CN114261175A

CN114261175A - Attaching jig

Info

Publication number: CN114261175A
Application number: CN202111657044.8A
Authority: CN
Inventors: 彭长毅; 沈慧萍
Original assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; Yecheng Optoelectronics Wuxi Co Ltd; General Interface Solution Ltd
Current assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; Yecheng Optoelectronics Wuxi Co Ltd; General Interface Solution Ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-04-01

Abstract

The application relates to the technical field of display, and the embodiment of the application provides a laminating jig, and the laminating jig comprises a jig body and a laminating layer, and a to-be-laminated object is adsorbed on a bearing surface of the laminating jig by means of the laminating layer. Because the laminating comprises viscous material, utilizes viscous material's molecular adsorption power to adsorb and treats the laminating, not only can reduce the damage that the laminating was treated to the tool body, can also match the thing of treating that has similar surface, reduces the development cost of tool. Meanwhile, the fixture has higher tolerance on the manufacturing precision of the fixture body.

Description

Attaching jig

Technical Field

The application relates to a show technical field, especially relate to a laminating tool.

Background

In the related art, the object to be attached is usually fixed on the attaching jig, so that the object to be attached does not move due to external force during the attaching process, and the manufacturing precision of the attaching jig is highly required. If the manufacturing precision of the attaching jig does not reach a certain condition, the attaching jig can rub with the object to be attached in the attaching process, the surface of the object to be attached is easily damaged by the attaching jig, and then the object to be attached cannot be stably fixed on the attaching jig, so that poor attaching between the object to be attached and the film is caused.

Disclosure of Invention

Accordingly, there is a need to provide a bonding jig for reducing damage to a to-be-bonded object during a bonding process and improving a bonding yield.

The embodiment of the application provides a laminating tool for in the processing procedure of will treating laminating thing and film laminating, the laminating tool includes:

the jig comprises a jig body, a positioning device and a positioning device, wherein the jig body is provided with a bearing surface for bearing an object to be attached; and

the laminating layer, the laminating layer comprises stickness material, the laminating layer is located the loading end, stickness material's molecular adsorption can with treat that the laminating adsorbs on the loading end.

In one embodiment, the attaching layer has a first attaching surface and a second attaching surface which are oppositely arranged, the first attaching surface is attached to the carrying surface, and the second attaching surface is used for adsorbing the object to be attached;

and a plurality of sunken parts sunken towards the first attaching surface are arranged on the second attaching surface.

In one embodiment, the plurality of the concave parts are arranged in an array.

In one embodiment, the array comprises a honeycomb array, a rectangular array.

In one embodiment, an orthographic projection of the recess on the second abutting surface is circular.

In one embodiment, the diameter of the circle is 5 micrometers to 1 millimeter.

In one embodiment, the recess comprises a hemispherical structure.

In one embodiment, the laminating layer comprises polydimethylsiloxane and thermoplastic polyurethane elastomer rubber.

In one embodiment, the adhesive layer has a young's modulus of 1 mpa to 3 mpa and an adhesion in a range of 0.00005 mpa to 0.1 mpa.

In one embodiment, the attaching jig comprises an adhesive layer positioned between the attaching layer and the carrying surface;

the laminating layer is fixed on the bearing surface by means of the bonding layer.

In one embodiment, the jig body comprises a first bearing part and a second bearing part; the first bearing piece is provided with a first surface facing the adhesive layer, and the second bearing piece is provided with a second surface facing the adhesive layer;

a channel penetrating through the first surface is formed in the first bearing piece along the attaching direction, and the second bearing piece is movably arranged in the channel along the attaching direction;

the first bearing piece and the second bearing piece are in initial states, the first surface is arranged around the periphery of the second surface in a surrounding mode and used for providing fixing supporting force for the object to be attached, and the first surface and the second surface are spliced into a continuous bearing surface.

In one embodiment, an orthographic projection of the laminating layer towards the bearing surface covers the second surface; or

The orthographic projection of the laminating layer towards the bearing surface covers the first surface and the second surface.

In one embodiment, the centerline of the first surface coincides with the centerline of the second surface.

Among the above-mentioned laminating tool, the laminating tool includes tool body and laminating layer, treats that the laminating thing adsorbs on the loading end of laminating tool with the help of laminating layer. Because the laminating comprises viscous material, utilizes viscous material's molecular adsorption power to adsorb and treats the laminating, not only can reduce the damage that the laminating was treated to the tool body, can also match the thing of treating that has similar surface, reduces the development cost of tool. Meanwhile, the fixture has higher tolerance on the manufacturing precision of the fixture body.

Drawings

FIG. 1 is a schematic view illustrating a bonding structure using a bonding jig according to an embodiment of the related art;

FIG. 2 is a schematic view of a bonded optical lens and a polarizing film according to an embodiment of the related art;

FIG. 3 is a schematic diagram illustrating a degree of fit between an object to be bonded and a bonding jig according to an embodiment of the related art;

fig. 4 is a schematic structural view of a bonding jig according to an embodiment of the present application;

FIG. 5 is an enlarged partial view of a lamination layer according to an embodiment of the disclosure;

FIG. 6 is a schematic diagram of an arrangement of recesses according to an embodiment of the present application;

FIG. 7 is a schematic view of an arrangement of concave portions according to another embodiment of the present application;

fig. 8 is a schematic structural diagram of a jig body in an initial state according to an embodiment of the present application;

fig. 9 is a schematic structural view of a jig body in a jacking state according to an embodiment of the present application;

fig. 10 is a schematic structural view of a bonding jig according to an embodiment of the present application;

fig. 11 is a schematic structural view of a bonding jig according to still another embodiment of the present application;

fig. 12 is a schematic structural view of a bonding jig according to another embodiment of the present application;

fig. 13 is a schematic structural view of a bonding jig according to still another embodiment of the present application;

fig. 14 is a schematic structural view of a bonding jig according to still another embodiment of the present application;

fig. 15 is a schematic structural view of a bonding jig according to another embodiment of the present application; notation of elements for simplicity:

10: lens 20: polarizing film

30: jig tool

100: the jig body 101: bearing surface

110: the first carrier 111: first surface

111 a: first portion 111 b: the second part

112: channel

120: the second carrier 121: second surface

200: lamination layer 200 a: microporous film

200 b: adhesive film 210: first binding face

220: second adhesion surface 221: concave part

300: adhesive layer

d: diameter z: direction of application

S: center line p: projection

A: fold of

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth to provide a thorough understanding of embodiments of the present application. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. The embodiments of this application can be implemented in many different ways than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the invention and therefore the embodiments of this application are not limited to the specific embodiments disclosed below.

It is to be understood that the terms "first," "second," and the like as used herein may be used herein to describe various terms of art, and are not to be construed as indicating or implying relative importance or implicit ly indicating a number of technical features being indicated. However, these terms are not intended to be limiting unless specifically stated. These terms are only used to distinguish one term from another. For example, the first supporting member and the second supporting member are different supporting members, the first surface and the second surface are different surfaces, and the first attaching surface and the second attaching surface are different attaching surfaces without departing from the scope of the present application. In the description of the embodiments of the present application, "a plurality" or "a plurality" means at least two, e.g., two, three, etc., unless specifically defined otherwise.

In the description of the embodiments of the present application, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

In the description of the embodiments of the present application, unless otherwise explicitly specified or limited, a first feature "on" or "under" a second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely below the second feature, or may simply mean that the first feature is at a lesser level than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Fig. 1 is a schematic structural diagram illustrating a bonding process performed by a bonding jig according to an embodiment of the related art; fig. 2 is a schematic structural view illustrating a lens 10 bonded to a polarizing film 20 in an embodiment of the related art; for convenience of explanation, only portions related to the embodiments in the related art are shown.

In the process of attaching the film, the object to be attached can be attached to the film to meet the requirement of optical function. As shown in fig. 1, taking the object to be bonded as a lens 10 and the film as a polarizing film 20 as an example, a fixture 30 may be provided with a fixing structure such as a tenon structure conforming to the shape of the object to be bonded, after the lens 10 is fixed to the fixture 30 by the fixing structure, the fixture 30 is lifted up, and the lens 10 is bonded to the heated polarizing film 20 located above the lens 10.

The inventor of the present application has noticed that, because the hardness of the material of the jig 30 is higher than that of the object to be bonded, the bearing surface of the jig 30 may not be completely matched with the object to be bonded, and a part of the area of the object to be bonded may generate strong friction with the bearing surface of the jig 30, which is particularly serious when the bearing surface of the jig 30 has processing defects, and the friction may cause damages such as scratches, concave holes, and the like on the object to be bonded. When the accuracy of the carrying surface of the jig 30 does not meet a predetermined condition, the fixing function of the jig 30 is weakened, and the object to be bonded is displaced during the bonding process, in addition to the aforementioned damages such as scratches and concave holes. For example, if a portion of the area of the object to be bonded is bonded and the object to be bonded is displaced due to an external force during the bonding process, lines between the non-bonded area and the bonded area of the object to be bonded may be generated due to the random pulling of the film, and these lines may form wrinkles a as shown in fig. 2 due to the bending and overlapping of the film. In addition, when different objects to be bonded having micrometer level difference are bonded by using the same jig 30, the aforementioned wrinkle phenomenon may also occur due to the difference between the jig 30 and the different objects to be bonded. In order to reduce this phenomenon, there are high requirements for the processing precision of the jig 30 and the processing precision of the object to be bonded, and different objects to be bonded need to be matched with different jigs 30, resulting in high production cost.

FIG. 3 is a schematic diagram illustrating a simulation of a fit between an object to be attached and an attaching jig according to an embodiment of the related art; for convenience of explanation, only portions related to the embodiments in the related art are shown.

As shown in fig. 3, the left scale represents the size of the gap corresponding to different colors, the unit of the numerical value is mm, the positive numerical value represents the gap distance between the bearing surface of the jig 30 and the object to be bonded, the negative numerical value represents the area that the object to be bonded will contact first when the jig 30 is placed on the jig, and the larger the negative numerical value, the area contacts the jig 30 first, that is, the earlier the interference is performed. The different regions have different colors, which will follow as the size of the voids changes. The color change means that the color gradually transits from cold tone to warm tone as the gap is larger and larger. The color changes from a warm tone to a cool tone in a direction outward from the center of the article to be bonded. Four points are randomly selected from the center of the object to be bonded and the distance between the object to be bonded and the bearing surface of the jig 30 is +0.103mm, +0.094mm, +0.036mm and-0.128 mm. That is, the periphery of the object to be bonded is fixed by the jig 30 and has a good fit, and a gap of at least 0.1 mm is formed between the central position of the object to be bonded and the bearing surface of the jig 30. In the process, the central position of the object to be bonded is a main defect position.

In order to solve the above problems, in another embodiment of the related art, the object to be bonded is fixed on the carrying surface of the fixture 30 by disposing a double-sided adhesive tape, so as to improve the defective rate. Because the double faced adhesive tape has the risk of adhesive residue, when clearing the adhesive residue, can injure the surface of the object to be attached.

Based on the consideration, the inventor designs a fitting jig through intensive research, and the fitting jig reduces the damage to the fitting object in the fitting process by providing extra gripping force to the fitting object, and improves the fitting yield. The following describes the attaching jig provided in the embodiments of the present application in conjunction with the related descriptions of some embodiments.

The attaching jig disclosed in the embodiment of the present application can be used in a process of attaching an object to be attached to a film, and can also be used in other scenes where two objects to be attached are required to be attached together. The article to be bonded in the embodiment of the present application may be a transparent, non-transparent, asymmetrically curved or planar article, and the film in the embodiment of the present application may be a film such as an optical film, a composite film, a superconducting film, a polyester film, a nylon film, or a plastic film, which is not particularly limited in the embodiment of the present application.

Fig. 4 is a schematic structural diagram illustrating a bonding jig according to an embodiment of the present application; for convenience of explanation, only the portions related to the embodiments of the present application are shown.

Referring to fig. 4, an embodiment of the application provides a bonding jig for bonding an object to be bonded to a film. The bonding jig includes a jig body 100 and a bonding layer 200. The fixture body 100 has a carrying surface 101 for carrying an object to be attached. The laminating layer 200 is composed of an adhesive material, the laminating layer 200 is arranged on the bearing surface 101, and the molecular adsorption force of the adhesive material can adsorb an object to be laminated on the bearing surface 101.

From this, because the laminating layer 200 comprises the stickness material, utilizes the molecular adsorption power of stickness material to adsorb and treats the laminating, not only can reduce the damage that the laminating was treated to tool body 100, can also match the thing of treating that has similar surface and laminating, reduces the development cost of tool. Meanwhile, the manufacturing accuracy of the jig body 100 is more tolerant.

Fig. 5 is a schematic partial enlarged structural view of a lamination layer 200 in an embodiment of the present application; for convenience of explanation, only the portions related to the embodiments of the present application are shown.

In some embodiments, as shown in fig. 5 in combination with fig. 4, the conforming layer 200 has a first conforming surface 210 and a second conforming surface 220 disposed opposite to each other. The first attaching surface 210 is attached to the carrying surface 101, and the second attaching surface 220 is used for absorbing an object to be attached. The second bonding surface 220 is provided with a plurality of recesses 221 recessed toward the first bonding surface 210. Therefore, the second attaching surface 220 can form a structure similar to a suction cup, and the holding power of the attaching layer 200 to the object to be attached is further improved on the basis of the molecular adsorption power of the adhesive material. Of course, in other embodiments, the recess 221 may not be provided, and the grip force to be applied is generated only by the molecular adsorption force of the adhesive material, which may be selected according to the actual use situation, and this is not specifically limited in this application.

FIG. 6 is a schematic diagram illustrating an arrangement of the concave parts 221 according to an embodiment of the present application; FIG. 7 is a schematic diagram illustrating the arrangement of the concave parts 221 according to another embodiment of the present application; for convenience of explanation, only the portions related to the embodiments of the present application are shown.

In some embodiments, the plurality of concave portions 221 are arranged in an array to obtain a more uniform suction force to the object to be attached. In some embodiments, as shown in fig. 6, the plurality of recesses 221 may be arranged in a honeycomb array. In yet other embodiments, as shown in fig. 7, the plurality of concave portions 221 may be arranged in a rectangular array. Of course, the plurality of concave portions 221 may be regularly arranged in other forms, may also be irregularly arranged, and may be set according to actual use conditions, which is not specifically limited in this embodiment of the application.

In some embodiments, please refer to fig. 5, an orthographic projection of the recess 221 on the second abutting surface 220 is a circle. And in particular to some embodiments. The circular diameter d is 5 μm to 1 mm. In other embodiments, the recess 221 comprises a hemispherical structure. Thus, by some structural changes, the adsorption force required for use is obtained.

In some embodiments, conforming layer 200 includes polydimethylsiloxane and thermoplastic polyurethane elastomer rubber. In other embodiments, the conforming layer 200 further includes an epoxy, a hydrocarbon, and an isoprene polymer. Therefore, the polymer material with viscosity is used, and the gripping force of the to-be-attached object is generated by utilizing the molecular adsorption force of the viscous material.

Through further research by the present inventors, when the young's modulus of the adhesive layer 200 is too high, the viscosity characteristic of the adhesive layer 200 may be affected, and it is not possible to provide stable adsorption force to the object to be bonded, and when the young's modulus of the adhesive layer 200 is too low, the use requirements of the durability and the deformation resistance of the adhesive layer 200 may not be satisfied. Thus, in some embodiments, the young's modulus of the adhesive layer 200 is set to be 1 mpa to 3 mpa, and the adhesion of the adhesive layer 200 is set to be 0.00005 mpa to 0.1 mpa, so as to satisfy the usage requirements of durability and deformation resistance of the adhesive layer while providing the required absorption force. Specifically, in some embodiments, when the surface roughness of the to-be-bonded object is high, the young's modulus of the bonding layer 200 may be set to be 2 mpa to 3 mpa, and the adhesion of the bonding layer 200 may be in a range of 0.05 mpa to 0.1 mpa; when the surface roughness of the to-be-bonded object is low, the young's modulus of the bonding layer 200 may be set to be 1 mpa to 2 mpa, and the viscosity of the bonding layer 200 may be set to be 0.00005 mpa to 0.05 mpa. The young's coefficient and the viscosity range of the adhesive layer 200 may be set according to the surface roughness of the object to be adhered.

The following description will be made on the fabrication of the adhesive layer 200 in some embodiments by taking an example in which the adhesive layer 200 includes polydimethylsiloxane and thermoplastic polyurethane elastomer rubber, and the adhesive layer 200 is provided with the recesses 221 having a hemispherical structure and arranged in a rectangular array.

Firstly, a cylindrical array substrate can be manufactured by a photolithography process, wherein the illumination pattern is mainly a circular array, and the cylindrical array substrate is obtained after exposure and development. And secondly, baking the cylindrical array substrate, wherein the cylindrical array is made of photoresist material, and a hemispherical structure is formed due to the surface tension softened at high temperature, so that the hemispherical array substrate is obtained. The hemispherical array substrate is used as a master mold to perform a transfer printing process. In the transfer process, a liquid polymer material is poured, and after the polymer material is cured, demolding is performed to obtain a film with a micro-suction-cup structure, which is the attachment layer 200 provided in some embodiments of the present application. It should be noted that the polymer material may be the material in some embodiments, and the temperature and time are controlled during the transferring and demolding process, so as to obtain the adhesive layer 200 with young's modulus of 1 mpa to 3 mpa and viscosity ranging from 0.00005 mpa to 0.1 mpa. Of course, the attachment layer 200 in the embodiment of the present application can also be obtained by, for example, injection molding, and the embodiment of the present application is not particularly limited in this regard.

Fig. 8 is a schematic structural diagram of the jig body 100 in an initial state according to an embodiment of the present application; fig. 9 is a schematic structural diagram illustrating the jig body 100 in a jacking state according to an embodiment of the present application; for convenience of explanation, only the portions related to the embodiments of the present application are shown.

In some embodiments, referring to fig. 8 and 9 in combination with fig. 4, the jig body 100 includes a first bearing member 110 and a second bearing member 120. The first carrier 110 has a first surface 111 facing the adhesive layer 200, and the second carrier 120 has a second surface 121 facing the adhesive layer 200. The first supporting member 110 has a channel 112 penetrating through the first surface 111 along the attaching direction z, and the second supporting member 120 is movably disposed in the channel 112 along the attaching direction z (i.e., the up-down direction illustrated in fig. 4). In some embodiments, the channels 112 may be provided in the form of through holes. The first bearing member 110 and the second bearing member 120 have an initial state (as shown in fig. 8), the first surface 111 surrounds the periphery of the second surface 121, the first surface 111 is used for providing a fixing supporting force for an object to be attached, and the first surface 111 and the second surface 121 are spliced to form the continuous bearing surface 101. The first surface 111 and the second surface 121 may be in a flush state as shown in fig. 4, or may be connected together by a curved surface to form a structure as shown in fig. 8 and 9, and the curved surface may be formed by a periphery of the second surface 121, which may be selected according to practical situations, and the embodiment of the present application is not particularly limited thereto. The second carrier 120 can be driven by a driving device (not shown) to eject the member to be bonded along the bonding direction z, and at this time, the positional relationship between the second carrier 120 and the first carrier 110 is as shown in fig. 9. Specifically, in some embodiments, in order to realize the fixing and supporting function of the first surface 111 for the object to be attached, the first surface 111 includes a first portion 111a and a second portion 111b, the first portion 111a is located at the periphery of the object to be attached and can play a role in clamping and fixing the object to be attached, the second portion 111b is located below the object to be attached and plays a role in supporting the object to be attached, and the first portion 111a and the second portion 111b of the first surface 111 are connected through a smooth curved surface, so that the damage to the object to be attached is reduced. That is to say, a protrusion p protruding toward the adhesive layer 200 is formed on a peripheral edge of one side of the first carrier 110 facing the adhesive layer 200, and a receiving space capable of being clamped by the to-be-adhered object is defined, and an inner wall of the receiving space is the first surface 111. Of course, in other embodiments, other structural forms may also be used to clamp and fix the object to be attached, as long as the use requirement can be met, and this is not specifically limited in this application embodiment. In this way, by providing the first carrier 110 and the second carrier 120, the process of placing and ejecting the object to be attached can be realized.

In some embodiments, with continued reference to fig. 8 and 9 in conjunction with fig. 4, the centerline of the first surface 111 coincides with the centerline of the second surface 121. That is to say, the center line of the first surface 111 and the center line of the second surface 121 are both the center line S, so that the stress of the object to be attached is more uniform in the attaching and jacking processes, and a better attaching effect is obtained.

Fig. 10 is a schematic structural diagram illustrating a bonding jig according to an embodiment of the present application; fig. 11 is a schematic structural diagram illustrating a bonding jig according to still another embodiment of the present application; fig. 12 is a schematic structural diagram illustrating a bonding jig according to another embodiment of the present application; fig. 13 is a schematic structural diagram illustrating a bonding jig according to still another embodiment of the present application; fig. 14 is a schematic structural diagram illustrating a bonding jig according to still another embodiment of the present application; fig. 15 is a schematic structural diagram illustrating a bonding jig according to another embodiment of the present application; for convenience of explanation, only the portions related to the embodiments of the present application are shown.

In some embodiments, an orthographic projection of the conforming layer 200 toward the carrying surface 101 covers the first surface 111, or an orthographic projection of the conforming layer 200 toward the carrying surface 101 covers the first surface 111 and the second surface 121. That is, the adhesive layer 200 may be disposed on the second surface 121, or the adhesive layer 200 may be disposed on both the first surface 111 and the second surface 121. The adhesive layer 200 may be configured as a microporous film 200a or an adhesive film 200 b. It should be noted that "microporous film 200 a" refers to the adhesive layer 200 including the recess 221 in some embodiments, and "adhesive film 200 b" refers to the adhesive layer 200 made of adhesive material in some embodiments. The first surface 111 may be provided with the microporous film 200a, the adhesive film 200b, or no film. The second surface 121 may be provided with either a microporous film 200a or an adhesive film 200 b. For example, fig. 10 illustrates a case where the microporous film 200a is disposed on the first surface 111 and the second surface 121, fig. 11 illustrates a case where the first surface 111 is not provided with a film and the microporous film 200a is disposed on the second surface 121, fig. 12 illustrates a case where the adhesive film 200b is disposed on the first surface 111 and the microporous film 200a is disposed on the second surface 121, fig. 13 illustrates a case where the microporous film 200a is disposed on the first surface 111 and the adhesive film 200b is disposed on the second surface 121, fig. 14 illustrates a case where the adhesive film 200b is disposed on the first surface 111 and the second surface 121, and fig. 15 illustrates a case where the adhesive film 200b is disposed on the second surface 121 without a film on the first surface 111. The setting may be performed according to the use situation, and this is not particularly limited in the embodiment of the present application.

To sum up, among the laminating tool that this application embodiment provided, through set up laminating layer 200 on the loading face 101 at tool body 100, provide extra adsorption affinity and grasp and wait to laminate, when placing and wait to laminate and carry out the laminating process, can reduce the tool and treat the damage of laminating, have higher tolerance to the tool and the precision of waiting to laminate, can be applicable to the laminating of treating of multiple different surfaces, reduction in production cost.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a bonding tool for in the processing procedure of will treating laminating thing and film laminating, its characterized in that, bonding tool includes:

2. The attaching jig according to claim 1, wherein the attaching layer has a first attaching surface and a second attaching surface which are oppositely arranged, the first attaching surface is attached to the carrying surface, and the second attaching surface is used for adsorbing the object to be attached;

3. The attaching jig according to claim 2, wherein the plurality of concave portions are arranged in an array.

4. The bonding jig of claim 3, wherein the array comprises a honeycomb array or a rectangular array.

5. The attaching jig according to claim 2, wherein an orthographic projection of the recess on the second attaching surface is circular.

6. The attaching jig according to claim 5, wherein the diameter of the circle is 5 μm to 1 mm.

7. The bonding jig according to claim 2, wherein the recess comprises a hemispherical structure.

8. The bonding jig of any one of claims 1-7, wherein the bonding layer comprises polydimethylsiloxane and thermoplastic polyurethane elastomer rubber.

9. The bonding jig according to any one of claims 1 to 7, wherein the adhesive layer has a Young's modulus of 1 MPa to 3 MPa, and an adhesion range of 0.00005 MPa to 0.1 MPa.

10. The bonding jig of any one of claims 1-7, wherein the bonding jig comprises an adhesive layer between the bonding layer and the carrying surface;

11. The attaching jig according to any one of claims 1 to 7, wherein the jig body includes a first bearing member and a second bearing member; the first bearing piece is provided with a first surface facing the adhesive layer, and the second bearing piece is provided with a second surface facing the adhesive layer;

12. The bonding jig according to claim 11, wherein an orthographic projection of the bonding layer towards the bearing surface covers the second surface; or

13. The attaching jig according to claim 11, wherein a center line of the first surface coincides with a center line of the second surface.