TW538435B - Method of making semiconductor device - Google Patents

Method of making semiconductor device Download PDF

Info

Publication number
TW538435B
TW538435B TW091105746A TW91105746A TW538435B TW 538435 B TW538435 B TW 538435B TW 091105746 A TW091105746 A TW 091105746A TW 91105746 A TW91105746 A TW 91105746A TW 538435 B TW538435 B TW 538435B
Authority
TW
Taiwan
Prior art keywords
batch
processing
batches
cleaning
rie
Prior art date
Application number
TW091105746A
Other languages
English (en)
Chinese (zh)
Inventor
Masaki Narita
Katsuya Okumura
Tokuhisa Ohiwa
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW538435B publication Critical patent/TW538435B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW091105746A 2001-03-29 2002-03-25 Method of making semiconductor device TW538435B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001095306A JP2002299315A (ja) 2001-03-29 2001-03-29 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW538435B true TW538435B (en) 2003-06-21

Family

ID=18949375

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091105746A TW538435B (en) 2001-03-29 2002-03-25 Method of making semiconductor device

Country Status (5)

Country Link
US (1) US6911398B2 (https=)
JP (1) JP2002299315A (https=)
KR (1) KR100464579B1 (https=)
CN (1) CN1197122C (https=)
TW (1) TW538435B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221313A (ja) * 2003-01-15 2004-08-05 Kawasaki Microelectronics Kk 半導体製造工程の管理方法および半導体製造ラインの管理システム
US7113253B2 (en) * 2003-09-16 2006-09-26 Asml Netherlands B.V. Method, apparatus and computer product for substrate processing
JP5215852B2 (ja) * 2006-07-31 2013-06-19 東京エレクトロン株式会社 基板処理装置およびコンディショニング要否決定方法
JP2009024229A (ja) * 2007-07-20 2009-02-05 Hitachi Kokusai Electric Inc 基板処理装置
JP5220447B2 (ja) * 2008-03-17 2013-06-26 東京エレクトロン株式会社 基板処理システムの洗浄方法、記憶媒体及び基板処理システム
JP2010098053A (ja) * 2008-10-15 2010-04-30 Tokyo Electron Ltd クリーニング方法及び記録媒体
JP5431901B2 (ja) * 2008-12-26 2014-03-05 キヤノンアネルバ株式会社 インライン真空処理装置、インライン真空処理装置の制御方法、情報記録媒体の製造方法
US10157741B1 (en) * 2017-07-31 2018-12-18 Taiwan Semiconductor Manufacturing Company Ltd. Method of manufacturing a semiconductor structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785155A (ja) * 1993-06-23 1995-03-31 Sony Corp ロット管理装置
JP3522912B2 (ja) * 1994-08-01 2004-04-26 東京エレクトロン株式会社 洗浄処理装置およびその制御方法
US5985032A (en) * 1995-05-17 1999-11-16 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus
JPH10149990A (ja) 1996-11-19 1998-06-02 Kokusai Electric Co Ltd ガスクリーニング方法
JPH10199817A (ja) 1997-01-10 1998-07-31 Kokusai Electric Co Ltd 成膜装置
US6280790B1 (en) * 1997-06-30 2001-08-28 Applied Materials, Inc. Reducing the deposition rate of volatile contaminants onto an optical component of a substrate processing system
CN1097491C (zh) * 1997-11-14 2003-01-01 东京电子株式会社 一种等离子体处理系统及清洁等离子体处理系统的方法
US6168672B1 (en) * 1998-03-06 2001-01-02 Applied Materials Inc. Method and apparatus for automatically performing cleaning processes in a semiconductor wafer processing system
KR19990076407A (ko) * 1998-03-31 1999-10-15 윤종용 반도체장치의 제조공정에 있어서의 박막 형성방법
US6270576B1 (en) * 1998-08-05 2001-08-07 Tokyo Electron Limited Coating and developing apparatus
KR100331779B1 (ko) * 1999-07-02 2002-04-09 김광교 반도체 세정설비의 구동 제어방법
JP2001351868A (ja) * 2000-06-07 2001-12-21 Hitachi Kokusai Electric Inc 半導体製造装置

Also Published As

Publication number Publication date
KR20020077191A (ko) 2002-10-11
US6911398B2 (en) 2005-06-28
JP2002299315A (ja) 2002-10-11
KR100464579B1 (ko) 2005-01-03
CN1379438A (zh) 2002-11-13
CN1197122C (zh) 2005-04-13
US20020155727A1 (en) 2002-10-24

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