KR100464579B1 - 반도체 장치 제조 방법 - Google Patents

반도체 장치 제조 방법 Download PDF

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Publication number
KR100464579B1
KR100464579B1 KR10-2002-0017006A KR20020017006A KR100464579B1 KR 100464579 B1 KR100464579 B1 KR 100464579B1 KR 20020017006 A KR20020017006 A KR 20020017006A KR 100464579 B1 KR100464579 B1 KR 100464579B1
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KR
South Korea
Prior art keywords
processing
lot
rie
cleaning
lots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2002-0017006A
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English (en)
Korean (ko)
Other versions
KR20020077191A (ko
Inventor
나리따마사끼
오꾸무라가쯔야
오히와도꾸히사
Original Assignee
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바
Publication of KR20020077191A publication Critical patent/KR20020077191A/ko
Application granted granted Critical
Publication of KR100464579B1 publication Critical patent/KR100464579B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR10-2002-0017006A 2001-03-29 2002-03-28 반도체 장치 제조 방법 Expired - Fee Related KR100464579B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00095306 2001-03-29
JP2001095306A JP2002299315A (ja) 2001-03-29 2001-03-29 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20020077191A KR20020077191A (ko) 2002-10-11
KR100464579B1 true KR100464579B1 (ko) 2005-01-03

Family

ID=18949375

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2002-0017006A Expired - Fee Related KR100464579B1 (ko) 2001-03-29 2002-03-28 반도체 장치 제조 방법

Country Status (5)

Country Link
US (1) US6911398B2 (https=)
JP (1) JP2002299315A (https=)
KR (1) KR100464579B1 (https=)
CN (1) CN1197122C (https=)
TW (1) TW538435B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101227235B1 (ko) * 2008-03-17 2013-01-28 도쿄엘렉트론가부시키가이샤 기판 처리 시스템의 세정 방법, 기억 매체 및 기판 처리 시스템

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221313A (ja) * 2003-01-15 2004-08-05 Kawasaki Microelectronics Kk 半導体製造工程の管理方法および半導体製造ラインの管理システム
US7113253B2 (en) * 2003-09-16 2006-09-26 Asml Netherlands B.V. Method, apparatus and computer product for substrate processing
JP5215852B2 (ja) * 2006-07-31 2013-06-19 東京エレクトロン株式会社 基板処理装置およびコンディショニング要否決定方法
JP2009024229A (ja) * 2007-07-20 2009-02-05 Hitachi Kokusai Electric Inc 基板処理装置
JP2010098053A (ja) * 2008-10-15 2010-04-30 Tokyo Electron Ltd クリーニング方法及び記録媒体
JP5431901B2 (ja) * 2008-12-26 2014-03-05 キヤノンアネルバ株式会社 インライン真空処理装置、インライン真空処理装置の制御方法、情報記録媒体の製造方法
US10157741B1 (en) * 2017-07-31 2018-12-18 Taiwan Semiconductor Manufacturing Company Ltd. Method of manufacturing a semiconductor structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785155A (ja) * 1993-06-23 1995-03-31 Sony Corp ロット管理装置
JPH08102458A (ja) * 1994-08-01 1996-04-16 Tokyo Electron Ltd 洗浄処理装置およびその制御方法
JPH10149990A (ja) * 1996-11-19 1998-06-02 Kokusai Electric Co Ltd ガスクリーニング方法
KR19990073317A (ko) * 1999-07-02 1999-10-05 김광교 반도체세정설비의구동제어방법및그장치
JP2001351868A (ja) * 2000-06-07 2001-12-21 Hitachi Kokusai Electric Inc 半導体製造装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5985032A (en) * 1995-05-17 1999-11-16 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus
JPH10199817A (ja) 1997-01-10 1998-07-31 Kokusai Electric Co Ltd 成膜装置
US6280790B1 (en) * 1997-06-30 2001-08-28 Applied Materials, Inc. Reducing the deposition rate of volatile contaminants onto an optical component of a substrate processing system
CN1097491C (zh) * 1997-11-14 2003-01-01 东京电子株式会社 一种等离子体处理系统及清洁等离子体处理系统的方法
US6168672B1 (en) * 1998-03-06 2001-01-02 Applied Materials Inc. Method and apparatus for automatically performing cleaning processes in a semiconductor wafer processing system
KR19990076407A (ko) * 1998-03-31 1999-10-15 윤종용 반도체장치의 제조공정에 있어서의 박막 형성방법
US6270576B1 (en) * 1998-08-05 2001-08-07 Tokyo Electron Limited Coating and developing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785155A (ja) * 1993-06-23 1995-03-31 Sony Corp ロット管理装置
JPH08102458A (ja) * 1994-08-01 1996-04-16 Tokyo Electron Ltd 洗浄処理装置およびその制御方法
JPH10149990A (ja) * 1996-11-19 1998-06-02 Kokusai Electric Co Ltd ガスクリーニング方法
KR19990073317A (ko) * 1999-07-02 1999-10-05 김광교 반도체세정설비의구동제어방법및그장치
JP2001351868A (ja) * 2000-06-07 2001-12-21 Hitachi Kokusai Electric Inc 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101227235B1 (ko) * 2008-03-17 2013-01-28 도쿄엘렉트론가부시키가이샤 기판 처리 시스템의 세정 방법, 기억 매체 및 기판 처리 시스템

Also Published As

Publication number Publication date
KR20020077191A (ko) 2002-10-11
US6911398B2 (en) 2005-06-28
JP2002299315A (ja) 2002-10-11
CN1379438A (zh) 2002-11-13
CN1197122C (zh) 2005-04-13
TW538435B (en) 2003-06-21
US20020155727A1 (en) 2002-10-24

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