TW594392B - Aqueous alkali-soluble resins, radiation sensitive resists, photo mask, and method of manufacturing electronics device - Google Patents
Aqueous alkali-soluble resins, radiation sensitive resists, photo mask, and method of manufacturing electronics device Download PDFInfo
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- TW594392B TW594392B TW091124701A TW91124701A TW594392B TW 594392 B TW594392 B TW 594392B TW 091124701 A TW091124701 A TW 091124701A TW 91124701 A TW91124701 A TW 91124701A TW 594392 B TW594392 B TW 594392B
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- 229920005989 resin Polymers 0.000 title claims abstract description 205
- 239000011347 resin Substances 0.000 title claims abstract description 205
- 238000004519 manufacturing process Methods 0.000 title claims description 43
- 230000005855 radiation Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 37
- 239000011159 matrix material Substances 0.000 claims abstract description 31
- 239000000203 mixture Substances 0.000 claims abstract description 25
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 24
- 239000002952 polymeric resin Substances 0.000 claims abstract description 23
- 238000001459 lithography Methods 0.000 claims abstract description 20
- 125000001624 naphthyl group Chemical group 0.000 claims abstract description 11
- 230000007547 defect Effects 0.000 claims abstract description 7
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical group C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims abstract 6
- 239000010408 film Substances 0.000 claims description 229
- 229920002120 photoresistant polymer Polymers 0.000 claims description 94
- -1 hydroxy, phenyl Chemical group 0.000 claims description 77
- 239000011342 resin composition Substances 0.000 claims description 58
- 125000004429 atom Chemical group 0.000 claims description 49
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 47
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 46
- 239000011248 coating agent Substances 0.000 claims description 46
- 238000000576 coating method Methods 0.000 claims description 46
- 230000015572 biosynthetic process Effects 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 39
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 claims description 36
- 125000000217 alkyl group Chemical group 0.000 claims description 32
- 239000001257 hydrogen Substances 0.000 claims description 32
- 229910052739 hydrogen Inorganic materials 0.000 claims description 32
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 29
- 229910052799 carbon Inorganic materials 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 25
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 23
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 21
- 239000002253 acid Substances 0.000 claims description 20
- 229920000642 polymer Polymers 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 19
- 229910052736 halogen Inorganic materials 0.000 claims description 18
- 150000002367 halogens Chemical class 0.000 claims description 18
- 239000006096 absorbing agent Substances 0.000 claims description 16
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 claims description 16
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 14
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 12
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 claims description 12
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 12
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Natural products CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 9
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 9
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 8
- 238000011161 development Methods 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 244000269722 Thea sinensis Species 0.000 claims description 6
- 150000002220 fluorenes Chemical class 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 5
- OQLZINXFSUDMHM-UHFFFAOYSA-N Acetamidine Chemical compound CC(N)=N OQLZINXFSUDMHM-UHFFFAOYSA-N 0.000 claims description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical group C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 4
- 238000005886 esterification reaction Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 3
- 125000000304 alkynyl group Chemical group 0.000 claims description 3
- 239000000460 chlorine Substances 0.000 claims description 3
- 229910052801 chlorine Inorganic materials 0.000 claims description 3
- 230000032050 esterification Effects 0.000 claims description 3
- 125000001424 substituent group Chemical group 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 2
- 244000046052 Phaseolus vulgaris Species 0.000 claims description 2
- 235000010627 Phaseolus vulgaris Nutrition 0.000 claims description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 claims description 2
- 125000003158 alcohol group Chemical group 0.000 claims description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical class OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims description 2
- HRRDCWDFRIJIQZ-UHFFFAOYSA-N naphthalene-1,8-dicarboxylic acid Chemical class C1=CC(C(O)=O)=C2C(C(=O)O)=CC=CC2=C1 HRRDCWDFRIJIQZ-UHFFFAOYSA-N 0.000 claims description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 claims description 2
- 230000036211 photosensitivity Effects 0.000 claims description 2
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims 9
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims 9
- 150000002790 naphthalenes Chemical class 0.000 claims 7
- 150000001299 aldehydes Chemical class 0.000 claims 5
- 125000005843 halogen group Chemical group 0.000 claims 5
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims 4
- 229920001688 coating polymer Polymers 0.000 claims 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 4
- 239000002250 absorbent Substances 0.000 claims 3
- 230000002745 absorbent Effects 0.000 claims 3
- 150000002989 phenols Chemical class 0.000 claims 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 235000019441 ethanol Nutrition 0.000 claims 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims 2
- 125000000524 functional group Chemical group 0.000 claims 2
- 238000005286 illumination Methods 0.000 claims 2
- DTNMLFOXJUUMQV-UHFFFAOYSA-N 1-ethyl-9h-fluorene Chemical group C1C2=CC=CC=C2C2=C1C(CC)=CC=C2 DTNMLFOXJUUMQV-UHFFFAOYSA-N 0.000 claims 1
- NTCCNERMXRIPTR-UHFFFAOYSA-N 2-hydroxy-1-naphthaldehyde Chemical compound C1=CC=CC2=C(C=O)C(O)=CC=C21 NTCCNERMXRIPTR-UHFFFAOYSA-N 0.000 claims 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims 1
- 241000282376 Panthera tigris Species 0.000 claims 1
- 150000001242 acetic acid derivatives Chemical class 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 150000001721 carbon Chemical group 0.000 claims 1
- 125000001309 chloro group Chemical group Cl* 0.000 claims 1
- 239000008199 coating composition Substances 0.000 claims 1
- 238000009833 condensation Methods 0.000 claims 1
- 230000005494 condensation Effects 0.000 claims 1
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims 1
- 125000005909 ethyl alcohol group Chemical group 0.000 claims 1
- 150000004820 halides Chemical class 0.000 claims 1
- 125000001475 halogen functional group Chemical group 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 125000001151 peptidyl group Chemical group 0.000 claims 1
- 150000003007 phosphonic acid derivatives Chemical class 0.000 claims 1
- 150000004714 phosphonium salts Chemical class 0.000 claims 1
- 125000006413 ring segment Chemical group 0.000 claims 1
- 235000015067 sauces Nutrition 0.000 claims 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 17
- 239000010453 quartz Substances 0.000 abstract description 5
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 102
- 239000000243 solution Substances 0.000 description 66
- IZVAOCKUNBYXSU-UHFFFAOYSA-J rhenium;tetrafluoride Chemical compound [F-].[F-].[F-].[F-].[Re] IZVAOCKUNBYXSU-UHFFFAOYSA-J 0.000 description 56
- 238000003786 synthesis reaction Methods 0.000 description 40
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 37
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 36
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- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 18
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 11
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- XGJZQNMUVTZITK-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexamethoxy-1,3,5-triazine-2,4,6-triamine Chemical compound CON(OC)C1=NC(N(OC)OC)=NC(N(OC)OC)=N1 XGJZQNMUVTZITK-UHFFFAOYSA-N 0.000 description 1
- BDCFWIDZNLCTMF-UHFFFAOYSA-N 2-phenylpropan-2-ol Chemical compound CC(C)(O)C1=CC=CC=C1 BDCFWIDZNLCTMF-UHFFFAOYSA-N 0.000 description 1
- ALKYHXVLJMQRLQ-UHFFFAOYSA-N 3-Hydroxy-2-naphthoate Chemical compound C1=CC=C2C=C(O)C(C(=O)O)=CC2=C1 ALKYHXVLJMQRLQ-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- RGUKYNXWOWSRET-UHFFFAOYSA-N 4-pyrrolidin-1-ylpyridine Chemical compound C1CCCN1C1=CC=NC=C1 RGUKYNXWOWSRET-UHFFFAOYSA-N 0.000 description 1
- XMDHVBVIADIYSJ-UHFFFAOYSA-N 9-(2-bromoethyl)anthracene Chemical compound C1=CC=C2C(CCBr)=C(C=CC=C3)C3=CC2=C1 XMDHVBVIADIYSJ-UHFFFAOYSA-N 0.000 description 1
- ZIRVQSRSPDUEOJ-UHFFFAOYSA-N 9-bromoanthracene Chemical compound C1=CC=C2C(Br)=C(C=CC=C3)C3=CC2=C1 ZIRVQSRSPDUEOJ-UHFFFAOYSA-N 0.000 description 1
- ZFFUCOYUEXYXEF-UHFFFAOYSA-N 9H-fluorene-2,6-diol Chemical compound OC1=CC=2CC3=CC=C(C=C3C=2C=C1)O ZFFUCOYUEXYXEF-UHFFFAOYSA-N 0.000 description 1
- CJZOQFLJASZYTM-UHFFFAOYSA-N 9h-fluorene-2,3-diol Chemical compound C1C2=CC=CC=C2C2=C1C=C(O)C(O)=C2 CJZOQFLJASZYTM-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- PGTGANDFRDADJD-UHFFFAOYSA-N CC(=O)O.OC=1C(=CC2=CC=CC=C2C1)C(=O)O Chemical compound CC(=O)O.OC=1C(=CC2=CC=CC=C2C1)C(=O)O PGTGANDFRDADJD-UHFFFAOYSA-N 0.000 description 1
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 1
- 241001522296 Erithacus rubecula Species 0.000 description 1
- NTCCWAQOBYMZOP-UHFFFAOYSA-N FC(S(=O)(=O)O)(F)F.C(C)(C)(C)C=1C(=C(C=CC1)I)C(C)(C)C Chemical class FC(S(=O)(=O)O)(F)F.C(C)(C)(C)C=1C(=C(C=CC1)I)C(C)(C)C NTCCWAQOBYMZOP-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- YPPVLYIFEAESGO-UHFFFAOYSA-N [2,3-bis(methylsulfonyloxy)phenyl] methanesulfonate Chemical compound CS(=O)(=O)OC1=CC=CC(OS(C)(=O)=O)=C1OS(C)(=O)=O YPPVLYIFEAESGO-UHFFFAOYSA-N 0.000 description 1
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 1
- VRVKKKKXKVCPEW-UHFFFAOYSA-N [2-[2-(hydroxymethyl)phenoxy]phenyl]methanol Chemical compound OCC1=CC=CC=C1OC1=CC=CC=C1CO VRVKKKKXKVCPEW-UHFFFAOYSA-N 0.000 description 1
- NWAIYLFAGPKYBZ-UHFFFAOYSA-N [3-(hydroxymethyl)-2,4,6-trimethylphenyl]methanol Chemical group CC1=CC(C)=C(CO)C(C)=C1CO NWAIYLFAGPKYBZ-UHFFFAOYSA-N 0.000 description 1
- YWMLORGQOFONNT-UHFFFAOYSA-N [3-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC(CO)=C1 YWMLORGQOFONNT-UHFFFAOYSA-N 0.000 description 1
- BWVAOONFBYYRHY-UHFFFAOYSA-N [4-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=C(CO)C=C1 BWVAOONFBYYRHY-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 1
- YUENFNPLGJCNRB-UHFFFAOYSA-N anthracen-1-amine Chemical compound C1=CC=C2C=C3C(N)=CC=CC3=CC2=C1 YUENFNPLGJCNRB-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- WUESWDIHTKHGQA-UHFFFAOYSA-N cyclohexylurea Chemical compound NC(=O)NC1CCCCC1 WUESWDIHTKHGQA-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- CEIPQQODRKXDSB-UHFFFAOYSA-N ethyl 3-(6-hydroxynaphthalen-2-yl)-1H-indazole-5-carboximidate dihydrochloride Chemical compound Cl.Cl.C1=C(O)C=CC2=CC(C3=NNC4=CC=C(C=C43)C(=N)OCC)=CC=C21 CEIPQQODRKXDSB-UHFFFAOYSA-N 0.000 description 1
- WHRIKZCFRVTHJH-UHFFFAOYSA-N ethylhydrazine Chemical compound CCNN WHRIKZCFRVTHJH-UHFFFAOYSA-N 0.000 description 1
- 125000006125 ethylsulfonyl group Chemical group 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
- 150000005209 naphthoic acids Chemical class 0.000 description 1
- 239000004533 oil dispersion Substances 0.000 description 1
- 150000002896 organic halogen compounds Chemical class 0.000 description 1
- 150000002907 osmium Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- CUQOHAYJWVTKDE-UHFFFAOYSA-N potassium;butan-1-olate Chemical compound [K+].CCCC[O-] CUQOHAYJWVTKDE-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 150000003220 pyrenes Chemical class 0.000 description 1
- 239000000700 radioactive tracer Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000104 sodium hydride Inorganic materials 0.000 description 1
- 239000012312 sodium hydride Substances 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- BNWCETAHAJSBFG-UHFFFAOYSA-N tert-butyl 2-bromoacetate Chemical compound CC(C)(C)OC(=O)CBr BNWCETAHAJSBFG-UHFFFAOYSA-N 0.000 description 1
- MFPWEWYKQYMWRO-UHFFFAOYSA-N tert-butyl carboxy carbonate Chemical compound CC(C)(C)OC(=O)OC(O)=O MFPWEWYKQYMWRO-UHFFFAOYSA-N 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- 125000001412 tetrahydropyranyl group Chemical group 0.000 description 1
- 125000001889 triflyl group Chemical group FC(F)(F)S(*)(=O)=O 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/56—Organic absorbers, e.g. of photo-resists
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001400619A JP3929307B2 (ja) | 2001-12-28 | 2001-12-28 | 水性アルカリ可溶性樹脂および感光性樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW594392B true TW594392B (en) | 2004-06-21 |
Family
ID=19189640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091124701A TW594392B (en) | 2001-12-28 | 2002-10-24 | Aqueous alkali-soluble resins, radiation sensitive resists, photo mask, and method of manufacturing electronics device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7005216B2 (enExample) |
| JP (1) | JP3929307B2 (enExample) |
| CN (1) | CN1264887C (enExample) |
| TW (1) | TW594392B (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI451192B (zh) * | 2011-01-14 | 2014-09-01 | 信越化學工業股份有限公司 | 光阻下層膜材料及使用此材料之圖案形成方法 |
| TWI642700B (zh) * | 2013-12-04 | 2018-12-01 | 日本化藥股份有限公司 | Phenolic resin, epoxy resin, epoxy resin composition, and cured product thereof |
| TWI673317B (zh) * | 2014-06-12 | 2019-10-01 | 日商迪愛生股份有限公司 | 永久膜用感光性組成物、光阻材料、及塗膜 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308002A (ja) * | 2000-02-15 | 2001-11-02 | Canon Inc | フォトマスクを用いたパターン作製方法、及びパターン作製装置 |
| KR100512171B1 (ko) * | 2003-01-24 | 2005-09-02 | 삼성전자주식회사 | 하층 레지스트용 조성물 |
| US7402373B2 (en) * | 2004-02-05 | 2008-07-22 | E.I. Du Pont De Nemours And Company | UV radiation blocking protective layers compatible with thick film pastes |
| US7127830B2 (en) * | 2004-08-02 | 2006-10-31 | Wafertech, Llc | Reticle carrier apparatus and method that tilts reticle for drying |
| CN100409073C (zh) * | 2004-12-30 | 2008-08-06 | 财团法人工业技术研究院 | 碱可溶树脂与包含该树脂的感旋光性组合物 |
| US7460209B2 (en) * | 2005-03-28 | 2008-12-02 | Intel Corporation | Advanced mask patterning with patterning layer |
| KR101069434B1 (ko) * | 2009-03-10 | 2011-09-30 | 주식회사 하이닉스반도체 | 자기조립분자층을 이용한 포토마스크 제조방법 |
| JP5549107B2 (ja) * | 2009-04-20 | 2014-07-16 | Ｄｉｃ株式会社 | ノボラック樹脂の製造方法 |
| US8586289B2 (en) | 2009-09-15 | 2013-11-19 | Mitsubishi Gas Chemical Company, Inc. | Aromatic hydrocarbon resin and composition for forming underlayer film for lithography |
| EP2532710B1 (en) * | 2010-02-03 | 2018-08-22 | DIC Corporation | Phenol resin composition, curable resin composition, cured products thereof, and printed circuit board |
| JP5630181B2 (ja) * | 2010-03-05 | 2014-11-26 | 大日本印刷株式会社 | ネガ型レジスト組成物、当該レジスト組成物を用いたレリーフパターンの製造方法及びフォトマスクの製造方法 |
| WO2012090408A1 (ja) * | 2010-12-28 | 2012-07-05 | 三菱瓦斯化学株式会社 | 芳香族炭化水素樹脂、リソグラフィー用下層膜形成組成物及び多層レジストパターンの形成方法 |
| JP5953811B2 (ja) * | 2012-02-24 | 2016-07-20 | Dic株式会社 | ポジ型フォトレジスト組成物 |
| CN106458812B (zh) * | 2014-05-15 | 2019-03-26 | Dic株式会社 | 含改性酚羟基化合物、含改性酚羟基化合物的制法、感光性组合物、保护材料及保护涂膜 |
| CN107111229B (zh) * | 2015-01-16 | 2020-11-27 | Dic株式会社 | 抗蚀永久膜用固化性组合物及抗蚀永久膜 |
| KR102832675B1 (ko) * | 2016-09-20 | 2025-07-14 | 삼성전자주식회사 | 레티클 패턴들의 임계치수 보정 방법 및 그를 포함하는 레티클 제조 방법 |
| US11269120B2 (en) * | 2017-09-13 | 2022-03-08 | Materion Corporation | Photo resist as opaque aperture mask on multispectral filter arrays |
| US11675266B2 (en) | 2021-04-15 | 2023-06-13 | Industrial Technology Research Institute | Photosensitive compound, photosensitive composition, and patterning method |
| KR102950676B1 (ko) * | 2021-09-02 | 2026-04-09 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3105234B2 (ja) | 1990-09-28 | 2000-10-30 | 株式会社日立製作所 | 半導体装置の製造方法 |
| JPH05289307A (ja) | 1992-04-13 | 1993-11-05 | Matsushita Electric Ind Co Ltd | レチクルおよびレチクル製造方法 |
| JP3749083B2 (ja) * | 2000-04-25 | 2006-02-22 | 株式会社ルネサステクノロジ | 電子装置の製造方法 |
-
2001
- 2001-12-28 JP JP2001400619A patent/JP3929307B2/ja not_active Expired - Fee Related
-
2002
- 2002-10-24 TW TW091124701A patent/TW594392B/zh not_active IP Right Cessation
- 2002-11-20 CN CNB021513872A patent/CN1264887C/zh not_active Expired - Fee Related
- 2002-11-20 US US10/299,692 patent/US7005216B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI451192B (zh) * | 2011-01-14 | 2014-09-01 | 信越化學工業股份有限公司 | 光阻下層膜材料及使用此材料之圖案形成方法 |
| TWI642700B (zh) * | 2013-12-04 | 2018-12-01 | 日本化藥股份有限公司 | Phenolic resin, epoxy resin, epoxy resin composition, and cured product thereof |
| TWI673317B (zh) * | 2014-06-12 | 2019-10-01 | 日商迪愛生股份有限公司 | 永久膜用感光性組成物、光阻材料、及塗膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1428358A (zh) | 2003-07-09 |
| CN1264887C (zh) | 2006-07-19 |
| US7005216B2 (en) | 2006-02-28 |
| JP2003201324A (ja) | 2003-07-18 |
| US20030129505A1 (en) | 2003-07-10 |
| JP3929307B2 (ja) | 2007-06-13 |
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