CN1197122C - 制造半导体器件的方法 - Google Patents

制造半导体器件的方法 Download PDF

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Publication number
CN1197122C
CN1197122C CNB021087113A CN02108711A CN1197122C CN 1197122 C CN1197122 C CN 1197122C CN B021087113 A CNB021087113 A CN B021087113A CN 02108711 A CN02108711 A CN 02108711A CN 1197122 C CN1197122 C CN 1197122C
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CN
China
Prior art keywords
processing
batch
cleaning
rie
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB021087113A
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English (en)
Chinese (zh)
Other versions
CN1379438A (zh
Inventor
成田雅贵
奥村胜弥
大岩德久
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Toshiba Corp
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Toshiba Corp
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Publication date
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Publication of CN1379438A publication Critical patent/CN1379438A/zh
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Publication of CN1197122C publication Critical patent/CN1197122C/zh
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CNB021087113A 2001-03-29 2002-03-29 制造半导体器件的方法 Expired - Fee Related CN1197122C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP095306/2001 2001-03-29
JP2001095306A JP2002299315A (ja) 2001-03-29 2001-03-29 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
CN1379438A CN1379438A (zh) 2002-11-13
CN1197122C true CN1197122C (zh) 2005-04-13

Family

ID=18949375

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB021087113A Expired - Fee Related CN1197122C (zh) 2001-03-29 2002-03-29 制造半导体器件的方法

Country Status (5)

Country Link
US (1) US6911398B2 (https=)
JP (1) JP2002299315A (https=)
KR (1) KR100464579B1 (https=)
CN (1) CN1197122C (https=)
TW (1) TW538435B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464792B (zh) * 2008-03-17 2014-12-11 東京威力科創股份有限公司 Substrate processing system cleaning method, memory media and substrate processing system

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221313A (ja) * 2003-01-15 2004-08-05 Kawasaki Microelectronics Kk 半導体製造工程の管理方法および半導体製造ラインの管理システム
US7113253B2 (en) * 2003-09-16 2006-09-26 Asml Netherlands B.V. Method, apparatus and computer product for substrate processing
JP5215852B2 (ja) * 2006-07-31 2013-06-19 東京エレクトロン株式会社 基板処理装置およびコンディショニング要否決定方法
JP2009024229A (ja) * 2007-07-20 2009-02-05 Hitachi Kokusai Electric Inc 基板処理装置
JP2010098053A (ja) * 2008-10-15 2010-04-30 Tokyo Electron Ltd クリーニング方法及び記録媒体
JP5431901B2 (ja) * 2008-12-26 2014-03-05 キヤノンアネルバ株式会社 インライン真空処理装置、インライン真空処理装置の制御方法、情報記録媒体の製造方法
US10157741B1 (en) * 2017-07-31 2018-12-18 Taiwan Semiconductor Manufacturing Company Ltd. Method of manufacturing a semiconductor structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785155A (ja) * 1993-06-23 1995-03-31 Sony Corp ロット管理装置
JP3522912B2 (ja) * 1994-08-01 2004-04-26 東京エレクトロン株式会社 洗浄処理装置およびその制御方法
US5985032A (en) * 1995-05-17 1999-11-16 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus
JPH10149990A (ja) 1996-11-19 1998-06-02 Kokusai Electric Co Ltd ガスクリーニング方法
JPH10199817A (ja) 1997-01-10 1998-07-31 Kokusai Electric Co Ltd 成膜装置
US6280790B1 (en) * 1997-06-30 2001-08-28 Applied Materials, Inc. Reducing the deposition rate of volatile contaminants onto an optical component of a substrate processing system
CN1097491C (zh) * 1997-11-14 2003-01-01 东京电子株式会社 一种等离子体处理系统及清洁等离子体处理系统的方法
US6168672B1 (en) * 1998-03-06 2001-01-02 Applied Materials Inc. Method and apparatus for automatically performing cleaning processes in a semiconductor wafer processing system
KR19990076407A (ko) * 1998-03-31 1999-10-15 윤종용 반도체장치의 제조공정에 있어서의 박막 형성방법
US6270576B1 (en) * 1998-08-05 2001-08-07 Tokyo Electron Limited Coating and developing apparatus
KR100331779B1 (ko) * 1999-07-02 2002-04-09 김광교 반도체 세정설비의 구동 제어방법
JP2001351868A (ja) * 2000-06-07 2001-12-21 Hitachi Kokusai Electric Inc 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464792B (zh) * 2008-03-17 2014-12-11 東京威力科創股份有限公司 Substrate processing system cleaning method, memory media and substrate processing system

Also Published As

Publication number Publication date
KR20020077191A (ko) 2002-10-11
US6911398B2 (en) 2005-06-28
JP2002299315A (ja) 2002-10-11
KR100464579B1 (ko) 2005-01-03
CN1379438A (zh) 2002-11-13
TW538435B (en) 2003-06-21
US20020155727A1 (en) 2002-10-24

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Granted publication date: 20050413