TW588400B - Apparatus for planarizing a semiconductor contactor - Google Patents

Apparatus for planarizing a semiconductor contactor Download PDF

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Publication number
TW588400B
TW588400B TW090106263A TW90106263A TW588400B TW 588400 B TW588400 B TW 588400B TW 090106263 A TW090106263 A TW 090106263A TW 90106263 A TW90106263 A TW 90106263A TW 588400 B TW588400 B TW 588400B
Authority
TW
Taiwan
Prior art keywords
control member
probe card
card assembly
substrate
adjustable
Prior art date
Application number
TW090106263A
Other languages
English (en)
Chinese (zh)
Inventor
Gaetan L Mathieu
Benjamin N Eldridge
Gary W Grube
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27062552&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW588400(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US09/528,064 external-priority patent/US6509751B1/en
Application filed by Formfactor Inc filed Critical Formfactor Inc
Application granted granted Critical
Publication of TW588400B publication Critical patent/TW588400B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW090106263A 2000-03-17 2001-03-16 Apparatus for planarizing a semiconductor contactor TW588400B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52793100A 2000-03-17 2000-03-17
US09/528,064 US6509751B1 (en) 2000-03-17 2000-03-17 Planarizer for a semiconductor contactor

Publications (1)

Publication Number Publication Date
TW588400B true TW588400B (en) 2004-05-21

Family

ID=27062552

Family Applications (2)

Application Number Title Priority Date Filing Date
TW090106263A TW588400B (en) 2000-03-17 2001-03-16 Apparatus for planarizing a semiconductor contactor
TW091119279A TW588404B (en) 2000-03-17 2001-03-16 Method for planarizing a semiconductor contactor

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW091119279A TW588404B (en) 2000-03-17 2001-03-16 Method for planarizing a semiconductor contactor

Country Status (7)

Country Link
EP (1) EP1266230B1 (OSRAM)
JP (4) JP2003528459A (OSRAM)
KR (1) KR100459050B1 (OSRAM)
AU (1) AU2001250876A1 (OSRAM)
DE (1) DE60142030D1 (OSRAM)
TW (2) TW588400B (OSRAM)
WO (1) WO2001071779A2 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI383154B (zh) * 2007-03-14 2013-01-21 Nhk Spring Co Ltd 探針卡

Families Citing this family (41)

* Cited by examiner, † Cited by third party
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DE60142030D1 (de) * 2000-03-17 2010-06-17 Formfactor Inc Verfahren und vorrichtung zum einebnen von einem halbleitersubstrat in einer testkartenanordnung
US6965244B2 (en) 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6911835B2 (en) 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
JP3621938B2 (ja) * 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
US7071715B2 (en) 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
JPWO2005083773A1 (ja) * 2004-02-27 2007-08-30 株式会社アドバンテスト プローブカード及びその製造方法
DE102004027887B4 (de) * 2004-05-28 2010-07-29 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
DE112005003580B4 (de) * 2005-05-23 2013-05-16 Kabushiki Kaisha Nihon Micronics Sondenanordnung, Verfahren zu ihrer Herstellung und elektrische Verbindungsvorrichtung
JP4634867B2 (ja) 2005-06-03 2011-02-16 株式会社ミツトヨ 画像測定システム及び方法
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
US7843198B2 (en) 2005-08-02 2010-11-30 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus
JP4642603B2 (ja) * 2005-08-25 2011-03-02 東京エレクトロン株式会社 プローブカード
US7728608B2 (en) 2005-10-24 2010-06-01 Kabushiki Naisha Nihon Micronics Method for assembling electrical connecting apparatus
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes
JP4823667B2 (ja) 2005-12-05 2011-11-24 日本発條株式会社 プローブカード
US8018242B2 (en) 2005-12-05 2011-09-13 Nhk Spring Co., Ltd. Probe card
US7365553B2 (en) 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
WO2007142204A1 (ja) * 2006-06-08 2007-12-13 Nhk Spring Co., Ltd. プローブカード
KR100821996B1 (ko) * 2006-09-08 2008-04-15 윌테크놀러지(주) 평탄도 조절 가능한 프로브 유닛
JP5190195B2 (ja) * 2006-11-29 2013-04-24 株式会社日本マイクロニクス 電気的接続装置
JP2008134170A (ja) * 2006-11-29 2008-06-12 Micronics Japan Co Ltd 電気的接続装置
JP2008216060A (ja) 2007-03-05 2008-09-18 Micronics Japan Co Ltd 電気的接続装置
KR101242004B1 (ko) 2007-03-19 2013-03-11 (주) 미코티엔 프로브 카드
DE112007003211B4 (de) 2007-03-20 2013-08-01 Kabushiki Kaisha Nihon Micronics Elektrische Verbindungsvorrichtung
KR100806736B1 (ko) * 2007-05-11 2008-02-27 주식회사 에이엠에스티 프로브 카드 및 그 제조방법
KR100911661B1 (ko) * 2007-07-11 2009-08-10 (주)엠투엔 평탄화 수단을 구비한 프로브 카드
US8149008B2 (en) 2007-07-19 2012-04-03 Nhk Spring Co., Ltd. Probe card electrically connectable with a semiconductor wafer
JP4941169B2 (ja) * 2007-08-15 2012-05-30 横河電機株式会社 プローブカード機構
JP5326240B2 (ja) * 2007-08-24 2013-10-30 富士通株式会社 プローブボードおよび電子デバイスの検査方法
US8378705B2 (en) 2008-02-29 2013-02-19 Nhk Spring Co., Ltd. Wiring substrate and probe card
US7923290B2 (en) * 2009-03-27 2011-04-12 Stats Chippac Ltd. Integrated circuit packaging system having dual sided connection and method of manufacture thereof
KR100954451B1 (ko) * 2009-06-19 2010-04-27 박영주 반도체 웨이퍼 테스트용 프로브 카드의 평탄화 장치 및 평탄화 장치의 평탄 조절체 인서트 적층방법
DE202009014987U1 (de) * 2009-10-28 2010-02-18 Feinmetall Gmbh Prüfvorrichtung zur elektrischen Prüfung von elektrischen Prüflingen
KR101108726B1 (ko) * 2010-01-26 2012-02-29 삼성전기주식회사 수평도 조절부재
KR101148635B1 (ko) * 2011-07-25 2012-05-25 삼성전기주식회사 프로브 카드
US9341650B2 (en) 2012-01-18 2016-05-17 Nhk Spring Co., Ltd. Space transformer having a ceramic substrate with a wiring pattern for use in a probe card
JP5991823B2 (ja) * 2012-02-14 2016-09-14 株式会社日本マイクロニクス 電気的接続装置及びその組立方法
US12535503B2 (en) 2021-02-24 2026-01-27 Advantest Corporation Semiconductor wafer testing apparatus, semiconductor wafer testing system, flatness measuring device, and method of adjusting flatness of wiring board
JP2024017497A (ja) * 2022-07-28 2024-02-08 株式会社日本マイクロニクス 電気的接続装置
KR102868587B1 (ko) 2023-12-13 2025-10-02 주식회사 아이에스시 테스트 소켓

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
JPH07109471B2 (ja) * 1986-12-23 1995-11-22 株式会社コパル ストロボ発光制御方式
JPH0680716B2 (ja) * 1990-10-11 1994-10-12 日本電子材料株式会社 プローブカードの位置決め機構
US5094536A (en) * 1990-11-05 1992-03-10 Litel Instruments Deformable wafer chuck
JP2802849B2 (ja) * 1992-03-16 1998-09-24 日立電子エンジニアリング株式会社 プローブカードの反り補正機構
JP2892505B2 (ja) * 1994-11-15 1999-05-17 フォームファクター，インコーポレイテッド 回路基板への電子コンポーネントの実装
JP2900240B2 (ja) * 1995-10-09 1999-06-02 日本電子材料株式会社 異方性導電シートの製造方法
JP2737774B2 (ja) * 1996-03-15 1998-04-08 日本電気株式会社 ウェハテスタ
JPH1031034A (ja) * 1996-07-17 1998-02-03 Denki Kagaku Kogyo Kk 平行度調整器付きプローブカード
JPH11163059A (ja) * 1997-11-25 1999-06-18 Yamamoto Isamu 集積回路用半導体薄板検査装置およびその検査方法
DE60142030D1 (de) * 2000-03-17 2010-06-17 Formfactor Inc Verfahren und vorrichtung zum einebnen von einem halbleitersubstrat in einer testkartenanordnung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI383154B (zh) * 2007-03-14 2013-01-21 Nhk Spring Co Ltd 探針卡
US8456184B2 (en) 2007-03-14 2013-06-04 Nhk Spring Co., Ltd. Probe card for a semiconductor wafer

Also Published As

Publication number Publication date
TW588404B (en) 2004-05-21
JP2005164601A (ja) 2005-06-23
KR20020095151A (ko) 2002-12-20
AU2001250876A1 (en) 2001-10-03
EP1266230B1 (en) 2010-05-05
DE60142030D1 (de) 2010-06-17
WO2001071779A3 (en) 2002-03-14
EP1266230A2 (en) 2002-12-18
KR100459050B1 (ko) 2004-12-03
WO2001071779A2 (en) 2001-09-27
JP2006343350A (ja) 2006-12-21
JP2005164600A (ja) 2005-06-23
JP2003528459A (ja) 2003-09-24

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MM4A Annulment or lapse of patent due to non-payment of fees