板２１に接触して凹状基板２０に押し付けられると、撓みが生じる弾性部材により構成されている。弾性部材の材質としては、上記の通り、種々のものが適用可能である。たとえば、ゴム若しくはその他の樹脂により、変位部１４２を構成することができる。また、板形状といっても、必ずしも全体が平坦面である必要はなく、一定の角度や湾曲を有していてもよい。 The displacement portion 142 of the present embodiment has a plate shape having at least the entire length of the side portion 20b in parallel with the side portions 20b of the concave substrate 20. One end of the displacement portion 142 that contacts and separates from the thin substrate 21 is a plate-shaped edge portion 142x. The displacement part 142 is configured by an elastic member that is bent when the edge part 142x comes into contact with the thin substrate 21 and is pressed against the concave substrate 20. As described above, various materials can be applied as the material of the elastic member. For example, the displacement part 142 can be made of rubber or other resin. Moreover, even if it says plate shape, the whole does not necessarily need to be a flat surface and may have a fixed angle and curvature.
　なお、変位部１４２は、凹状基板２０及び薄状基板２１を傷つけないものとすることが望ましい。たとえば、ゴム若しくはその他の樹脂製若しくは樹脂によるコーテイングを施されたものとすることができる。また、縁部１４２ｘに丸みを有する形状とすることにより、傷つきを防止することもできる。 Note that it is desirable that the displacement portion 142 does not damage the concave substrate 20 and the thin substrate 21. For example, it may be made of rubber or other resin or coated with resin. Further, by making the edge 142x have a round shape, damage can be prevented.
　支持部１４３は、変位部１４２の一部である他端を支持する部材である。この支持部１４３は、変位部１４２の変位の支点となる軸部１４３ａを有している。軸部１４３ａは、凹状基板２０の側辺部２０ｂに平行に設けられ、図示しない駆動源によって回動する。これにより、支持部１４３は、軸部１４３ａを中心に回動する。 The support portion 143 is a member that supports the other end that is a part of the displacement portion 142. The support portion 143 has a shaft portion 143 a that serves as a fulcrum of displacement of the displacement portion 142. The shaft portion 143a is provided in parallel to the side portion 20b of the concave substrate 20, and is rotated by a driving source (not shown). Thereby, the support part 143 rotates centering | focusing on the axial part 143a.
　支持部１４３の軸部１４３ａの回動中心から、変位部１４２の一端までの回転半径は、変位部１４２の一端が、その回動中に薄状基板２１から離れずに、凹状基板２０への圧着を維持する長さに設定されている。 The radius of rotation from the center of rotation of the shaft portion 143a of the support portion 143 to one end of the displacement portion 142 is such that one end of the displacement portion 142 does not leave the thin substrate 21 during the rotation and is moved to the concave substrate 20. The length is set to maintain the crimping.
　たとえば、側辺部２０ｂが湾曲部によって立ち上がっている場合、軸部１４３ａの回転中心から湾曲部の内面までの距離は、内面の位置や形状により一定ではない場合がある。この場合、距離が最も長い位置と最も短い位置との差が、変位部１４２の弾性変形によって吸収され、変位部１４２の一端による凹状基板２０への薄状基板２１の圧着が維持されるように、回転半径が設定されている。 For example, when the side portion 20b is raised by the curved portion, the distance from the rotation center of the shaft portion 143a to the inner surface of the curved portion may not be constant depending on the position and shape of the inner surface. In this case, the difference between the position where the distance is the longest and the position where the distance is the shortest is absorbed by the elastic deformation of the displacement portion 142, and the pressure bonding of the thin substrate 21 to the concave substrate 20 by one end of the displacement portion 142 is maintained. , Turning radius is set.
　なお、押付部１４１は、変位部１４２と同時に若しくは変位部１４２よりも先に、薄状基板２１を凹状基板２０に圧着するように設定されている。同時に圧着させる場合には、押付部１４１の押付面と変位部１４２の一端の高さを等しくする。 The pressing portion 141 is set so as to press the thin substrate 21 to the concave substrate 20 simultaneously with the displacement portion 142 or before the displacement portion 142. In the case of simultaneously pressing, the pressing surface of the pressing portion 141 and the height of one end of the displacement portion 142 are made equal.
　押付部１４１を先に圧着させるには、押付部１４１を、薄状基板２１を凹状基板２０に圧着させる方向に付勢する弾性部材を設ける。この場合、押付部１４１が薄状基板２１を凹状基板２０に圧着した際に、押付部１４１が弾性部材の付勢力に抗して、変位部１４２に対して相対的に後退し、その後、変位部１４２の一端が薄状基板２１を凹状基板２０に圧着する。 In order to press the pressing portion 141 first, an elastic member that urges the pressing portion 141 in a direction in which the thin substrate 21 is pressed against the concave substrate 20 is provided. In this case, when the pressing portion 141 presses the thin substrate 21 to the concave substrate 20, the pressing portion 141 moves backward relative to the displacement portion 142 against the urging force of the elastic member, and then the displacement One end of the portion 142 presses the thin substrate 21 to the concave substrate 20.
　また、押付部１４１を先に圧着させるには、押付部１４１自体若しくはその押付面を、弾性体とすることも可能である。この場合、押付部１４１が薄状基板２１を凹状基板２０に圧着した際に、押付部１４１の押付面が弾性変形して、変位部１４２の一端に対して相対的に後退し、その後、変位部１４２の一端が薄状基板２１を凹状基板２０に圧着する。 Also, in order to press the pressing portion 141 first, the pressing portion 141 itself or its pressing surface can be an elastic body. In this case, when the pressing portion 141 press-bonds the thin substrate 21 to the concave substrate 20, the pressing surface of the pressing portion 141 is elastically deformed and retreats relative to one end of the displacement portion 142, and then is displaced. One end of the portion 142 presses the thin substrate 21 to the concave substrate 20.
　（作用）
　以上のような本実施形態による基板の貼り合わせ工程を説明する。まず、初期状態において、図１１に示すように、変位部１４２の一端は、押付部１４１側に寄せておく。そして、保持部３に凹状基板２０を設置して、押付部１４１及び変位部１４２の上に、一方の面に接着剤Ｒが付着された薄状基板２１の他方の面を載置する。これにより、凹状基板２０と薄状基板２１は、チャンバ９内において対向する。 (Function)
The substrate bonding process according to the present embodiment as described above will be described. First, in the initial state, as shown in FIG. 11, one end of the displacement portion 142 is brought close to the pressing portion 141 side. Then, the concave substrate 20 is installed on the holding unit 3, and the other surface of the thin substrate 21 with the adhesive R attached to one surface is placed on the pressing unit 141 and the displacement unit 142. Thereby, the concave substrate 20 and the thin substrate 21 face each other in the chamber 9.
　この状態で、真空チャンバ９内を、真空源により真空引きする。そして、薄状基板２１が凹状基板２０に接近して貼り合わされる前に、硬化処理部５０から接着剤Ｒを仮硬化させるためのエネルギーを放射する。これにより、押付部１４１及び変位部１４２が凹状基板２０の対向する側辺部２０ｂの間の空間に入り込む際、薄状基板２１に塗布された接着剤Ｒが流動することを抑制できる。 In this state, the vacuum chamber 9 is evacuated by a vacuum source. Then, before the thin substrate 21 is attached close to the concave substrate 20, energy for temporarily curing the adhesive R is emitted from the curing processing unit 50. Thereby, when the pressing part 141 and the displacement part 142 enter the space between the side parts 20b which the concave substrate 20 opposes, it can suppress that the adhesive agent R apply | coated to the thin board | substrate 21 flows.
　そして、保持部３に対して、押圧機構４が接近すると、押付部１４１及び変位部１４２が凹状基板２０の対向する側辺部２０ｂの間の空間に入り込むので、薄状基板２１も、この空間内に入る。このとき、図１２（Ａ）に示すように、変位部１４２は、凹状基板２０の側辺部２０ｂよりも内側の空間に入っている。 When the pressing mechanism 4 approaches the holding unit 3, the pressing unit 141 and the displacement unit 142 enter the space between the opposing side portions 20 b of the concave substrate 20, so that the thin substrate 21 is also in this space. Get inside. At this time, as shown in FIG. 12A, the displacement portion 142 is in a space inside the side portion 20 b of the concave substrate 20.
　保持部３と押圧機構４との接近は、図１２（Ａ）（Ｂ）に示すように、押付部１４１が、薄状基板２１の中央領域を、凹状基板２０の中央領域に押し付けるまで続行する。たとえば、駆動機構の駆動源に、トルクセンサ等を接続しておくことで、当該押し付けを感知可能である。 The approach between the holding unit 3 and the pressing mechanism 4 continues until the pressing unit 141 presses the central region of the thin substrate 21 against the central region of the concave substrate 20 as shown in FIGS. . For example, the pressing can be detected by connecting a torque sensor or the like to the drive source of the drive mechanism.
　以上のように、押付部１４１が、凹状基板２０に対して、薄状基板２１を押し付けると、変位部１４２の一端も、凹状基板２０に対して、薄状基板２１を押し付ける。この押付部１４１の押し付けタイミングと、変位部１４２の押し付けタイミングは、上記の通りである。なお、この押し付けにより、変位部１４２が弾性変形し、押付部１４１の押圧端と連続した位置に、変位部１４２の一端が挿入される。 As described above, when the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, one end of the displacement portion 142 also presses the thin substrate 21 against the concave substrate 20. The pressing timing of the pressing portion 141 and the pressing timing of the displacement portion 142 are as described above. By this pressing, the displacement portion 142 is elastically deformed, and one end of the displacement portion 142 is inserted at a position continuous with the pressing end of the pressing portion 141.
　この状態で、図１２（Ｃ）（Ｄ）に示すように、駆動源が作動して支持部１４３が回動する。すると、変位部１４２の一端が、凹状基板２０の側辺部２０ｂの湾曲部に沿って、薄状基板２１の外縁に向かって移動する。変位部１４２の弾性変形により、その一端は、薄状基板２１を介した凹状基板２０への接触を維持する。このため、薄状基板２１が凹状基板２０の側辺部２０ｂに圧着される。なお、貼り合わせ後に、硬化処理部５０により、接着剤Ｒを仮硬化させるためのエネルギーを放射してもよい。 In this state, as shown in FIGS. 12C and 12D, the drive source is activated and the support portion 143 is rotated. Then, one end of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20 b of the concave substrate 20. Due to the elastic deformation of the displacement portion 142, one end thereof maintains contact with the concave substrate 20 via the thin substrate 21. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20. In addition, you may radiate | emit the energy for carrying out the temporary hardening of the adhesive agent R by the hardening process part 50 after bonding.
　（効果）
　以上のような本実施形態によれば、側辺部２０ｂの湾曲部の形状にばらつきがあっても、隙間やシワが生じることなく、薄状基板２１を適切に圧着させることができる。 (effect)
According to the present embodiment as described above, even if the shape of the curved portion of the side portion 20b varies, the thin substrate 21 can be appropriately crimped without causing a gap or a wrinkle.
　また、製品によって側辺部２０ｂの湾曲部の形状が相違する場合であっても、それぞれの形状に合わせた嵌合面を有する凸面形状の部材を準備しておく必要がない。このため、部材の準備や交換作業の手間が省け、生産性が向上する。 Further, even if the shape of the curved portion of the side portion 20b is different depending on the product, it is not necessary to prepare a convex-shaped member having a fitting surface adapted to each shape. For this reason, the labor of member preparation and replacement work can be saved, and the productivity is improved.
　また、薄状基板２１は、押付部１４１が薄状基板２１を凹状基板２０の中央領域に押し付けた後、凹状基板２０の側辺部２０ｂ側への変位部１４２の回動に従って、薄状基板２１が凹状基板２０に押し付けられていく。このため、真空泡等の噛み込みが生じることなく、凹状基板２０の全面に亘って、薄状基板２１を均一に密着させることができる。したがって、貼り合わせ後の製品の品質が向上する。また、貼り合わせ前に硬化処理部５０により接着剤Ｒを仮硬化させるので、接着剤Ｒの流動が抑制される。さらに、貼り合わせ後に硬化処理部５０により接着剤Ｒを仮硬化させた場合には、貼り合わされた薄状基板２１の形状を維持し、剥がれないようにすることができる。従って、当該構成によっても、第５、第６の実施形態と同様の効果を奏することができる。なお、貼り合わせ前の仮硬化と、貼り合わせ後の仮硬化は、いずれか一方若しくは双方を行なってもよい。 Further, after the pressing portion 141 presses the thin substrate 21 against the central region of the concave substrate 20, the thin substrate 21 follows the rotation of the displacement portion 142 toward the side portion 20 b of the concave substrate 20. 21 is pressed against the concave substrate 20. For this reason, the thin substrate 21 can be uniformly adhered over the entire surface of the concave substrate 20 without the occurrence of biting of vacuum bubbles or the like. Therefore, the quality of the product after bonding is improved. Moreover, since the adhesive agent R is temporarily hardened by the hardening process part 50 before bonding, the flow of the adhesive agent R is suppressed. Furthermore, when the adhesive R is temporarily cured by the curing processing unit 50 after bonding, the shape of the bonded thin substrate 21 can be maintained and can be prevented from peeling off. Therefore, the same effects as those of the fifth and sixth embodiments can be obtained by this configuration. In addition, you may perform any one or both of temporary hardening before bonding and temporary hardening after bonding.
　（第８の実施形態）
　本実施形態に係る基板貼合装置について、図１３及び図１４を参照して説明する。図１３及び図１４は、本実施形態における押圧機構４の構成と動作を示す図である。 (Eighth embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG.13 and FIG.14. 13 and 14 are diagrams showing the configuration and operation of the pressing mechanism 4 in the present embodiment.
　（構成）
　本実施形態は、基本的には、上記の第７の実施形態と同様の構成である。ただし、図１３に示すように、本実施形態の変位部１４２は、ローラ１４２ａと軸支部１４２ｂを有している。ローラ１４２ａは、凹状基板２０の側辺部２０ｂに平行に、少なくとも側辺部２０ｂの全長の長さを有する回転部材である。このローラ１４２ａの外周面が、薄状基板２１に接離する変位部１４２の一端となる。 (Constitution)
This embodiment is basically the same configuration as the seventh embodiment. However, as shown in FIG. 13, the displacement part 142 of this embodiment has the roller 142a and the axial support part 142b. The roller 142a is a rotating member having at least the entire length of the side portion 20b in parallel with the side portion 20b of the concave substrate 20. The outer peripheral surface of the roller 142 a becomes one end of a displacement portion 142 that contacts and separates from the thin substrate 21.
　軸支部１４２ｂは、その一端に、ローラ１４２ａを回転可能に支持する部材である。軸支部１４２ｂは、少なくともローラ１４２ａの全長と同等の長さを有する。この軸支部１４２ｂは、両端のアーム部により、ローラ１４２ａの軸の両端を支持する。このアーム部は、たとえば、弾性体、エアシリンダ、電磁石によるフローティング装置等により、変位（伸縮）可能に設けられ、湾曲部の形状に応じて、ローラ１４２ａによる圧着を維持させる構成となっている。弾性体としては、ゴム若しくはその他の樹脂、バネ又はこれらにより支持体を弾性支持したものを用いることが可能である。電磁石を用いた場合、制御装置が通電を制御することにより、圧着力、伸縮量等を調整することが容易となる。 The shaft support 142b is a member that rotatably supports the roller 142a at one end thereof. The shaft support 142b has a length at least equal to the entire length of the roller 142a. The shaft support 142b supports both ends of the shaft of the roller 142a by arm portions at both ends. The arm portion is provided so as to be displaceable (extendable / contractible) by, for example, an elastic body, an air cylinder, an electromagnet floating device, and the like, and is configured to maintain the pressure bonding by the roller 142a according to the shape of the bending portion. As the elastic body, it is possible to use rubber or other resin, a spring, or a material in which the support is elastically supported by these. When an electromagnet is used, it becomes easy to adjust the crimping force, the amount of expansion and contraction, etc., by the control device controlling energization.
　支持部１４３は、軸支部１４２ｂの他端を支持する部材である。この支持部１４３は、変位部１４２の変位の支点、つまり、軸支部１４２ｂの回動の軸となる軸部１４３ａを有している。軸部１４３ａの構成は、上記の第１の実施形態と同様である。 The support part 143 is a member that supports the other end of the shaft support part 142b. The support portion 143 has a displacement fulcrum of the displacement portion 142, that is, a shaft portion 143a serving as a rotation axis of the shaft support portion 142b. The configuration of the shaft portion 143a is the same as that in the first embodiment.
　なお、押付部１４１は、上記の第１の実施形態と同様に、変位部１４２のローラ１４２ａと同時に若しくはローラ１４２ａよりも先に、薄状基板２１を凹状基板２０に圧着するように設定されている。 The pressing portion 141 is set to press the thin substrate 21 to the concave substrate 20 simultaneously with the roller 142a of the displacement portion 142 or before the roller 142a, as in the first embodiment. Yes.
　（作用）
　以上のような本実施形態による基板の貼り合わせ工程を説明する。なお、上記の実施形態と同様の工程については、説明を簡略化若しくは省略する。まず、初期状態において、ローラ１４２ａは、押付部１４１側に寄せておく。そして、凹状基板２０を保持した保持部３に対して、押圧機構４を接近させて、薄状基板２１を、凹状基板２０の対向する側辺部２０ｂの間の空間に入り込ませる。 (Function)
The substrate bonding process according to the present embodiment as described above will be described. Note that the description of the same steps as those in the above embodiment is simplified or omitted. First, in the initial state, the roller 142a is brought close to the pressing portion 141 side. Then, the pressing mechanism 4 is brought close to the holding unit 3 that holds the concave substrate 20, and the thin substrate 21 enters the space between the opposing side portions 20 b of the concave substrate 20.
　このとき、図１４（Ａ）に示すように、変位部１４２の一端であるローラ１４２ａの外周面が、凹状基板２０の側辺部２０ｂよりも内側の空間に入っている。 At this time, as shown in FIG. 14A, the outer peripheral surface of the roller 142a, which is one end of the displacement portion 142, is in a space inside the side portion 20b of the concave substrate 20.
　そして、図１４（Ｂ）に示すように、押付部１４１が、凹状基板２０に対して薄状基板２１を押し付けると、変位部１４２の一端であるローラ１４２ａの外周面も、凹状基板２０に対して、薄状基板２１を押し付ける。 14B, when the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, the outer peripheral surface of the roller 142a, which is one end of the displacement portion 142, also moves against the concave substrate 20. Then, the thin substrate 21 is pressed.
　この状態で、駆動源が作動して軸部１４３ａが回動する。すると、図１４（Ｃ）（Ｄ）に示すように、変位部１４２のローラ１４２ａが、凹状基板２０の側辺部２０ｂの湾曲部に沿って、回転しながら薄状基板２１の外縁に向かって移動する。このため、薄状基板２１が凹状基板２０の側辺部２０ｂに圧着する。このとき、アーム部が、湾曲部の形状に応じて伸縮することにより、ローラ１４２ａによる薄状基板２１の凹状基板２０への圧着が維持される。 In this state, the drive source is activated and the shaft portion 143a rotates. Then, as shown in FIGS. 14C and 14D, the roller 142a of the displacement portion 142 rotates along the curved portion of the side portion 20b of the concave substrate 20 toward the outer edge of the thin substrate 21. Moving. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20. At this time, the arm portion expands and contracts according to the shape of the curved portion, so that the pressure bonding of the thin substrate 21 to the concave substrate 20 by the roller 142a is maintained.
　（効果）
　以上のような本実施形態によれば、第７の実施形態と同様の効果が得られるとともに、以下のような効果が得られる。すなわち、薄状基板２１に直接接触する部材が、回転するローラ１４２ａである。このため、薄状基板２１の表面を擦ることによる傷つき等が発生し難くなる。また、高速で移動させても、薄状基板２１を傷つけ難いため、貼り合わせ処理の高速化が可能となる。さらに、アーム部が伸縮することにより、凹状基板２０の湾曲部の形状、薄状基板２１の可撓性にばらつきがあっても、曲面に倣って圧着を維持させることもできる。 (effect)
According to the present embodiment as described above, the same effects as those of the seventh embodiment can be obtained, and the following effects can be obtained. That is, the member that is in direct contact with the thin substrate 21 is the rotating roller 142a. For this reason, scratches and the like due to rubbing the surface of the thin substrate 21 are less likely to occur. Further, since the thin substrate 21 is not easily damaged even if it is moved at a high speed, the bonding process can be speeded up. Furthermore, even when the shape of the curved portion of the concave substrate 20 and the flexibility of the thin substrate 21 vary due to the expansion and contraction of the arm portion, it is possible to maintain the pressure bonding following the curved surface.
　（第９の実施形態）
　本実施形態に係る基板貼合装置について、図１５及び図１６を参照して説明する。図１５及び図１６は、本実施形態における押圧機構４の構成と動作を示す図である。 (Ninth embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG.15 and FIG.16. FIG.15 and FIG.16 is a figure which shows the structure and operation | movement of the press mechanism 4 in this embodiment.
　（構成）
　本実施形態は、基本的には、上記の第７の実施形態と同様の構成である。ただし、本実施形態の変位部１４２は、図１５に示すように、ブラシ１４２ｃを有している。また、支持部１４３は、ブラシ１４２ｃを固定する基体部１４３ｂを有している。 (Constitution)
This embodiment is basically the same configuration as the seventh embodiment. However, the displacement part 142 of this embodiment has the brush 142c, as shown in FIG. Moreover, the support part 143 has the base | substrate part 143b which fixes the brush 142c.
　ブラシ１４２ｃは、たとえば、複数本の樹脂、天然若しくは合成繊維又は毛の集合体であり、その一端が、凹状基板２０の側辺部２０ｂの湾曲部に向かっている。ブラシ１４２ｃの一部である他端は、基体部１４３ｂに植毛されている。 The brush 142c is, for example, an assembly of a plurality of resins, natural or synthetic fibers, or hairs, and one end of the brush 142c faces the curved portion of the side portion 20b of the concave substrate 20. The other end, which is a part of the brush 142c, is implanted in the base portion 143b.
　基体部１４３ｂは、凹状基板２０の側辺部２０ｂに平行に、少なくとも側辺部２０ｂの全長の長さを有する部材であり、側辺部２０ｂの湾曲部に向かう曲面を有している。この曲面の全面に亘って、ブラシ１４２ｃが植毛されている。 The base portion 143b is a member having at least the entire length of the side portion 20b in parallel with the side portion 20b of the concave substrate 20, and has a curved surface toward the curved portion of the side portion 20b. The brush 142c is planted over the entire surface of the curved surface.
　このブラシ１４２ｃの先端は、薄状基板２１に接して凹状基板２０に押し付ける一端となる。ブラシ１４２ｃの根本における基体部１４３ｂへの植毛部分は、ブラシ１４２ｃの変位の支点の一つとなっている。また、ブラシ１４２ｃは柔軟性を有するため、薄状基板２１を凹状基板２０に押し付ける際に屈曲する。 The tip of the brush 142c is one end that contacts the thin substrate 21 and presses against the concave substrate 20. The portion of the brush 142c that is implanted into the base portion 143b is one of the fulcrums for displacement of the brush 142c. Further, since the brush 142c has flexibility, it is bent when the thin substrate 21 is pressed against the concave substrate 20.
　なお、図示はしないが、押付部１４１が、凹状基板２０に対して、薄状基板２１を押し付けた後に、さらに、変位部１４２の基体部１４３ｂを、ブラシ１４２ｃの先端が薄状基板２１を凹状基板２０へ押し付ける方向へ移動させる駆動機構を有する。 Although not shown, after the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, the base portion 143 b of the displacement portion 142 is further recessed, and the tip of the brush 142 c is concave to the thin substrate 21. It has a drive mechanism that moves in the direction of pressing against the substrate 20.
　なお、押付部１４１は、上記の第１の実施形態と同様に、変位部１４２のブラシ１４２ｃと同時に若しくはブラシ１４２ｃよりも先に、薄状基板２１を凹状基板２０に圧着するように設定されている。また、変位部１４２の一端であるブラシ１４２ｃの先端は、凹状基板２０の側辺部２０ｂよりも内側の空間に収まるとともに、内側から外側にかけて、順次薄状基板２１を凹状基板２０に圧着する高さに設定されている。 As in the first embodiment, the pressing portion 141 is set to press the thin substrate 21 against the concave substrate 20 simultaneously with the brush 142c of the displacement portion 142 or before the brush 142c. Yes. In addition, the tip of the brush 142c, which is one end of the displacement portion 142, fits in a space inside the side portion 20b of the concave substrate 20, and the thin substrate 21 is sequentially pressed against the concave substrate 20 from the inside to the outside. Is set.
　（作用）
　以上のような本実施形態による基板の貼り合わせ工程を説明する。なお、上記の実施形態と同様の工程については、説明を簡略化若しくは省略する。まず、凹状基板２０を保持した保持部３に対して、押圧機構４を接近させて、薄状基板２１を凹状基板２０の対向する側辺部２０ｂの間の空間に入り込ませる。 (Function)
The substrate bonding process according to the present embodiment as described above will be described. Note that the description of the same steps as those in the above embodiment is simplified or omitted. First, the pressing mechanism 4 is brought close to the holding unit 3 that holds the concave substrate 20, and the thin substrate 21 enters the space between the opposing side portions 20 b of the concave substrate 20.
　このとき、図１６（Ａ）に示すように、変位部１４２の一端であるブラシ１４２ｃの先端が、凹状基板２０の側辺部２０ｂよりも内側の空間に入っている。 At this time, as shown in FIG. 16A, the tip of the brush 142c, which is one end of the displacement portion 142, is in a space inside the side portion 20b of the concave substrate 20.
　そして、図１６（Ｂ）に示すように、押付部１４１が、凹状基板２０に対して、薄状基板２１を押し付けると、変位部１４２の一端であるブラシ１４２ｃの先端も、凹状基板２０に対して、薄状基板２１を押し付ける。 16B, when the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, the tip of the brush 142c, which is one end of the displacement portion 142, also moves against the concave substrate 20. Then, the thin substrate 21 is pressed.
　この状態で、駆動機構が作動して、基体部１４３ｂを凹状基板２０に向かって移動させる。すると、図１６（Ｃ）（Ｄ）に示すように、内側のブラシ１４２ｃから外側のブラシ１４２ｃへと、順次薄状基板２１を凹状基板２０に押し付けながら、ブラシ１４２ｃが屈曲していく。これにより、ブラシ１４２ｃが、凹状基板２０の側辺部２０ｂの湾曲部に沿って、薄状基板２１を圧着する。 In this state, the drive mechanism operates to move the base portion 143b toward the concave substrate 20. Then, as shown in FIGS. 16C and 16D, the brush 142c is bent while pressing the thin substrate 21 against the concave substrate 20 sequentially from the inner brush 142c to the outer brush 142c. Thereby, the brush 142c press-bonds the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20.
　（効果）
　以上のような本実施形態によれば、第７の実施形態と同様の効果が得られるとともに、以下のような効果が得られる。すなわち、薄状基板２１に直接接触する部材が、柔軟性を有するブラシ１４２ｃである。このため、湾曲形状について、より大きな相違やばらつきがあっても、これを吸収して精度の高い貼り合わせが可能となる。また、薄状基板２１の表面を擦ることによる傷つき等が発生し難くなる。 (effect)
According to the present embodiment as described above, the same effects as those of the seventh embodiment can be obtained, and the following effects can be obtained. That is, the member that is in direct contact with the thin substrate 21 is a flexible brush 142c. For this reason, even if there is a greater difference or variation in the curved shape, it is possible to absorb this and perform bonding with high accuracy. Further, scratches caused by rubbing the surface of the thin substrate 21 are less likely to occur.
　また、高速で移動させても、薄状基板２１を傷つけ難いため、貼り合わせ処理の高速化が可能となる。さらに、変位部１４２の構成が、基体部１４３ｂに植毛されたブラシ１４２ｃなので、装置構成が簡略化され、安価に製造できる。 In addition, since the thin substrate 21 is hardly damaged even if it is moved at a high speed, the bonding process can be speeded up. Furthermore, since the structure of the displacement part 142 is the brush 142c planted in the base | substrate part 143b, an apparatus structure is simplified and it can manufacture at low cost.
　（第１０の実施形態）
　本実施形態に係る基板貼合装置について、図１７を参照して説明する。図１７は、本実施形態における押圧機構４の構成と動作を示す図である。
　（構成）
　本実施形態は、基本的には、上記の第９の実施形態と同様の構成である。ただし、本実施形態においては、図１７（Ａ）に示すように、押付部１４１と基体部１４３ｂ（支持部１４３）とが一体的に構成され、基体部１４３ｂのみならず、押付部１４１の上面にも、ブラシ１４２ｃ（変位部１４２）が植毛されている。このブラシ１４２ｃの先端は、凹状基板２０の中央部から先に、薄状基板２１を圧着し、凹状基板２０の側辺部２０ｂ側に向かって、順次他のブラシ１４２ｃも圧着するように、中央部が高く設定されている。 (Tenth embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG. FIG. 17 is a diagram illustrating the configuration and operation of the pressing mechanism 4 in the present embodiment.
(Constitution)
This embodiment is basically the same configuration as the ninth embodiment. However, in the present embodiment, as shown in FIG. 17A, the pressing portion 141 and the base portion 143b (support portion 143) are integrally formed, and not only the base portion 143b but also the upper surface of the pressing portion 141. Moreover, the brush 142c (displacement part 142) is planted. The tip of the brush 142c is centered so that the thin substrate 21 is crimped first from the central portion of the concave substrate 20, and the other brushes 142c are also sequentially crimped toward the side portion 20b of the concave substrate 20. The department is set high.
（作用）
　以上のような本実施形態による基板の貼り合わせ工程を説明する。なお、上記の実施形態と同様の工程については、説明を簡略化若しくは省略する。まず、凹状基板２０を保持した保持部３に対して、押圧機構４を接近させて、薄状基板２１を凹状基板２０の対向する側辺部２０ｂの間の空間に入り込ませる。 (Function)
The substrate bonding process according to the present embodiment as described above will be described. Note that the description of the same steps as those in the above embodiment is simplified or omitted. First, the pressing mechanism 4 is brought close to the holding unit 3 that holds the concave substrate 20, and the thin substrate 21 enters the space between the opposing side portions 20 b of the concave substrate 20.
　このとき、図１７（Ｂ）に示すように、変位部１４２の一端であるブラシ１４２ｃの先端は、凹状基板２０の側辺部２０ｂよりも内側にある。 At this time, as shown in FIG. 17B, the tip of the brush 142c, which is one end of the displacement portion 142, is located inside the side portion 20b of the concave substrate 20.
　そして、図１７（Ｃ）に示すように、押付部１４１のブラシ１４２ｃが、凹状基板２０に対して、薄状基板２１を押し付ける。このとき、ブラシ１４２ｃの先端は、凹状基板２０の中央部から側辺部２０ｂに向かって、順次薄状基板２１を圧着して行く。 Then, as shown in FIG. 17C, the brush 142 c of the pressing unit 141 presses the thin substrate 21 against the concave substrate 20. At this time, the tip of the brush 142c sequentially press-bonds the thin substrate 21 from the central portion of the concave substrate 20 toward the side portion 20b.
　さらに、図１７（Ｄ）（Ｅ）（Ｆ）に示すように、凹状基板２０の側辺部２０ｂの湾曲部においても、内側のブラシ１４２ｃから外側のブラシ１４２ｃへと、順次薄状基板２１を凹状基板２０に押し付けながら、ブラシ１４２ｃが屈曲していく。これにより、ブラシ１４２ｃが、凹状基板２０の側辺部２０ｂの湾曲部に沿って、薄状基板２１を圧着する。 Further, as shown in FIGS. 17D, 17E, and 17F, the thin substrate 21 is sequentially moved from the inner brush 142c to the outer brush 142c also in the curved portion of the side portion 20b of the concave substrate 20. The brush 142c is bent while being pressed against the concave substrate 20. Thereby, the brush 142c press-bonds the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20.
　（効果）
　以上のような本実施形態によれば、第４の実施形態と同様の効果が得られるとともに、以下のような効果が得られる。すなわち、薄状基板２１を凹状基板２０に押圧する部材の全体がブラシ１４２ｃとなっているので、凹状基板２０の中央部から外側に向かって、順次圧着していくことができる。このため、真空泡等の噛み込みをより一層防止して、凹状基板２０の全面に亘って、薄状基板２１を均一に密着させることができる。したがって、貼り合わせ後の製品の品質がより一層向上する。また、変位部１４２の基体部１４３ｂのみを駆動する駆動機構が不要となる。 (effect)
According to the present embodiment as described above, the same effects as in the fourth embodiment can be obtained, and the following effects can be obtained. That is, since the whole member that presses the thin substrate 21 against the concave substrate 20 is the brush 142c, it can be sequentially pressed from the center of the concave substrate 20 to the outside. For this reason, biting of vacuum bubbles or the like can be further prevented, and the thin substrate 21 can be uniformly adhered over the entire surface of the concave substrate 20. Therefore, the quality of the product after bonding is further improved. In addition, a driving mechanism that drives only the base portion 143b of the displacement portion 142 becomes unnecessary.
　（第１１の実施形態）
　本実施形態に係る基板貼合装置について、図１８を参照して説明する。図１８は、本実施形態における押圧機構４の構成と動作を示す図である。
　（構成）
　本実施形態は、基本的には上記の第７の実施形態と同様の構成である。ただし、本実施形態は、図１８（Ａ）に示すように、ガイド機構１５を有している。 (Eleventh embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG. FIG. 18 is a diagram illustrating the configuration and operation of the pressing mechanism 4 in the present embodiment.
(Constitution)
This embodiment is basically the same configuration as the seventh embodiment. However, this embodiment has a guide mechanism 15 as shown in FIG.
　ガイド機構１５は、押圧機構４により押圧される薄状基板２１の側辺部２１ｂの近傍の面が、凹状基板２０の両側辺部２０ｂの内側に入るように、ガイドする機構である。このガイド機構１５は、押圧機構４に載置された薄状基板２１の両側辺部２１ｂに接離する一対のガイド部材１５ａを有している。ガイド部材１５ａは、少なくとも薄状基板２１の側辺部２１ｂの全長と同等の長さを有する板形状である。 The guide mechanism 15 is a mechanism that guides the surface in the vicinity of the side portion 21 b of the thin substrate 21 pressed by the pressing mechanism 4 so as to enter the inside of the side portions 20 b of the concave substrate 20. The guide mechanism 15 has a pair of guide members 15 a that come in contact with and separate from both side portions 21 b of the thin substrate 21 placed on the pressing mechanism 4. The guide member 15a has a plate shape having a length equivalent to at least the entire length of the side portion 21b of the thin substrate 21.
　そして、一対のガイド部材１５ａは、薄状基板２１の側辺部２１ｂに接するガイド位置と、薄状基板２１の側辺部２１ｂから離れて退避する退避位置との間で、図示しない移動機構により移動可能に設けられている。なお、この移動機構は、たとえば、それぞれガイド部材１５ａを有する一対のフレーム等が、駆動源に接続された軸を中心に回動可能に設けられ、互いに逆方向に回動することにより、一対のガイド部材１５ａが互いに接離する方向に移動する構成としてもよい。また、一対のガイド部材１５ａは、薄状基板２１の側辺部２１ｂに接しながら、図示しない昇降機構により、押圧機構４とともに昇降可能に設けられている。なお、この昇降機構は、押圧機構４の駆動機構と兼用であってもよい。また、ガイド部材１５ａの昇降移動は、保持部３に保持された凹状基板２０に対して、相対的であればよい。 The pair of guide members 15a is moved between a guide position in contact with the side portion 21b of the thin substrate 21 and a retraction position that is retracted away from the side portion 21b of the thin substrate 21 by a moving mechanism (not shown). It is provided to be movable. In addition, this moving mechanism is provided with a pair of frames each having a guide member 15a so as to be rotatable around an axis connected to a drive source, and by rotating in opposite directions to each other, It is good also as a structure which the guide member 15a moves to the direction which mutually contacts. In addition, the pair of guide members 15 a are provided so as to be lifted and lowered together with the pressing mechanism 4 by a lifting mechanism (not shown) while being in contact with the side portion 21 b of the thin substrate 21. Note that this lifting mechanism may also be used as the driving mechanism of the pressing mechanism 4. Further, the up-and-down movement of the guide member 15 a may be relative to the concave substrate 20 held by the holding unit 3.
　この一対のガイド部材１５ａは、薄状基板２１を、押付部１４１により押し付けられ、変位部１４２により圧着される部分以外は、凹状基板２０から離間した位置に保持するように、ガイド位置における互いの間隔と、押圧機構４への追従距離が設定されている。 The pair of guide members 15 a are configured so that the thin substrate 21 is held at a position separated from the concave substrate 20 except for a portion pressed by the pressing portion 141 and pressed by the displacement portion 142. An interval and a follow-up distance to the pressing mechanism 4 are set.
　（作用）
　以上のような本実施形態の貼り合わせ工程を説明する。基本的な貼り合わせ工程は、上記の第１の実施形態と同様である。ただし、本実施形態においては、図１８（Ｂ）に示すように、押圧機構４に載置された薄状基板２１の両側辺部２１ｂに、ガイド位置に移動したガイド部材１５ａが接することにより、撓みを生じさせる。 (Function)
The bonding process of this embodiment as described above will be described. The basic bonding process is the same as that in the first embodiment. However, in the present embodiment, as shown in FIG. 18B, the guide members 15a moved to the guide position are in contact with both side portions 21b of the thin substrate 21 placed on the pressing mechanism 4, Causes deflection.
　この撓みによって、薄状基板２１の両側辺部２１ｂは、凹状基板２０の両側辺部２０ｂの内側の空間に入る位置に来る。このように、薄状基板２１の両側辺部２１ｂの位置が規制された状態で、押圧機構４が凹状基板２０に接近するとともに、これに追従して、ガイド部材１５ａも凹状基板２０に接近する。 Due to this bending, the both side portions 21b of the thin substrate 21 come to a position entering the space inside the both side portions 20b of the concave substrate 20. In this way, the pressing mechanism 4 approaches the concave substrate 20 in a state where the positions of the both side portions 21b of the thin substrate 21 are regulated, and the guide member 15a also approaches the concave substrate 20 following this. .
　そして、押付部１４１及び変位部１４２が凹状基板２０の対向する側辺部２０ｂの間の空間に入り込むので、薄状基板２１も、この空間内に入る。このとき、薄状基板２１の両側辺部２１ｂは、ガイド部材１５ａによって、凹状基板２０の側辺部２０ｂよりも内側に入っている。 Since the pressing portion 141 and the displacement portion 142 enter the space between the opposing side portions 20b of the concave substrate 20, the thin substrate 21 also enters this space. At this time, both side portions 21b of the thin substrate 21 are located inside the side portions 20b of the concave substrate 20 by the guide member 15a.
　さらに、図１８（Ｃ）（Ｄ）に示すように、押付部１４１による薄状基板２１の凹状基板２０への押し付けと、変位部１４２による凹状基板２０の側辺部２０ｂの湾曲部に沿った薄状基板２１の圧着が行われる。この詳細は、上記の第１の実施形態と同様である。 Further, as shown in FIGS. 18C and 18D, the pressing unit 141 presses the thin substrate 21 against the concave substrate 20, and the displacement unit 142 follows the curved portion of the side portion 20 b of the concave substrate 20. The thin substrate 21 is crimped. The details are the same as in the first embodiment.
　本実施形態では、図１８（Ｄ）に示すように、薄状基板２１の全面が凹状基板２０に貼り合わされるまで、薄状基板２１がガイド部材１５ａに接して保持され、その後、図１８（Ｅ）に示すように、薄状基板２１からガイド部材１５ａが離れる。このため、貼り合わせ中の薄状基板２１の板面の揺れが防止される。 In the present embodiment, as shown in FIG. 18D, the thin substrate 21 is held in contact with the guide member 15a until the entire surface of the thin substrate 21 is bonded to the concave substrate 20, and thereafter, FIG. E), the guide member 15a is separated from the thin substrate 21. For this reason, shaking of the plate surface of the thin substrate 21 being bonded is prevented.
　（効果）
　以上のような本実施形態によれば、第７の実施形態と同様の効果が得られるとともに、最終的に薄状基板２１の全面が凹状基板２０に圧着される前の薄状基板２１の揺れが生じない。このため、より一層均一で精度のよい貼り合わせを実現でき、貼り合わせ基板の品質が向上する。 (effect)
According to the present embodiment as described above, the same effects as those of the seventh embodiment can be obtained, and the thin substrate 21 can be shaken before the entire surface of the thin substrate 21 is finally bonded to the concave substrate 20. Does not occur. For this reason, it is possible to realize a more uniform and accurate bonding, and the quality of the bonded substrate is improved.
　（第１２の実施形態）
　本実施形態に係る基板貼合装置について、図１９及び図２０を参照して説明する。図１９及び図２０は、本実施形態における押圧機構４の構成と動作を示す図である。 (Twelfth embodiment)
The board | substrate bonding apparatus which concerns on this embodiment is demonstrated with reference to FIG.19 and FIG.20. 19 and 20 are diagrams showing the configuration and operation of the pressing mechanism 4 in the present embodiment.
　（構成）
　本実施形態は、基本的には、上記の第７の実施形態と同様の構成である。ただし、図１９に示すように、本実施形態の変位部１４２は、たとえば、断面が略楕円形状であり、薄状基板２１に接離する一端を、複数有している。そして、変位部１４２は、凹状基板２０の側辺部２０ｂに平行に、少なくとも側辺部２０ｂの全長の長さを有する回転部材である。なお、変位部１４２としては、比較的硬質の部材を用いても、弾性部材を用いてもよい。 (Constitution)
This embodiment is basically the same configuration as the seventh embodiment. However, as shown in FIG. 19, the displacement portion 142 of the present embodiment has, for example, a plurality of one ends that are substantially elliptical in cross section and contacted and separated from the thin substrate 21. And the displacement part 142 is a rotation member which has the length of the full length of the side part 20b at least parallel to the side part 20b of the concave board | substrate 20. As shown in FIG. As the displacement portion 142, a relatively hard member or an elastic member may be used.
　支持部１４３は、変位部１４２の一部を支持し、変位部１４２の回動の支点となる軸である。この軸の構成は、上記の第１の実施形態の軸部１４３ａと同様である。支持部１４３は、変位部１４２の偏心位置に設けられ、変位部１４２の一方の外周面である縁部１４２ｙとこれに対向する他方の外周面である縁部１４２ｚとは、支持部１４３、つまり、軸の回転中心からの距離が異なっている。たとえば、縁部１４２ｙの方が、縁部１４２ｚよりも、回転中心からの距離が長い。この縁部１４２ｙ、１４２ｚが、薄状基板２１に接離する変位部１４２の一端となる。なお、回転半径の異なる一端は、３つ以上設けて、より多くの曲面に対応可能とすることもできる。 The support portion 143 is a shaft that supports a part of the displacement portion 142 and serves as a pivot point of rotation of the displacement portion 142. The configuration of this shaft is the same as that of the shaft portion 143a of the first embodiment. The support portion 143 is provided at an eccentric position of the displacement portion 142, and the edge portion 142y that is one outer peripheral surface of the displacement portion 142 and the edge portion 142z that is the other outer peripheral surface that opposes the support portion 143, that is, The distance from the rotation center of the shaft is different. For example, the edge 142y has a longer distance from the center of rotation than the edge 142z. The edge portions 142y and 142z serve as one end of the displacement portion 142 that contacts and separates from the thin substrate 21. Note that three or more ends having different rotation radii can be provided so as to be able to handle more curved surfaces.
　押付部１４１における変位部１４２の近傍には、変位部１４２の回動を許容する穴、窪み若しくは空洞が設けられている。また、押付部１４１は、上記の第１の実施形態と同様に、変位部１４２と同時に若しくは変位部１４２よりも先に、薄状基板２１を凹状基板２０に圧着するように設定されている。なお、支持部１４３を弾性部材により変位可能に設け、湾曲部の形状に応じて、変位部１４２による圧着を維持させる構成としてもよい。 In the vicinity of the displacement portion 142 in the pressing portion 141, a hole, a recess, or a cavity that allows the displacement portion 142 to rotate is provided. Further, the pressing portion 141 is set so as to press the thin substrate 21 to the concave substrate 20 simultaneously with the displacement portion 142 or before the displacement portion 142 as in the first embodiment. The support portion 143 may be provided so as to be displaceable by an elastic member, and the pressure bonding by the displacement portion 142 may be maintained according to the shape of the bending portion.
　（作用）
　以上のような本実施形態による基板の貼り合わせ工程を説明する。なお、上記の実施形態と同様の工程については、説明を簡略化若しくは省略する。まず、初期状態において、凹状基板２０における側辺部２０ｂの湾曲形状に合わせて、縁部１４２ｙ、１４２ｚのいずれか一方が、薄状基板２１に接する方向にしておく。 (Function)
The substrate bonding process according to the present embodiment as described above will be described. Note that the description of the same steps as those in the above embodiment is simplified or omitted. First, in an initial state, either one of the edge portions 142 y and 142 z is set in a direction in contact with the thin substrate 21 in accordance with the curved shape of the side portion 20 b in the concave substrate 20.
　図１９（Ａ）は、曲率半径が大きい湾曲形状の場合であり、この場合、縁部１４２ｙが薄状基板２１に向かうようにする。そして、凹状基板２０を保持した保持部３に対して、押圧機構４を接近させて、薄状基板２１を、凹状基板２０の対向する側辺部２０ｂの間の空間に入り込ませる。すると、図１９（Ａ）に示すように、押付部１４１とともに、変位部１４２の縁部１４２ｙも、凹状基板２０に対して、薄状基板２１を押し付ける。 FIG. 19A shows a case of a curved shape with a large radius of curvature. In this case, the edge 142y faces the thin substrate 21. Then, the pressing mechanism 4 is brought close to the holding unit 3 that holds the concave substrate 20, and the thin substrate 21 enters the space between the opposing side portions 20 b of the concave substrate 20. Then, as shown in FIG. 19A, the edge portion 142 y of the displacement portion 142, together with the pressing portion 141, presses the thin substrate 21 against the concave substrate 20.
　この状態で、駆動源が作動して支持部１４３が回動する。すると、図１９（Ｂ）に示すように、変位部１４２の縁部１４２ｙが、凹状基板２０の側辺部２０ｂの湾曲部に沿って、薄状基板２１の外縁に向かって移動する。このため、薄状基板２１が凹状基板２０の側辺部２０ｂに圧着する。 In this state, the drive source operates and the support portion 143 rotates. Then, as shown in FIG. 19B, the edge 142 y of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20 b of the concave substrate 20. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20.
　一方、曲率半径が小さい湾曲形状の場合は、図２０（Ａ）に示すように、縁部１４２ｚが薄状基板２１に向かうようにする。そして、縁部１４２ｚが、上記と同様に、押付部１４１とともに、薄状基板２１を凹状基板２０に対して押し付けた状態で、支持部１４３が回動する。すると、図２０（Ｂ）に示すように、変位部１４２の縁部１４２ｚが、凹状基板２０の側辺部２０ｂの湾曲部に沿って、薄状基板２１の外縁に向かって移動する。このため、薄状基板２１が凹状基板２０の側辺部２０ｂに圧着する。 On the other hand, in the case of a curved shape with a small radius of curvature, the edge 142z faces the thin substrate 21 as shown in FIG. And the support part 143 rotates in the state which the edge part 142z pressed the thin board | substrate 21 with respect to the concave board | substrate 20 with the pressing part 141 similarly to the above. Then, as shown in FIG. 20B, the edge 142 z of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20 b of the concave substrate 20. For this reason, the thin substrate 21 is pressure-bonded to the side portion 20 b of the concave substrate 20.
　（効果）
　以上のような本実施形態によれば、第７の実施形態と同様の効果が得られるとともに、以下のような効果が得られる。すなわち、変位部１４２が、回転半径の異なる縁部１４２ｙ、１４２ｚを有しているため、部材の準備や交換作業をしなくても、異なる湾曲形状に対応して、均一な貼り合わせを実現できる。このため、生産性を向上させることができる。なお、湾曲部の形状の多少のばらつきは、凹状基板２０の弾性変形により吸収され、変位部１４２による薄状基板２１の圧着を維持できる。さらに、支持部１４３を弾性部材により変位可能に設けることにより、凹状基板２０の湾曲部の形状、薄状基板２１の可撓性にばらつきがあっても、曲面に倣って圧着を維持させることもできる。 (effect)
According to the present embodiment as described above, the same effects as those of the seventh embodiment can be obtained, and the following effects can be obtained. That is, since the displacement portion 142 has the edge portions 142y and 142z having different rotation radii, uniform bonding can be realized corresponding to different curved shapes without preparing or replacing the members. . For this reason, productivity can be improved. Note that some variation in the shape of the curved portion is absorbed by the elastic deformation of the concave substrate 20, and the pressure bonding of the thin substrate 21 by the displacement portion 142 can be maintained. Further, by providing the support portion 143 so as to be displaceable by an elastic member, even if the shape of the curved portion of the concave substrate 20 and the flexibility of the thin substrate 21 vary, it is possible to maintain the pressure bonding following the curved surface. it can.
　（他の実施形態）
　本発明は、上記のような実施形態に限定されるものではない。たとえば、以下のような形態も、本発明に含まれる。 (Other embodiments)
The present invention is not limited to the embodiment as described above. For example, the following forms are also included in the present invention.
（１）貼り合わせ対象となる一対の基板の位置関係は、上記の実施形態で例示したものには限定されない。たとえば、図２１（Ａ）に示すように、凹状基板２０を下方に支持し、薄状基板２１を押付部１４１により上方に保持する態様も構成可能である。この場合、図２１（Ｂ）～（Ｄ）に示すように、薄状基板２１を保持した押付部１４１及び変位部１４２を下降させて、押付部１４１が薄状基板２１の中央領域を凹状基板２０に押し付け、変位部１４２が薄状基板２１を凹状基板２０の側辺部２０ｂに圧着させる。なお、凹状基板２０の上方に薄状基板２１を載置して、その上から、押付部１４１及び変位部１４２によって、押し付けることにより、貼り合わせを行うこともできる。 (1) The positional relationship between a pair of substrates to be bonded is not limited to that exemplified in the above embodiment. For example, as shown in FIG. 21A, it is possible to configure a mode in which the concave substrate 20 is supported downward and the thin substrate 21 is held upward by the pressing portion 141. In this case, as shown in FIGS. 21B to 21D, the pressing portion 141 and the displacement portion 142 holding the thin substrate 21 are lowered, and the pressing portion 141 moves the central region of the thin substrate 21 into the concave substrate. 20, the displacement portion 142 presses the thin substrate 21 against the side portion 20 b of the concave substrate 20. Bonding can also be performed by placing the thin substrate 21 above the concave substrate 20 and pressing it from above with the pressing portion 141 and the displacement portion 142.
（２）なお、上記の実施形態のいずれにおいても、硬化処理部によるエネルギーの照射によって、貼り合わせ前の接着剤、貼り合わせ後の接着剤に対して、仮硬化を行うことにより、接着剤の流動を抑制してもよい。この仮硬化は、たとえば、接着剤に与えるエネルギーを弱くすることで実現できる。また、大気中で照射したりすることにより実現できる。たとえば、接着剤が紫外線硬化樹脂である場合に、大気中でＵＶ光を照射することにより、接着剤を仮硬化させることができる。大気中で照射する場合、大気中の酸素に硬化が阻害されて、表面の粘性を保った状態を維持しやすい。なお、樹脂の種類に応じて、仮硬化処理の方法は、電磁波の照射、温度変更（加熱、冷却）、送風等、種々のものを適用することが考えられる。さらに、上記の実施形態では、硬化処理部４２ｂ、５０を保持部３の外部に設けていたが、保持部３内部にも設けて、保持部３の全体から接着剤Ｒの全体を硬化させるためのエネルギーを放射するようにしてもよい。そして、これらの硬化処理部を使い分けることで、以下のような硬化処理を実現できる。
　(a) 貼り合わせ前に凹状基板２０や薄状基板２１に塗布された接着剤Ｒの仮硬化を行う。
　(b) 凹状基板２０の側辺部２０ｂでの薄状基板２１の貼り合わせ前若しくは後における仮硬化を行う。
　(c) 貼り合わせ後の凹状基板２０や薄状基板２１の接着剤Ｒ全体の仮硬化又は本硬化（完全に硬化状態に至る硬化）を行う。 (2) In any of the above-described embodiments, by pre-curing the adhesive before bonding and the adhesive after bonding by irradiation of energy by the curing processing unit, The flow may be suppressed. This temporary curing can be realized, for example, by weakening the energy applied to the adhesive. Moreover, it is realizable by irradiating in air | atmosphere. For example, when the adhesive is an ultraviolet curable resin, the adhesive can be temporarily cured by irradiating UV light in the atmosphere. In the case of irradiation in the atmosphere, curing is hindered by oxygen in the atmosphere, and it is easy to maintain a state in which the viscosity of the surface is maintained. Depending on the type of resin, it is conceivable to apply various methods such as irradiation of electromagnetic waves, temperature change (heating, cooling), air blowing, etc., as the method of the temporary curing treatment. Further, in the above-described embodiment, the curing processing units 42b and 50 are provided outside the holding unit 3. However, the curing processing units 42b and 50 are also provided inside the holding unit 3 to cure the entire adhesive R from the entire holding unit 3. May be radiated. And the following hardening processes are realizable by using these hardening process parts properly.
(a) The adhesive R applied to the concave substrate 20 or the thin substrate 21 is temporarily cured before bonding.
(b) Temporary curing is performed before or after the thin substrate 21 is bonded to the side portion 20b of the concave substrate 20.
(c) The entire adhesive R of the concave substrate 20 and the thin substrate 21 after bonding is temporarily cured or fully cured (curing to reach a completely cured state).
　さらに、上記の実施形態では、貼り合わせの前後において、硬化処理部によりエネルギーを放射して接着剤を仮硬化させていた。但し、変位部の一端が凹状基板に対して薄状基板を押し付けていく実施形態において、変位部の一端の移動に合わせて、凹状基板と薄状基板が圧着された部位に向けて硬化処理部によりエネルギーを放射するようにしても良い。例えば、ＵＶランプの光を光ファイバーにより導き、光ファイバーの端面を凹状基板の全長に亘って直線状、又は点状に配置し、変位部の一端の移動に合わせて、凹状基板と薄状基板が圧着された部位に向けてＵＶを照射していく。そうすることによって、凹状基板と薄状基板が圧着されて貼り合わされた部位から徐々に仮硬化していくので、貼り合わせ後に硬化処理部によりエネルギーを放射して接着剤を仮硬化するよりも、仮硬化する時間を短縮することができ、薄状基板の凹状基板に対するズレも抑制できる。 Furthermore, in the above-described embodiment, the adhesive is temporarily cured by radiating energy from the curing unit before and after the bonding. However, in the embodiment in which one end of the displacement portion presses the thin substrate against the concave substrate, the curing processing unit is directed toward the portion where the concave substrate and the thin substrate are pressure bonded in accordance with the movement of one end of the displacement portion. May emit energy. For example, the light of the UV lamp is guided by an optical fiber, and the end face of the optical fiber is arranged in a straight line or a dotted shape over the entire length of the concave substrate, and the concave substrate and the thin substrate are crimped in accordance with the movement of one end of the displacement portion. The UV is irradiated toward the target site. By doing so, since the concave substrate and the thin substrate are gradually preliminarily cured from the bonded and bonded portion, rather than radiating energy by the curing treatment part after bonding, the adhesive is temporarily cured. The time for temporary curing can be shortened, and the displacement of the thin substrate with respect to the concave substrate can be suppressed.
（３）基板の貼り合わせは、真空中で行っても、大気中で行ってもよい。大気中で行う場合であっても、凹状基板の中央領域から側辺部へと向かって薄状基板を圧着していくことにより、気泡等の噛み込みを防止できる。たとえば、第１０の実施形態のようなブラシを用いた場合には、比較的広い範囲で平坦面が圧着するのではなく、凹状基板の中央部から外側に向かって、順次圧着させることができるので、気泡の防止に有効である。 (3) The substrates may be bonded in a vacuum or in the air. Even when the process is performed in the air, it is possible to prevent entrapment of bubbles and the like by pressing the thin substrate from the central region of the concave substrate toward the side portion. For example, when the brush as in the tenth embodiment is used, the flat surface is not crimped in a relatively wide range, but can be sequentially crimped from the center of the concave substrate toward the outside. , Effective in preventing air bubbles.
（４）貼り合せ対象となる基板は、カバーパネルやタッチパネルと液晶モジュール若しくは液晶モジュールを構成する表示パネルとバックライト等が、典型例である。しかし、一対の貼着対象となり得るものであれば、その大きさ、形状、材質等は問わない。たとえば、表示装置を構成する各種の部材等にも適用可能である。いずれの基板に接着剤を付着させるかは自由であり、基板の一方に接着剤を付着させる場合のみならず、双方に付着させる場合にも適用可能である。接着剤を用いずに、一方の基板を他方の基板に圧着させる場合にも適用可能である。 (4) The substrate to be bonded is typically a cover panel, a touch panel and a liquid crystal module, or a display panel and a backlight constituting the liquid crystal module. However, the size, shape, material, etc. are not limited as long as they can be a pair of objects to be attached. For example, the present invention can also be applied to various members constituting the display device. It is free to attach the adhesive to which substrate, and it is applicable not only when the adhesive is attached to one of the substrates but also when the adhesive is attached to both. The present invention is also applicable to the case where one substrate is pressure-bonded to the other substrate without using an adhesive.
（５）上記の実施形態のいずれを組み合わせてもよい。たとえば、第１１の実施形態は、上記の全ての実施形態と組み合わせ可能である。つまり、以上の各実施形態は、発明の範囲を限定することを意図したものではない。これらの実施形態は、発明の要旨の範囲内で、種々の省略、置き換え、変更、組み合わせを行うことができ、特許請求の範囲に記載された発明とその均等の範囲に含まれる。 (5) Any of the above embodiments may be combined. For example, the eleventh embodiment can be combined with all the above embodiments. In other words, the above embodiments are not intended to limit the scope of the invention. These embodiments can be variously omitted, replaced, changed, and combined within the scope of the gist of the invention, and are included in the invention described in the scope of claims and the equivalents thereof.
１…基板貼合装置
１５…ガイド機構
１５ａ…ガイド部材
２０…凹状基板
２０ａ…凹面
２０ｂ…側辺部
２０ｃ…凹面空間
２１…薄状基板
２１ｂ…側辺部
３…保持部
４…押圧機構
４１…中心ブロック
４２…分離ブロック
４２ａ…押圧曲面
４２ｂ、５０…硬化処理部
４２ｃ…吸引部
４４…ステージ
４５…レール
４６…スライド台
４７ａ…回転機
４７ｂ…ボールネジ
４８…回転軸
４９…回転機
５…ツメ部
５ａ…フランジ
９…真空チャンバ
１４１…押付部
１４２…変位部
１４２ａ…ローラ
１４２ｂ…軸支部
１４２ｃ…ブラシ
１４２ｘ、１４２ｙ、１４２ｚ…縁部
１４３…支持部
１４３ａ…軸部
１４３ｂ…基体部
Ｒ…接着剤
Ａ…第１の位置
Ｂ…第２の位置
Ｃ…第３の位置 DESCRIPTION OF SYMBOLS 1 ... Board | substrate bonding apparatus 15 ... Guide mechanism 15a ... Guide member 20 ... Concave substrate 20a ... Concave surface 20b ... Side part 20c ... Concave surface 21 ... Thin board | substrate 21b ... Side part 3 ... Holding part 4 ... Pressing mechanism 41 ... Central block 42 ... separation block 42a ... pressing curved surface 42b, 50 ... curing processing part 42c ... suction part 44 ... stage 45 ... rail 46 ... slide table 47a ... rotating machine 47b ... ball screw 48 ... rotating shaft 49 ... rotating machine 5 ... claw part 5a ... Flange 9 ... Vacuum chamber 141 ... Pushing part 142 ... Displacement part 142a ... Roller 142b ... Shaft support part 142c ... Brush 142x, 142y, 142z ... Edge part 143 ... Supporting part 143a ... Shaft part 143b ... Base part R ... Adhesive A ... 1st position B ... 2nd position C ... 3rd position

Claims (15)

  1. 　凹面を有する凹状基板と可撓性を有する薄状基板とを、接着剤を介して貼り合わせる基板貼合装置であって、
    　前記凹状基板の凹面に対して、前記薄状基板を押圧する押圧手段を有し、
    　前記押圧手段は、
    　前記凹状基板の凹面に前記薄状基板を押し付ける押付部と、
    　前記押付部の脇に位置し、前記押付部による前記凹状基板に対する前記薄状基板の押し付けとともに、前記凹状基板の凹面内に収まり、前記薄状基板を前記凹面に倣って圧着させるように変位する変位部と、
    　を有することを特徴とする基板貼合装置。     A substrate laminating apparatus for laminating a concave substrate having a concave surface and a flexible thin substrate via an adhesive,
    A pressing means for pressing the thin substrate against the concave surface of the concave substrate;
    The pressing means is
    A pressing portion that presses the thin substrate against the concave surface of the concave substrate;
    It is located beside the pressing portion, and the thin substrate is pressed against the concave substrate by the pressing portion, and is displaced so as to fit within the concave surface of the concave substrate and to press the thin substrate along the concave surface. A displacement part;
    The board | substrate bonding apparatus characterized by having.
  2. 　前記押付部は、中心ブロックであり、
    　前記変位部は、前記中心ブロックと接近及び離反可能な分離ブロックであり、
    　前記押圧手段は、
    　前記中心ブロックと前記分離ブロックが前記凹面よりも小さく縮まるまで、前記分離ブロックを前記中心ブロックに寄せて、前記薄状基板とともに当該凹面空間内に入り込ませ、
    　前記分離ブロックを前記凹面空間内で前記凹状基板の側辺部方向へ移動させることで、前記薄状基板を前記凹面に倣って押し拡げること、
    　を特徴とする請求項１記載の基板貼合装置。     The pressing portion is a center block,
    The displacement part is a separation block that can approach and leave the center block,
    The pressing means is
    Until the central block and the separation block are contracted to be smaller than the concave surface, the separation block is brought close to the central block so as to enter the concave space together with the thin substrate,
    Moving the separation block in the concave space toward the side of the concave substrate, thereby spreading the thin substrate along the concave surface;
    The board | substrate bonding apparatus of Claim 1 characterized by these.
  3. 　前記分離ブロックは、
    　前記凹状基板の前記側辺部が有する前記凹面の部分と概略同一形状の押圧曲面を該側辺部側に有すること、
    　を特徴とする請求項２記載の基板貼合装置。     The separation block is
    Having a pressing curved surface having substantially the same shape as the concave surface portion of the side portion of the concave substrate on the side portion side;
    The board | substrate bonding apparatus of Claim 2 characterized by these.
  4. 　前記変位部の少なくとも一部が、弾性部材により構成されていることを特徴とする請求項１記載の基板貼合装置。 The substrate bonding apparatus according to claim 1, wherein at least a part of the displacement portion is formed of an elastic member.
  5. 　前記押圧手段は、
    　前記分離ブロックを前記中心ブロックに寄せたときの全体形状に倣って前記薄状基板を予め曲げ成形するガイド手段を更に備え、
    　前記分離ブロックは、
    　前記曲げ成形後、前記凹状基板の前記側辺部方向へ移動すること、
    　を特徴とする請求項２記載の基板貼合装置。     The pressing means is
    Guide means for pre-bending the thin substrate following the overall shape when the separation block is brought close to the central block,
    The separation block is
    After the bending, moving toward the side of the concave substrate;
    The board | substrate bonding apparatus of Claim 2 characterized by these.
  6. 　前記ガイド手段は、
    　前記薄状基板の側辺端面に引っ掛かって外力を与えることで、前記薄状基板を予め前記曲げ成形するツメ部を含むこと、
    　を特徴とする請求項５記載の基板貼合装置。     The guide means includes
    Including a claw portion for bending the thin substrate in advance by hooking the side edge of the thin substrate and applying an external force;
    The board | substrate bonding apparatus of Claim 5 characterized by these.
  7. 　前記分離ブロックは、
    　前記ツメ部による前記曲げ成形の最中、前記凹状基板の前記側辺部と前記薄状基板を介して当接する位置よりも外側方の位置から、前記中心ブロックに寄った位置まで移動すること、
    　を特徴とする請求項６記載の基板貼合装置。     The separation block is
    During the bending by the claw portion, moving from a position outside the position contacting the side edge of the concave substrate via the thin substrate to a position close to the central block,
    The board | substrate bonding apparatus of Claim 6 characterized by these.
  8. 　前記ツメ部は、
    　外力を受けていない前記薄状基板の側辺端面を通り、前記分離ブロックの外形に沿って移動すること、
    　を特徴とする請求項７記載の基板貼合装置。     The claw portion is
    Moving along the outer edge of the separation block through the side edge surface of the thin substrate not receiving external force,
    The board | substrate bonding apparatus of Claim 7 characterized by these.
  9. 　前記ツメ部は、
    　外力を受けていない前記薄状基板の側辺端面と、前記中心ブロックに寄った前記分離ブロックの外形に沿って曲げ成形された後の前記薄状基板の側辺端面とを通る直線上を移動すること、
    　を特徴とする請求項８記載の基板貼合装置。     The claw portion is
    Moves on a straight line passing through the side edge surface of the thin substrate that is not subjected to external force and the side edge surface of the thin substrate after being bent along the outer shape of the separation block near the center block. To do,
    The board | substrate bonding apparatus of Claim 8 characterized by these.
  10. 　前記中心ブロックと前記分離ブロックとの全体形状に倣って曲げ成形された前記薄状基板を前記分離ブロックに吸着させる吸引手段を更に備えること、
    　を特徴とする請求項５記載の基板貼合装置。     Further comprising suction means for adsorbing the thin substrate bent to follow the overall shape of the central block and the separation block to the separation block;
    The board | substrate bonding apparatus of Claim 5 characterized by these.
  11. 　前記凹状基板及び前記薄状基板の少なくとも一方に塗布されている前記接着剤を、前記薄状基板を前記凹状基板に貼り合わせる前及び貼り合わせた後の少なくとも一方において、仮硬化させる硬化処理部を備えること、
    　を特徴とする請求項１記載の基板貼合装置。     A curing unit that temporarily cures the adhesive applied to at least one of the concave substrate and the thin substrate before and after the thin substrate is bonded to the concave substrate; Preparing,
    The board | substrate bonding apparatus of Claim 1 characterized by these.
  12. 　前記凹状基板及び前記薄状基板の少なくとも一方に塗布されている前記接着剤を、前記側辺部の貼り合わせ前及び前記側辺部の貼り合わせ後の少なくとも一方において、仮硬化させる硬化処理部を備えることを特徴とする請求項１記載の基板貼合装置。 A curing treatment unit that temporarily cures the adhesive applied to at least one of the concave substrate and the thin substrate, at least before bonding the side edges and after bonding the side edges; The board | substrate bonding apparatus of Claim 1 characterized by the above-mentioned.
  13. 　前記押圧手段は、前記変位部を支持する支持部を有し、
    　前記変位部は、一端を前記薄状基板に接触させながら、前記凹状基板の側辺部に向かって変位することにより、前記薄状基板を前記凹面に倣って圧着させ、
    　前記支持部は、前記変位部の他端を変位の支点として支持することを特徴とする請求項１記載の基板貼合装置。     The pressing means has a support part that supports the displacement part,
    The displacement part is displaced toward the side part of the concave substrate while bringing one end into contact with the thin substrate, thereby causing the thin substrate to be pressure-bonded following the concave surface,
    The board | substrate bonding apparatus of Claim 1 with which the said support part supports the other end of the said displacement part as a fulcrum of a displacement.
  14. 　前記変位部の一端は、前記凹状基板への前記薄状基板の圧着を維持するように、前記支点との間の距離が可変に設けられていることを特徴とする請求項１３記載の基板貼合装置。 The substrate sticking according to claim 13, wherein one end of the displacement portion is provided with a variable distance from the fulcrum so as to maintain pressure bonding of the thin substrate to the concave substrate. Combined device.
  15. 　凹面を有する凹状基板と可撓性を有する薄状基板とを、接着剤を介して貼り合わせる基板貼合方法であって、
    　押付部が、前記凹状基板の凹面に前記薄状基板を押し付け、
    　前記押付部の脇に位置する変位部が、前記押付部による前記凹状基板に対する前記薄状基板の押し付けとともに、前記凹状基板の凹面内に収まり、前記薄状基板を前記凹面に倣って圧着させるように変位することを特徴とする基板貼合方法。     A substrate laminating method for laminating a concave substrate having a concave surface and a flexible thin substrate via an adhesive,
    The pressing part presses the thin substrate against the concave surface of the concave substrate,
    A displacement portion located beside the pressing portion is placed in the concave surface of the concave substrate together with the pressing of the thin substrate against the concave substrate by the pressing portion, so that the thin substrate is pressure-bonded following the concave surface. The board | substrate bonding method characterized by displacing.
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TW201410103A (en) 2014-03-01
KR20150038449A (en) 2015-04-08
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