TWD178422S - 電漿處理裝置用電極板之部分 - Google Patents
電漿處理裝置用電極板之部分Info
- Publication number
- TWD178422S TWD178422S TW105300839F TW105300839F TWD178422S TW D178422 S TWD178422 S TW D178422S TW 105300839 F TW105300839 F TW 105300839F TW 105300839 F TW105300839 F TW 105300839F TW D178422 S TWD178422 S TW D178422S
- Authority
- TW
- Taiwan
- Prior art keywords
- article
- pores
- design
- plasma
- case
- Prior art date
Links
- 239000011148 porous material Substances 0.000 abstract 4
- 238000010586 diagram Methods 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 230000005284 excitation Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2015-18692F JP1545606S (fr) | 2015-08-26 | 2015-08-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD178422S true TWD178422S (zh) | 2016-09-21 |
Family
ID=55484389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105300839F TWD178422S (zh) | 2015-08-26 | 2016-02-23 | 電漿處理裝置用電極板之部分 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD877079S1 (fr) |
JP (1) | JP1545606S (fr) |
TW (1) | TWD178422S (fr) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD411516S (en) * | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
US6537419B1 (en) * | 2000-04-26 | 2003-03-25 | David W. Kinnard | Gas distribution plate assembly for providing laminar gas flow across the surface of a substrate |
USD460350S1 (en) * | 2001-03-22 | 2002-07-16 | Alan Davis | Compressed fabric article package having a wedge shape |
KR100400044B1 (ko) * | 2001-07-16 | 2003-09-29 | 삼성전자주식회사 | 간격 조절 장치를 가지는 웨이퍼 처리 장치의 샤워 헤드 |
US6793733B2 (en) * | 2002-01-25 | 2004-09-21 | Applied Materials Inc. | Gas distribution showerhead |
USD570310S1 (en) * | 2006-08-01 | 2008-06-03 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
US8702866B2 (en) * | 2006-12-18 | 2014-04-22 | Lam Research Corporation | Showerhead electrode assembly with gas flow modification for extended electrode life |
US8221582B2 (en) * | 2008-07-07 | 2012-07-17 | Lam Research Corporation | Clamped monolithic showerhead electrode |
TWD136587S1 (zh) * | 2008-07-22 | 2010-08-21 | 東京威力科創股份有限公司 | 晶圓吸附板 |
US9484190B2 (en) * | 2014-01-25 | 2016-11-01 | Yuri Glukhoy | Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area |
JP1545222S (fr) * | 2015-06-10 | 2016-03-07 | ||
TWD177995S (zh) * | 2015-11-18 | 2016-09-01 | Asm知識產權私人控股有限公司 | 用於半導體製造設備之氣體供應板 |
TWD178425S (zh) * | 2016-01-08 | 2016-09-21 | Asm知識產權私人控股有限公司 | 用於半導體製造設備的電極板 |
TWD178699S (zh) * | 2016-01-08 | 2016-10-01 | Asm知識產權私人控股有限公司 | 用於半導體製造設備的氣體分散板 |
-
2015
- 2015-08-26 JP JPD2015-18692F patent/JP1545606S/ja active Active
-
2016
- 2016-02-16 US US29/554,794 patent/USD877079S1/en active Active
- 2016-02-23 TW TW105300839F patent/TWD178422S/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP1545606S (fr) | 2016-03-14 |
USD877079S1 (en) | 2020-03-03 |
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