TW550711B - Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates - Google Patents

Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates Download PDF

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Publication number
TW550711B
TW550711B TW091108106A TW91108106A TW550711B TW 550711 B TW550711 B TW 550711B TW 091108106 A TW091108106 A TW 091108106A TW 91108106 A TW91108106 A TW 91108106A TW 550711 B TW550711 B TW 550711B
Authority
TW
Taiwan
Prior art keywords
temperature
patent application
item
scope
hydrogen
Prior art date
Application number
TW091108106A
Other languages
English (en)
Chinese (zh)
Inventor
Steffen Frigge
Wilhelm Kegel
Jens-Uwe Sachse
Michael Stadtmueller
Regina Hayn
Original Assignee
Infineon Technologies Ag
Mattson Thermal Products Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Mattson Thermal Products Gmbh filed Critical Infineon Technologies Ag
Application granted granted Critical
Publication of TW550711B publication Critical patent/TW550711B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
    • H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01304—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H10D64/01306—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon
    • H10D64/01308—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon the conductor further comprising a non-elemental silicon additional conductive layer, e.g. a metal silicide layer formed by the reaction of silicon with an implanted metal
    • H10D64/01312—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon the conductor further comprising a non-elemental silicon additional conductive layer, e.g. a metal silicide layer formed by the reaction of silicon with an implanted metal the additional layer comprising a metal or metal silicide formed by deposition, i.e. without a silicidation reaction, e.g. sputter deposition

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW091108106A 2001-04-26 2002-04-19 Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates TW550711B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10120523A DE10120523A1 (de) 2001-04-26 2001-04-26 Verfahren zur Minimierung der Wolframoxidausdampfung bei der selektiven Seitenwandoxidation von Wolfram-Silizium-Gates

Publications (1)

Publication Number Publication Date
TW550711B true TW550711B (en) 2003-09-01

Family

ID=7682847

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091108106A TW550711B (en) 2001-04-26 2002-04-19 Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates

Country Status (8)

Country Link
US (1) US7094637B2 (https=)
EP (1) EP1382062B1 (https=)
JP (1) JP2004526327A (https=)
KR (1) KR20040015149A (https=)
CN (1) CN1503987A (https=)
DE (2) DE10120523A1 (https=)
TW (1) TW550711B (https=)
WO (1) WO2002089190A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI770857B (zh) * 2020-09-22 2022-07-11 南亞科技股份有限公司 製造半導體裝置的方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7020729B2 (en) * 2002-05-16 2006-03-28 Intel Corporation Protocol independent data transmission interface
DE10236896B4 (de) * 2002-08-12 2010-08-12 Mattson Thermal Products Gmbh Vorrichtung und Verfahren zum thermischen Behandeln von Halbleiterwafern
US6774012B1 (en) * 2002-11-08 2004-08-10 Cypress Semiconductor Corp. Furnace system and method for selectively oxidizing a sidewall surface of a gate conductor by oxidizing a silicon sidewall in lieu of a refractory metal sidewall
US7235497B2 (en) * 2003-10-17 2007-06-26 Micron Technology, Inc. Selective oxidation methods and transistor fabrication methods
KR100580118B1 (ko) * 2005-03-09 2006-05-12 주식회사 하이닉스반도체 반도체 소자의 게이트 전극 패턴 형성방법
JP2007123669A (ja) * 2005-10-31 2007-05-17 Elpida Memory Inc 半導体装置の製造方法
KR100650858B1 (ko) * 2005-12-23 2006-11-28 주식회사 하이닉스반도체 플래쉬 메모리 소자의 제조 방법
US7951728B2 (en) * 2007-09-24 2011-05-31 Applied Materials, Inc. Method of improving oxide growth rate of selective oxidation processes
US8278287B2 (en) * 2008-04-15 2012-10-02 Quark Pharmaceuticals Inc. siRNA compounds for inhibiting NRF2
WO2010026624A1 (ja) * 2008-09-02 2010-03-11 株式会社 東芝 不揮発性半導体記憶装置の製造方法
US8889565B2 (en) * 2009-02-13 2014-11-18 Asm International N.V. Selective removal of oxygen from metal-containing materials

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59132136A (ja) * 1983-01-19 1984-07-30 Hitachi Ltd 半導体装置の製造方法
JPH10223900A (ja) * 1996-12-03 1998-08-21 Toshiba Corp 半導体装置及び半導体装置の製造方法
US5796151A (en) 1996-12-19 1998-08-18 Texas Instruments Incorporated Semiconductor stack having a dielectric sidewall for prevention of oxidation of tungsten in tungsten capped poly-silicon gate electrodes
JP4283904B2 (ja) * 1997-07-11 2009-06-24 株式会社東芝 半導体装置の製造方法
JP2000156497A (ja) * 1998-11-20 2000-06-06 Toshiba Corp 半導体装置の製造方法
US6346467B1 (en) 1999-09-02 2002-02-12 Advanced Micro Devices, Inc. Method of making tungsten gate MOS transistor and memory cell by encapsulating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI770857B (zh) * 2020-09-22 2022-07-11 南亞科技股份有限公司 製造半導體裝置的方法
US11456177B2 (en) 2020-09-22 2022-09-27 Nanya Technology Corporation Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
WO2002089190A3 (de) 2003-01-09
EP1382062B1 (de) 2007-11-14
DE10120523A1 (de) 2002-10-31
EP1382062A2 (de) 2004-01-21
KR20040015149A (ko) 2004-02-18
CN1503987A (zh) 2004-06-09
US7094637B2 (en) 2006-08-22
WO2002089190A2 (de) 2002-11-07
US20040121569A1 (en) 2004-06-24
JP2004526327A (ja) 2004-08-26
DE50211205D1 (de) 2007-12-27

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