TWD178422S - 電漿處理裝置用電極板之部分 - Google Patents

電漿處理裝置用電極板之部分

Info

Publication number
TWD178422S
TWD178422S TW105300839F TW105300839F TWD178422S TW D178422 S TWD178422 S TW D178422S TW 105300839 F TW105300839 F TW 105300839F TW 105300839 F TW105300839 F TW 105300839F TW D178422 S TWD178422 S TW D178422S
Authority
TW
Taiwan
Prior art keywords
article
pores
design
plasma
case
Prior art date
Application number
TW105300839F
Other languages
English (en)
Chinese (zh)
Inventor
Shinichi Kozuka
Ryosuke Niitsuma
Manabu Ishikawa
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD178422S publication Critical patent/TWD178422S/zh

Links

TW105300839F 2015-08-26 2016-02-23 電漿處理裝置用電極板之部分 TWD178422S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-18692F JP1545606S (fr) 2015-08-26 2015-08-26

Publications (1)

Publication Number Publication Date
TWD178422S true TWD178422S (zh) 2016-09-21

Family

ID=55484389

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105300839F TWD178422S (zh) 2015-08-26 2016-02-23 電漿處理裝置用電極板之部分

Country Status (3)

Country Link
US (1) USD877079S1 (fr)
JP (1) JP1545606S (fr)
TW (1) TWD178422S (fr)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD411516S (en) * 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US6537419B1 (en) * 2000-04-26 2003-03-25 David W. Kinnard Gas distribution plate assembly for providing laminar gas flow across the surface of a substrate
USD460350S1 (en) * 2001-03-22 2002-07-16 Alan Davis Compressed fabric article package having a wedge shape
KR100400044B1 (ko) * 2001-07-16 2003-09-29 삼성전자주식회사 간격 조절 장치를 가지는 웨이퍼 처리 장치의 샤워 헤드
US6793733B2 (en) * 2002-01-25 2004-09-21 Applied Materials Inc. Gas distribution showerhead
USD570310S1 (en) * 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US8702866B2 (en) * 2006-12-18 2014-04-22 Lam Research Corporation Showerhead electrode assembly with gas flow modification for extended electrode life
US8221582B2 (en) * 2008-07-07 2012-07-17 Lam Research Corporation Clamped monolithic showerhead electrode
TWD136587S1 (zh) * 2008-07-22 2010-08-21 東京威力科創股份有限公司 晶圓吸附板
US9484190B2 (en) * 2014-01-25 2016-11-01 Yuri Glukhoy Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area
JP1545222S (fr) * 2015-06-10 2016-03-07
TWD177995S (zh) * 2015-11-18 2016-09-01 Ａｓｍ知識產權私人控股有限公司 用於半導體製造設備之氣體供應板
TWD178425S (zh) * 2016-01-08 2016-09-21 Ａｓｍ知識產權私人控股有限公司 用於半導體製造設備的電極板
TWD178699S (zh) * 2016-01-08 2016-10-01 Ａｓｍ知識產權私人控股有限公司 用於半導體製造設備的氣體分散板

Also Published As

Publication number Publication date
USD877079S1 (en) 2020-03-03
JP1545606S (fr) 2016-03-14

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