CN114261133B - Flexible plate stamping mechanism and electronic equipment - Google Patents
Flexible plate stamping mechanism and electronic equipment Download PDFInfo
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- CN114261133B CN114261133B CN202111435964.5A CN202111435964A CN114261133B CN 114261133 B CN114261133 B CN 114261133B CN 202111435964 A CN202111435964 A CN 202111435964A CN 114261133 B CN114261133 B CN 114261133B
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- 238000004080 punching Methods 0.000 claims abstract description 69
- 238000005452 bending Methods 0.000 claims abstract description 32
- 238000005096 rolling process Methods 0.000 claims description 41
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 230000003028 elevating effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000003825 pressing Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Abstract
The invention discloses a flexible board stamping mechanism and electronic equipment, wherein the flexible board stamping mechanism comprises a base, a lifting table and a stamping device; the base is provided with a stamping groove for placing the flexible board and the electronic device stacked on the flexible board, and the side wall of the stamping groove is provided with a stamping part capable of stamping the patch of the flexible board upwards into a vertical patch; the lifting table can lift relative to the punching groove; the stamping device is arranged on the lifting table and used for bending and stamping the vertical patch onto the electronic device. The flexible board stamping mechanism can reduce the labor intensity of workers, reduce the manual labor force and improve the production efficiency of the electronic device when the flexible board and the electronic device are assembled.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to a flexible board stamping mechanism and electronic equipment.
Background
In an electronic device, a flexible board (for example, an FPCB board for shielding external electromagnetic interference, or other flexible board structure for protecting or fixing the electronic device) is generally assembled on the electronic device. Such flexible boards generally have a body and a patch disposed on a periphery of the body. When the electronic device is assembled, the flexible board is firstly arranged on the bottom surface of the electronic device, so that the patches on the periphery of the flexible board extend out from the lateral direction of the electronic device; then, the patch on the periphery of the flexible board is manually bent upwards to be attached to the periphery of the electronic device. However, this manual assembly method requires a lot of labor force, and has low production efficiency, which is not beneficial to improving production efficiency.
Disclosure of Invention
The invention mainly aims to provide a flexible board stamping mechanism, which aims to reduce the labor intensity of workers, reduce the manual labor force and improve the production efficiency of an electronic device.
In order to achieve the above object, the present invention provides a flexible board stamping mechanism, which includes a base, a lifting table and a stamping device; the base is provided with a stamping groove for placing the flexible board and the electronic device stacked on the flexible board, and the side wall of the stamping groove is provided with a stamping part capable of stamping the patch of the flexible board upwards into a vertical patch; the lifting table can lift relative to the punching groove; the stamping device is arranged on the lifting table and used for bending and stamping the vertical patch onto the electronic device.
Optionally, the stamping device includes a stamping assembly, the stamping assembly includes a stamping driver and a stamping knife, the stamping driver is connected with the stamping knife, so as to drive the stamping knife to move along an inner and outer direction, and the vertical patch is bent towards the inner side and attached to the step part of the portion to be attached of the electronic device.
Optionally, the stamping knife comprises a lower knife face and a front knife face; the lower knife surface is used for stamping a part of the vertical patch into a first attaching part attached to the transverse step surface of the step part; the front cutter surface is positioned at the front end of the lower cutter surface and is used for stamping the part, connected with the first attaching part, of the vertical patch into a second attaching part attached to the vertical step surface of the step part.
Optionally, the stamping device further includes a rolling assembly, the rolling assembly includes a rolling driver and a rolling member, the rolling driver is connected with the rolling member to drive the rolling member to move along an inner and outer direction, and the end portion of the vertical patch is stamped into a third attaching portion attached to the top surface of the electronic device.
Optionally, the rolling piece is configured as a roller; the stamping knife is also provided with an upper knife face positioned above the lower knife face, and the upper knife face is used for supporting the roller to roll.
Optionally, the rolling driver comprises a cylinder, a push rod connected with the cylinder and driven by the cylinder to move along the inner and outer directions, and a swing rod hinged with the inner end of the push rod and capable of swinging up and down; the roller is connected with the swing rod.
Optionally, a plurality of patches are arranged on the periphery of the flexible board; the lifting table is provided with a plurality of stamping devices, and the stamping devices are respectively in one-to-one correspondence with the stamping parts so as to be matched with the stamping of the patches.
Optionally, a positioning shaft is further disposed on the lower surface of the lifting platform, and the positioning shaft is located above the punching groove and is used for pressing and positioning the electronic device in the punching groove.
Optionally, the flexible board stamping mechanism further comprises a picking and placing device, and the picking and placing device is used for stamping the flexible board and the electronic device stacked on the flexible board into the stamping groove and taking out the flexible board and the electronic device stacked on the flexible board after stamping is finished.
The invention further provides electronic equipment, which comprises an electronic device and a flexible board, wherein the flexible board is bent and stamped on the electronic device by adopting a flexible board stamping mechanism. The flexible board stamping mechanism comprises a base, a lifting table and a stamping device; the base is provided with a stamping groove for placing the flexible board and the electronic device stacked on the flexible board, and the side wall of the stamping groove is provided with a stamping part capable of stamping the patch of the flexible board upwards into a vertical patch; the lifting table can lift relative to the punching groove; the stamping device is arranged on the lifting table and used for bending the vertical patch to the upper side and stamping the vertical patch onto the electronic device.
The technical scheme of the invention provides a flexible board stamping mechanism for assembling a flexible board and an electronic device, which comprises a base, a lifting table and a stamping device; the base is provided with a stamping groove for placing the flexible board and the electronic device stacked on the flexible board, and the side wall of the stamping groove is provided with a stamping part capable of stamping the patch of the flexible board upwards into a vertical patch; the lifting table can be lifted relative to the punching groove; the stamping device is arranged on the lifting table and is used for bending the vertical patch towards the upper side and stamping the vertical patch onto the electronic device, so that the flexible board can be assembled onto the electronic device by using the flexible board stamping mechanism, the labor intensity of workers is reduced, the labor force is reduced, and the production efficiency of the electronic device is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a conventional electronic device and a flexible board prior to assembly;
FIG. 2 is a schematic diagram of the electronic device and the flexible board of FIG. 1 from another perspective;
FIG. 3 is a schematic diagram of the electronic device and the flexible board of FIG. 1 assembled;
FIG. 4 is a schematic diagram of a flexible board stamping mechanism according to an embodiment of the present invention;
FIG. 5 is an enlarged view of the portion P 1 of FIG. 4;
FIG. 6 is a schematic view of a flexible board stamping mechanism of the present invention placing a flexible board and an electronic device stacked on the flexible board on a stamping slot of a base;
FIG. 7 is a schematic view of the base of FIG. 6;
FIG. 8 is an enlarged view of the portion P 2 of FIG. 7;
FIG. 9 is an assembled view of the lift table and stamping apparatus of FIG. 6;
FIG. 10 is a schematic view of the structure of the single stamping device of FIG. 9;
FIG. 11 is an enlarged view of the portion P 3 of FIG. 10;
FIG. 12 is a schematic view of the flexible board stamping mechanism of the present invention after the flexible board and the electronic device are assembled and removed from the stamping slot of the base;
FIG. 13 is a schematic view of the flexible board and the electronic device of FIG. 12 after assembly;
FIG. 14 is a cross-sectional view taken along line A-A of FIG. 13;
FIG. 15-A is a schematic view of a flexible board stamping mechanism of the present invention prior to a first bending of the flexible board;
FIG. 15-B is a schematic view of the flexible board stamping mechanism of the present invention after a first bending of the flexible board;
FIG. 16-A is a schematic view of a flexible board stamping mechanism of the present invention prior to a second bending of the flexible board;
FIG. 16-B is a schematic view of the flexible board stamping mechanism of the present invention after a second bending of the flexible board;
FIG. 17-A is a schematic diagram of a flexible board stamping mechanism of the present invention before a third bending of the flexible board;
Fig. 17-B is a schematic diagram of the flexible board stamping mechanism after the flexible board is bent for the third time.
Reference numerals illustrate:
| Reference numerals | Name of the name | Reference numerals | Name of the name |
| 100 | Base seat | 3211 | Cylinder |
| 110 | Punching groove | 3212 | Push rod |
| 111 | Bottom wall | 3213 | Swing rod |
| 112 | Peripheral wall | 322 | Rolling piece/roller |
| 112a | Stamping part | 400 | Electronic device |
| 112b | Groove | 410 | Bottom surface |
| 200 | Lifting table | 420 | Top surface |
| 210 | Fixing frame | 430 | Circumferential surface |
| 220 | Positioning shaft | 440 | Step part |
| 221 | Positioning support leg | 441 | Lateral step surface |
| 300 | Stamping device | 442 | Vertical step surface |
| 310 | Stamping assembly | 500 | Flexible board |
| 311 | Stamping driver | 510 | Body |
| 312 | Stamping knife | 520 | Patch |
| 312a | Lower knife surface | 520’ | Vertical paster |
| 312b | Rake face | 521 | Base part |
| 312c | Upper knife surface | 522 | A first attaching part |
| 320 | Rolling assembly | 523 | A second attaching part |
| 321 | Rolling driver | 524 | Third attaching part |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1 and 2, in the related art, an electronic device generally assembles a flexible board 500 on an electronic device 400, and the flexible board 500 may be a FPCB board for shielding external electromagnetic interference, or other flexible board structures for protecting or fixing the electronic device. Such a flexible board 500 generally has a body 510 and a patch 520 provided on the periphery of the body 510. When assembling, an operator is required to place the flexible board 500 on the bottom surface 410 of the electronic device 400, so that the patch 520 of the flexible board 500 extends laterally from the bottom surface 410 of the electronic device 400; then, the patch 520 of the flexible board 500 is manually folded upwards and attached to the periphery of the electronic device 400 (as shown in fig. 3), so that the flexible board 500 is fixedly connected to the electronic device 400. However, this manual assembly method requires a lot of labor force, and has low production efficiency, which is not beneficial to improving production efficiency.
In view of the above, the present invention provides a flexible board stamping mechanism for assembling a flexible board 500 onto an electronic device 400, so as to realize automation of assembling the flexible board 500 and the electronic device 400, thereby reducing labor intensity of workers, reducing manpower, and improving production efficiency of the electronic device 400.
Referring to fig. 4 to 6, in an embodiment of the flexible board stamping mechanism of the present invention, the flexible board stamping mechanism includes a base 100, a lifting table 200 and a stamping device 300; wherein, the base 100 is provided with a punching slot 110 for placing the flexible board 500 and the electronic device 400 stacked on the flexible board 500, and a punching part 112a (as shown in fig. 7 and 8) for punching the patch 520 of the flexible board 500 upwards into a vertical patch 520' is arranged on the side wall of the punching slot 110; the lifting table 200 is liftably provided above the punching groove 110; the stamping device 300 is mounted on the lift table 200 for bending and stamping the vertical patch 520' onto the circumference of the electronic device 400.
Specifically, the base 100 is cylindrically designed; the top of the base 100 is provided with a punching groove 110, and the punching groove 110 is opened upward. The stamping groove 110 may be a circular groove, a square groove, or an irregular groove, which may be designed according to the shape and structure of the electronic device 400. In the present embodiment, the punching groove 110 is designed as a circular groove, and the punching groove 110 has a bottom wall 111 and a circumferential wall 112 provided along the circumference of the bottom wall 111; wherein, a plurality of grooves 112b are provided on the circumferential wall 112 of the punching groove 110, and one punching portion 112a is formed between two adjacent grooves 112 b. The lifting table 200 is disposed above the punching slot 110, and the lifting table 200 can be lifted or lowered relative to the punching slot 110, so as to adjust the distance between the lifting table 200 and the punching slot 110, thereby driving the punching device 300 to approach or separate from the punching slot 110.
When the flexible board 500 and the electronic device 400 are assembled by using the flexible board stamping mechanism, the stamping part 112a on the peripheral wall 112 of the stamping groove 110 on the base 100 is used for first bending the patch 520 of the flexible board 500, so that the patch 520 of the flexible board 500 is bent upwards to form a vertical patch 520' (as shown in fig. 15-a and 15-B) around the periphery of the electronic device 400; then, the vertical patch 520' is bent along the radial direction of the electronic device 400 by using the stamping device 300 and stamped on the circumference of the electronic device 400 (as shown in fig. 16-a to 17-B), so that the flexible board 500 and the electronic device 400 can be assembled.
Referring to fig. 15-a and 15-B, when the flexible board stamping mechanism performs first bending on the patch 520 of the flexible board 500, the flexible board 500 and the electronic device 400 stacked on the flexible board 500 are stamped into the stamping slot 110, during this process, the patch 520 on the periphery of the flexible board 500 is correspondingly abutted against the stamping portion 112a on the periphery of the stamping slot 110, and the patch 520 is abutted against by the stamping portion 112a and cannot be stamped into the stamping slot 110 along with the flexible board 500, but is bent upward by the stamping portion 112a until the flexible board 500 and the electronic device 400 stacked on the flexible board 500 are stamped into the slot bottom of the stamping slot 110, and the patch 520 of the flexible board 500 is bent into a vertical patch 520' extending vertically.
It will be appreciated that, during the first bending process, the operation of stamping the flexible board 500 and the electronic device 400 stacked on the flexible board 500 into the stamping slot 110 may be performed mechanically, for example, a pick-and-place device (described in detail later) is configured in the flexible board stamping mechanism, and the flexible board 500 and the electronic device 400 stacked on the flexible board 500 are stamped into the stamping slot 110 by using the pick-and-place device, so that the patch 520 of the flexible board 500 is bent into the vertical patch 520' by the stamping portion 112a of the stamping slot 110, thereby fully automating the flexible board stamping mechanism. Of course, in other embodiments, the operation of stamping the flexible board 500 and the electronic device 400 stacked on the flexible board 500 into the stamping slot 110 may also be performed by an operator, that is, by manually pressing the flexible board 500 and the electronic device 400 stacked on the flexible board 500 into the stamping slot 110, so that the patch 520 of the flexible board 500 is bent into the vertical patch 520' by the stamping portion 112a of the stamping slot 110, thereby realizing the semi-automation of the flexible board stamping mechanism.
After the first bending of the patch 520 of the flexible board 500 by the above-mentioned flexible board punching mechanism, the patch 520 of the flexible board 500 is bent into a vertical patch 520 'around the circumference of the electronic device 400, the vertical patch 520' having a base 521 connected to the body 510 of the flexible board 500 and a portion to be bent extending upward from the base 521; wherein, the base 521 is attached to the peripheral surface 430 of the electronic device 400 adjacent to the bottom surface 410 thereof. After the first bending, the portion to be bent of the vertical patch 520' is bent along the radial direction of the electronic device 400 by using the stamping device 300 and stamped on the circumference of the electronic device 400, so that the flexible board 500 and the electronic device 400 can be assembled.
The technical scheme of the invention provides a flexible board stamping mechanism for assembling a flexible board 500 and an electronic device 400, wherein the flexible board stamping mechanism comprises a base 100, a lifting table 200 and a stamping device 300; wherein, the base 100 is provided with a punching groove 110 for placing the flexible board 500 and the electronic device 400 stacked on the flexible board 500, and the peripheral wall 112 of the punching groove 110 is provided with a punching part 112a capable of punching the patch 520 of the flexible board 500 upwards into a vertical patch 520'; the lifting table 200 is liftably provided above the punching groove 110; the stamping device 300 is mounted on the lifting platform 200, so as to bend the vertical patch 520' towards the upper side and stamp the vertical patch onto the periphery of the electronic device 400, and therefore the flexible board 500 can be automatically assembled onto the electronic device 400 by using the flexible board stamping mechanism (see the description above for specific assembly process), so that assembly automation is realized, manual labor force is reduced, and production efficiency of the electronic device 400 is improved.
As described above, after the flexible board stamping mechanism performs the first bending on the patch 520 of the flexible board 500, the portion to be bent of the vertical patch 520 'of the flexible board 500 needs to be bent onto the circumference of the electronic device 400 and attached to the same, so that the stamping device 300 needs to bend and stamp the portion to be bent of the vertical patch 520' according to the shape and structure of the circumference of the electronic device 400. Therefore, the specific structure and the stamping manner of the stamping device 300 can be reasonably designed in combination with the shape structure of the periphery of the electronic device 400.
Referring to fig. 9, 10 and 15-a, in an embodiment, the stamping device 300 includes a stamping assembly 310, the stamping assembly 310 includes a stamping driver 311 and a stamping knife 312, the stamping driver 311 is connected with the stamping knife 312 to drive the stamping knife 312 to move in an inward and outward direction, and the vertical patch 520' is bent inward and attached to a step 440 around the electronic device 400.
Specifically, the ram driver 311 may be a cylinder. The electronic device 400 has a bottom surface 410, a top surface 420, and a step 440 between the circumferences of the bottom surface 410 and the top surface 420; the step 440 of the electronic device 400 is located above the circumferential surface 430. After the punching portion 112a of the flexible board punching mechanism performs the first bending on the patch 520 of the flexible board 500, the punching assembly 310 may perform the second bending on the patch 520 of the flexible board 500.
Referring to fig. 6, 16-a and 16-B, after the first bending, the lifting platform 200 is driven to drive the stamping device 300 to descend to a predetermined stamping position, so that the stamping component 310 of the stamping device 300, the portion to be stamped of the vertical patch 520', and the step 440 of the electronic device 400 are substantially in the same linear direction; then, the punching blade 312 is driven by the punching driver 311 to advance toward the step 440 of the electronic device 400, so that the punching blade 312 punches the portion to be punched of the vertical patch 520 'onto the step 440 of the electronic device 400, thereby bending and fitting the portion to be punched of the vertical patch 520' onto the step 440.
Further, the stepped portion 440 includes a lateral step surface 441 and a vertical step surface 442 (shown in fig. 16-a) connecting the lateral step surface 441 and the top surface 420. The stamping knife 312 includes a lower knife face 312a and a front knife face 312B (as shown in fig. 11 and 16-B); wherein, the lower blade surface 312a is used for stamping a part of the vertical patch 520' into a first attaching portion 522 attached to the lateral step surface 441 of the step portion 440; the rake surface 312b is located at the front end of the lower rake surface 312a for punching out the portion of the vertical patch 520' connected to the first fitting portion 522 into the second fitting portion 523 fitted to the vertical step surface 442 of the step portion 440.
Specifically, the outer peripheral edge of the lateral step surface 441 of the step 440 engages with the upper peripheral edge of the circumferential surface 430; the lower periphery of the vertical step surface 442 of the step portion 440 is engaged with the inner periphery of the horizontal step surface 441, and the upper periphery of the vertical step surface 442 is engaged with the top surface 420 of the electronic device 400. The front end surface of the punching cutter 312 is concavely provided with a limit groove penetrating up and down, and the bottom surface of the limit groove forms a front cutter surface 312b of the punching cutter 312.
When the punching driver 311 drives the punching blade 312 to advance towards the step 440 of the electronic device 400, the punching blade 312 contacts the portion to be punched of the vertical patch 520', and the portion to be punched of the vertical patch 520' is limited in the limit groove of the punching blade 312, so that the portion to be punched of the vertical patch 520 'is not easy to be misplaced with the punching blade 312 when the punching blade 312 continues to advance for punching, and the punching blade 312 is ensured to accurately punch the portion to be punched of the vertical patch 520' onto the step 440 of the electronic device 400; in this process, the lower blade surface 312a of the punching blade 312 punches a portion of the vertical patch 520 'into a first fitted portion 522 fitted to the lateral step surface 441, the outer peripheral edge of the first fitted portion 522 being adjacent to the base 521 of the vertical patch 520'; at the same time, the punched rake face 312b punches the portion of the vertical patch 520' connected to the first bonding portion 522 into the second bonding portion 523 bonded to the vertical step face 442. In this way, the patch 520 of the flexible board 500 can be fully contacted and matched with each step surface of the step portion 440 of the electronic device 400, so as to improve the firmness of connection assembly of the two.
Referring to fig. 16-B, in an embodiment, after the second bending of the patch 520 of the flexible board 500 is completed, the vertical patch 520' further has an end portion extending upward from the second attaching portion 523, so that the end portion may be further bent for a third time by the stamping device 300 to stamp the end portion onto the top surface 420 of the electronic device 400, so as to increase the surface area of the fitting assembly of the patch 520 of the flexible board 500 and the electronic device 400, and further improve the connection and assembly firmness of the two.
Referring to fig. 9 to 11, in this embodiment, the stamping device 300 further includes a rolling assembly 320, where the rolling assembly 320 includes a rolling driver 321 and a rolling member 322, and the rolling driver 321 is connected to the rolling member 322 to drive the rolling member 322 to move inward and outward, so as to stamp the end portion of the vertical patch 520' into a third fitting portion 524 that is fitted to the top surface 420.
17-A and 17-B, specifically, after the patch 520 of the flexible board 500 is bent for the second time, the rolling assembly 320 of the stamping device 300 is substantially aligned with the end portion of the vertical patch 520' and the top surface 420 of the electronic device 400; then, the rolling member 322 is driven by the rolling driver 321 to advance toward the top surface 420 of the electronic device 400, so that the rolling member 322 attaches the end portion of the vertical patch 520' to the top surface 420 of the electronic device 400, thereby forming a third attaching portion 524 attached to the top surface 420, and the third bending of the patch 520 of the flexible board 500 is sequentially performed, so that the whole patch 520 of the flexible board 500 is completely bent and attached to the circumference of the electronic device 400. After the assembly, the patch 520 of the flexible board 500 has a base 521, a first bonding portion 522, a second bonding portion 523, and a third bonding portion 524 that are sequentially bonded to the electronic device 400 in the up-down direction (as shown in fig. 13 and 14).
After the flexible board 500 is bent for the third time by the flexible board stamping mechanism, the flexible board 500 and the electronic device 400 are assembled, and at this time, the rolling piece 322 is driven by the rolling driver 321 and then is retracted to the initial position; then, the punching driver 311 drives the punching cutter 312 to retract to the initial position; then, the lifting platform 200 is driven to lift the stamping device 300 away from the base 100, so that the assembled flexible board 500 and the electronic device 400 in the stamping slot 110 of the base 100 are exposed (as shown in fig. 12), and finally the assembled flexible board 500 and the electronic device 400 are taken out from the stamping slot 110.
Referring to fig. 10, 11 and 17-a, for the rolling member 322, the rolling member 322 may be a roller or a roller 322, or a hob. In the present embodiment, the rolling piece 322 is provided as a roller 322. To facilitate rolling of the roller 322, the punch blade 312 optionally also has an upper blade surface 312c above its lower blade surface 312a, the upper blade surface 312c for supporting the roller 322 for rolling. After the second bending of the flexible board 500 is completed, the punching blade 312 is held on the step portion 440 of the electronic device 400, and the upper blade surface 312c of the punching blade 312 is substantially flush with the top surface 420 of the electronic device 400; thus, in completing the third bending of the flexible board 500, the rolling driver 321 may drive the roller 322 to roll along the upper blade surface 312c of the punching blade 312 to the top surface 420 of the electronic device 400, thereby attaching the end portion of the vertical patch 520' to the top surface 420 of the electronic device 400 to form the third attaching portion 524.
It is contemplated herein that after the second bending of the patch 520 of the flexible board 500, the upper blade surface 312c of the stamping blade 312 may not be horizontal or may have a slight drop from the top surface 420 of the electronic device 400, thereby requiring fine tuning of the position of the roll assembly 320 to facilitate entry of the roller 322 into the top surface 420 of the electronic device 400. Based on this, the rolling driver 321 optionally includes a cylinder 3211, a push rod 3212 connected to the cylinder 3211 to be driven by the cylinder 3211 to move in the inside-outside direction, and a swing link 3213 hinged to the inner end of the push rod 3212 to be swingable up and down; the roller 322 is connected with a swing rod 3213.
Specifically, when the flexible board 500 is bent for the third time, the air cylinder 3211 drives the push rod 3212 to advance from outside to inside, so that the push rod 3212 drives the swing rod 3213 to advance synchronously, and the swing rod 3213 pushes the roller 322 to roll forward, so that the end portion of the vertical patch 520' of the flexible board 500 is pushed onto the top surface 420 of the electronic device 400. In this process, when the upper blade surface 312c of the punching blade 312 is not horizontal, or has a small drop with the top surface 420 of the electronic device 400, the roller 322 may be finely adjusted to the up-down position under the swinging action of the swinging rod 3213, so that the roller 322 adapts to the inclination of the upper blade surface 312c of the punching blade 312, or the upper blade surface 312c of the punching blade 312 has a small drop with the top surface 420 of the electronic device 400, so as to ensure that the roller 322 may roll reciprocally between the upper blade surface 312c of the punching blade 312 and the top surface 420 of the electronic device 400.
Referring to fig. 4 and 9, according to any of the above embodiments, a plurality of patches 520 are disposed on the periphery of the flexible board 500; accordingly, the lifting platform 200 is provided with a plurality of pressing devices 300, and the plurality of pressing devices 300 are respectively in one-to-one correspondence with the plurality of pressing portions 112a so as to match with and press the plurality of patches 520.
Specifically, the periphery of the stamping groove 110 of the base 100 is provided with a plurality of stamping parts 112a, and the stamping parts 112a are arranged at intervals; the lifting platform 200 is provided with a plurality of fixing frames 210, and each fixing frame 210 is correspondingly provided with a stamping device 300. The stamping devices 300 on the plurality of fixing frames 210 are respectively in one-to-one correspondence with the plurality of stamping portions 112a, so that each stamping device 300 and the stamping portion 112a corresponding thereto are combined into a component for bending the same patch 520 of the flexible board 500. The plurality of pressing devices 300 may press the patch 520 of the flexible board 500 in synchronization with each other, and the plurality of pressing devices 300 press the patch 520 of the flexible board 500 in a bending manner independently of each other, which is not limited herein.
Referring to fig. 4,5 and 9, in an embodiment, a positioning shaft 220 is further disposed on the lower surface of the lifting platform 200, and the positioning shaft 220 is located above the punching slot 110 for pressing and positioning the electronic device 400 in the punching slot 110.
Specifically, the positioning shaft 220 protrudes downward from the lower surface of the elevating platform 200, and a plurality of positioning legs 221 are provided at the lower end of the positioning shaft 220, and the plurality of positioning legs 221 are arranged at intervals along the same circumference. When the elevating table 200 is lowered to a predetermined punching position, the plurality of positioning legs 221 of the positioning shaft 220 are pressed against the stepped portion 440 of the electronic device 400, and each positioning leg 221 is located between two adjacent patches 520 of the flexible board 500, thereby positioning the flexible board 500 and the electronic device 400 in the punching groove 110 without interfering with the bending operation of the flexible board 500 on the patches 520 by the punching device 300.
Based on any of the above embodiments, the flexible board stamping mechanism further includes a pick-and-place device (not shown in the drawings) for stamping the flexible board 500 and the electronic device 400 stacked on the flexible board 500 into the stamping slot 110, and taking out the flexible board after the stamping is completed. When the stamping part 112a of the flexible board stamping mechanism is used for first bending the patch 520 of the flexible board 500, the flexible board 500 and the electronic device 400 stacked on the flexible board 500 are stamped into the stamping groove 110 by using the pick-and-place device, so that the patch 520 of the flexible board 500 is stamped into the vertical patch 520' by the stamping part 112a of the stamping groove 110, thereby realizing first bending. After the subsequent stamping device 300 performs bending stamping on the vertical patch 520', the lifting platform 200 is lifted, and the complete flexible board 500 and the electronic device 400 are integrally taken out by using the taking and placing device. This can reduce the manual operations and greatly improve the assembly efficiency of the flexible board 500 and the electronic device 400.
The present invention also provides an electronic apparatus including the electronic device 400 and the flexible board 500. The flexible board 500 is bent and pressed onto the electronic device 400 by using a flexible board pressing mechanism. The specific structure of the flexible board stamping mechanism refers to the embodiment. The electronic device adopts all the technical schemes of all the embodiments, so that the electronic device has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted.
Optionally, the electronic device is any one of a mobile phone, a tablet computer, a smart watch, a bluetooth headset, and a VR device.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (5)
1. A flexible board stamping mechanism, characterized in that the flexible board stamping mechanism comprises:
The base is provided with a stamping groove for placing the flexible board and the electronic device stacked on the flexible board, the circumferential wall of the stamping groove is provided with a plurality of grooves, a stamping part is formed between two adjacent grooves, and the stamping part is used for stamping the patch of the flexible board upwards to form a vertical patch;
the lifting table can lift relative to the stamping groove;
The stamping device is arranged on the lifting table and used for bending and stamping the vertical patch to the electronic device;
the stamping device comprises a stamping assembly, the stamping assembly comprises a stamping driver and a stamping knife, the stamping driver is connected with the stamping knife to drive the stamping knife to move along the inner and outer directions, and the vertical patch is bent towards the inner side and attached to the step part of the part to be attached of the electronic device;
the stamping knife comprises a lower knife face and a front knife face, wherein the lower knife face is used for stamping a part of the vertical patch into a first attaching part attached to the transverse step face of the step part; the front cutter surface is positioned at the front end of the lower cutter surface and is used for stamping a part of the vertical patch connected with the first attaching part into a second attaching part attached to the vertical step surface of the step part;
The stamping device further comprises a rolling assembly, the rolling assembly comprises a rolling driver and a rolling piece, the rolling driver is connected with the rolling piece to drive the rolling piece to move along the inner and outer directions, and the tail end part of the vertical patch is stamped into a third attaching part attached to the top surface of the electronic device;
The lower surface of elevating platform still is provided with the locating shaft, the locating shaft is located the top of punching press groove is used for with electron device press location in the punching press inslot.
2. The flexible sheet stamping mechanism as defined in claim 1, wherein the rolling members are provided as rollers; the stamping knife is also provided with an upper knife face positioned above the lower knife face, and the upper knife face is used for supporting the roller to roll.
3. The flexible board stamping mechanism as claimed in claim 2, wherein the rolling driver comprises a cylinder, a push rod connected with the cylinder and driven by the cylinder to move in the inner and outer directions, and a swing rod hinged with the inner end of the push rod to swing up and down; the roller is connected with the swing rod.
4. A flexible board punching mechanism as claimed in any one of claims 1 to 3, characterized in that a peripheral edge of the flexible board is provided with a plurality of the patches; the lifting table is provided with a plurality of stamping devices, and the stamping devices are respectively in one-to-one correspondence with the stamping parts so as to be matched with the stamping of the patches.
5. A flexible board punching mechanism as claimed in any one of claims 1 to 3, characterized in that the flexible board punching mechanism further comprises pick-and-place means for punching the flexible board and the electronic device stacked on the flexible board into the punching groove and taking out the flexible board after the punching is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111435964.5A CN114261133B (en) | 2021-11-29 | Flexible plate stamping mechanism and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111435964.5A CN114261133B (en) | 2021-11-29 | Flexible plate stamping mechanism and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114261133A CN114261133A (en) | 2022-04-01 |
| CN114261133B true CN114261133B (en) | 2024-06-04 |
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| CN211071419U (en) * | 2019-11-27 | 2020-07-24 | 苏州启达工程塑料科技有限公司 | One-time processing and forming equipment for motor support |
| CN213793878U (en) * | 2020-11-09 | 2021-07-27 | 深圳市嘉富盛实业有限公司 | High-efficient copper sheet stamping device |
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| JPH0786796A (en) * | 1993-09-09 | 1995-03-31 | Matsushita Electric Ind Co Ltd | Electronic component supply method and its equipment |
| CN104471630A (en) * | 2012-07-30 | 2015-03-25 | 芝浦机械电子装置株式会社 | Substrate bonding apparatus and substrate bonding method |
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