TW538660B - Method for making an electric circuit device - Google Patents
Method for making an electric circuit device Download PDFInfo
- Publication number
- TW538660B TW538660B TW091111649A TW91111649A TW538660B TW 538660 B TW538660 B TW 538660B TW 091111649 A TW091111649 A TW 091111649A TW 91111649 A TW91111649 A TW 91111649A TW 538660 B TW538660 B TW 538660B
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- TW
- Taiwan
- Prior art keywords
- conductive
- circuit device
- conductive foil
- manufacturing
- mentioned
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001216245A JP4761662B2 (ja) | 2001-07-17 | 2001-07-17 | 回路装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW538660B true TW538660B (en) | 2003-06-21 |
Family
ID=19050747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091111649A TW538660B (en) | 2001-07-17 | 2002-05-31 | Method for making an electric circuit device |
Country Status (5)
Country | Link |
---|---|
US (1) | US6955942B2 (ja) |
JP (1) | JP4761662B2 (ja) |
KR (1) | KR100715749B1 (ja) |
CN (1) | CN1233205C (ja) |
TW (1) | TW538660B (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7247526B1 (en) * | 1998-06-10 | 2007-07-24 | Asat Ltd. | Process for fabricating an integrated circuit package |
JP2004071899A (ja) * | 2002-08-07 | 2004-03-04 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
US7612429B2 (en) * | 2002-10-31 | 2009-11-03 | Rohm Co., Ltd. | Chip resistor, process for producing the same, and frame for use therein |
JP4183500B2 (ja) * | 2002-12-20 | 2008-11-19 | 三洋電機株式会社 | 回路装置およびその製造方法 |
US7256486B2 (en) * | 2003-06-27 | 2007-08-14 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Packaging device for semiconductor die, semiconductor device incorporating same and method of making same |
US7919787B2 (en) * | 2003-06-27 | 2011-04-05 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Semiconductor device with a light emitting semiconductor die |
US7279355B2 (en) * | 2003-06-27 | 2007-10-09 | Avago Technologies Ecbuip (Singapore) Pte Ltd | Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same |
JP2005129900A (ja) * | 2003-09-30 | 2005-05-19 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
WO2005114730A1 (ja) * | 2004-05-20 | 2005-12-01 | Spansion Llc | 半導体装置の製造方法および半導体装置 |
TWI247367B (en) * | 2004-12-02 | 2006-01-11 | Siliconware Precision Industries Co Ltd | Semiconductor package free of carrier and fabrication method thereof |
JP4646661B2 (ja) * | 2005-03-18 | 2011-03-09 | 株式会社リコー | プリント配線基板印刷方法と実装方法ならびにプログラム |
DE102006012738A1 (de) * | 2006-03-17 | 2007-09-20 | Infineon Technologies Ag | Nutzen aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren und Moldform zur Herstellung desselben |
JP2008042087A (ja) * | 2006-08-09 | 2008-02-21 | Tdk Corp | 貼り合わせ基板の加工方法及びコイル部品の製造方法 |
CN101155474B (zh) * | 2006-09-28 | 2011-08-24 | 比亚迪股份有限公司 | 一种在fpc领域对位覆盖膜方法及其专用隔离板 |
KR100764684B1 (ko) * | 2006-11-01 | 2007-10-08 | 인티그런트 테크놀로지즈(주) | 반도체 패키지 제조방법, 반도체 장치 및 그 제조방법 |
CN101437359B (zh) * | 2007-11-15 | 2012-08-08 | 福建华映显示科技有限公司 | 具有位置标示的电路板与接合的方法 |
JP5136458B2 (ja) * | 2009-02-20 | 2013-02-06 | ヤマハ株式会社 | 半導体パッケージ及びその製造方法 |
TWI427716B (zh) * | 2010-06-04 | 2014-02-21 | 矽品精密工業股份有限公司 | 無載具之半導體封裝件及其製法 |
US10529576B2 (en) * | 2017-08-17 | 2020-01-07 | Semiconductor Components Industries, Llc | Multi-faced molded semiconductor package and related methods |
MY172923A (en) * | 2016-03-31 | 2019-12-13 | Twisden Ltd | Integrated circuit package having pin up interconnect |
DE102017107708A1 (de) * | 2017-04-10 | 2018-10-11 | Prüftechnik Dieter Busch AG | Differenzsonde, Prüfvorrichtung und Herstellungsverfahren |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995026047A1 (en) * | 1994-03-18 | 1995-09-28 | Hitachi Chemical Company, Ltd. | Semiconductor package manufacturing method and semiconductor package |
JP3198889B2 (ja) * | 1995-09-22 | 2001-08-13 | 日立電線株式会社 | 半導体装置 |
JPH09260560A (ja) * | 1996-03-21 | 1997-10-03 | Toppan Printing Co Ltd | リードフレーム及びその製造方法 |
JP3137323B2 (ja) * | 1997-03-04 | 2001-02-19 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP3519579B2 (ja) * | 1997-09-09 | 2004-04-19 | 株式会社ルネサステクノロジ | 半導体装置及びその製造方法 |
JP3521758B2 (ja) * | 1997-10-28 | 2004-04-19 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JP3436159B2 (ja) * | 1998-11-11 | 2003-08-11 | 松下電器産業株式会社 | 樹脂封止型半導体装置の製造方法 |
JP3686287B2 (ja) * | 1999-07-14 | 2005-08-24 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP3883784B2 (ja) * | 2000-05-24 | 2007-02-21 | 三洋電機株式会社 | 板状体および半導体装置の製造方法 |
JP4667559B2 (ja) * | 2000-05-30 | 2011-04-13 | ルネサスエレクトロニクス株式会社 | 半導体装置、フォトマスクおよび半導体装置の製造方法 |
JP2002009443A (ja) * | 2000-06-22 | 2002-01-11 | Nec Corp | 多層プリント配線板の製造方法とその製造装置 |
JP3600130B2 (ja) | 2000-09-04 | 2004-12-08 | 三洋電機株式会社 | 回路装置の製造方法 |
-
2001
- 2001-07-17 JP JP2001216245A patent/JP4761662B2/ja not_active Expired - Fee Related
-
2002
- 2002-05-31 TW TW091111649A patent/TW538660B/zh not_active IP Right Cessation
- 2002-07-16 US US10/196,087 patent/US6955942B2/en not_active Expired - Fee Related
- 2002-07-16 KR KR1020020041664A patent/KR100715749B1/ko not_active IP Right Cessation
- 2002-07-17 CN CNB021261245A patent/CN1233205C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1233205C (zh) | 2005-12-21 |
US20030017645A1 (en) | 2003-01-23 |
KR100715749B1 (ko) | 2007-05-08 |
JP4761662B2 (ja) | 2011-08-31 |
KR20030007212A (ko) | 2003-01-23 |
JP2003031729A (ja) | 2003-01-31 |
US6955942B2 (en) | 2005-10-18 |
CN1398153A (zh) | 2003-02-19 |
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